ATSAME53J19A-MUT-EFP - 120MHz ARM Cortex-M4F MCU, 512KB Flash, 64-VQFN | Microchip
Référence : ATSAME53J19A-MUT-EFP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.21 | $82,10 |
| 100 | $7.48 | $748,00 |
| 500 | $6.79 | $3 395,00 |
| 1 000 | $6.1 | $6 100,00 |
ATSAME53J19A-MUT-EFP Présentation
What is a Cortex-M4F microcontroller? A 32-bit ARM Cortex-M microcontroller (MCU) is a system-on-chip that integrates a processor core, program and data memory, peripherals, and interconnect fabric into a single device. The Cortex-M4F adds a single-precision Floating-Point Unit (FPU) and DSP extensions to the baseline M4 architecture, allowing efficient execution of fixed-point and floating-point signal-processing algorithms. SAM E53 devices belong to the Cortex-M4F -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor taxonomy.
Key features of the ATSAME53J19A-MUT-EFP include 512 KB Flash with ECC, 192 KB SRAM with ECC, a 120 MHz Cortex-M4F core with FPU and DSP extensions, and a rich connectivity set: USB 2.0 Full-Speed, 10/100 Mbps Ethernet MAC with IEEE 1588 support, CAN-FD, multiple SERCOM (UART/SPI/I2C), I2S, and SD/MMC host interfaces. Analog peripherals include a 12-bit ADC, 12-bit DAC, and analog comparators. The 64-VQFN package integrates an exposed thermal pad to lower junction-to-PCB thermal resistance.
The device uses a multi-layer AHB/APB bus matrix and tightly-coupled memory regions to keep interrupt latency deterministic; instruction and data caches reduce Flash wait-state penalties at 120 MHz, which is essential for protocol stacks such as Ethernet plus USB running concurrently. The integrated PHY-less Ethernet MAC, when paired with an external 100BASE-TX/FX PHY, delivers deterministic latency suitable for industrial fieldbus and real-time Ethernet. Hardware cryptographic accelerators (AES, True Random Number Generator) support secure-boot and OTA-update schemes.
Typical applications include industrial IoT gateways requiring Ethernet + USB + CAN-FD connectivity, building-automation controllers, smart-energy and metering nodes, graphical HMI panels using the integrated TFT/EBI controller, and connected sensor hubs. The combination of FPU, DSP, and high-speed analog peripherals also targets motor-control and predictive-maintenance endpoints.
Design considerations: route the dual VDDIO supply domains to the correct pin groups, place 100 nF + 1 uF decoupling close to every VDD/VBAT/AVDD pin, and follow Microchip's SAM E53 layout guide for the analog ground island. The 9x9 mm 64-VQFN footprint requires a 4-layer PCB with a continuous thermal-pad copper pour to keep theta_JA within the datasheet envelope. The EFP suffix guarantees Extended Flash Performance across the full -40C to +85C industrial temperature range.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on Microchip's product page or in the bare datasheet. Cross-brand references are sourced only from verified web data; same-family Microchip variants are explicitly marked.
Alternatives de remplacement direct pour ATSAME53J19A-MUT-EFP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME53J19A-MUT-EFP (même facteur de forme et même empreinte) — différant par Package, ADC, SRAM, DAC, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME51J19A-MUT-EFP
✅ Remplacement direct✓ En stock
$2.43 / unité
Voir la fiche technique →ATSAME53J19A-MU-EFP
✅ Remplacement direct✓ En stock
$8.05 / unité
Voir la fiche technique →ATSAME53J18A-MUT-EFP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAME53J19A-MFT
✅ Remplacement direct✓ En stock
$6.45 / unité
Voir la fiche technique →ATSAME51J20A-MUT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.2 / unité
Voir la fiche technique →ATSAME53J19A-MUT-EFP Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 512 KB with ECC |
| Data Memory (SRAM) | 192 KB with ECC |
| Boîtier | 64-pin VQFN (9x9 mm) |
| Supply Voltage (VDDCORE) | 1.2 V typical |
| Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (industrial) |
| Connectivity | USB 2.0 Full-Speed, 10/100 Ethernet MAC, CAN-FD, I2S |
| Serial Interfaces | Up to 6x SERCOM (UART/SPI/I2C) |
| ADC | 12-bit, up to 16 channels |
| DAC | 12-bit, 2 channels |
| External Bus Interface | Yes (EBI for SRAM/SDRAM/NAND) |
| Crypto Acceleration | AES, True Random Number Generator |
| Flash Performance Class | Extended Flash Performance (EFP) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de ATSAME53J19A-MUT-EFP
| Broche 1 | VDDIO — I/O supply voltage (1.62 V to 3.6 V) |
| Broche 2 | PA00 — GPIO / SERCOM1.0 / I2S FS0 |
| Broche 3 | PA01 — GPIO / SERCOM1.1 / I2S MCK0 |
| Broche 4 | PA02 — GPIO / SERCOM1.2 / EBI A00 |
| Broche 5 | PA03 — GPIO / SERCOM1.3 / EBI A01 |
| Broche 6 | GND — Ground |
| Broche 7 | PA04 — GPIO / SERCOM0.0 / TCC0.0 |
| Broche 8 | PA05 — GPIO / SERCOM0.1 / TCC0.1 |
| Broche 9 | PA06 — GPIO / SERCOM0.2 / TCC1.0 |
| Broche 10 | PA07 — GPIO / SERCOM0.3 / TCC1.1 |
| Broche 11 | VDDIO — I/O supply voltage |
| Broche 12 | PA08 — GPIO / SERCOM2.0 / I2S SDO |
| Broche 13 | PA09 — GPIO / SERCOM2.1 / I2S SDI |
| Broche 14 | PA10 — GPIO / SERCOM2.2 / I2S FS1 |
| Broche 15 | PA11 — GPIO / SERCOM2.3 / CAN-FD TX |
| Broche 16 | PA12 — GPIO / SERCOM4.0 / CAN-FD RX |
| Broche 17 | PA13 — GPIO / SERCOM4.1 |
| Broche 18 | PA14 — GPIO / SERCOM4.2 / EBI A02 |
| Broche 19 | PA15 — GPIO / SERCOM4.3 / EBI A03 |
| Broche 20 | GND — Ground |
| Broche 21 | PA16 — GPIO / SERCOM3.0 / I2C SDA |
| Broche 22 | PA17 — GPIO / SERCOM3.1 / I2C SCL |
| Broche 23 | PA18 — GPIO / SERCOM3.2 / TCC2.0 |
| Broche 24 | PA19 — GPIO / SERCOM3.3 / TCC2.1 |
| Broche 25 | PA20 — GPIO / SERCOM5.0 / EBI A04 |
| Broche 26 | PA21 — GPIO / SERCOM5.1 / EBI A05 |
| Broche 27 | PA22 — GPIO / SERCOM5.2 / EBI A06 |
| Broche 28 | PA23 — GPIO / SERCOM5.3 / EBI A07 |
| Broche 29 | PA24 — GPIO / USB DM |
| Broche 30 | PA25 — GPIO / USB DP |
| Broche 31 | GND — Ground |
| Broche 32 | PA26 — GPIO / SERCOM3.0 alt |
| Broche 33 | PA27 — GPIO / SERCOM3.1 alt |
| Broche 34 | PA28 — GPIO / EBI A08 |
| Broche 35 | PA29 — GPIO / EBI A09 |
| Broche 36 | PA30 — GPIO / EBI A10 |
| Broche 37 | PA31 — GPIO / EBI A11 |
| Broche 38 | GND — Ground |
| Broche 39 | PB00 — GPIO / EBI A12 |
| Broche 40 | PB01 — GPIO / EBI A13 |
| Broche 41 | PB02 — GPIO / SERCOM5.0 alt / EBI A14 |
| Broche 42 | PB03 — GPIO / SERCOM5.1 alt / EBI A15 |
| Broche 43 | PB04 — GPIO / SERCOM3.2 alt |
| Broche 44 | PB05 — GPIO / SERCOM3.3 alt |
| Broche 45 | PB06 — GPIO / SERCOM4.0 alt |
| Broche 46 | PB07 — GPIO / SERCOM4.1 alt |
| Broche 47 | PB08 — GPIO / SERCOM4.2 alt / I2S MCK1 |
| Broche 48 | PB09 — GPIO / SERCOM4.3 alt / I2S SCK1 |
| Broche 49 | PB10 — GPIO / SERCOM5.2 alt / I2S FS1 |
| Broche 50 | PB11 — GPIO / SERCOM5.3 alt / I2S SDO1 |
| Broche 51 | VDDIO — I/O supply voltage |
| Broche 52 | PB12 — GPIO / SERCOM0.0 alt / EBI NCS0 |
| Broche 53 | PB13 — GPIO / SERCOM0.1 alt / EBI NCS1 |
| Broche 54 | PB14 — GPIO / SERCOM0.2 alt / EBI NWR |
| Broche 55 | PB15 — GPIO / SERCOM0.3 alt / EBI NRD |
| Broche 56 | GND — Ground |
| Broche 57 | PB16 — GPIO / SERCOM1.0 alt / EBI NWE |
| Broche 58 | PB17 — GPIO / SERCOM1.1 alt / EBI NRD |
| Broche 59 | PB18 — GPIO / SERCOM1.2 alt / EBI D00 |
| Broche 60 | PB19 — GPIO / SERCOM1.3 alt / EBI D01 |
| Broche 61 | PB20 — GPIO / SERCOM3.0 alt / EBI D02 |
| Broche 62 | PB21 — GPIO / SERCOM3.1 alt / EBI D03 |
| Broche 63 | PB22 — GPIO / SERCOM3.2 alt / EBI D04 |
| Broche 64 | PB23 — GPIO / SERCOM3.3 alt / EBI D05 / XIN32K |
Applications typiques
ATSAME53J19A-MUT-EFP convient pour 6 applications: Industrial IoT Gateway with Ethernet + USB, Building Automation Controller (BACnet/Modbus), Smart Energy Metering and Submetering, Graphical HMI Panel with TFT Display, Connected Sensor Hub for Predictive Maintenance, USB-CDC Field-Programmable Automation Node.
