ATSAM3SD8CA-CU - 64MHz Cortex-M3 MCU 512KB Flash | Microchip
Référence : ATSAM3SD8CA-CU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.4 | $3,40 |
| 10 | $3.12 | $31,20 |
| 100 | $2.86 | $286,00 |
| 500 | $2.62 | $1 310,00 |
| 1 000 | $2.41 | $2 410,00 |
ATSAM3SD8CA-CU Présentation
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, sitting at the heart of the embedded systems hierarchy: MCU -> embedded processor -> system-on-chip -> semiconductor device. The ARM Cortex-M3 is a 32-bit RISC processor core designed for cost-sensitive, deterministic real-time embedded applications, and the SAM3S family wraps this core with a rich peripheral set and low-power modes.
Key features of the ATSAM3SD8CA-CU include the 64 MHz Cortex-M3 core with Thumb-2 instruction set, 512 KB (512K x 8) Flash program memory supporting in-system programming, 64 KB SRAM, and a supply voltage range of 1.62 V to 3.6 V. The device integrates USB, USART, SPI, and TWI communication peripherals along with a 12-bit ADC, timers, PWM channels, and multiple low-power sleep and wait modes for energy-sensitive designs.
Technically, the SAM3S series uses a multi-layer AHB bus matrix that allows the CPU, DMA controller (Peripheral DMA), and USB to access memory and peripherals concurrently, reducing latency. The Flash Access Zone concept and prefetch buffer sustain zero-wait-state execution at moderate clock frequencies, while the nested vectored interrupt controller (NVIC) provides deterministic interrupt handling.
Typical applications include industrial control and automation nodes, consumer and portable devices with USB connectivity, metering and sensing systems, and motor control or HVAC interfaces where the DMA-driven peripherals offload the CPU.
When designing with this part, budget GPIO carefully: the 100-ball TFBGA requires fine-pitch (0.8 mm) PCB layout with via-in-pad or dog-bone fanout, and the 1.62-3.6 V supply demands a clean, decoupled 3.3 V rail for stable Flash operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAM3SD8CA-CU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM3SD8CA-CU (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Flash Memory, SRAM, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM3S8BA-MUR
✅ Remplacement direct✓ En stock
$5.15 / unité
Voir la fiche technique →ATSAM3N4BA-MU
✅ Remplacement direct✓ En stock
$3.48 / unité
Voir la fiche technique →ATSAM3S4BA-CU
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAM4S8CA-CU
✅ Remplacement direct✓ En stock
$6.18 / unité
Voir la fiche technique →ATSAM4N8CA-CU
✅ Remplacement direct✓ En stock
$2.02 / unité
Voir la fiche technique →ATSAM3SD8CA-CU Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit Single-Core |
| Fréquence d'horloge maximale | 64 MHz |
| Flash Memory Size | 512 KB (512K x 8) |
| RAM Size | 64K x 8 |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Series | SAM3S |
| Boîtier | 100-TFBGA (9x9 mm), 0.8 mm pitch, 1.1 mm height |
| Type de montage | Surface Mount |
| Temperature Grade | Industrial |
| Technology | CMOS |
| Terminal Form | Ball |
| Number of Terminals | 100 |
| Package Shape | Square |
| Connectivity | USB, USART, SPI, TWI (I2C) |
| Green / RoHS Attribute | Green, IT, MRL A |
| Oscillator Type | Internal + External crystal |
Guide de configuration des broches du ATSAM3SD8CA-CU square
Configuration des broches du ATSAM3SD8CA-CU (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAM3SD8CA-CU.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAM3SD8CA-CU convient pour 6 applications: Industrial Control and Automation, USB-Connected Consumer Devices, Metering and Smart Sensing, Motor Control and HVAC Interfaces, Networking and Communication Bridges, Test and Measurement Instrumentation.
Industrial Control and Automation
The ATSAM3SD8CA-CU fits industrial control nodes because its 64 MHz Cortex-M3 core delivers deterministic real-time response through the NVIC, while the peripheral DMA controller offloads USART, SPI, and TWI transfers so the CPU remains free for control loops. The 12-bit ADC and PWM channels support closed-loop motor and process control, and the industrial temperature grade and 1.62 V to 3.6 V supply tolerance suit electrically noisy factory environments. Firmware executes from 512 KB internal Flash with no external memory required, simplifying BOM and improving reliability. In a typical PLC expansion module, the MCU polls sensors over TWI, streams data over RS-485-style USART links, and drives outputs via PWM, all within one 9x9 mm TFBGA footprint.
Recommandé
USB-Connected Consumer Devices
With its integrated USB device peripheral and 512 KB Flash, the ATSAM3SD8CA-CU is a strong fit for consumer accessories such as barcode readers, scales, and HID-class devices that need a USB connection to a PC. The multi-layer AHB bus matrix lets USB DMA move data to SRAM while the Cortex-M3 processes the previous packet, sustaining continuous transfers without CPU stalls. The 64 KB SRAM provides ample buffering for USB endpoints plus application state, and the low-power wait and sleep modes extend battery life in portable designs. The 9x9 mm TFBGA100 keeps the controller compact enough for handheld enclosures while the 100 balls provide enough I/O for keys, displays, and indicators.
