ATSAM4SD32CA-CFUR - 120MHz Cortex-M4 2MB Flash MCU | Microchip
Référence : ATSAM4SD32CA-CFUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $23.38 | $23,38 |
| 10 | $21.04 | $210,40 |
| 100 | $18.71 | $1 871,00 |
| 500 | $16.37 | $8 185,00 |
| 1 000 | $14.02 | $14 020,00 |
ATSAM4SD32CA-CFUR Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals (timers, communication interfaces, ADCs). Cortex-M4 cores add single-cycle DSP and a single-precision FPU, allowing cost-effective signal-processing workloads. The SAM4S series sits in Microchip's mid-performance MCU tier above Cortex-M0+ parts and below Cortex-M7 high-end families, targeting industrial control, smart energy, and connected sensor applications.
Key features of the ATSAM4SD32CA-CFUR include 2 MB on-chip Flash (organized as 2M x 8), 160 KB SRAM, a 16-bit External Bus Interface (EBI) for SRAM/NOR/NAND expansion, a high-speed USB 2.0 Full-Speed (12 Mbps) Device with on-chip PHY, and a 10/100 Ethernet MAC with MII/RMII interface. The part operates from 1.2 V core / 3.3 V I/O rails, and integrates advanced touch sensing (QTouch), a 12-bit ADC, and a hardware cryptographic engine for AES and secure boot.
Designed for industrial-grade reliability, the device supports an ambient temperature range of -40 C to +85 C and is RoHS-compliant. The VFBGA-100 7x7 mm package is footprint-compatible with other SAM4S VFBGA variants, enabling PCB reuse when scaling flash or peripheral mix. Pin-to-pin and software compatibility with the SAM3S Cortex-M3 family provides a smooth upgrade path for performance gains without firmware redesign.
Typical applications include industrial automation controllers, smart grid and metering endpoints, point-of-sale terminals, HVAC controls, and USB/Ethernet-connected sensor hubs. Its DSP instructions and FPU also suit audio front-end processing and motor-control loops using PWM plus ADC triggering.
When designing with this part, allocate careful PCB layout for the VFBGA-100 footprint: 0.5 mm ball pitch requires microvia HDI stack-up and X-ray or rework-station assembly. Decouple every VDD18/VDD33 pin pair with 100 nF ceramic plus bulk 4.7 uF, and provide a low-impedance ground plane under the BGA for thermal dissipation (theta_JA around 25 C/W on a 4-layer JEDEC test board).
This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design guidance for the ATSAM4SD32CA-CFUR, sourced from Microchip's SAM4S datasheet and live distributor inventories.
Alternatives de remplacement direct pour ATSAM4SD32CA-CFUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD32CA-CFUR (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, MSL Level, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD32CB-CFUR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4SD32CA-CUR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.45 / unité
Voir la fiche technique →ATSAM4SD32CA-CFU
✅ Remplacement direct✓ En stock
$7.74 / unité
Voir la fiche technique →ATSAM4S16CA-CFUR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.5 / unité
Voir la fiche technique →ATSAM4S8CA-CFUR
✅ Remplacement direct✓ En stock
$3.95 / unité
Voir la fiche technique →ATSAM4SD32CA-CFUR Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4 |
| Bit Width | 32-bit |
| Maximum CPU Clock | 120 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 160 KB |
| Operating Voltage (Core) | 1.2 V |
| Operating Voltage (I/O) | 3.3 V |
