ATSAMA5D26B-CUR - ARM Cortex-A5 MPU 500MHz 289-LFBGA | Microchip
Teilenummer: ATSAMA5D26B-CUR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.92 | $139,20 |
| 100 | $12.45 | $1.245,00 |
| 500 | $10.95 | $5.475,00 |
| 1.000 | $9.55 | $9.550,00 |
ATSAMA5D26B-CUR Übersicht
An ARM Cortex-A5 MPU (Microprocessor Unit) is an applications-class CPU core implementing the ARMv7-A architecture with optional NEON SIMD and VFPv4 floating-point support. The Cortex-A5 sits within the broader hierarchy: Cortex-A5 -> 32-bit applications core -> ARM Cortex family -> MPU -> system-on-chip. SAMA5D2 MPUs from Microchip integrate the Cortex-A5 with DDR/LPDDR controllers, image sensor interfaces, LCD controllers, Ethernet MAC, USB, and hardware crypto accelerators, replacing discrete host processors in embedded designs.
Key features of the ATSAMA5D26B-CUR include: 500 MHz maximum CPU clock, hardware cryptography (AES, SHA, TRNG), dual CAN-FD controllers, a 1 Gbps Ethernet MAC with 1588 PTP support, a 12-bit ISP image sensor pipeline, an LCD controller up to WXGA (1280x720), 5 uA backup-mode current for battery applications, and a low-power 0.8 mm ball-pitch package. The device operates from a single 1.2 V core supply with 1.8 V/3.3 V I/O rails.
The SAMA5D2 architecture pairs the Cortex-A5 core with tightly-coupled SRAM, a multi-layer AHB/APB bus matrix, dedicated peripheral DMA, and on-chip OTP for secure key storage. This heterogeneous fabric enables deterministic interrupt latency suitable for industrial HMI and motor-control co-processing while sustaining Linux/Android class application workloads.
Typical applications include industrial HMI panels, smart energy gateways, building automation controllers, medical patient monitors, point-of-sale terminals, and ruggedized IoT edge nodes. The wide operating temperature and integrated security engine also make it suitable for automotive aftermarket telematics and fleet-management gateways.
When designing with this MPU, ensure the 0.8 mm BGA is mounted on at least a 4-layer PCB with microvia-in-pad capability for the inner-row balls. Provide a low-noise LDO for the 1.2 V core rail and follow Microchip's power-sequencing recommendations in the datasheet to avoid latch-up during warm reset.
This page synthesizes distributor stock data, drop-in SAMA5D2 family variants, and practical PCB layout guidance not found in the standalone manufacturer datasheet.
Drop-in-Alternativen für ATSAMA5D26B-CUR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMA5D26B-CUR (gleiche Bauform und Footprint) – abweichend in Ethernet, Package, Core Architecture, USB, Display Controller.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAMA5D26B-CU
✅ Drop-In✓ Auf Lager
$7.5 / Stück
Datenblatt ansehen →ATSAMA5D26B-CNR
✅ Drop-In✓ Auf Lager
$9.1 / Stück
Datenblatt ansehen →ATSAMA5D26A-CUR
✅ Drop-In✓ Auf Lager
$14.2 / Stück
Datenblatt ansehen →ATSAMA5D24C-CUR
✅ Drop-In✓ Auf Lager
$10.2 / Stück
Datenblatt ansehen →ATSAMA5D22B-CUR
✅ Drop-In✓ Auf Lager
$9.1 / Stück
Datenblatt ansehen →ATSAMA5D26B-CUR Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-A5 (ARMv7-A) |
| Maximum CPU Clock | 500 MHz |
| Core Count | 1 |
| Bit Width | 32-bit |
| NEON MPE Co-processor | Yes |
| Gehäuse | 289-LFBGA (14x14 mm) |
| Ball Pitch | 0.8 mm |
| Betriebstemperatur | -40C to +85C (industrial) |
| Supply Voltage - Core | 1.2 V |
| Supply Voltage - I/O | 1.8 V / 3.3 V |
| Backup Mode Current | 5 uA |
| Ethernet | 10/100/1000 Mbps MAC with 1588 PTP |
| USB | USB 2.0 Host + Device |
| Hardware Cryptography | AES, SHA, TRNG |
| Display Controller | LCD up to WXGA (1280x720) |
| Image Sensor Pipeline | 12-bit ISP |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
ATSAMA5D26B-CUR 289-lfbga (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für ATSAMA5D26B-CUR (289-lfbga (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMA5D26B-CUR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAMA5D26B-CUR ist geeignet für 6 Anwendungs: Industrial HMI Panel, Smart Energy Gateway, Building Automation Controller, Medical Patient Monitor, Point-of-Sale Terminal, Ruggedized IoT Edge Node.
Industrial HMI Panel
The ATSAMA5D26B-CUR's integrated LCD controller supports displays up to 1280x720 (WXGA), providing pixel clocks for typical 7- to 10-inch industrial touchscreens. The 500 MHz Cortex-A5 with NEON acceleration handles Qt/Embedded and LVGL UIs smoothly. Hardware AES/SHA crypto enables secure boot and signed firmware updates required in IEC 62443 industrial environments. The 289-LFBGA package with 0.8 mm pitch is compatible with standard PCB fab processes. Operating from -40C to +85C suits factory-floor enclosures.
Empfohlen
Smart Energy Gateway
For smart-meter data concentrators and energy gateways, the ATSAMA5D26B-CUR provides the 1 Gbps Ethernet MAC with 1588 PTP for synchronized metering plus dual CAN-FD for downstream meter-bus aggregation. The 5 uA backup-mode current extends battery life in outage reporting. Hardware crypto engines accelerate DLMS/COSEM and TLS 1.3 sessions. The integrated DDR/LPDDR controller supports commodity mobile DRAM, lowering BOM cost. Linux BSP and Yocto meta-layers from Microchip shorten time-to-market.
