ATSAM4SD16CB-CFNR - SAM4S Cortex-M4 120MHz 1MB MCU | Microchip
Référence : ATSAM4SD16CB-CFNR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.65 | $765,00 |
| 500 | $6.83 | $3 415,00 |
| 1 000 | $6.12 | $6 120,00 |
ATSAM4SD16CB-CFNR Présentation
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, memory (Flash and SRAM), and a rich set of peripherals including timers, communication interfaces (USART, SPI, TWI), and analog blocks (ADC). In the wider system hierarchy, an MCU sits inside the embedded-computing IC category, below microprocessors (MPU) and above discrete logic. The Cortex-M4 core specifically targets deterministic real-time control with DSP extensions, allowing both control loops and signal-processing tasks to run on a single chip.
Key features of the ATSAM4SD16CB-CFNR include up to 120 MHz core clock, 1 MB embedded Flash (configured as 2 x 512 KB dual-bank for live updates), 160 KB SRAM, an external bus interface, a 16-bit External Interrupt Controller, and the standard SAM4S peripheral set (HS USB, CAN, EMAC, multiple USART/SPI/TWI). An integrated voltage regulator and brown-out detector simplify power-tree design at 1.2 V core / 3.3 V I/O operation.
Architecturally, the SAM4SD16 uses the Cortex-M4 with Thumb-2 instruction set, NVIC for deterministic interrupts, and a multi-layer bus matrix connecting Flash, SRAM, and peripheral bridges. This high-bandwidth interconnect is what allows the 120 MHz core to feed the Ethernet MAC, HS USB, and other high-throughput peripherals without contention. The dual-bank Flash further supports in-application programming and safe firmware updates, which is critical for products that cannot tolerate downtime during reflash.
Typical applications include industrial control and HMI panels, smart energy metering, building automation gateways, point-of-sale terminals, consumer audio peripherals, and connectivity-rich IoT edge nodes. The combination of HS USB, CAN, and EMAC makes it especially attractive for industrial gateway designs that bridge field-bus networks to Ethernet backhaul.
When designing with this part, pay attention to the VFBGA-100 PCB land pattern, keep the analog supply cleanly decoupled, and use the on-chip brown-out and watchdog features to meet IEC functional-safety expectations in industrial deployments. New designs should target silicon Revision B as recommended by the manufacturer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAM4SD16CB-CFNR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD16CB-CFNR (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD16CB-CFN
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAM4S16CB-CFN
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →ATSAM4S8CB-CFNR
✅ Remplacement direct✓ En stock
$6.85 / unité
Voir la fiche technique →ATSAM4S4CB-AN
✅ Remplacement direct✓ En stock
$3.5 / unité
Voir la fiche technique →ATSAM4SA16CB-AN
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.95 / unité
Voir la fiche technique →ATSAM4SD16CB-CFNR Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4F (32-bit, single-precision FPU) |
| Core Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| Supply Voltage (VDDCORE) | 1.2 V (typ) |
| I/O Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Boîtier | 100-VFBGA (7x7 mm) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40 C to +85 C (extended) |
| Peripherals | HS USB, CAN, EMAC, USART, SPI, TWI, EBI |
| ADC | 1 x 16-channel 12-bit ADC |
| Timers | Multiple TC, PWM, RTC |
| External Interrupt Controller | Yes (16-line) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Silicon Revision | Revision B (recommended for new designs) |
Guide de configuration des broches du ATSAM4SD16CB-CFNR 100-vfbga (7x7 mm)
Configuration des broches du ATSAM4SD16CB-CFNR (boîtier 100-vfbga (7x7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAM4SD16CB-CFNR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAM4SD16CB-CFNR convient pour 6 applications: Industrial HMI Control Panel, Smart Energy Metering, Building Automation Gateway, Point-of-Sale Terminal, Consumer Audio Peripheral, IoT Edge Sensor Node.
Industrial HMI Control Panel
The ATSAM4SD16CB-CFNR fits industrial HMI control panels because its 120 MHz Cortex-M4F core can drive a TFT LCD via the External Bus Interface while running a real-time control loop on the integrated timers. The 1 MB dual-bank Flash allows safe in-application firmware updates without halting the HMI, and 160 KB SRAM holds frame buffers and widget state. With the HS USB, CAN, and EMAC peripherals integrated, the same MCU can also handle touchscreen input, field-bus comms, and Ethernet backhaul in a single chip, reducing the BOM versus a discrete MPU plus per-host co-processor design.
Recommandé
Smart Energy Metering
The ATSAM4SD16CB-CFNR suits smart energy metering because the 12-bit ADC with up to 16 channels can sample current and voltage transducers simultaneously while the Cortex-M4F runs DSP-class RMS and harmonic calculations. The 160 KB SRAM is enough to buffer one full AC line cycle at high sample rates, and the 1 MB dual-bank Flash stores metrology libraries plus communication stacks for DLMS/COSEM or wireless M-Bus. The -40 C to +85 C industrial temperature range satisfies outdoor cabinet deployments common in AMI rollouts.