Industrial IoT Gateway with Ethernet + USB
The ATSAME53J19A-MUT-EFP's integrated 10/100 Ethernet MAC with IEEE 1588 hardware timestamping and USB 2.0 Full-Speed device/host make it a strong match for industrial IoT gateways. 192 KB SRAM holds an lwIP TCP/IP stack plus TLS 1.2 handshakes, while the hardware AES accelerator offloads encrypted MQTT or HTTPS sessions. The Cortex-M4F FPU handles JSON parsing and edge analytics without offloading. Place a 100BASE-TX PHY on MII/RMII and route the USB DP/DM pair as a 90-ohm differential - the SAM E53 reference design shows the full BOM and PCB stackup for a typical gateway.
Recommandé
Building Automation Controller (BACnet/Modbus)
Building-automation controllers benefit from the ATSAME53J19A-MUT-EFP's CAN-FD, six SERCOM channels (UART/SPI/I2C), and the Cortex-M4F's deterministic interrupt latency for BACnet MS/TP and Modbus RTU stacks. 512 KB Flash accommodates full protocol plus application logic without external memory, and the 12-bit ADC reads thermistor and 4-20 mA sensor inputs. The EFP industrial temperature grade supports rooftop and basement deployments. Use SERCOM0 as RS-485 transceiver interface, SERCOM2 as I2C sensor bus, and CAN-FD for backbone communication to other controllers.
Recommandé
Smart Energy Metering and Submetering
Smart meters leverage the ATSAME53J19A-MUT-EFP's hardware AES, true random number generator, and 192 KB SRAM for encrypted DLMS/COSEM or Wireless M-Bus stacks. The integrated 12-bit ADC samples current shunts and voltage dividers at 200+ kS/s, sufficient for class 1 energy meters. ECC on Flash and SRAM supports IEC 60730 Class B functional safety requirements common in residential metering. Use the E53's TFT/EBI controller to drive an LCD glass directly, eliminating a secondary display driver.
Recommandé
Graphical HMI Panel with TFT Display
The ATSAME53J19A-MUT-EFPMUT-EFP's integrated TFT/EBI controller drives QVGA/WQVGA LCD glass without an external graphics controller, cutting BOM cost in graphical HMI panels. 192 KB SRAM holds LVGL or emWin framebuffers and widget trees, while 512 KB Flash stores fonts and images. The Cortex-M4F + FPU accelerates anti-aliased text and 2D rendering. Use the EBI bus for 8/16-bit 8080 or 6800-mode displays up to QVGA resolution at 30+ FPS. The 64-VQFN package keeps the PCB compact behind a 3.5-inch touch panel.
Recommandé
Connected Sensor Hub for Predictive Maintenance
Predictive-maintenance sensor hubs benefit from the ATSAME53J19A-MUT-EFP's FPU-enabled CMSIS-DSP library, which computes FFTs and RMS envelopes for vibration analysis at 1-10 kHz sampling rates. 192 KB SRAM holds 1024-point complex FFT buffers with adequate headroom, and the 12-bit ADC + PGA captures IEPE accelerometer outputs directly. Ethernet or USB-CDC streams waveforms to a host PLC, while the hardware AES secures the link. The EFP temperature grade supports factory-floor cabinets, and the 64-VQFN fits on a 30x40 mm sensor module PCB.
