ATSAME70N19B-CNT - Cortex-M7 MCU 300MHz 512KB Flash 100-TFBGA
Référence : ATSAME70N19B-CNT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.16 | $13,16 |
| 10 | $12.4 | $124,00 |
| 100 | $11.2 | $1 120,00 |
| 500 | $10.05 | $5 025,00 |
| 1 000 | $9.2 | $9 200,00 |
ATSAME70N19B-CNT Présentation
A microcontroller (MCU) is an integrated circuit containing a CPU core, program memory (Flash), data memory (SRAM), and a configurable set of on-chip peripherals such as timers, ADC/DAC, communication controllers (USART/SPI/TWI), and GPIO. The ARM Cortex-M7 architecture extends the Cortex-M4 instruction set with a superscalar pipeline, dual-issue load/store, and an IEEE 754 single-precision FPU, placing the SAME70 in the high-performance tier of Cortex-M microcontrollers — between mainstream Cortex-M4 devices and application processors. SAME70 MCUs sit within the broader hierarchy of microcontrollers -> embedded processors -> semiconductor ICs.
Key features of the ATSAME70N19B-CNT include 512 KB Flash, 256 KB SRAM, a 300 MHz maximum CPU clock, an integrated FPU, and a High-Speed USB controller with on-chip PHY. The part is offered in a 100-ball Thin-profile Fine-pitch BGA (TFBGA) measuring 9x9 mm, providing dense I/O access in a compact footprint suitable for space-constrained designs. The industrial-grade temperature range and integrated peripherals reduce BOM cost by replacing external communication or memory chips.
The SAME70 architecture integrates a multi-layer bus matrix that allows simultaneous transfers between the CPU, DMA, and peripheral subsystems. The on-chip Flash accelerator and instruction cache deliver deterministic interrupt latency and enable sustained DSP throughput suitable for motor control, audio codecs, and complex sensor fusion. The integrated Ethernet MAC and HS USB PHY simplify connectivity in industrial gateways and connected sensor nodes.
Typical applications include industrial motor control (FOC for BLDC and PMSM drives), high-speed data acquisition and signal processing, building automation controllers, IoT edge nodes with Ethernet connectivity, audio processing, and HMI subsystems with display support. The combination of DSP extensions, large SRAM, and high-speed peripherals also makes it suitable for point-of-sale terminals and medical instrumentation.
When designing with the ATSAME70N19B-CNT, designers should carefully consider PCB routing for the BGA fan-out, decoupling strategy for the 1.2V core rail, and trace impedance for the Ethernet and HS-USB differential pairs. The TFBGA package requires reflow profiling that matches the package's thermal mass to avoid solder joint defects.
This page synthesizes distributor pricing, drop-in alternatives within the SAME70 family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAME70N19B-CNT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70N19B-CNT (même facteur de forme et même empreinte) — différant par Package, SRAM, Core Architecture, MSL Level, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70N20B-CNT
✅ Remplacement direct✓ En stock
$10.5 / unité
Voir la fiche technique →ATSAME70N21B-CNT
✅ Remplacement direct✓ En stock
$9.28 / unité
Voir la fiche technique →ATSAME70Q21A-CNT
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →ATSAME70N19B-CFN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N19B-ANT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N19B-CNT Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M7 with FPU |
| Maximum CPU Clock | 300 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 256 KB |
| Largeur du bus de données | 32-bit |
| Core Count | Single-core |
| Boîtier | 100-TFBGA (9x9 mm) |
| Type de montage | Surface Mount |
| Communication Interfaces | USART, SPI, TWI (I2C), HS USB with on-chip PHY, Ethernet MAC (per family) |
| Statut RoHS | Compliant |
| Series | SAM E70 |
| Niveau MSL | 3 (per BGA) |
