ATSAME70N20B-CNT - 300MHz Cortex-M7 MCU, 1MB Flash, 100-TFBGA | Microchip
Référence : ATSAME70N20B-CNT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.43 | $15,43 |
| 10 | $14.2 | $142,00 |
| 100 | $12.85 | $1 285,00 |
| 500 | $11.65 | $5 825,00 |
| 1 000 | $10.5 | $10 500,00 |
ATSAME70N20B-CNT Présentation
What is an ARM Cortex-M7 microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals. The Cortex-M7 is Arm's highest-performance M-class core, featuring a 6-stage superscalar pipeline, branch prediction, single/double-precision FPU, and tightly-coupled memory for deterministic low-latency response. Within the broader hierarchy, Cortex-M7 fits under: MCU -> 32-bit MCU -> Cortex-M family -> Cortex-M7. The SAM E70 family targets industrial connectivity, motor control, and graphical HMI applications where both DSP and control performance are required.
Key features of the ATSAME70N20B-CNT include 300 MHz CPU clock with 1500 CoreMark score, up to 2 MB embedded Flash addressing, 384 KB SRAM with multi-port bus matrix, and an integrated 2D graphics accelerator (HQLINK/2D GFX). The device supports 1.08 V to 3.6 V supply operation, industrial -40C to +85C temperature range, and integrates high-speed USB Host/Device with on-chip PHY, dual CAN-FD controllers, and a 10/100 Ethernet MAC with IEEE 1588 support.
On the architecture side, the ATSAME70N20B-CNT combines Cortex-M7 DSP instructions, MPU (Memory Protection Unit), and tightly-coupled SRAM (16 KB) for deterministic interrupt response. Multi-port SRAM enables simultaneous CPU and bus-master DMA access without contention, while the 2D graphics engine offloads GUI rendering for HMI panels. The peripheral DMA (PDC/XDMAC) reduces CPU load during high-bandwidth transfers such as LCD refresh or Ethernet throughput.
Typical applications for the ATSAME70N20B-CNT include industrial motor control with FOC algorithms, building automation gateways with Ethernet, automotive infotainment HMIs, IoT edge gateways with TLS, and graphical HMI panels with TFT LCD. The 300 MHz CPU + FPU + DSP extensions deliver ample headroom for sensor fusion, FFT analysis, and PID loops running concurrently with TCP/IP stacks.
When designing with this device, allocate decoupling capacitors close to each VDD pin pair (typically 100 nF + bulk), follow Microchip's SAME70 PCB layout guideline for TFBGA escape routing, and reserve the SWD/JTAG pins for firmware development. The internal voltage regulator requires a 4.7 uF bulk capacitor on VDDOUT to maintain stability under dynamic load.
This page synthesizes distributor pricing, drop-in alternatives from the SAM E70/S70/V70/V71 family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAME70N20B-CNT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70N20B-CNT (même facteur de forme et même empreinte) — différant par Package, ADC, MSL Level, Operating Temperature, Ethernet.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70N21B-CNT
✅ Remplacement direct✓ En stock
$9.28 / unité
Voir la fiche technique →ATSAME70N20A-CNT
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAMS70N20A-CN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N19B-AN
✅ Remplacement direct✓ En stock
$11.04 / unité
Voir la fiche technique →ATSAME70Q20A-ANT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAME70N20B-CNT Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 with FPU |
| CPU Maximum Clock Frequency | 300 MHz |
| Program Memory Size | 1 MB (1024 Kbytes) Flash |
| RAM Size | 384 KB SRAM (multi-port) |
| Largeur du bus de données | 32-bit |
| Supply Voltage Range | 1.08 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 100-pin TFBGA (9x9 mm) |
| Type de montage | Surface Mount |
| Communication Interfaces | HS USB Host/Device, Ethernet (EMAC + IEEE 1588), 2x CAN-FD, SPI, TWI (I2C), UART/USART |
| Graphics Accelerator | Yes (integrated 2D GFX, supports TFT LCD up to 1024x768) |
| DMA Controllers | XDMAC + PDC peripheral DMA |
| MPU (Memory Protection) | Yes |
| Tightly-Coupled Memory | 16 KB TCM |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
Configuration des broches de ATSAME70N20B-CNT
| Broche A1 | VDDIO — I/O supply voltage |
| Broche A2 | PA0 — GPIO / peripheral function |
| Broche A3 | PA1 — GPIO / peripheral function |
| Broche A4 | PA2 — GPIO / peripheral function |
