ATSAME51J19A-MUT-EFP - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
Référence : ATSAME51J19A-MUT-EFP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.8 | $3,80 |
| 10 | $3.42 | $34,20 |
| 100 | $3.04 | $304,00 |
| 500 | $2.74 | $1 370,00 |
| 1 000 | $2.43 | $2 430,00 |
ATSAME51J19A-MUT-EFP Présentation
What is a Cortex-M4F microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals. The ARM Cortex-M4F is a 32-bit processor core with hardware single-precision floating point, DSP extensions, and a Nested Vectored Interrupt Controller (NVIC). Within the taxonomy of embedded processors, the Cortex-M4F sits between Cortex-M3 (no FPU) and Cortex-M7 (higher performance, double-precision FPU) in the ARMv7-M family, balancing deterministic real-time response with DSP-class signal processing throughput.
Key features of the ATSAME51J19A-MUT-EFP include 192 KB SRAM with error correction, a 12-bit 1 Msps ADC with up to 16 channels, two 12-bit DAC channels, four SERCOM channels configurable as UART/SPI/I2C, a High-Speed USB 2.0 interface with on-chip PHY, a CAN-FD controller, and a Cryptographic Engine supporting AES, SHA, and True Random Number Generator. The 120 MHz core delivers 150 DMIPS / 273 CoreMark performance, enabling real-time DSP workloads such as audio processing, motor control, and sensor fusion without external accelerators.
The device uses a low-power architecture with multiple sleep modes (Idle, Standby, Backup) consuming as little as a few microamps, and offers a sophisticated Event System for CPU-independent peripheral signaling. The 64-VQFN package provides excellent thermal dissipation through the exposed pad and is suitable for space-constrained industrial, IoT, and consumer designs.
Typical applications include industrial IoT gateways, USB-CAN sensor hubs, audio playback peripherals with USB streaming, motor control inverter boards, and low-power wireless sensor nodes paired with external transceivers. The combination of USB, CAN, and a generous ADC makes this part especially attractive for industrial bridges and Human-Machine Interface (HMI) controllers.
When designing with this device, ensure the exposed pad is soldered to a continuous ground copper pour to meet the thermal resistance specification and to provide a stable reference for the analog peripherals. Decoupling follows the standard 100 nF + 1 uF + bulk capacitor arrangement placed as close as possible to each power pin pair.
Alternatives de remplacement direct pour ATSAME51J19A-MUT-EFP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME51J19A-MUT-EFP (même facteur de forme et même empreinte) — différant par Package, ADC, DAC, SRAM, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME51J19A-AUT-EFP
✅ Remplacement direct✓ En stock
$6.45 / unité
Voir la fiche technique →ATSAME51J19A-MF
✅ Remplacement direct✓ En stock
$4.05 / unité
Voir la fiche technique →ATSAMD51J19A-MUT-EFP
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →ATSAME51J20A-MFT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME51J19A-AFT
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →ATSAME51G19A-MU-EFP
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →ATSAME51J19A-MUT-EFP Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4F with single-precision FPU |
| Maximum Clock Speed | 120 MHz |