Configuration des broches de ATSAME70N19B-CNT
| Broche A1 | VDDIO — I/O supply voltage |
| Broche A2 | PB0 — GPIO / peripheral function |
| Broche A3 | PB1 — GPIO / peripheral function |
| Broche A4 | PB2 — GPIO / peripheral function |
| Broche A5 | PB3 — GPIO / peripheral function |
| Broche A6 | VDDCORE — Core supply voltage (1.2V) |
| Broche A7 | GND — Ground |
| Broche A8 | PA0 — GPIO / peripheral function |
| Broche A9 | PA1 — GPIO / peripheral function |
| Broche A10 | PA2 — GPIO / peripheral function |
| Broche B1 | PC0 — GPIO / peripheral function |
| Broche B2 | PC1 — GPIO / peripheral function |
| Broche B3 | PC2 — GPIO / peripheral function |
| Broche B4 | PC3 — GPIO / peripheral function |
| Broche B5 | VDDIO — I/O supply voltage |
| Broche B6 | GND — Ground |
| Broche B7 | PA3 — GPIO / peripheral function |
| Broche B8 | PA4 — GPIO / peripheral function |
| Broche B9 | PA5 — GPIO / peripheral function |
| Broche B10 | PA6 — GPIO / peripheral function |
| Broche C1 | PC4 — GPIO / peripheral function |
| Broche C2 | PC5 — GPIO / peripheral function |
| Broche C3 | PC6 — GPIO / peripheral function |
| Broche C4 | PC7 — GPIO / peripheral function |
| Broche C5 | PD0 — GPIO / peripheral function |
| Broche C6 | PD1 — GPIO / peripheral function |
| Broche C7 | PA7 — GPIO / peripheral function |
| Broche C8 | PA8 — GPIO / peripheral function |
| Broche C9 | PA9 — GPIO / peripheral function |
| Broche C10 | PA10 — GPIO / peripheral function |
| Broche D1 | PD2 — GPIO / peripheral function |
| Broche D2 | PD3 — GPIO / peripheral function |
| Broche D3 | PD4 — GPIO / peripheral function |
| Broche D4 | PD5 — GPIO / peripheral function |
| Broche D5 | PD6 — GPIO / peripheral function |
| Broche D6 | PD7 — GPIO / peripheral function |
| Broche D7 | PA11 — GPIO / peripheral function |
| Broche D8 | PA12 — GPIO / peripheral function |
| Broche D9 | PA13 — GPIO / peripheral function |
| Broche D10 | PA14 — GPIO / peripheral function |
| Broche E1 | PE0 — GPIO / peripheral function |
| Broche E2 | PE1 — GPIO / peripheral function |
| Broche E3 | PE2 — GPIO / peripheral function |
| Broche E4 | PE3 — GPIO / peripheral function |
| Broche E5 | PE4 — GPIO / peripheral function |
| Broche E6 | PE5 — GPIO / peripheral function |
| Broche E7 | PA15 — GPIO / peripheral function |
| Broche E8 | PA16 — GPIO / peripheral function |
| Broche E9 | PA17 — GPIO / peripheral function |
| Broche E10 | PA18 — GPIO / peripheral function |
| Broche F1 | PF0 — GPIO / peripheral function |
| Broche F2 | PF1 — GPIO / peripheral function |
| Broche F3 | PF2 — GPIO / peripheral function |
| Broche F4 | PF3 — GPIO / peripheral function |
| Broche F5 | VDDCORE — Core supply voltage (1.2V) |
| Broche F6 | GND — Ground |
| Broche F7 | PA19 — GPIO / peripheral function |
| Broche F8 | PA20 — GPIO / peripheral function |
| Broche F9 | PA21 — GPIO / peripheral function |
| Broche F10 | PA22 — GPIO / peripheral function |
| Broche G1 | PF4 — GPIO / peripheral function |
| Broche G2 | PF5 — GPIO / peripheral function |
| Broche G3 | PF6 — GPIO / peripheral function |
| Broche G4 | PF7 — GPIO / peripheral function |
| Broche G5 | PG0 — GPIO / peripheral function |
| Broche G6 | PG1 — GPIO / peripheral function |
| Broche G7 | PA23 — GPIO / peripheral function |
| Broche G8 | PA24 — GPIO / peripheral function |
| Broche G9 | PA25 — GPIO / peripheral function |
| Broche G10 | PA26 — GPIO / peripheral function |
| Broche H1 | PG2 — GPIO / peripheral function |
| Broche H2 | PG3 — GPIO / peripheral function |
| Broche H3 | PG4 — GPIO / peripheral function |
| Broche H4 | PG5 — GPIO / peripheral function |
| Broche H5 | PG6 — GPIO / peripheral function |
| Broche H6 | PG7 — GPIO / peripheral function |
| Broche H7 | PA27 — GPIO / peripheral function |
| Broche H8 | PA28 — GPIO / peripheral function |
| Broche H9 | VDDIO — I/O supply voltage |
| Broche H10 | GND — Ground |