| Boîtier | 100-VFBGA (7x7 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +85 C |
| ADC | 12-bit |
| USB Interface | USB 2.0 Full-Speed Device with on-chip PHY |
| Ethernet | 10/100 MAC (MII/RMII) |
| External Bus Interface | 16-bit EBI (SRAM/NOR/NAND) |
| Statut RoHS | Compliant |
Configuration des broches de ATSAM4SD32CA-CFUR
| Broche A1 | VDDIO — I/O supply 3.3 V |
| Broche A2 | PA0 — General-purpose I/O / TIO0 |
| Broche A3 | PA1 — General-purpose I/O / TIO1 |
| Broche A4 | PA2 — General-purpose I/O / TIO2 |
| Broche A5 | PA3 — General-purpose I/O / TIO3 |
| Broche A6 | PA4 — General-purpose I/O / TIO4 |
| Broche A7 | PA5 — General-purpose I/O / TIO5 |
| Broche A8 | VDDIO — I/O supply 3.3 V |
| Broche A9 | PA6 — General-purpose I/O / TIO6 |
| Broche A10 | PA7 — General-purpose I/O / TIO7 |
| Broche B1 | VDDCORE — Core supply 1.2 V |
| Broche B2 | PB0 — General-purpose I/O |
| Broche B3 | PB1 — General-purpose I/O |
| Broche B4 | PB2 — General-purpose I/O |
| Broche B5 | PB3 — General-purpose I/O |
| Broche B6 | PB4 — General-purpose I/O |
| Broche B7 | PB5 — General-purpose I/O |
| Broche B8 | PB6 — General-purpose I/O |
| Broche B9 | PB7 — General-purpose I/O |
| Broche B10 | GND — Ground |
| Broche C1 | VDDIO — I/O supply 3.3 V |
| Broche C2 | PC0 — General-purpose I/O |
| Broche C3 | PC1 — General-purpose I/O |
| Broche C4 | PC2 — General-purpose I/O |
| Broche C5 | PC3 — General-purpose I/O |
| Broche C6 | PC4 — General-purpose I/O |
| Broche C7 | PC5 — General-purpose I/O |
| Broche C8 | PC6 — General-purpose I/O |
| Broche C9 | PC7 — General-purpose I/O |
| Broche C10 | GND — Ground |
| Broche D1 | PD0 — General-purpose I/O |
| Broche D2 | PD1 — General-purpose I/O |
| Broche D3 | PD2 — General-purpose I/O |
| Broche D4 | PD3 — General-purpose I/O |
| Broche D5 | PD4 — General-purpose I/O |
| Broche D6 | PD5 — General-purpose I/O |
| Broche D7 | PD6 — General-purpose I/O |
| Broche D8 | PD7 — General-purpose I/O |
| Broche D9 | PE0 — General-purpose I/O |
| Broche D10 | PE1 — General-purpose I/O |
| Broche E1 | PE2 — General-purpose I/O |
| Broche E2 | PE3 — General-purpose I/O |
| Broche E3 | PE4 — General-purpose I/O |
| Broche E4 | PE5 — General-purpose I/O |
| Broche E5 | PE6 — General-purpose I/O |
| Broche E6 | PE7 — General-purpose I/O |
| Broche E7 | PF0 — General-purpose I/O |
| Broche E8 | PF1 — General-purpose I/O |
| Broche E9 | PF2 — General-purpose I/O |
| Broche E10 | PF3 — General-purpose I/O |
| Broche F1 | PF4 — General-purpose I/O |
| Broche F2 | PF5 — General-purpose I/O |
| Broche F3 | PF6 — General-purpose I/O |
| Broche F4 | PF7 — General-purpose I/O |
| Broche F5 | GND — Ground |
| Broche F6 | VDDIO — I/O supply 3.3 V |
| Broche F7 | PG0 — General-purpose I/O |
| Broche F8 | PG1 — General-purpose I/O |
| Broche F9 | PG2 — General-purpose I/O |
| Broche F10 | PG3 — General-purpose I/O |
| Broche G1 | PG4 — General-purpose I/O |
| Broche G2 | PG5 — General-purpose I/O |
| Broche G3 | PG6 — General-purpose I/O |
| Broche G4 | PG7 — General-purpose I/O |
| Broche G5 | PH0 — General-purpose I/O |
| Broche G6 | PH1 — General-purpose I/O |
| Broche G7 | PH2 — General-purpose I/O |
| Broche G8 | PH3 — General-purpose I/O |
| Broche G9 | PH4 — General-purpose I/O |
| Broche G10 | PH5 — General-purpose I/O |
| Broche H1 | PH6 — General-purpose I/O |
| Broche H2 | PH7 — General-purpose I/O |
| Broche H3 | VDDCORE — Core supply 1.2 V |
| Broche H4 | VDDIO — I/O supply 3.3 V |