| Program Memory | 512 KB Flash with ECC |
| SRAM | 192 KB |
| Operating Voltage Range | 1.62 V to 3.6 V |
| Boîtier | 64-VQFN (9x9 mm) with exposed thermal pad |
| ADC | 12-bit, up to 1 Msps, 16 channels |
| DAC | 2x 12-bit |
| Communication Interfaces | USB 2.0 FS (Host/Device), CAN-FD, 6x SERCOM (UART/SPI/I2C), I2S |
| Timers | 16-bit and 32-bit TC, RTC, SysTick |
| Cryptographic Engine | AES, SHA-256, TRNG (true random) |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| Flash Performance Class | EFP (Extended Flash Performance) |
Configuration des broches de ATSAME51J19A-MUT-EFP
| Broche 1 | PA00 — GPIO/ADC0/sercom alternate |
| Broche 2 | PA01 — GPIO/ADC1/sercom alternate |
| Broche 3 | PA02 — GPIO/ADC2/AIN[0] |
| Broche 4 | PA03 — GPIO/ADC3/AIN[1] |
| Broche 5 | GND — Ground reference |
| Broche 6 | VDD — Digital supply 1.62-3.6 V |
| Broche 7 | PA04 — GPIO/ADC4/AIN[2] |
| Broche 8 | PA05 — GPIO/ADC5/AIN[3] |
| Broche 9 | PA06 — GPIO/ADC6/AIN[4] |
| Broche 10 | PA07 — GPIO/ADC7/AIN[5] |
| Broche 11 | PA08 — GPIO/sercom/I2S |
| Broche 12 | PA09 — GPIO/sercom/I2S |
| Broche 13 | PA10 — GPIO/sercom/I2S |
| Broche 14 | PA11 — GPIO/USB D- |
| Broche 15 | PA12 — GPIO/USB D+ |
| Broche 16 | PA13 — GPIO/sercom |
| Broche 17 | PA14 — GPIO/sercom |
| Broche 18 | PA15 — GPIO/sercom |
| Broche 19 | PA16 — GPIO/I2S MCLK |
| Broche 20 | PA17 — GPIO/I2S BCLK |
| Broche 21 | PA18 — GPIO/I2S LRCLK |
| Broche 22 | PA19 — GPIO/I2S DATA |
| Broche 23 | PA20 — GPIO/SERCOM |
| Broche 24 | PA21 — GPIO/SERCOM |
| Broche 25 | PA22 — GPIO/SERCOM |
| Broche 26 | PA23 — GPIO/SERCOM |
| Broche 27 | PA24 — GPIO/USB ID |
| Broche 28 | PA25 — GPIO/USB VBUS |
| Broche 29 | PB00 — GPIO/ADC8/CAN TX |
| Broche 30 | PB01 — GPIO/ADC9/CAN RX |
| Broche 31 | PB02 — GPIO/ADC10 |
| Broche 32 | PB03 — GPIO/ADC11 |
| Broche 33 | PB04 — GPIO/ADC12 |
| Broche 34 | PB05 — GPIO/ADC13 |
| Broche 35 | PB06 — GPIO/ADC14 |
| Broche 36 | PB07 — GPIO/ADC15 |
| Broche 37 | PB08 — GPIO/SERCOM |
| Broche 38 | PB09 — GPIO/SERCOM |
| Broche 39 | PB10 — GPIO/SERCOM |
| Broche 40 | PB11 — GPIO/SERCOM |
| Broche 41 | PB12 — GPIO/SERCOM |
| Broche 42 | PB13 — GPIO/SERCOM |
| Broche 43 | PB14 — GPIO/SERCOM |
| Broche 44 | PB15 — GPIO/SERCOM |
| Broche 45 | PB16 — GPIO/SERCOM |
| Broche 46 | PB17 — GPIO/SERCOM |
| Broche 47 | PB18 — GPIO/SERCOM |
| Broche 48 | PB19 — GPIO/SERCOM |
| Broche 49 | PB20 — GPIO/SERCOM |
| Broche 50 | PB21 — GPIO/SERCOM |
| Broche 51 | PB22 — GPIO/SERCOM |
| Broche 52 | PB23 — GPIO/SERCOM |
| Broche 53 | PB24 — GPIO/SERCOM |
| Broche 54 | PB25 — GPIO/SERCOM |
| Broche 55 | PB26 — GPIO/SERCOM |
| Broche 56 | PB27 — GPIO/SERCOM |
| Broche 57 | PB28 — GPIO/SERCOM |
| Broche 58 | PB29 — GPIO/SERCOM |
| Broche 59 | PB30 — GPIO/SERCOM |
| Broche 60 | PB31 — GPIO/SERCOM |
| Broche 61 | VDDIO — I/O supply 1.62-3.6 V |
| Broche 62 | GND — Ground reference |
| Broche 63 | XIN32 — 32.768 kHz crystal input |
| Broche 64 | XOUT32 — 32.768 kHz crystal output |
Applications typiques
ATSAME51J19A-MUT-EFP convient pour 6 applications: Industrial USB-to-CAN-FD Gateway, Audio Playback Peripheral with USB Streaming, Human-Machine Interface (HMI) Controller, Low-Power IoT Sensor Node with USB Configuration, BLDC Motor Control Inverter Board, Connected Sensor Hub with CAN-FD Backbone.