Empfohlen
Building Automation Controller
Building automation systems require deterministic networking and rich peripheral support. The ATSAMA5D26B-CUR's dual CAN-FD, USB 2.0, I2C, SPI, and QSPI handle BACnet, KNX, Modbus, and wireless module integration simultaneously. The Cortex-A5 at 500 MHz runs BACnet stacks, scheduling logic, and HMI concurrently. Hardware TRNG seeds TLS/DTLS for cloud connectivity. Industrial temperature grade and 5 uA backup suit always-on building controllers with battery-backed RTC retention.
Empfohlen
Medical Patient Monitor
Patient monitors demand deterministic real-time response alongside secure data handling. The ATSAMA5D26B-CUR's Cortex-A5 with NEON accelerates ECG/PPG DSP pipelines while the 12-bit ISP interfaces medical imaging sensors. Hardware AES and SHA engines meet HIPAA/FDA cybersecurity guidance for patient data. The 1 Gbps Ethernet with 1588 PTP synchronizes waveforms across hospital networks. Industrial temperature range ensures reliability in clinical environments with fluctuating ambient conditions.
Empfohlen
Point-of-Sale Terminal
POS terminals integrate a touchscreen, printer, NFC reader, and Ethernet/Wi-Fi connectivity. The ATSAMA5D26B-CUR's LCD controller drives the touch display while USB 2.0 host ports connect printers and barcode scanners. Hardware crypto secures EMV chip-card transactions and PCI-PTS key storage. The Cortex-A5 at 500 MHz runs Linux/Android POS applications with sub-second boot via the optimized boot ROM. The 289-LFBGA package suits compact terminal enclosures.
Empfohlen
Ruggedized IoT Edge Node
Ruggedized edge nodes for outdoor or vehicle-mounted deployments benefit from the ATSAMA5D26B-CUR's -40C to +85C industrial temperature range and 5 uA backup current for solar-powered installations. The Cortex-A5 at 500 MHz runs edge-AI inference via NCNN/TFLite with NEON acceleration. Dual CAN-FD interfaces vehicle bus systems, while 1 Gbps Ethernet with PTP synchronizes distributed edge nodes. The 289-LFBGA 0.8 mm pitch is compatible with conformal-coated ruggedized PCB assemblies.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMA5D26B-CUR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAMA5D26B-CU | ATSAMA5D26B-CNR | ATSAMA5D26A-CUR | ATSAMA5D24C-CUR | ATSAMA5D22B-CUR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (14x14) | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same | 289-LFBGA (14x14) - same |
| CPU Core | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz | Cortex-A5 500 MHz (A rev) | Cortex-A5 500 MHz (lower tier) | Cortex-A5 500 MHz (lower tier) |
| Silicon Revision | B (current) | B (current) | B (current) | A (NRND) | C (current) | B (current) |
| Operating Temperature | -40C to +85C (industrial) | 0C to +70C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Packaging Format | Tape & Reel | Tray | Tape & Reel (alternate) | Tape & Reel | Tape & Reel | Tape & Reel |
| Peripheral Tier | Full SAMA5D26 (high) | Full SAMA5D26 | Full SAMA5D26 | Full SAMA5D26 (A rev) | Mid SAMA5D24 | Entry SAMA5D22 |
Wichtigste Unterscheidungsmerkmale
- Current production silicon revision (vs. ATSAMA5D26A-CUR)
- Industrial operating temperature range (vs. ATSAMA5D26B-CU)
- Highest peripheral tier in the SAMA5D2 family (vs. ATSAMA5D24C-CUR / ATSAMA5D22B-CUR)
Designhinweise
The 289-LFBGA 14x14 mm package uses 0.8 mm ball pitch. Microchip recommends at least a 4-layer PCB stack-up with microvia-in-pad for the inner-row balls, and a 1.6 mm finished board thickness to ensure reliable BGA soldering. Escape routing on the top layer should use 4-mil traces with 4-mil spacing to fan out from the inner balls; consult the SAMA5D2 hardware design guide for via pattern templates. Use ENIG surface finish for industrial-grade reliability.
Power sequencing is critical: VDDCORE (1.2 V) must rise before VDDIO (3.3 V / 1.8 V), with a maximum delay of 50 ms specified in the datasheet. Use a dedicated PMIC such as the Microchip MCP16502 or a discrete LDO+sequencer pair. The backup mode draws 5 uA from the backup battery rail; ensure a low-leakage Schottky diode isolates this rail from the main supply during power-down to maximize RTC retention.
Estimated thermal analysis: with VDDCORE 1.2 V at 500 MHz full-load, the MPU dissipates approximately 0.6-0.9 W depending on peripheral utilization. With the LFBGA package theta_JA of approximately 25 C/W on a 4-layer JEDEC test board, junction temperature rise is roughly 15-23 C above ambient. For -40C to +85C industrial operation, derating to 70 C ambient is recommended; for sealed enclosures, route thermal vias under the exposed die pad to an internal copper plane.
Common pitfalls when designing with the ATSAMA5D26B-CUR: (1) DDR3L vs LPDDR2 power-rail differences - the SAMA5D26 supports both but boot ROM configuration differs; (2) JTAG/SWD pin sharing with SDMMC - isolate with series resistors if both interfaces are used during development; (3) BOOT pins must be pulled to known states via 10k resistors to select the correct boot source (NAND, SD, SPI flash, or USB); (4) the NRST input is sensitive to noise - decouple with 100 nF directly at the pin.
Compliance-Informationen
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - automotive applications should consult Microchip's AEC-Q100 qualified MPU portfolio.