ATSAMA5D26C-CN - Cortex-A5 500MHz MPU, 289-LFBGA | Microchip
Référence : ATSAMA5D26C-CN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.55 | $9,55 |
| 10 | $8.97 | $89,70 |
| 100 | $8.21 | $821,00 |
| 500 | $7.45 | $3 725,00 |
| 1 000 | $6.82 | $6 820,00 |
ATSAMA5D26C-CN Présentation
A microprocessor (MPU) is an integrated circuit containing a complete central processing unit, cache, memory management unit, and peripheral interfaces on a single die. Unlike microcontrollers (MCUs) which integrate flash and RAM on-chip for compact real-time tasks, MPUs typically require external DDR memory and run a full operating system such as Linux. Within the embedded hierarchy, the SAMA5D2 family occupies the MPU tier above Cortex-M microcontrollers but below Cortex-A application processors, providing a balanced trade-off between performance, power consumption, and system cost.
Key features include 500 MHz Cortex-A5 core with FPU, 128 KB on-chip SRAM, 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 controller, dual QSPI and e.MMC flash interfaces, hardware cryptography (AES, SHA, TRNG), 5 uA backup current, and an embedded audio subsystem with I2S and class-D amplifier interfaces. The 0.8 mm ball pitch package reduces PCB design complexity compared to finer-pitch alternatives.
The architecture combines a Cortex-A5 core with NEON media extensions, hardware crypto engines, and a dedicated audio subsystem that offloads sound processing from the CPU. The deep-sleep power management scheme maintains RTC and 32 KB backup SRAM while consuming only 5 uA, extending battery life in always-on IoT edge nodes.
Typical applications include industrial HMI panels, IoT edge gateways, smart energy meters, medical point-of-care devices, and secure connected terminals. The hardware cryptography and secure boot make it suitable for payment terminals and access control systems requiring tamper resistance.
When designing with this MPU, plan PCB layout for the 289-ball BGA with at least 4 layers and via-in-pad for signal integrity on DDR traces. Verify DDR timing against the SAMA5D2 hardware design checklist and use Microchip's Linux4SAM BSP for boot validation.
This page synthesizes distributor pricing, SAMA5D2 family drop-in alternatives, and practical layout guidance not consolidated in the manufacturer datasheet, accelerating component selection for industrial MPU designs.
Alternatives de remplacement direct pour ATSAMA5D26C-CN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMA5D26C-CN (même facteur de forme et même empreinte) — différant par Package, Ethernet, USB, Operating Temperature, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMA5D26B-CU
✅ Remplacement direct✓ En stock
$7.5 / unité
Voir la fiche technique →ATSAMA5D26A-CN
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →ATSAMA5D26C-CNR
✅ Remplacement direct✓ En stock
$10.85 / unité
Voir la fiche technique →ATSAMA5D26A-CUR
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →ATSAMA5D24C-CUR
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →ATSAMA5D225C-D1M-CU
✅ Remplacement direct✓ En stock
$12.6 / unité
Voir la fiche technique →ATSAMA5D26C-CN Valeurs maximales et caractéristiques électriques
| Manufacturer | Microchip Technology |
| Series | SAMA5D2 |
| Core Processor | ARM Cortex-A5 |
| Core Count | 1 |
| Bit Width | 32-bit |
| Maximum CPU Clock | 500 MHz |
| On-chip SRAM | 128 KB |
| Backup SRAM | 32 KB (5 uA retention) |
| FPU | Yes (single/double precision) |
| Boîtier | 289-LFBGA 14x14 mm, 0.8 mm pitch |
| External Memory Bus | 16-bit DDR2/DDR3L/LPDDR2/LPDDR3 |
| Flash Interfaces | 2x QSPI, e.MMC, NAND |
| Hardware Crypto | AES, SHA, TRNG, secure boot |
| Embedded Audio Subsystem | Yes (I2S, class-D amplifier interface) |
| Température de fonctionnement | -40C to +85C (industrial) |
| Tension d'alimentation | 1.2 V core (typ) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du ATSAMA5D26C-CN 289-lfbga 14x14 mm, 0.8 mm pitch
Configuration des broches du ATSAMA5D26C-CN (boîtier 289-lfbga 14x14 mm, 0.8 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAMA5D26C-CN.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAMA5D26C-CN convient pour 6 applications: Industrial HMI Panels, IoT Edge Gateways, Smart Energy Meters, Medical Point-of-Care Devices, Secure Payment Terminals, Connected Building Access Control.
Industrial HMI Panels
The ATSAMA5D26C-CN drives industrial HMI panels with its 500 MHz Cortex-A5 core, 16-bit DDR3L controller for framebuffer bandwidth, and the embedded audio subsystem for touchscreen beep feedback. The 289-LFBGA package fits behind 7-10 inch LCD panels while industrial -40C to +85C temperature range supports factory-floor deployment. The hardware crypto engine secures operator authentication via TLS to backend SCADA systems, and Linux4SAM BSP supports Qt/GTK GUI toolchains for rapid HMI development.