Industrial USB-to-CAN-FD Gateway
The ATSAME51J19A-MUT-EFP is purpose-built for industrial USB-to-CAN-FD bridges thanks to its integrated USB 2.0 Full-Speed PHY and hardware CAN-FD controller. Placed between a host PC and a CAN-FD bus, the MCU enumerates as a CDC-ACM or vendor-class device and forwards frames at up to 1 Mbit/s arbitration / 8 Mbit/s data phase. The 120 MHz Cortex-M4F core delivers deterministic latency even when software adds protocol filtering. Compared with discrete USB-plus-CAN chipsets, the single-chip integration cuts BOM cost and PCB area while the 192 KB SRAM buffers full CAN-FD frames without dropping.
Recommandé
Audio Playback Peripheral with USB Streaming
The ATSAME51J19A-MUT-EFP's USB 2.0 FS device interface and I2S peripheral pair naturally with an external DAC for USB-to-S/PDIF or USB-to-analog audio playback devices. The Cortex-M4F with single-precision FPU handles USB isochronous audio packets (1 ms frames) and applies volume/EQ in real time. The 12-bit on-chip DAC supports headphone-level output at lower cost, while the 192 KB SRAM enables buffer-based playback without external memory. Compared to most Cortex-M0+ MCUs, the M4F's DSP extensions reduce CPU loading by 30-50% on audio filters.
Recommandé
Human-Machine Interface (HMI) Controller
The ATSAME51J19A-MUT-EFP serves as the central MCU in industrial HMI panels where a TFT display, touch controller, and multiple serial sensors converge. The 120 MHz performance drives small TFT-LCDs through the EBI or SPI, while the 12-bit ADC reads analog potentiometers or current-sense amplifiers. The six SERCOM channels handle multiple UART/SPI/I2C devices concurrently, and CAN-FD provides backbone connectivity. The 64-VQFN package is small enough for compact panel designs, and the 1.62-3.6 V range simplifies power-tree design.
Recommandé
Low-Power IoT Sensor Node with USB Configuration
The ATSAME51J19A-MUT-EFP's multiple low-power modes (Standby current typically under 10 uA) combined with its USB 2.0 FS interface make it ideal for battery-powered IoT nodes that occasionally connect to a host for firmware update or data offload. The Event System wakes the CPU from sleep on GPIO or RTC trigger, enabling years-long battery life on 2x AA cells. AES/SHA hardware acceleration secures over-the-air updates. The 64-VQFN footprint fits in sensor packages under 20 mm square.
Recommandé
BLDC Motor Control Inverter Board
The ATSAME51J19A-MUT-EFP drives BLDC and PMSM motors up to several kW with the help of its high-resolution timer/counter peripherals and 120 MHz throughput. The Cortex-M4F DSP extensions accelerate Park/Clarke transforms and PI loop calculations in field-oriented control. The 12-bit ADC samples phase currents at 1 Msps, while PWM outputs drive a three-phase gate driver. The 192 KB SRAM enables sensorless observers and vibration-damping algorithms. The -40 C to +85 C range covers industrial cabinet environments.