| Broche J1 | PH0 — GPIO / peripheral function |
| Broche J2 | PH1 — GPIO / peripheral function |
| Broche J3 | PH2 — GPIO / peripheral function |
| Broche J4 | PH3 — GPIO / peripheral function |
| Broche J5 | PH4 — GPIO / peripheral function |
| Broche J6 | PH5 — GPIO / peripheral function |
| Broche J7 | PA29 — GPIO / peripheral function |
| Broche J8 | PA30 — GPIO / peripheral function |
| Broche J9 | PA31 — GPIO / peripheral function |
| Broche J10 | NRST — Reset (active low) |
| Broche K1 | PI0 — GPIO / peripheral function |
| Broche K2 | PI1 — GPIO / peripheral function |
| Broche K3 | PI2 — GPIO / peripheral function |
| Broche K4 | PI3 — GPIO / peripheral function |
| Broche K5 | PI4 — GPIO / peripheral function |
| Broche K6 | PI5 — GPIO / peripheral function |
| Broche K7 | VDDCORE — Core supply voltage (1.2V) |
| Broche K8 | GND — Ground |
| Broche K9 | TDI — JTAG Test Data In |
| Broche K10 | TDO — JTAG Test Data Out |
Applications typiques
ATSAME70N19B-CNT convient pour 8 applications: Industrial Motor Control (FOC / BLDC / PMSM), High-Speed Data Acquisition and Signal Processing, Industrial Ethernet Gateway and IoT Edge Node, Building Automation and HVAC Controllers, Audio Processing and Consumer Electronics, Medical Instrumentation and Patient Monitoring, Human-Machine Interface (HMI) and Point-of-Sale Terminals, Power Conversion and Digital Power Supplies.
Industrial Motor Control (FOC / BLDC / PMSM)
The ATSAME70N19B-CNT's 300 MHz Cortex-M7 core with single-precision FPU and DSP extensions is well-suited for field-oriented control (FOC) of three-phase BLDC and PMSM motors. The 256 KB SRAM supports real-time commutation tables, current-controller state variables, and sensor-fusion algorithms, while the 512 KB Flash holds the full motor-control state machine plus peripheral drivers. The integrated PWM timers and high-speed ADC enable current-loop execution in under 1 microsecond, allowing torque-ripple reduction and high-RPM operation. The 100-TFBGA package fits compact inverter PCBs alongside gate drivers and power stages. For multi-axis systems, designers can leverage the SAME70N20 or Q21 variants for additional memory without changing PCB layout, simplifying platform migration across product families.
Recommandé
High-Speed Data Acquisition and Signal Processing
The ATSAME70N19B-CNT's 300 MHz Cortex-M7 with DSP extensions executes FIR, FFT, and CMSIS-DSP routines fast enough for real-time vibration analysis, condition monitoring, and predictive maintenance. The 256 KB SRAM is sufficient for 1024-point FFT buffers, while the 512 KB Flash accommodates application firmware plus DSP libraries. The integrated high-speed ADC (12-bit, up to 2 Msps on the family) pairs with DMA-driven sample streaming for sustained acquisition without CPU intervention. Designers typically route sensor inputs through the AFEC peripheral and process them via the ARM CMSIS-DSP library. This combination delivers professional-grade data acquisition in a compact TFBGA footprint suitable for industrial sensor front-ends and laboratory instrumentation.
Recommandé
Industrial Ethernet Gateway and IoT Edge Node
The SAME70 family integrates a 10/100 Ethernet MAC (GMII/RMII to external PHY) and High-Speed USB 2.0 with on-chip HS PHY, making the ATSAME70N19B-CNT a strong candidate for industrial gateways and IoT edge nodes. The 300 MHz Cortex-M7 runs TCP/IP stacks (lwIP, CycloneTCP) and application logic concurrently, with DMA channels dedicated to packet transfer between Ethernet and SRAM. The 256 KB SRAM buffers network packets and application data, while the 512 KB Flash stores the protocol stack, TLS libraries, and application firmware. Industrial temperature grade and EMC-robust design enable deployment on factory floors. Designers pair the MCU with an external Ethernet PHY such as the KSZ8081 and use the integrated HS USB for local configuration or peripheral expansion.