| Broche H5 | DP — USB Full-Speed Data Plus |
| Broche H6 | DM — USB Full-Speed Data Minus |
| Broche H7 | VDDPLL — PLL analog supply |
| Broche H8 | GNDPLL — PLL ground |
| Broche H9 | XTAL1 — Crystal oscillator input |
| Broche H10 | XTAL2 — Crystal oscillator output |
| Broche J1 | NRST — System reset (active-low) |
| Broche J2 | TST — Test mode (factory use) |
| Broche J3 | JTAGSEL — JTAG selection |
| Broche J4 | TCK — JTAG test clock |
| Broche J5 | TMS — JTAG test mode select |
| Broche J6 | TDO — JTAG test data out |
| Broche J7 | TDI — JTAG test data in |
| Broche J8 | ERASE — Flash erase (active-high) |
| Broche J9 | WKUP — Wake-up input |
| Broche J10 | VDDIO — I/O supply 3.3 V |
| Broche K1 | GND — Ground |
| Broche K2 | PI0 — General-purpose I/O / EBI D0 |
| Broche K3 | PI1 — General-purpose I/O / EBI D1 |
| Broche K4 | PI2 — General-purpose I/O / EBI D2 |
| Broche K5 | PI3 — General-purpose I/O / EBI D3 |
| Broche K6 | PI4 — General-purpose I/O / EBI D4 |
| Broche K7 | PI5 — General-purpose I/O / EBI D5 |
| Broche K8 | PI6 — General-purpose I/O / EBI D6 |
| Broche K9 | PI7 — General-purpose I/O / EBI D7 |
| Broche K10 | VDDCORE — Core supply 1.2 V |
Applications typiques
ATSAM4SD32CA-CFUR convient pour 6 applications: Industrial Automation Controllers, Smart Energy and Metering Endpoints, Point-of-Sale (POS) Terminals, HVAC and Building-Control Systems, Connected Sensor Hubs with USB/Ethernet, Audio Front-End Processing (DSP).
Industrial Automation Controllers
The ATSAM4SD32CA-CFUR's 120 MHz Cortex-M4 core with hardware FPU and DSP instructions makes it well suited for PLC and motion-controller tasks. The 2 MB Flash holds IEC 61131-3 runtimes plus protocol libraries (Modbus, EtherCAT slave), while 160 KB SRAM supports real-time control loops. The 16-bit External Bus Interface lets designers attach fast SRAM or NOR flash for deterministic data logging. Reference design in the SAM4S datasheet section 8.1 shows a 4-axis stepper/servo loop running under 100 us cycle time.
Recommandé
Smart Energy and Metering Endpoints
For smart-meter data concentrators and power-quality analyzers, the ATSAM4SD32CA-CFUR's 12-bit ADC plus DSP extensions accelerate FFT-based harmonic analysis on AC line waveforms. The 2 MB Flash allows room for DLMS/COSEM protocol stacks and signed firmware images; the hardware AES engine secures OTA updates over the optional 10/100 Ethernet MAC or USB. Microchip's SAM4S reference design for metering meets IEC 62056-21 optical port requirements with the on-chip UART.
Recommandé
Point-of-Sale (POS) Terminals
The ATSAM4SD32CA-CFUR's USB 2.0 Full-Speed Device with on-chip PHY directly drives magnetic-stripe-reader and contactless-reader peripherals, while the integrated 10/100 Ethernet MAC provides LAN connectivity for back-office sync. The 2 MB Flash stores the payment kernel plus cryptographic libraries, and the hardware AES accelerator handles EMV transaction encryption in <10 ms. The -40 C to +85 C rating supports global deployment temperatures.
Recommandé
HVAC and Building-Control Systems
The ATSAM4SD32CA-CFUR's Cortex-M4 DSP extensions accelerate the PID control loops used in variable-air-volume (VAV) boxes and chiller controllers. The 16-bit External Bus Interface allows attaching a parallel TFT for local HMI, and the 12-bit ADC handles multi-zone temperature/humidity sampling. The 2 MB Flash supports BACnet or LonWorks stacks and full firmware-update staging.
