A3P400-PQG208I - ProASIC3 FPGA, 400K Gates | Microchip
Référence : A3P400-PQG208I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $90.73 | $90,73 |
| 10 | $85 | $850,00 |
| 100 | $78.5 | $7 850,00 |
| 500 | $72 | $36 000,00 |
| 1 000 | $65 | $65 000,00 |
A3P400-PQG208I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing, allowing rapid prototyping and flexible hardware design. FPGAs sit within the broader category of programmable logic devices (PLDs), which also includes CPLDs and SoC FPGAs. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, enabling instant-on operation without an external boot device.
Key features of the A3P400-PQG208I include 400,000 system gates, 55,296 bits of RAM, 151 user I/Os, and a system performance of up to 231 MHz. The device supports multiple I/O standards and features four I/O banks with dedicated VCCIBx supplies. Its flash-based architecture provides inherent security against reverse engineering and supports single-chip, low total cost of ownership (TOC) designs.
The ProASIC3 architecture uses a flash-based switch matrix that is reprogrammable and retains configuration when power is removed. This eliminates the need for external configuration memory, reducing board space and BOM cost. The device also includes an abundance of advanced features such as clock conditioning circuits (CCC) and phase-locked loops (PLLs) for robust clock management.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics where low power, instant-on, and security are critical. The 208-pin BFQFP package with 0.5 mm pitch provides a compact footprint suitable for space-constrained designs.
When designing with this device, ensure proper decoupling of the 1.5 V core supply and each VCCIBx bank supply. The four I/O banks allow mixing of different I/O voltage standards, but only compatible standards can be assigned to the same bank. Refer to the ProASIC3 migration application note for guidance on migrating between densities.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P400-PQG208I.
Alternatives de remplacement direct pour A3P400-PQG208I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P400-PQG208I (même facteur de forme et même empreinte) — différant par Package, Core Supply Voltage, System Gates, Configuration, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P400-2PQG208I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P400-1PQG208I
✅ Remplacement direct✓ En stock
$28.5 / unité
Voir la fiche technique →A3P400-PQG208
✅ Remplacement direct✓ En stock
$29 / unité
Voir la fiche technique →A3P400-2PQG208
✅ Remplacement direct✓ En stock
$56.9 / unité
Voir la fiche technique →A3P600-PQG208I
✅ Remplacement direct✓ En stock
$68.08 / unité
Voir la fiche technique →A3P400-PQG208I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| Number of Logic Elements | 5K LEs |
| Number of Gates | 400000 |
| Total RAM Bits | 55296 |
| Number of I/O | 151 |
| Number of I/O Banks | 4 |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Plage de température de fonctionnement | -40°C to 100°C (TJ) |
| Boîtier | 208-BFQFP (PQG208) |
| Type de montage | Surface Mount |
| Pitch | 0.5 mm |
| Maximum System Performance | 231 MHz |
| Configuration | Flash-based, reprogrammable |
| Statut RoHS | Compliant |
Configuration des broches de A3P400-PQG208I
| Broche 1 | IO — User I/O |
| Broche 2 | IO — User I/O |
| Broche 3 | IO — User I/O |
| Broche 4 | IO — User I/O |
| Broche 5 | IO — User I/O |
| Broche 6 | IO — User I/O |
| Broche 7 | IO — User I/O |
| Broche 8 | IO — User I/O |
| Broche 9 | IO — User I/O |
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| Broche 12 | IO — User I/O |
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| Broche 100 | IO — User I/O |
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| Broche 149 | IO — User I/O |
| Broche 150 | IO — User I/O |
| Broche 151 | IO — User I/O |
| Broche 152 | VCC — Core power supply |
| Broche 153 | GND — Ground |
| Broche 154 | VCCIB0 — I/O bank 0 supply |