Recommandé
Building Automation and HVAC Controllers
Building automation controllers benefit from the ATSAME70N19B-CNT's combination of connectivity peripherals, DSP performance, and industrial-grade reliability. The MCU can simultaneously drive an LCD/TFT display via the integrated HSMCI peripheral, run BACnet or Modbus stacks over RS-485, and process temperature/humidity sensor inputs through ADC channels. The 256 KB SRAM holds HVAC state machines and scheduling data, while the 512 KB Flash stores the application plus protocol stacks. The 100-TFBGA package allows slim wall-mount enclosure designs with dense I/O. The Cortex-M7 DSP capability supports acoustic-noise compensation in variable-air-volume (VAV) boxes and chiller optimization, reducing operating costs in commercial buildings.
Recommandé
Audio Processing and Consumer Electronics
The ATSAME70N19B-CNT's 300 MHz Cortex-M7 with FPU decodes compressed audio codecs (MP3, AAC, Opus) and runs DSP effects (equalization, bass enhancement, room correction) in real time. The integrated I2S peripheral interfaces directly to audio DACs and ADCs, while the 256 KB SRAM buffers decoded PCM samples and DSP working memory. The 512 KB Flash stores codec firmware plus UI assets. The high-speed USB 2.0 with on-chip PHY simplifies connectivity to host PCs or phones for streaming audio or firmware updates. The compact 100-TFBGA package is suitable for soundbars, smart speakers, and headphone amplifiers where PCB space is constrained and processing performance is critical.
Recommandé
Medical Instrumentation and Patient Monitoring
Medical devices such as patient monitors, infusion pumps, and diagnostic instruments benefit from the ATSAME70N19B-CNT's deterministic real-time response, DSP capability, and large memory. The Cortex-M7 runs ECG/EEG signal-processing algorithms, while the 256 KB SRAM buffers waveforms and derived parameters (heart rate, SpO2 trends). The 12-bit ADC and dedicated timers provide precise timing for stimulus and measurement cycles. The 512 KB Flash holds the application plus safety self-test routines. Designers building IEC 62304-compliant firmware should consider the SAMV71 family for Class B functional-safety libraries; the SAME70 is well-suited for non-safety-critical medical peripherals and laboratory analyzers.
Recommandé
Human-Machine Interface (HMI) and Point-of-Sale Terminals
HMI panels and point-of-sale (POS) terminals use the ATSAME70N19B-CNT to drive TFT LCDs, read touch controllers over I2C, and process secure payment or user-interaction logic. The integrated HSMCI peripheral interfaces to SD cards for storage of fonts, graphics, and transaction logs. The 256 KB SRAM supports multi-layer GUI rendering and on-screen keyboard buffers, while the 512 KB Flash stores the application plus display assets. The high-speed USB enables connectivity to printers, barcode scanners, and payment terminals. The 100-TFBGA compact footprint fits slim-panel designs. Compared to lower-tier Cortex-M4 MCUs, the SAME70's M7 core delivers noticeably smoother UI animations and faster cryptographic operations.
