A3P600-PQG208I - ProASIC3 Flash FPGA 600K Gates | Microchip
MPN: A3P600-PQG208I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $90.77 | $90.77 |
| 10 | $86.23 | $862.30 |
| 100 | $79.48 | $7,948.00 |
| 500 | $73.51 | $36,755.00 |
| 1,000 | $68.08 | $68,080.00 |
Drop-in alternatives for A3P600-PQG208I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3P600-1PQG208I
✅ Drop-In✓ In Stock
$68 / Unit
View Datasheet →A3P600-2PQG208I
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View Datasheet →A3P600-2PQG208
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$55.87 / Unit
View Datasheet →A3P600-1PQG208
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$49.94 / Unit
View Datasheet →A3P600L-1PQG208I
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$29 / Unit
View Datasheet →A3P1000-2PQG208
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$65.67 / Unit
View Datasheet →A3P400-2PQG208
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$56.9 / Unit
View Datasheet →A3P600-PQG208I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600K |
| Logic Elements | 7KLEs class (per distributor listing) |
| User I/O | 154 |
| Max System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | On-chip flash (single-chip, non-volatile) |
| Package | 208-BFQFP (PQFP-208) |
| Mounting Type | Surface Mount |
| Temperature Grade | I - Industrial |
| Operating Temperature | -40C to +100C (ambient, industrial) |
| Terminal Form | Gull Wing |
| Soft CPU Support | Optional soft ARM support (per ProASIC3 datasheet) |
A3P600-PQG208I 208-bfqfp (pqfp-208) Pin Configuration Guide
Complete pinout information for A3P600-PQG208I (208-bfqfp (pqfp-208) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-PQG208I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-PQG208I is suitable for 6 applications: Industrial Control and Automation, Secure and Instant-On Systems, Avionics and Aerospace Glue Logic, Communications Bridging and Line Cards, Motor Drive and Power Conversion Interface, Test and Measurement Instrumentation.
Industrial Control and Automation
The A3P600-PQG208I fits industrial control because its I-suffix industrial rating (-40C to +100C) and flash fabric deliver deterministic, live-at-power-up logic without configuration delay - critical for machines that must act within milliseconds of power valid. The 600K gates and 154 user I/Os consolidate PLC I/O conditioning, encoder interfaces, and interlock logic that would otherwise need several CPLDs and glue chips, cutting BOM count and board area. Powered from a 1.5V core with hot-swap capable I/O banks, it tolerates backplane live insertion. The trade-off versus SRAM FPGAs is lower absolute fabric speed (231 MHz system performance class), which is ample for industrial state machines and protocol bridging but not for high-speed DSP. Reconfiguration in the field is done via the JTAG port using Microchip Libero SoC tooling.
Recommended
Secure and Instant-On Systems
Because the ProASIC3 fabric stores its bitstream in on-chip flash, the A3P600-PQG208I never exposes its configuration externally, providing inherent design security that SRAM FPGAs only achieve with added encryption circuitry. This makes it well suited to security cameras, access-control hardware, and licensed equipment where IP protection matters. Instant-on behavior means the device is functional within microseconds of power, enabling boot-time security arbitration or power sequencing control for companion processors such as the MSP430FR5994. The 600K-gate capacity accommodates crypto accelerators, tamper-detection state machines, and sensor fusion front ends. Designers should still review Microchip flash FPGA security application notes for anti-tamper guidance, since physical security requirements vary by threat model and deployment environment.
Recommended
Avionics and Aerospace Glue Logic
Flash FPGAs are widely used in aerospace sub-systems because they are single-chip, live at power-up, and immune to configuration upset from radiation-induced configuration-memory flips that affect SRAM devices. The A3P600-PQG208I's 600K gates and 154 I/Os handle backplane interfaces, MIL-STD-style bus bridging, and legacy glue-logic consolidation on retrofit programs where the 208-pin PQFP footprint must be preserved. The industrial temperature grade and wide I/O standard support (LVTTL, LVCMOS, SSTL, LVDS differential) ease integration with mixed-voltage avionics rails. Designers should confirm program-specific screening and qualification beyond the standard I-grade, and Microchip radiation-tolerant variants of this family should be evaluated for orbit applications rather than this commercial-origin catalog part.
Recommended
Communications Bridging and Line Cards
With 154 user I/Os organized in banks supporting LVTTL, LVCMOS, SSTL, and differential LVDS, the A3P600-PQG208I suits protocol bridging between legacy parallel buses and newer serial links on networking line cards. The 231 MHz system performance class supports parallel data paths at 8-bit x tens-of-MHz rates, while embedded flash memory blocks implement dual-port FIFOs for clock-domain crossing. Single-chip configuration removes the boot-time window during which SRAM FPGAs are offline - useful in redundant systems needing hitless failover. Power designers should budget for I/O bank currents at high toggle rates and follow Microchip's bank voltage rules. For designs migrating upward, the same-footprint A3P1000-2PQG208 doubles capacity without PCB respin, protecting the layout investment.