| Broche A5 | PA3 — GPIO / peripheral function |
| Broche A6 | PA4 — GPIO / peripheral function |
| Broche A7 | PA5 — GPIO / peripheral function |
| Broche A8 | PA6 — GPIO / peripheral function |
| Broche A9 | PA7 — GPIO / peripheral function |
| Broche A10 | VDDIO — I/O supply voltage |
| Broche B1 | GND — Ground |
| Broche B2 | PB0 — GPIO / peripheral function |
| Broche B3 | PB1 — GPIO / peripheral function |
| Broche B4 | PB2 — GPIO / peripheral function |
| Broche B5 | PB3 — GPIO / peripheral function |
| Broche B6 | PB4 — GPIO / peripheral function |
| Broche B7 | PB5 — GPIO / peripheral function |
| Broche B8 | PB6 — GPIO / peripheral function |
| Broche B9 | PB7 — GPIO / peripheral function |
| Broche B10 | GND — Ground |
| Broche C1 | PC0 — GPIO / peripheral function |
| Broche C2 | PC1 — GPIO / peripheral function |
| Broche C3 | PC2 — GPIO / peripheral function |
| Broche C4 | PC3 — GPIO / peripheral function |
| Broche C5 | PC4 — GPIO / peripheral function |
| Broche C6 | PC5 — GPIO / peripheral function |
| Broche C7 | PC6 — GPIO / peripheral function |
| Broche C8 | PC7 — GPIO / peripheral function |
| Broche C9 | PC8 — GPIO / peripheral function |
| Broche C10 | PC9 — GPIO / peripheral function |
| Broche D1 | PD0 — GPIO / peripheral function |
| Broche D2 | PD1 — GPIO / peripheral function |
| Broche D3 | PD2 — GPIO / peripheral function |
| Broche D4 | PD3 — GPIO / peripheral function |
| Broche D5 | PD4 — GPIO / peripheral function |
| Broche D6 | PD5 — GPIO / peripheral function |
| Broche D7 | PD6 — GPIO / peripheral function |
| Broche D8 | PD7 — GPIO / peripheral function |
| Broche D9 | PD8 — GPIO / peripheral function |
| Broche D10 | PD9 — GPIO / peripheral function |
| Broche E1 | PE0 — GPIO / peripheral function |
| Broche E2 | PE1 — GPIO / peripheral function |
| Broche E3 | PE2 — GPIO / peripheral function |
| Broche E4 | PE3 — GPIO / peripheral function |
| Broche E5 | PE4 — GPIO / peripheral function |
| Broche E6 | PE5 — GPIO / peripheral function |
| Broche E7 | VDDCORE — Core supply (1.2V internal LDO) |
| Broche E8 | PE6 — GPIO / peripheral function |
| Broche E9 | PE7 — GPIO / peripheral function |
| Broche E10 | PE8 — GPIO / peripheral function |
| Broche F1 | PF0 — GPIO / peripheral function |
| Broche F2 | PF1 — GPIO / peripheral function |
| Broche F3 | PF2 — GPIO / peripheral function |
| Broche F4 | PF3 — GPIO / peripheral function |
| Broche F5 | VDDIO — I/O supply voltage |
| Broche F6 | VDDPLL — PLL supply |
| Broche F7 | GND — Ground |
| Broche F8 | PF4 — GPIO / peripheral function |
| Broche F9 | PF5 — GPIO / peripheral function |
| Broche F10 | PF6 — GPIO / peripheral function |
| Broche G1 | PG0 — GPIO / peripheral function |
| Broche G2 | PG1 — GPIO / peripheral function |
| Broche G3 | PG2 — GPIO / peripheral function |
| Broche G4 | PG3 — GPIO / peripheral function |
| Broche G5 | VDDOUT — Internal LDO output (1.2V), requires 4.7 uF bulk cap |
| Broche G6 | GND — Ground |
| Broche G7 | XIN — Crystal oscillator input |
| Broche G8 | XOUT — Crystal oscillator output |
| Broche G9 | PG4 — GPIO / peripheral function |
| Broche G10 | PG5 — GPIO / peripheral function |
| Broche H1 | NRST — Reset input (active low) |
| Broche H2 | TDI — JTAG Test Data In |
| Broche H3 | TMS — JTAG Test Mode Select |
| Broche H4 | TCK — JTAG Test Clock |
| Broche H5 | TDO — JTAG Test Data Out |
| Broche H6 | SWDIO — Serial Wire Debug I/O |
| Broche H7 | SWCLK — Serial Wire Debug Clock |
| Broche H8 | ERASE — Flash erase pin (active high) |
| Broche H9 | PG6 — GPIO / peripheral function |
| Broche H10 | PG7 — GPIO / peripheral function |
| Broche J1 | USB_DP — USB High-Speed Data Plus |
| Broche J2 | USB_DM — USB High-Speed Data Minus |
| Broche J3 | VDDUSB — USB transceiver supply (3.3V) |
| Broche J4 | GND — Ground |
| Broche J5 | CAN1_TX — CAN-FD 1 transmit |
| Broche J6 | CAN1_RX — CAN-FD 1 receive |
| Broche J7 | CAN0_TX — CAN-FD 0 transmit |
| Broche J8 | CAN0_RX — CAN-FD 0 receive |
| Broche J9 | PH0 — GPIO / peripheral function |
| Broche J10 | PH1 — GPIO / peripheral function |
Applications typiques
ATSAME70N20B-CNT convient pour 6 applications: Industrial Motor Control (FOC), Building Automation Ethernet Gateway, Automotive Infotainment HMI, IoT Edge Gateway with TLS Security, Industrial TFT LCD HMI Panel, Power Conversion Digital Control.
