ATSAMA5D26B-CUR - ARM Cortex-A5 MPU 500MHz 289-LFBGA | Microchip
Référence : ATSAMA5D26B-CUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.92 | $139,20 |
| 100 | $12.45 | $1 245,00 |
| 500 | $10.95 | $5 475,00 |
| 1 000 | $9.55 | $9 550,00 |
ATSAMA5D26B-CUR Présentation
An ARM Cortex-A5 MPU (Microprocessor Unit) is an applications-class CPU core implementing the ARMv7-A architecture with optional NEON SIMD and VFPv4 floating-point support. The Cortex-A5 sits within the broader hierarchy: Cortex-A5 -> 32-bit applications core -> ARM Cortex family -> MPU -> system-on-chip. SAMA5D2 MPUs from Microchip integrate the Cortex-A5 with DDR/LPDDR controllers, image sensor interfaces, LCD controllers, Ethernet MAC, USB, and hardware crypto accelerators, replacing discrete host processors in embedded designs.
Key features of the ATSAMA5D26B-CUR include: 500 MHz maximum CPU clock, hardware cryptography (AES, SHA, TRNG), dual CAN-FD controllers, a 1 Gbps Ethernet MAC with 1588 PTP support, a 12-bit ISP image sensor pipeline, an LCD controller up to WXGA (1280x720), 5 uA backup-mode current for battery applications, and a low-power 0.8 mm ball-pitch package. The device operates from a single 1.2 V core supply with 1.8 V/3.3 V I/O rails.
The SAMA5D2 architecture pairs the Cortex-A5 core with tightly-coupled SRAM, a multi-layer AHB/APB bus matrix, dedicated peripheral DMA, and on-chip OTP for secure key storage. This heterogeneous fabric enables deterministic interrupt latency suitable for industrial HMI and motor-control co-processing while sustaining Linux/Android class application workloads.
Typical applications include industrial HMI panels, smart energy gateways, building automation controllers, medical patient monitors, point-of-sale terminals, and ruggedized IoT edge nodes. The wide operating temperature and integrated security engine also make it suitable for automotive aftermarket telematics and fleet-management gateways.
When designing with this MPU, ensure the 0.8 mm BGA is mounted on at least a 4-layer PCB with microvia-in-pad capability for the inner-row balls. Provide a low-noise LDO for the 1.2 V core rail and follow Microchip's power-sequencing recommendations in the datasheet to avoid latch-up during warm reset.
This page synthesizes distributor stock data, drop-in SAMA5D2 family variants, and practical PCB layout guidance not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour ATSAMA5D26B-CUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMA5D26B-CUR (même facteur de forme et même empreinte) — différant par Ethernet, Package, Core Architecture, USB, Display Controller.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMA5D26B-CU
✅ Remplacement direct✓ En stock
$7.5 / unité
Voir la fiche technique →ATSAMA5D26B-CNR
✅ Remplacement direct✓ En stock
$9.1 / unité
Voir la fiche technique →ATSAMA5D26A-CUR
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →ATSAMA5D24C-CUR
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →ATSAMA5D22B-CUR
✅ Remplacement direct✓ En stock
$9.1 / unité
Voir la fiche technique →ATSAMA5D26B-CUR Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-A5 (ARMv7-A) |
| Maximum CPU Clock | 500 MHz |
| Core Count | 1 |
| Bit Width | 32-bit |
| NEON MPE Co-processor | Yes |
| Boîtier | 289-LFBGA (14x14 mm) |
| Ball Pitch | 0.8 mm |
| Température de fonctionnement | -40C to +85C (industrial) |
| Supply Voltage - Core | 1.2 V |
| Supply Voltage - I/O | 1.8 V / 3.3 V |
| Backup Mode Current | 5 uA |
| Ethernet | 10/100/1000 Mbps MAC with 1588 PTP |
| USB | USB 2.0 Host + Device |
| Hardware Cryptography | AES, SHA, TRNG |
| Display Controller | LCD up to WXGA (1280x720) |
| Image Sensor Pipeline | 12-bit ISP |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du ATSAMA5D26B-CUR 289-lfbga (14x14 mm)
Configuration des broches du ATSAMA5D26B-CUR (boîtier 289-lfbga (14x14 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAMA5D26B-CUR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAMA5D26B-CUR convient pour 6 applications: Industrial HMI Panel, Smart Energy Gateway, Building Automation Controller, Medical Patient Monitor, Point-of-Sale Terminal, Ruggedized IoT Edge Node.
Industrial HMI Panel
The ATSAMA5D26B-CUR's integrated LCD controller supports displays up to 1280x720 (WXGA), providing pixel clocks for typical 7- to 10-inch industrial touchscreens. The 500 MHz Cortex-A5 with NEON acceleration handles Qt/Embedded and LVGL UIs smoothly. Hardware AES/SHA crypto enables secure boot and signed firmware updates required in IEC 62443 industrial environments. The 289-LFBGA package with 0.8 mm pitch is compatible with standard PCB fab processes. Operating from -40C to +85C suits factory-floor enclosures.
Recommandé
Smart Energy Gateway
For smart-meter data concentrators and energy gateways, the ATSAMA5D26B-CUR provides the 1 Gbps Ethernet MAC with 1588 PTP for synchronized metering plus dual CAN-FD for downstream meter-bus aggregation. The 5 uA backup-mode current extends battery life in outage reporting. Hardware crypto engines accelerate DLMS/COSEM and TLS 1.3 sessions. The integrated DDR/LPDDR controller supports commodity mobile DRAM, lowering BOM cost. Linux BSP and Yocto meta-layers from Microchip shorten time-to-market.