Recommended
Motor Drive and Power Conversion Interface
In motor drives, the A3P600-PQG208I implements PWM distribution, dead-time insertion, gate-interface supervision, and protective interlock logic alongside a control DSP such as the TMS320F28035-class or TMS320F28335 devices. Flash-based instant-on operation means protective logic is active before software-controlled devices finish booting, a genuine safety benefit when DC bus capacitors can hold hazardous energy. The industrial temperature rating covers drive cabinet environments, and LVDS-capable I/Os support noisy-environment signaling between control and sensing boards. Designers must respect the PQFP package's power handling: compute I/O ring dissipation from toggle rates and load capacitance, and verify junction temperature against the industrial rating. The soft-logic flexibility allows rapid revision of protection profiles across drive product families sharing one PCB.
Recommended
Test and Measurement Instrumentation
Bench and rack instrumentation benefits from the A3P600-PQG208I's combination of instant-on deterministic timing, 154 flexible I/Os, and in-field reprogrammability via JTAG. Typical roles include triggering and timing sequencers, channel multiplexing, sensor front-end aggregation, and host interface glue between ADCs and embedded processors. Flash configuration means the instrument presents consistent timing behavior from cold start - important for calibration repeatability - and no external configuration device occupies board space in dense front-end modules. The 600K-gate capacity supports per-channel DSP-lite filtering, and embedded memory blocks form capture FIFOs ahead of the host readout path. Designers should allocate I/O banks so that analog-side digital returns keep switching noise away from precision front ends, following Microchip's I/O bank and ground-return layout guidance.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-PQG208I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-1PQG208I | A3P600-2PQG208I | A3P600L-1PQG208I | A3P400-2PQG208 | A3P1000-2PQG208 |
|---|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP-208) | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same | 208-BFQFP - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) |
| System Gates | 600K | 600K | 600K | 600K (low power) | 400K | 1M |
| Speed Grade | Standard (base) | -1 | -2 (fastest) | -1 (low power) | -2 | -2 |
| Temperature Grade | Industrial (I) | Industrial | Industrial | Industrial | Commercial | Commercial |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V (reduced static power) | 1.5 V | 1.5 V |
| Configuration | On-chip flash, single-chip | On-chip flash | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
| Unit Price (qty 1, as of 2026-08-31) | $90.77 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Flash configuration, single-chip instant-on (vs SRAM FPGAs (Xilinx/Altera equivalents))
- Industrial temperature with full I/O bank flexibility (vs A3P600-2PQG208 (commercial))
- No-footprint-respin capacity scaling (vs A3P400-2PQG208 / A3P1000-2PQG208)
- Trade-off: lower fabric speed than modern SRAM FPGAs (vs A3P1000-2PQG208 (or any modern FPGA))
Design Notes
ProASIC3 devices use a 1.5V core plus bank-dependent VCCI rails. Estimated: with 154 user I/Os, I/O ring power scales with f * C * V^2 * N - at 50 MHz average toggle, 15 pF loads, and 3.3V banks, I/O dynamic current can reach the hundreds-of-milliamps range, so size the VCCI regulators with margin and decouple each bank locally with at least 0.1 uF per few I/Os plus bulk capacitance. Verify total dissipation against the PQFP thermal resistance in the ProASIC3 family datasheet before committing the power tree.
The 208-pin PQFP has 0.5 mm pitch gull-wing leads - use the JEDEC-style footprint from the Microchip library, with drag-soldering-friendly pads and fiducials at diagonal corners for automated optical alignment. Place 0.1 uF decoupling within 3 mm of alternating VCC/GND pin pairs around the perimeter. JTAG programming header should be routed short with series termination on TCK to avoid ringing at programming clock rates.
Do not mix incompatible I/O standards within one bank - assign VCCI per bank in Libero before finalizing schematic pin assignments, or you will respin the board. Also, when substituting speed grades (e.g., A3P600-1PQG208I for this base-grade part), re-run static timing analysis in Libero SoC: a design near the standard-grade limit may fail timing at -1. Finally, confirm the exact package suffix on purchase orders - PQ208 and PQG208 differ in finish and compliance, per the Xecor comparison of A3P600-PQ208I vs A3P600-PQG208I.
For LVDS or SSTL bank usage on this PQFP part, keep trace lengths matched within the skew budget and reference a continuous ground plane; the relatively large PQFP loop inductance makes stubs and vias more impactful than on fine-pitch BGAs. Estimated: at 231 MHz-class internal performance with parallel I/O above 100 MHz toggle, add series 22-33 ohm resistors on high-drive outputs to tame overshoot into unprotected downstream devices.
Compliance Information
PQG suffix indicates Microchip green/lead-free package nomenclature, but explicit RoHS/REACH certificates were not present in the verified data - confirm on the Microchip product page. Not an automotive AEC-Q100 program part.