Recommandé
IoT Edge Gateways
For IoT edge gateways aggregating sensor data from Modbus, CAN, and Ethernet field buses, the ATSAMA5D26C-CN delivers 500 MHz of Cortex-A5 compute with FPU for edge analytics while drawing under 2 W typical. The hardware AES/SHA accelerators handle TLS/DTLS encryption at line rate without CPU loading, and the 5 uA backup mode preserves RTC and 32 KB of context RAM across battery swaps. Dual QSPI interfaces allow concurrent firmware A/B partitioning for OTA-safe updates on Linux-based gateways.
Recommandé
Smart Energy Meters
The ATSAMA5D26C-CN powers next-generation smart electricity meters combining metrology DSP, secure communication, and local display. Its hardware TRNG and secure boot satisfy IEC 62443 cybersecurity requirements for grid infrastructure, while the embedded audio subsystem drives audible alerts for meter tampering events. Industrial temperature operation and 5 uA backup current extend battery life in power-outage scenarios, and the 16-bit DDR2/LPDDR2 interface supports the large frame buffers required for graphical tariff displays.
Recommandé
Medical Point-of-Care Devices
Point-of-care diagnostic devices leverage the ATSAMA5D26C-CN's Cortex-A5 FPU for biomarker analysis algorithms while the hardware crypto engine ensures HIPAA-compliant patient data encryption. The embedded audio subsystem enables voice-guided test instructions through integrated speakers, and the 500 MHz performance sustains both the user interface and the sample analysis pipeline concurrently. Low 5 uA backup mode preserves patient session logs across device dock events in clinical workflows.
Recommandé
Secure Payment Terminals
Payment terminals benefit from the ATSAMA5D26C-CN's secure boot chain, hardware AES/SHA accelerators for PCI-PTS compliant PIN encryption, and tamper-detection interfaces. The 500 MHz Cortex-A5 runs Linux with the terminal application stack while dedicated crypto engines offload EMV and contactless transaction processing. The 289-LFBGA package supports compact terminal form factors, and the industrial temperature range ensures reliability in retail and outdoor kiosk deployments.
Recommandé
Connected Building Access Control
Building access controllers use the ATSAMA5D26C-CN to manage RFID/NFC readers, door strikes, and IP-networked audit logging. The Cortex-A5 with FPU runs facial recognition edge inference at the door while hardware crypto secures biometric template storage. The embedded audio subsystem drives intercom prompts, and the 5 uA backup preserves access logs during power outages. Industrial temperature tolerance supports outdoor and parking-garage access point installations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMA5D26C-CN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMA5D26B-CU | ATSAMA5D26A-CN | ATSAMA5D26C-CNR | ATSAMA5D24C-CUR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 289-LFBGA (CN) 14x14 mm | 289-LFBGA (CU) 14x14 mm - same | 289-LFBGA (CN) 14x14 mm - same | 289-LFBGA (CN) 14x14 mm - same | 289-LFBGA (CU) 14x14 mm - same |
| Silicon Revision | C | B (older) | A (oldest) | C (same) | C (D24 sub-family) |
| CPU Clock | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Embedded Audio Subsystem | Yes | Yes | Yes | Yes | No (D24 omits audio) |
| Hardware Crypto Engine | Yes (AES/SHA/TRNG) | Yes | Yes | Yes | No (D24 omits crypto) |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Embedded audio subsystem integrated on-chip (vs ATSAMA5D24C-CUR)
- Hardware cryptography engine with secure boot (vs ATSAMA5D24C-CUR)
- Latest silicon revision C with errata fixes (vs ATSAMA5D26B-CU)
Notes de conception
Estimated: design the ATSAMA5D26C-CN PCB with at least 4 layers using a continuous ground plane beneath the 289-LFBGA package. Route DDR2/DDR3L traces as 50-ohm single-ended with matched-length groups within +/-25 mils and length-matched clock pair within +/-10 mils. Use via-in-pad with filled-and-capped vias for BGA breakouts to preserve signal integrity on the 0.8 mm pitch ball grid. Reference Microchip application note SAMA5D2 Hardware Design Checklist for the full layout guidelines.
The 289-LFBGA package thermal resistance theta_JA is approximately 25 C/W on a 4-layer JEDEC test board. At 1.2 V core and 500 MHz running full Dhrystone load, the MPU dissipates around 1.5 W typical, yielding a 38 C junction rise above ambient - acceptable for industrial enclosures up to ~60 C ambient. For sealed outdoor enclosures above 70 C, add thermal vias under the BGA thermal pad and connect them to inner ground planes for spreading.
Do not omit the external 32.768 kHz crystal on the SAMA5D26C-CN - the RTC and backup SRAM domain require it for timekeeping and 5 uA retention. Use only Linux4SAM BSP versions >= 4.19 with the matched silicon revision; earlier kernels lack revision C errata workarounds. Verify the boot configuration straps (BMS, JTAG/SWD) before first power-up to prevent bricking the secure boot fuse bits.
Informations de conformité
RoHS compliant per Microchip product page. Industrial -40C to +85C temperature grade (not AEC-Q100 automotive qualified). Lead-free BGA balls per JEDEC J-STD-020 MSL3 classification.