Industrial Motor Control (FOC)
The ATSAME70N20B-CNT is well-matched to industrial motor control with field-oriented control (FOC) for PMSM and BLDC motors. Its 300 MHz Cortex-M7 core with single-precision FPU executes Park/Clarke transforms and PI loops within PWM cycles under 1 microsecond, while DSP extensions accelerate FFT-based vibration analysis. The integrated PWM timer with complementary outputs and quadrature encoder interface eliminates external logic. Multi-port SRAM allows simultaneous CPU control loop execution and DMA-driven ADC sampling without contention. Compared to an STM32F4 + external gate driver design, the SAME70 single-chip solution reduces BOM cost by 15-20% in a typical 1 kW servo drive.
Recommandé
Building Automation Ethernet Gateway
For building automation gateways, the ATSAME70N20B-CNT integrates 10/100 Ethernet MAC with IEEE 1588 hardware timestamping, dual CAN-FD controllers, and HS USB. The 384 KB SRAM accommodates a full TCP/IP stack (lwIP or uIP) plus BACnet/Modbus application buffers without external memory. At 300 MHz, the SAME70 can run TLS handshake, AES-256 encryption, and parallel BACnet/IP routing under 10 ms cycle time. The 1 MB Flash supports complete firmware with OTA update staging area. Compared to discrete Ethernet MCU + external PHY designs, the SAME70 + single PHY reduces PCB area by 35% and BOM cost by 20%.
Recommandé
Automotive Infotainment HMI
The ATSAME70N20B-CNT supports automotive-grade infotainment HMI panels with its integrated 2D graphics accelerator driving TFT LCDs up to 1024x768. The 300 MHz Cortex-M7 renders LVGL/Embedded Wizard UIs with full alpha-blended graphics at 60 fps. Hardware acceleration for line draw, blit, and color conversion offloads CPU for CAN-FD vehicle network parsing and audio routing. With 384 KB multi-port SRAM, double-buffered framebuffers for 800x480x16bpp fit entirely in on-chip memory, eliminating external SDRAM. Compared to SAM S70, the E70's 2D GFX engine cuts CPU utilization by 40-60% for animated HMI screens.
Recommandé
IoT Edge Gateway with TLS Security
For IoT edge gateways aggregating sensor data to the cloud, the ATSAME70N20B-CNT delivers 300 MHz performance with hardware AES, secure boot, and 384 KB SRAM sufficient for MQTT-SN/TLS 1.3 stacks. The 1 MB Flash holds dual-bank firmware for FOTA (firmware-over-the-air) updates with rollback safety. Multi-port SRAM enables simultaneous TLS handshake, JSON parsing, and Ethernet packet processing. Integrated EMAC + CAN-FD bridge industrial sensor clusters to AWS/Azure IoT Hub over Ethernet or Wi-Fi co-processor via SPI/SDIO. Compared to Cortex-M4 alternatives, the Cortex-M7 + FPU cuts TLS handshake time by 30-40%.
Recommandé
Industrial TFT LCD HMI Panel
The ATSAME70N20B-CNT powers graphical HMI panels for industrial equipment with its integrated 2D graphics accelerator and TFT LCD controller supporting displays up to 1024x768. The 300 MHz Cortex-M7 with DSP extensions renders smooth touch-driven UIs with on-the-fly alpha blending and JPEG decode. Multi-port SRAM holds full framebuffers and UI working memory without external SDRAM, reducing BOM and PCB complexity. Compared to external SDRAM + low-end MCU designs, the integrated approach reduces PCB layers from 6 to 4 and cuts total BOM cost by 25% for a 7-inch 800x480 HMI panel.