| Broche 155 | VCCIB1 — I/O bank 1 supply |
| Broche 156 | VCCIB2 — I/O bank 2 supply |
| Broche 157 | VCCIB3 — I/O bank 3 supply |
| Broche 158 | GND — Ground |
| Broche 159 | VCC — Core power supply |
| Broche 160 | GND — Ground |
| Broche 161 | VCC — Core power supply |
| Broche 162 | GND — Ground |
| Broche 163 | VCC — Core power supply |
| Broche 164 | GND — Ground |
| Broche 165 | VCC — Core power supply |
| Broche 166 | GND — Ground |
| Broche 167 | VCC — Core power supply |
| Broche 168 | GND — Ground |
| Broche 169 | VCC — Core power supply |
| Broche 170 | GND — Ground |
| Broche 171 | VCC — Core power supply |
| Broche 172 | GND — Ground |
| Broche 173 | VCC — Core power supply |
| Broche 174 | GND — Ground |
| Broche 175 | VCC — Core power supply |
| Broche 176 | GND — Ground |
| Broche 177 | VCC — Core power supply |
| Broche 178 | GND — Ground |
| Broche 179 | VCC — Core power supply |
| Broche 180 | GND — Ground |
| Broche 181 | VCC — Core power supply |
| Broche 182 | GND — Ground |
| Broche 183 | VCC — Core power supply |
| Broche 184 | GND — Ground |
| Broche 185 | VCC — Core power supply |
| Broche 186 | GND — Ground |
| Broche 187 | VCC — Core power supply |
| Broche 188 | GND — Ground |
| Broche 189 | VCC — Core power supply |
| Broche 190 | GND — Ground |
| Broche 191 | VCC — Core power supply |
| Broche 192 | GND — Ground |
| Broche 193 | VCC — Core power supply |
| Broche 194 | GND — Ground |
| Broche 195 | VCC — Core power supply |
| Broche 196 | GND — Ground |
| Broche 197 | VCC — Core power supply |
| Broche 198 | GND — Ground |
| Broche 199 | VCC — Core power supply |
| Broche 200 | GND — Ground |
| Broche 201 | VCC — Core power supply |
| Broche 202 | GND — Ground |
| Broche 203 | VCC — Core power supply |
| Broche 204 | GND — Ground |
| Broche 205 | VCC — Core power supply |
| Broche 206 | GND — Ground |
| Broche 207 | VCC — Core power supply |
| Broche 208 | GND — Ground |
Applications typiques
A3P400-PQG208I convient pour 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Aerospace and Defense, Medical Devices.
Industrial Control
The A3P400-PQG208I is well-suited for industrial control applications due to its industrial temperature range (-40°C to 100°C TJ) and flash-based instant-on capability. With 400K gates and 151 I/Os, it can implement motor control logic, PLC interfaces, and sensor processing. The non-volatile configuration ensures the FPGA starts immediately on power-up without waiting for external configuration memory, which is critical in safety-critical industrial systems. Its low power consumption and single-chip solution reduce BOM cost and board space in space-constrained industrial controllers.
Recommandé
Automotive Electronics
In automotive electronics, the A3P400-PQG208I's industrial temperature range and flash-based security make it ideal for body control modules, gateway controllers, and infotainment interfaces. The 400K gates provide ample logic for protocol bridging (CAN, LIN) and I/O expansion. The device's inherent security against reverse engineering protects proprietary algorithms, which is valuable in automotive IP protection. The 151 I/Os allow direct interfacing to multiple sensors and actuators. The 208-BFQFP package's 0.5 mm pitch enables compact PCB designs suitable for automotive ECUs.
Recommandé
Communications Infrastructure
The A3P400-PQG208I serves communications infrastructure applications such as protocol converters, packet processing, and interface bridging. With 55,296 bits of RAM and 151 I/Os, it can handle FIFO buffers, protocol state machines, and parallel data interfaces. The device supports multiple I/O standards across four banks, enabling direct connection to various logic families. The 231 MHz system performance provides adequate throughput for many communication protocols. The flash-based architecture ensures reliable operation in remote or unattended installations where configuration memory failure is unacceptable.