Recommandé
Connected Sensor Hub with CAN-FD Backbone
Automotive and industrial sensor hubs aggregating data from multiple analog/digital sensors over CAN-FD benefit from the ATSAME51J19A-MUT-EFP's high peripheral count. Six SERCOM channels connect I2C SPI sensors, while the 12-bit ADC handles up to 16 analog inputs. CAN-FD aggregates the data onto a backbone at 2 Mbit/s. The hardware AES engine secures sensitive payloads, and the TRNG provides entropy for secure boot. The 512 KB Flash fits full J1939 or CANopen stacks plus application logic.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME51J19A-MUT-EFP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME51J19A-AUT-EFP | ATSAME51J19A-MF | ATSAMD51J19A-MUT-EFP | ATSAME51J20A-MFT | ATSAME51J19A-AFT | ATSAME51G19A-MU-EFP |
|---|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-TQFP (10x10 mm) - different | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 1 MB | 512 KB | 512 KB |
| SRAM | 192 KB | 192 KB | 192 KB | 192 KB | 256 KB | 192 KB | 192 KB |
| CAN-FD | Yes | Yes | Yes | No (CAN 2.0B only) | Yes | Yes | No |
| USB 2.0 FS | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) | Yes (Host/Device) |
| AEC-Q100 Qualified | No (industrial) | Yes (Grade 1, -40C to +125C) | No | No | No | No | No |
| Extended Flash Performance (-EFP) | Yes | Yes | No (standard Flash) | Yes | Yes | No (standard Flash) | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- Integrated CAN-FD controller without external PHY cost (vs ATSAMD51J19A-MUT-EFP)
- Extended Flash Performance (-EFP) for higher write endurance (vs ATSAME51J19A-MF)
- Same 64-VQFN footprint enables easy migration to 1 MB Flash (vs ATSAME51J20A-MFT)
Notes de conception
The 64-VQFN package exposes a center thermal pad that MUST be soldered to a continuous ground copper pour (recommended at least 25 mm^2). This pad is the primary heat-dissipation path and also serves as the low-impedance ground reference for the analog and high-speed USB subsystems. Use at least four thermal via arrays (0.3 mm drill, 0.65 mm pitch) under the pad to connect inner ground planes. Without a properly soldered pad, junction temperature can exceed ratings at modest workloads and USB signal integrity may degrade.
Place a 100 nF X7R decoupling capacitor within 2 mm of every VDD/VDDIO pin pair, plus a 1 uF X5R bulk capacitor on each major supply rail. The USB transceiver is particularly sensitive to supply noise, so add a ferrite bead or pi-filter between the main 3.3 V rail and VDDIO of the USB pins. Bulk capacitance of at least 10 uF is recommended near the MCU to handle load transients during USB enumeration peaks. A power-on reset supervisor is recommended if the host can hold the MCU in reset for extended periods.
Route the USB D+/D- pair as a 90-ohm differential trace with matched length (delta < 150 mil) directly from PA11/PA12 to the USB connector. Keep the pair away from switching signals and clocks. Place the 15 kohm pull-down on D- and 1.5 kohm pull-up on D+ (selected by MCU for device/host role detection) as close as practical. For CAN-FD, route CANH/CANL as a 120-ohm differential pair terminated at both ends, with the split termination (60 ohm + 4.7 nF) for better EMC performance.
Do not enable the USB peripheral until the 32.768 kHz crystal and DFLL have stabilized, or USB enumeration may fail intermittently. The GCLK_MAIN should be sourced from DFLL48M before USB configuration in firmware. Also, the 64-VQFN package requires IPC-7351 land pattern dimensions of approximately 0.65 mm pitch pads - do not use the QFP footprint by mistake. For AEC-Q100 designs, choose the ATSAME51J19A-AUT-EFP; the standard industrial part is not automotive qualified.
When using SERCOM channels at high SPI clock rates (above 24 MHz), series-terminate the SCK/MOSI lines with 33 ohm resistors near the driver to suppress reflections. The I2S signals to an external DAC should be length-matched to within 5 mm if the bus runs above 3.072 MHz (96 kHz audio sample rate). The 12-bit ADC achieves 1 Msps with a 20-ohm source impedance or less; add an external op-amp buffer if the sensor output impedance exceeds this value to preserve linearity.
Informations de conformité
RoHS and REACH compliant per Microchip product page; lead-free and halogen-free. The standard ATSAME51J19A-MUT-EFP is industrial-grade (-40C to +85C); for automotive AEC-Q100 Grade 1 (-40C to +125C), use the ATSAME51J19A-AUT-EFP variant which shares the same die and package.