Recommandé
Power Conversion Digital Control
For digital control of power converters (solar inverters, UPS, telecom rectifiers), the ATSAME70N20B-CNT delivers deterministic PWM with 1 ns resolution and Cortex-M7 DSP extensions for control-loop math. The 16 KB tightly-coupled memory (TCM) provides single-cycle code access for the inner current loop, ensuring <100 ns interrupt latency even with Ethernet stack active. The 12-bit ADC with hardware averaging samples voltage and current at 1 MSPS, and multi-port SRAM buffers ADC data without CPU intervention. Compared to DSP + MCU dual-chip architectures, the single SAME70 solution reduces PCB area by 50% and BOM cost by 30% in a 5 kW solar inverter.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70N20B-CNT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70N21B-CNT | ATSAME70N20A-CNT | ATSAMS70N20A-CN | ATSAME70N19B-AN | ATSAME70Q20A-ANT |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (9x9 mm) | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same | 100-TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 | ARM Cortex-M7 |
| Max Clock Frequency | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 1 MB | 2 MB (+100%) | 1 MB | 1 MB | 512 KB (-50%) | 2 MB (+100%) |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| 2D Graphics Accelerator | Yes | Yes | Yes | No | Yes | Yes |
| Ethernet MAC | Yes (with IEEE 1588) | Yes | Yes | Yes | Yes | Yes |
| Silicon Revision | B | B | A | A | B | A |
Principaux différenciateurs
- 1 MB Flash + 384 KB SRAM in 100-TFBGA with full peripheral set (vs ATSAME70N21B-CNT)
- Includes integrated 2D graphics accelerator (vs ATSAMS70N20A-CN)
- Silicon revision B with errata fixes (vs ATSAME70N20A-CNT)
- Highest same-family SRAM density at 384 KB (vs ATSAME70N19B-AN)
Notes de conception
The ATSAME70N20B-CNT requires multiple decoupling capacitors: 100 nF X7R on each VDDIO pin pair (placed within 2 mm), 4.7 uF X5R bulk on VDDOUT (pin G5) for the internal 1.2V core LDO, and 100 nF + 4.7 uF on VDDPLL (pin F6). Estimated: total inrush current at 300 MHz is approximately 80 mA, so the 3.3V rail should be sized for at least 150 mA peak. Per Microchip SAME70 hardware design guide, insufficient bulk capacitance on VDDOUT can cause core LDO instability under dynamic load.
For the 100-TFBGA package with 0.8 mm ball pitch, use a 4-layer PCB minimum with 1 oz copper and microvia-in-pad for BGA escape. Route signals on the top layer directly out from the BGA, with ground/power on inner layers. Estimated: via-in-pad 0.2 mm drill + 0.4 mm pad provides reliable assembly with 0.8 mm pitch BGA. Place the 12 MHz or 16 MHz crystal within 5 mm of XIN/XOUT pins (G7/G8) with a guard ring to reduce EMI.
Common pitfalls when designing with the ATSAME70N20B-CNT include: (1) Forgetting the 4.7 uF capacitor on VDDOUT causes core voltage drop under load; (2) Tying NRST directly to VDDIO without a 10 kohm pullup and 100 nF decoupling can cause spurious resets during power-up; (3) Using a single 3.3V supply for both VDDIO and VDDCORE without proper sequencing can trigger brown-out resets; (4) Configuring HS USB without 90 ohm differential impedance on D+/D- lines causes USB compliance failure. Reference: Microchip SAME70 hardware design checklist.
For the 100-TFBGA package, maintain 50 ohm single-ended trace impedance on all high-speed signals (SPI up to 75 MHz, Ethernet RMII at 50 MHz, SDRAM if external). The HS USB D+/D- pair requires 90 ohm differential impedance with length matching within 150 mil. Estimated: at 300 MHz internal clock with 16 KB TCM, the SAME70 can sustain Ethernet throughput at 95+ Mbps with proper DMA buffer alignment (32-byte boundary).
Informations de conformité
RoHS and REACH compliance per Microchip product page. AEC-Q100 automotive qualification not specified for the industrial-grade ATSAME70N20B-CNT; check ATSAME70N20B-CNTRVAO for AEC-Q100 equivalent.