Recommandé
Building Automation Controller
Building automation systems require deterministic networking and rich peripheral support. The ATSAMA5D26B-CUR's dual CAN-FD, USB 2.0, I2C, SPI, and QSPI handle BACnet, KNX, Modbus, and wireless module integration simultaneously. The Cortex-A5 at 500 MHz runs BACnet stacks, scheduling logic, and HMI concurrently. Hardware TRNG seeds TLS/DTLS for cloud connectivity. Industrial temperature grade and 5 uA backup suit always-on building controllers with battery-backed RTC retention.
Recommandé
Medical Patient Monitor
Patient monitors demand deterministic real-time response alongside secure data handling. The ATSAMA5D26B-CUR's Cortex-A5 with NEON accelerates ECG/PPG DSP pipelines while the 12-bit ISP interfaces medical imaging sensors. Hardware AES and SHA engines meet HIPAA/FDA cybersecurity guidance for patient data. The 1 Gbps Ethernet with 1588 PTP synchronizes waveforms across hospital networks. Industrial temperature range ensures reliability in clinical environments with fluctuating ambient conditions.
Recommandé
Point-of-Sale Terminal
POS terminals integrate a touchscreen, printer, NFC reader, and Ethernet/Wi-Fi connectivity. The ATSAMA5D26B-CUR's LCD controller drives the touch display while USB 2.0 host ports connect printers and barcode scanners. Hardware crypto secures EMV chip-card transactions and PCI-PTS key storage. The Cortex-A5 at 500 MHz runs Linux/Android POS applications with sub-second boot via the optimized boot ROM. The 289-LFBGA package suits compact terminal enclosures.
Recommandé
Ruggedized IoT Edge Node
Ruggedized edge nodes for outdoor or vehicle-mounted deployments benefit from the ATSAMA5D26B-CUR's -40C to +85C industrial temperature range and 5 uA backup current for solar-powered installations. The Cortex-A5 at 500 MHz runs edge-AI inference via NCNN/TFLite with NEON acceleration. Dual CAN-FD interfaces vehicle bus systems, while 1 Gbps Ethernet with PTP synchronizes distributed edge nodes. The 289-LFBGA 0.8 mm pitch is compatible with conformal-coated ruggedized PCB assemblies.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMA5D26B-CUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMA5D26B-CU | ATSAMA5D26B-CNR | ATSAMA5D26A-CUR | ATSAMA5D24C-CUR | ATSAMA5D22B-CUR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same |
| CPU Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz (A rev) | Cortex-A5 500 MHz (lower tier) | Cortex-A5 500 MHz (lower tier) |
| Silicon Revision | B (current) | B (current) | B (current) | A (NRND) | C (current) | B (current) |
| Operating Temperature | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel (alternate) | Tape & Reel | Tape & Reel | Tape & Reel |
| Peripheral Tier | Full SAMA5D26 (high) | Full SAMA5D26 | Full SAMA5D26 | Full SAMA5D26 (A rev) | Mid SAMA5D24 | Entry SAMA5D22 |
Principaux différenciateurs
- Current production silicon revision (vs ATSAMA5D26A-CUR)
- Industrial operating temperature range (vs ATSAMA5D26B-CU)
- Highest peripheral tier in the SAMA5D2 family (vs ATSAMA5D24C-CUR / ATSAMA5D22B-CUR)
Notes de conception
The 289-LFBGA 14x14 mm package uses 0.8 mm ball pitch. Microchip recommends at least a 4-layer PCB stack-up with microvia-in-pad for the inner-row balls, and a 1.6 mm finished board thickness to ensure reliable BGA soldering. Escape routing on the top layer should use 4-mil traces with 4-mil spacing to fan out from the inner balls; consult the SAMA5D2 hardware design guide for via pattern templates. Use ENIG surface finish for industrial-grade reliability.
Power sequencing is critical: VDDCORE (1.2 V) must rise before VDDIO (3.3 V / 1.8 V), with a maximum delay of 50 ms specified in the datasheet. Use a dedicated PMIC such as the Microchip MCP16502 or a discrete LDO+sequencer pair. The backup mode draws 5 uA from the backup battery rail; ensure a low-leakage Schottky diode isolates this rail from the main supply during power-down to maximize RTC retention.
Estimated thermal analysis: with VDDCORE 1.2 V at 500 MHz full-load, the MPU dissipates approximately 0.6-0.9 W depending on peripheral utilization. With the LFBGA package theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, junction temperature rise is roughly 15-23 C above ambient. For -40C to +85C industrial operation, derating to 70 C ambient is recommended; for sealed enclosures, route thermal vias under the exposed die pad to an internal copper plane.
Common pitfalls when designing with the ATSAMA5D26B-CUR: (1) DDR3L vs LPDDR2 power-rail differences - the SAMA5D26 supports both but boot ROM configuration differs; (2) JTAG/SWD pin sharing with SDMMC - isolate with series resistors if both interfaces are used during development; (3) BOOT pins must be pulled to known states via 10k resistors to select the correct boot source (NAND, SD, SPI flash, or USB); (4) the NRST input is sensitive to noise - decouple with 100 nF directly at the pin.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - automotive applications should consult Microchip's AEC-Q100 qualified MPU portfolio.