Recommandé
Building Automation Gateway
The ATSAM4SD16CB-CFNR works well as a building automation gateway because it bridges field buses (CAN, RS-485 over USART) to Ethernet via the integrated EMAC, all on one chip. The 120 MHz Cortex-M4F can run BACnet, Modbus, or KNX stacks concurrently, and the dual-bank 1 MB Flash supports OTA firmware updates so installers do not need to physically recall gateways for bug fixes. The small 100-VFBGA 7x7 mm package fits DIN-rail enclosures with strict width budgets.
Recommandé
Point-of-Sale Terminal
The ATSAM4SD16CB-CFNR powers point-of-sale terminals because the HS USB port connects to peripherals (barcode scanners, NFC readers, printers), the EMAC links to the store LAN, and the 12-bit ADC reads battery and thermal-printer head currents. The Cortex-M4F DSP extensions accelerate crypto for PCI-PTS tokenization, and the dual-bank Flash enables secure boot with rollback to a known-good image if an update fails - critical for payment terminals.
Recommandé
Consumer Audio Peripheral
The ATSAM4SD16CB-CFNR drives consumer audio peripherals because the Cortex-M4F single-precision FPU executes audio DSP (EQ, mixing, SRC) in real time, while the HS USB port streams 24-bit 96 kHz audio from a host. The 160 KB SRAM holds several seconds of audio buffer at typical sample rates, and the rich set of I2S-capable peripherals (configurable as SPI) connects directly to DACs and ADCs without an external bridge IC.
Recommandé
IoT Edge Sensor Node
The ATSAM4SD16CB-CFNR suits IoT edge sensor nodes because its low-power SAM4S sleep modes combined with the Cortex-M4F DSP extensions let the device wake, process sensor data, and transmit before returning to sleep. The HS USB simplifies factory provisioning, the integrated EMAC gives wired backhaul when needed, and the 1 MB Flash stores TLS stacks plus an OTA updater. The 100-VFBGA 7x7 mm footprint enables very compact sensor-pod form factors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD16CB-CFNR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD16CB-CFN | ATSAM4S16CB-CFN | ATSAM4S8CB-CFNR | ATSAM4S4CB-AN | ATSAM4SA16CB-AN |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 1 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (single-bank) | 512 KB | 256 KB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB | 64 KB | 160 KB |
| Ethernet MAC | Yes (EMAC) | Yes | Yes | Yes | Yes | No |
| Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Operating Voltage (Core) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Principaux différenciateurs
- Dual-bank 1 MB Flash for safe OTA updates (vs ATSAM4S16CB-CFN)
- Full SAM4S peripheral set with Ethernet MAC (vs ATSAM4SA16CB-AN)
- Tape-and-reel packaging for high-volume SMT (vs ATSAM4SD16CB-CFN)
Notes de conception
Estimated: the 100-VFBGA 7x7 mm package uses a 0.65 mm ball pitch. Per Microchip layout guidelines, place a 4-layer stack-up with a continuous ground plane under the BGA, fan-out via microvias-in-pad, and provide at least 1 oz copper for power planes. Bypass VDDCORE with 100 nF X7R per pin and bulk 4.7 uF tantalum, and keep VDDIO decoupling within 2 mm of each supply ball to meet the 120 MHz core's switching-noise envelope.
Do not assume all 100-VFBGA SAM4S parts have dual-bank Flash; the ATSAM4S16 is single-bank and cannot safely perform OTA rollbacks the way the ATSAM4SD16 (dual-bank) can. Also note that the SAM4SA family drops the EMAC peripheral, so the ATSAM4SA16CB-AN is not a substitute if you need Ethernet. Confirm peripheral presence in the device selection table of the SAM4S datasheet before committing to a layout.
Estimated: at 120 MHz with all peripherals active, the ATSAM4SD16CB-CFNR dissipates under 300 mW typical. The 100-VFBGA with a 4-layer JEDEC test board dissipates this comfortably at 85 C ambient without external cooling. For continuous 100% CPU load at elevated ambient, verify junction rise using theta_JA from the SAM4S package thermal characteristics section rather than relying on bare-package ratings.
Route the HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil. Keep the crystal traces short and symmetric, place the 12 pF load capacitors within 2 mm of the XIN/XOUT balls, and guard the analog VDDANA pin with a ferrite bead plus dedicated LDO. Following these layout rules avoids the most common SAM4S EMC and USB-compliance failures seen during certification.
Informations de conformité
RoHS compliant per Microchip product page. AEC-Q100 not applicable (industrial/consumer MCU). MSL Level 3 per JEDEC J-STD-020 for VFBGA packages.