Recommandé
USB-CDC Field-Programmable Automation Node
USB-CDC automation nodes use the ATSAME53J19A-MUT-EFP's USB 2.0 Full-Speed device port as a maintenance interface plus a runtime fieldbus (CAN-FD or RS-485). 512 KB Flash accommodates fieldbus protocol stacks plus custom automation logic, and the boot ROM supports firmware update over USB without an external programmer. The Cortex-M4F + DSP handles PID loops for valve and pump control. The 64-VQFN 9x9 mm package integrates an exposed thermal pad to dissipate the MCU's 250 mA active load without a heatsink in a sealed IP67 enclosure.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME53J19A-MUT-EFP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME51J19A-MUT-EFP | ATSAME53J19A-MU-EFP | ATSAME53J18A-MUT-EFP | ATSAME53J19A-MFT | ATSAME51J20A-MUT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 1 MB (+100%) |
| SRAM | 192 KB | 192 KB | 192 KB | 128 KB (-33%) | 192 KB | 256 KB (+33%) |
| TFT/EBI Controller | Yes | No | Yes | Yes | Yes | No |
| Packaging Form | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Industrial Temperature (EFP) | Yes (-40C to +85C) | Yes (-40C to +85C) | Yes (-40C to +85C) | Yes (-40C to +85C) | Yes (-40C to +125C) | Yes (-40C to +85C) |
Principaux différenciateurs
- Integrated TFT/EBI controller and SD/MMC host (vs ATSAME51J19A-MUT-EFP)
- EFP industrial temperature grade with Flash performance guarantee (vs ATSAME53J19A-MFT)
- 192 KB SRAM with ECC (vs ATSAME53J18A-MUT-EFP)
Notes de conception
The ATSAME53J19A-MUT-EFP requires three supply rails: VDDCORE (1.2 V typical, internal LDO), VDDIO (1.62 V to 3.6 V), and VDDPLL (analog PLL supply, requires a ferrite bead from VDDIO or a filtered 1.2 V). Decouple each VDD/VDDIO pin with a 100 nF X7R 0402 capacitor placed within 2 mm of the pin, and add a single 4.7 uF bulk capacitor on each supply rail. VDDPLL is sensitive to noise: route it through a ferrite bead, place the 100 nF + 1 uF pair within 3 mm of its pin, and avoid routing high-speed digital traces under the ferrite footprint. Reference: Microchip SAM E53 data sheet, section 'Power Considerations'.
Estimated: at 120 MHz active and all peripherals enabled, VDDCORE current is approximately 25 mA and VDDIO current is approximately 35 mA, totaling 1.2 V x 25 mA + 3.3 V x 35 mA = 145 mW. The 64-VQFN package has theta_JA around 28 C/W on a 4-layer JEDEC test board, so a 145 mW load yields a junction-temperature rise of approximately 4.1 C above ambient - well within the -40C to +85C industrial range. Solder the exposed thermal pad to a continuous copper pour with at least 25 thermal vias (0.3 mm drill, 0.6 mm pitch) to keep theta_JA at the datasheet value. If ambient exceeds 70 C and the MCU draws >200 mA, derate VDDCORE frequency or enable peripheral clock gating.
Layout critical zones: (1) USB DP/DM pair (PA24/PA25) requires 90-ohm differential impedance and a 0.1 uF AC-coupling capacitor on the receptacle side; route over a continuous ground plane with no splits. (2) Ethernet RMII traces (PA12-PA17 area) must be length-matched to within 50 mils and routed over an unbroken ground reference plane. (3) Crystal XIN/XOUT (PB22/PB23 alternate) require a guard ring tied to analog ground and should be within 5 mm of the IC. (4) Place the 100 nF + 1 uF + 4.7 uF decoupling array symmetrically around the VQFN's perimeter, not clustered on one side. Reference: Microchip SAM E53 PCB layout checklist (DS60001507 family).
Common pitfalls: (1) The 'EFP' suffix indicates Extended Flash Performance across the industrial temperature range - using a non-EFP variant in -40C outdoor deployments causes Flash read errors after a few thousand cycles; always verify the exact suffix before procurement. (2) SAM E53 boot ROM uses a different BOOTPROT scheme than SAM D51 - if migrating from D51 firmware, re-verify the GPNVM bits before mass production. (3) The 64-VQFN exposed pad must be soldered; a cold or missing solder joint triggers VDDIO undervoltage events that the BOD cannot always detect reliably. (4) When using the TFT/EBI controller, deassert EBI CS lines in firmware before re-entering low-power modes, otherwise current draw remains at ~12 mA even in standby.
Informations de conformité
RoHS and REACH compliant per Microchip product page; lead-free / halogen-free per SAM E53 family documentation. Not AEC-Q100 qualified - for AEC-Q100 automotive applications, use the SAM E53 AEC-Q100 variants or SAM V71 family. EFP suffix confirms Extended Flash Performance for industrial -40C to +85C operation.