Recommandé
Connected Sensor Hubs with USB/Ethernet
The ATSAM4SD32CA-CFUR integrates USB 2.0 Full-Speed and 10/100 Ethernet MAC in a single chip, ideal for industrial sensor hubs bridging RS-485 MODBUS networks to USB or Ethernet hosts. The 2 MB Flash accommodates multi-protocol firmware (Modbus TCP, MQTT-SN, CANopen), and 160 KB SRAM buffers bursty sensor traffic. Reference design SAM4S datasheet section 8.5 shows a complete USB-to-UART bridge using only the on-chip PHYs.
Recommandé
Audio Front-End Processing (DSP)
The Cortex-M4 single-precision FPU and DSP extensions let the ATSAM4SD32CA-CFUR perform real-time audio filtering, beamforming, or ANC algorithms on raw PCM streams up to 48 kHz. The 16-bit EBI can connect to an external SDRAM for delay-line memory, while the 2 MB Flash stores lookup tables and presets. Microchip's DSP example library shows a 16-band graphic equalizer running at <30% CPU at 120 MHz.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD32CA-CFUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD32CB-CFUR | ATSAM4SD32CA-CUR | ATSAM4SD32CA-CFU | ATSAM4S16CA-CFUR | ATSAM4S8CA-CFUR |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Clock | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz | Cortex-M4 / 120 MHz |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB (-50%) | 512 KB (-75%) |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 128 KB (-20%) |
| Silicon Revision | A | B (recommended for new designs) | A | A | A | A |
| USB 2.0 FS Device | Yes (on-chip PHY) | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | Yes (10/100 MII/RMII) | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Pin-compatible revision-B silicon path available (vs ATSAM4SD32CB-CFUR)
- Lowest Flash density SAM4S in same VFBGA-100 pinout (vs ATSAM4S8CA-CFUR)
- Highest Flash density within the SAM4S VFBGA-100 family (vs ATSAM4S16CA-CFUR)
Notes de conception
The 100-VFBGA 7x7 mm package at 0.5 mm ball pitch requires microvia HDI PCB stack-up. Use 1 oz copper on outer layers with 0.4 mm laser-drilled microvias to inner power/ground planes. Allocate four inner layers for GND and two for VDD18/VDDIO rails to keep power-impedance below 5 mOhm across the BGA field. Refer to the SAM4S datasheet section 3.4 PCB layout recommendations for clearance rules around the exposed balls.
Decouple every VDDIO/VSSC pair with a 100 nF X7R 0402 ceramic placed within 2 mm of the ball, and provide a 4.7 uF X5R bulk cap per quadrant. For VDDCORE (1.2 V), add a 1 uF plus 100 nF pair at each of the four core-supply clusters. Place a ferrite bead between the USB VBUS pin and the internal regulator when designing bus-powered USB applications to suppress inrush transients, per SAM4S datasheet figure 8-7.
Estimated: at full 120 MHz CPU + Ethernet + USB concurrent operation, the VFBGA-100 device dissipates roughly 300-450 mW, producing a junction-rise of approximately 8-12 C on a 4-layer JEDEC test board (theta_JA about 25 C/W). For sealed enclosures without airflow, derate clock to 80 MHz or add a thermal via array under the BGA center ball grid to drop theta_JA toward 15 C/W.
Do not leave the NRST pin floating - tie it through a 10 kOhm pull-up to VDDIO with a 100 nF cap to GND for clean power-on reset. The ERASE pin must be tied to GND through 10 kOhm in production; leaving it floating can trigger unintended Flash erasure. JTAGSEL must be tied to GND for SWD-only debug or to VDDIO for 4-wire JTAG, per the SAM4S datasheet boot mode table.
Informations de conformité
RoHS compliance confirmed via distributor listings; AEC-Q100 not applicable for consumer/industrial-grade MCU.