Recommandé
Metering and Smart Sensing
Energy meters, water meters, and environmental sensing nodes benefit from the ATSAM3SD8CA-CU's combination of a 12-bit ADC for measurement front-ends, USART/SPI links for communication modules, and low-power modes that keep average current low between readings. The 512 KB Flash leaves room for calibration tables, logging, and field-updatable firmware with a dual-image bootloader. The Peripheral DMA controller samples the ADC on hardware triggers at fixed intervals, producing jitter-free measurement sequences critical for RMS power computation. Industrial temperature grading and the wide 1.62 V to 3.6 V supply range allow direct operation from battery-backed or industrial 3.3 V rails without extra regulation stages.
Recommandé
Motor Control and HVAC Interfaces
The SAM3S peripheral set, including PWM channels, timers, and the 12-bit ADC with DMA, makes the ATSAM3SD8CA-CU suitable for fan, pump, and damper control in HVAC systems. PWM outputs drive power stages while the ADC samples current-sense and temperature feedback synchronized by hardware triggers through the Peripheral DMA, forming a closed loop with minimal CPU jitter. Multiple USARTs allow simultaneous connection to building-automation buses (for example Modbus over RS-485) and local service ports. The 64 MHz Cortex-M3 core executes PI control loops with ample margin, and its sleep modes support the standby consumption targets demanded by continuously powered HVAC controllers.
Recommandé
Networking and Communication Bridges
Protocol-conversion bridges (for example SPI-to-USB or USART-to-Ethernet-module gateways) leverage the ATSAM3SD8CA-CU's multiple serial peripherals and DMA concurrently: one USART receives from a field device while SPI services a network coprocessor and USB reports to a host, all handled by the AHB bus matrix without CPU-mediated data copies. The 64 KB SRAM comfortably holds multi-protocol buffers, and 512 KB Flash stores firmware for several protocol stacks with room for updates. The industrial temperature grade supports DIN-rail mounted gateways in cabinets, and the compact TFBGA100 keeps gateway PCB area small enough for cost-sensitive installations.
Recommandé
Test and Measurement Instrumentation
Bench accessories, data loggers, and handheld instruments use the ATSAM3SD8CA-CU's 12-bit ADC, precise timers, and USB device port to acquire, timestamp, and upload measurement data. The Cortex-M3's deterministic interrupts provide accurate time-stamping of events, while the DMA-driven ADC captures waveforms into the 64 KB SRAM without software latency. 512 KB Flash retains calibration constants and multi-range configuration tables, and USB firmware can enumerate as a virtual COM port for driver-free PC connectivity. Low-power sleep between measurement bursts extends battery life in portable instruments, and the 3.3 V operation simplifies integration with analog front-end circuitry.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM3SD8CA-CU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM3S8BA-MUR | ATSAM3N4BA-MU | ATSAM4S8CA-CU | ATSAM4N8CA-CU |
|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm, 0.8 mm pitch) | 100-TFBGA (9x9) - same footprint | 100-TFBGA (9x9) - same footprint | 100-TFBGA (9x9) - same footprint | 100-TFBGA (9x9) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Clock | Cortex-M3 @ 64 MHz | Cortex-M3 @ 64 MHz | Cortex-M3 @ 96 MHz (SAM3N) | Cortex-M4 @ 120 MHz | Cortex-M4 @ 120 MHz |
| Flash Memory | 512 KB | 512 KB | 256 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 16 KB | 128 KB | 160 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| DSP Instructions | No (Cortex-M3) | No | No | Yes (Cortex-M4) | Yes (Cortex-M4) |
Principaux différenciateurs
- Full 512 KB Flash with 64 KB SRAM in one die (vs ATSAM3N4BA-MU)
- Lowest-cost 512 KB option in the footprint (vs ATSAM4S8CA-CU)
- USB peripheral included (vs ATSAM3N4BA-MU)
Notes de conception
The 100-ball TFBGA with 0.8 mm ball pitch and 1.1 mm height requires a dedicated fanout strategy. Use either via-in-pad (with filled and capped vias) or short dog-bone escape traces to reach 0.2 mm drill vias, on a minimum 4-layer stackup with dedicated ground and power planes. Keep signal lengths from the BGA to DDR-less peripherals short and length-match only high-speed clocked buses. Follow Microchip SAM3S family layout guidance in the datasheet PCB layout section, and define a keep-out around the ball array for reflow inspection access.
Supply the device from a clean 3.3 V rail within the 1.62 V to 3.6 V operating window. Place 100 nF ceramic decoupling capacitors at each VDD ball pair plus one bulk 4.7-10 uF capacitor near the package, keeping the decoupling loop inductance minimal for Flash programming and ADC accuracy. If an external switching regulator precedes the MCU, add an LC filter or ferrite bead to reduce ripple on the analog supply. Estimated: at 64 MHz active mode, core current is on the order of tens of milliamps per the SAM3S datasheet power table - verify exact figures in the manufacturer power consumption section for your battery budget.
The 100-ball TFBGA ballout multiplexes several functions per ball: before finalizing schematic symbols, verify every peripheral assignment against the SAM3S datasheet multiplexing table, because a wrong mux choice discovered after layout forces a respin. Also, Flash execution performance depends on wait states at 64 MHz - enable the prefetch buffer and place critical routines in SRAM if timing-critical. Finally, ensure NRST and the programming/debug (JTAG/SWD) pins remain accessible on test points for in-system programming and field debugging.
Informations de conformité
Distributor listings describe the package as BGA, Grn (Green), IT, MRL A - indicating green/lead-free/halogen-free packaging with Manufacturing Readiness Level A per Mouser data. REACH and conflict-minerals status not stated in provided data.