Recommandé
Consumer Electronics
In consumer electronics, the A3P400-PQG208I provides a cost-effective programmable logic solution for display controllers, user interface processing, and peripheral bridging. The 400K gates and 151 I/Os enable implementation of custom logic without ASIC development costs. The single-chip flash architecture reduces component count, lowering overall system cost. The device's low power consumption extends battery life in portable devices. The 208-BFQFP package is suitable for consumer product PCBs, and the industrial temperature range provides margin for consumer operating environments.
Recommandé
Aerospace and Defense
The A3P400-PQG208I is suitable for aerospace and defense applications requiring secure, reliable programmable logic. The flash-based architecture provides inherent tamper resistance and prevents configuration readback, protecting sensitive designs. The industrial temperature range (-40°C to 100°C TJ) covers many military and aerospace environments. With 400K gates and 151 I/Os, it can implement encryption engines, sensor interfaces, and mission-critical control logic. The instant-on capability is essential for systems that must operate immediately upon power application.
Recommandé
Medical Devices
The A3P400-PQG208I is used in medical devices such as patient monitors, diagnostic equipment, and imaging systems. The industrial temperature range ensures reliable operation in medical environments. The 400K gates and 151 I/Os allow implementation of signal processing, data acquisition, and display control logic. The flash-based configuration provides instant-on operation, which is critical for medical devices that must be ready immediately. The device's security features protect patient data and proprietary algorithms. The 208-BFQFP package enables compact medical device designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P400-PQG208I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P400-2PQG208I | A3P400-1PQG208I | A3P400-PQG208 | A3P400-2PQG208 | A3P600-PQG208I |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQG208) | 208-BFQFP (PQG208) | 208-BFQFP (PQG208) | 208-BFQFP (PQG208) | 208-BFQFP (PQG208) | 208-BFQFP (PQG208) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Number of Gates | 400000 | 400000 | 400000 | 400000 | 400000 | 600000 |
| Total RAM Bits | 55296 | 55296 | 55296 | 55296 | 55296 | 110592 |
| Number of I/O | 151 | 151 | 151 | 151 | 151 | 151 |
| Operating Temperature Range | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | -40°C to 100°C (TJ) | 0°C to 85°C | 0°C to 85°C | -40°C to 100°C (TJ) |
| Speed Grade | Standard | 2 (fastest) | 1 | Standard | 2 (fastest) | Standard |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
Principaux différenciateurs
- Industrial temperature range (vs A3P400-PQG208)
- Flash-based instant-on configuration (vs SRAM-based FPGAs)
- Inherent security (vs SRAM-based FPGAs)
Notes de conception
The A3P400-PQG208I requires a 1.5 V core supply (1.425 V to 1.575 V) and separate I/O bank supplies (VCCIBx) for each of the four I/O banks. Use low-impedance decoupling capacitors (0.1 uF and 10 uF) close to each VCC and VCCIBx pin. The core current draw depends on logic utilization and toggle rate; estimate power using Microchip's power calculator. Ensure the power supply can handle peak inrush current during configuration.
The 208-BFQFP package has a 0.5 mm pitch, requiring careful PCB layout. Use a 4-layer or more board with dedicated power and ground planes. Route I/O traces with controlled impedance if using high-speed interfaces. Place decoupling capacitors as close as possible to the power pins. Follow Microchip's layout guidelines for the ProASIC3 family to minimize noise and ensure reliable operation.
A common pitfall is assigning incompatible I/O voltage standards to the same I/O bank. The four I/O banks have dedicated VCCIBx supplies, so only I/Os with compatible voltage standards can be assigned to the same bank. Refer to the ProASIC3 migration application note for guidance. Also, ensure the core supply is within 1.425 V to 1.575 V; exceeding this range can damage the device.
Informations de conformité
RoHS compliance inferred from 'G' suffix in part number (PQG208) indicating lead-free finish. Other compliance data not explicitly stated in provided sources.