Recommandé
Power Conversion and Digital Power Supplies
Digital power-supply controllers based on the ATSAME70N19B-CNT execute high-frequency control loops (up to several hundred kHz) thanks to the 300 MHz Cortex-M7. DSP extensions accelerate PID and state-space control algorithms for totem-pole PFC, LLC resonant converters, and dual-active-bridge stages. The high-resolution PWM timers and fast ADC enable sub-microsecond feedback loop execution. The 256 KB SRAM holds controller state variables and adaptive-tuning parameters, while the 512 KB Flash stores firmware and compensation libraries. The Ethernet MAC enables remote monitoring and firmware updates in industrial UPS and telecom-rectifier applications. Same-brand migration to the SAME70N20 or Q21 variants provides additional memory for advanced control algorithms without changing the PCB layout.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70N19B-CNT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70N20B-CNT | ATSAME70N21B-CNT | ATSAME70Q21A-CNT | ATSAME70N19B-CFN | ATSAME70N19B-ANT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 |
| Maximum Clock | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash | 512 KB | 1 MB | 2 MB | 2 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 384 KB | 384 KB | 384 KB | 256 KB | 256 KB |
| FPU | Yes (single-precision) | Yes | Yes | Yes | Yes | Yes |
| HS USB with PHY | Yes | Yes | Yes | Yes | Yes | Yes |
| Automotive Qualified | No | No | No | Yes (AEC-Q100) | No | No |
Principaux différenciateurs
- 300 MHz Cortex-M7 vs 120 MHz Cortex-M4 in lower-tier families (vs ATSAME54N20A-AU)
- On-chip HS USB PHY integrated (vs ATSAME51N20A-AU)
- Industrial-grade reliability with Cortex-M7 performance (vs Consumer-grade Cortex-M7 parts from other vendors)
Notes de conception
The 100-TFBGA (9x9 mm) package requires a controlled-impedance PCB stack-up with micro-via fan-out from each BGA ball. Use a 4-layer minimum stack-up with a continuous ground plane directly under the BGA. Micro-via diameter should not exceed 0.15 mm with 0.25 mm pad, and the BGA land pattern must follow IPC-7351 or Microchip's land-pattern recommendation. Place decoupling capacitors (100 nF X7R) within 1 mm of each VDDIO/VDDCORE pin pair, plus bulk 4.7 uF capacitors near the package periphery. Reflow profile must respect the BGA's MSL-3 moisture sensitivity, requiring bake-out before soldering if the factory-floor exposure exceeds the floor-life limit.
The SAME70 family requires two distinct supply rails: VDDIO (typically 3.3V for I/O) and VDDCORE (1.2V for the Cortex-M7 core). Use a low-noise LDO such as the MCP1700 or a switching regulator with output filter to generate VDDCORE. Estimated: at 300 MHz with all peripherals enabled, core current is approximately 80-120 mA; designers should budget 200 mA headroom for transient peaks during DMA bursts. Place a 10 uF bulk capacitor plus 100 nF decoupling on each VDDCORE pin pair. The 1.2V rail must rise monotonically within 10 ms to avoid the internal POR reset issue; use an RC delay or sequencer if the upstream supply ramps slowly.
A common design pitfall is using the wrong boot configuration pins: the BMS (Boot Mode Select) pin must be tied correctly at reset to select between internal Flash, SAM-BA bootloader, or external memory boot. Another common mistake is over-driving the NRST line - the reset pin is open-drain and requires an external pull-up; do not drive it actively high. For HS USB designs, the D+/D- traces must be 90 ohm differential with length matching to within 150 mil, and the on-chip PHY requires a precise 12 MHz crystal. For Ethernet, the RMII/GMII interface to the external PHY requires 50 MHz reference clock routing under 50 mm with controlled impedance.
The 100-TFBGA package has a typical theta_JA of approximately 30-40 C/W depending on PCB copper area. Estimated: at 300 MHz full-load operation, core power dissipation is roughly 0.5-0.7 W. For industrial-grade applications (85 C ambient), the junction temperature rises 25-30 C, leaving comfortable thermal headroom. However, in enclosed industrial enclosures with limited airflow, designers should add thermal vias under the central BGA balls to spread heat into the internal ground plane, and consider copper pours on top and bottom layers connected by an array of thermal vias directly under the die.
For mixed-signal designs using the SAME70's integrated ADC, segregate analog and digital ground regions on a split ground plane connected at a single point near the MCU's AGND pin. The analog reference voltage (ADVREF) must be heavily decoupled with 10 nF + 1 uF capacitors placed within 5 mm of the pin, and the analog signal traces should be guarded by ground traces on both sides. For high-speed interfaces (HS USB, Ethernet, SDRAM), maintain 50 ohm single-ended or 90 ohm differential impedance, and use length-matching to within 150 mil across the differential pairs. The SDRAM interface requires source-synchronous clock routing with matched trace lengths.
Informations de conformité
RoHS and REACH compliant per Microchip product environmental compliance documentation. Lead-free SAC BGA balls. Not AEC-Q100 qualified - use SAME70Q21A-CNT for automotive applications. Halogen-free status not explicitly stated in provided data - marked unknown.
