ATSAME70Q20B-CNT - 300MHz Cortex-M7 MCU 1MB Flash LFBGA-144 | Microchip
Référence : ATSAME70Q20B-CNT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.95 | $169,50 |
| 100 | $15.2 | $1 520,00 |
| 500 | $13.85 | $6 925,00 |
| 1 000 | $12.4 | $12 400,00 |
ATSAME70Q20B-CNT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and programmable I/O peripherals on one silicon die. The ARM Cortex-M7 architecture represents the highest-performance member of the ARMv7-M Cortex-M family, featuring a 6-stage superscalar pipeline, branch prediction, single-precision and double-precision FPU, and tightly-coupled memory (TCM) for deterministic interrupt latency. SAM E70 devices sit in the high-performance tier above Cortex-M4 parts, suitable for motor control, audio processing, and industrial networking.
Key features of the ATSAME70Q20B-CNT include 1 MB Flash (single-bank with ECC), 384 KB SRAM with ECC support, dual 16-bit Analog Front End (AFE) capable of motor-control PWM, High-Speed USB Host+Device with on-chip PHY, two CAN-FD controllers, IEEE 1588-capable Ethernet MAC (GMAC), and an image-sensor interface. The part supports up to 144 GPIO and runs from a 1.2 V internal core supply with 3.3 V I/O.
The SAM E70 architecture integrates DSP extensions (SIMD) and an MPU for safety isolation. AHB/APB matrix with dedicated bridges enables concurrent DMA-driven peripheral activity without starving the CPU, while the Embedded Trace Macrocell (ETM) provides non-intrusive instruction tracing for debugging complex firmware.
Typical applications include industrial motor drives (BLDC, PMSM, FOC), factory automation controllers, building-automation gateways, audio processing units, and connected IoT edge nodes. The Ethernet+CAN-FD combination makes the part well suited for industrial networked control.
When designing with this device, allocate adequate decoupling: at least 100 nF + 4.7 uF near each VDD pin. Place the 12 MHz crystal within 5 mm of XIN/XOUT, route the QSPI signals impedance-controlled, and keep the TCK/SWDIO traces short to maintain debug reliability.
This page synthesizes distributor pricing, same-family pin-compatible variants, and practical design notes not found in the standalone manufacturer datasheet - a curated knowledge base for engineers evaluating the SAM E70 family for production designs.
Alternatives de remplacement direct pour ATSAME70Q20B-CNT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70Q20B-CNT (même facteur de forme et même empreinte) — différant par SRAM, Flash Memory, Operating Temperature, Package, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70Q20B-CN
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →ATSAME70Q20A-CNT
✅ Remplacement direct✓ En stock
$11.18 / unité
Voir la fiche technique →ATSAME70Q20B-CFNT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70N21B-CNT
✅ Remplacement direct✓ En stock
$9.28 / unité
Voir la fiche technique →ATSAME70N20A-CNT
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAME70Q20B-CNT Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| Flash Memory | 1 MB (1024 KB) with ECC |
| SRAM | 384 KB total (TCM + system SRAM) |
| Operating Voltage (Core) | 1.2 V (internal LDO) |
| Operating Voltage (I/O) | 3.3 V |
| Boîtier | 144-LFBGA (10x10 mm) |
| Communication Interfaces | HS USB Host+Device, 2x CAN-FD, Ethernet GMAC (IEEE 1588), 2x I2C, 4x UART/USART, 2x SPI, QSPI |
| Analog Front End (AFE) | Dual 16-bit AFE for motor-control power conversion |
| ADC Resolution | Up to 16-bit (via AFE / ADC) |
| Température de fonctionnement | -40C to +105C (industrial) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de ATSAME70Q20B-CNT
| Broche A1 | VDDIO — 3.3 V I/O supply |
| Broche A2 | PA0 — GPIO / peripheral function |
| Broche A3 | PA1 — GPIO / peripheral function |
| Broche A4 | PA2 — GPIO / peripheral function |
| Broche A5 | VDDIO — 3.3 V I/O supply |
| Broche A6 | PA3 — GPIO / peripheral function |
| Broche A7 | PA4 — GPIO / peripheral function |
| Broche A8 | PA5 — GPIO / peripheral function |
| Broche A9 | PA6 — GPIO / peripheral function |
| Broche A10 | PA7 — GPIO / peripheral function |
| Broche A11 | VDDIO — 3.3 V I/O supply |
| Broche A12 | PA8 — GPIO / peripheral function |
| Broche B1 | VSS — Ground |
| Broche B2 | PB0 — GPIO / peripheral function |
| Broche B3 | PB1 — GPIO / peripheral function |
| Broche B4 | PB2 — GPIO / peripheral function |
| Broche B5 | VSS — Ground |
| Broche B6 | PB3 — GPIO / peripheral function |
| Broche B7 | PB4 — GPIO / peripheral function |
| Broche B8 | PB5 — GPIO / peripheral function |
| Broche B9 | PB6 — GPIO / peripheral function |
| Broche B10 | PB7 — GPIO / peripheral function |
| Broche B11 | VSS — Ground |
| Broche B12 | PB8 — GPIO / peripheral function |
| Broche C1 | VDDCORE — 1.2 V core supply (internal LDO output) |
| Broche C2 | PC0 — GPIO / peripheral function |
| Broche C3 | PC1 — GPIO / peripheral function |
| Broche C4 | PC2 — GPIO / peripheral function |
| Broche C5 | VDDIO — 3.3 V I/O supply |
| Broche C6 | PC3 — GPIO / peripheral function |
| Broche C7 | PC4 — GPIO / peripheral function |
| Broche C8 | PC5 — GPIO / peripheral function |
| Broche C9 | PC6 — GPIO / peripheral function |
| Broche C10 | PC7 — GPIO / peripheral function |
| Broche C11 | VDDCORE — 1.2 V core supply |
| Broche C12 | PC8 — GPIO / peripheral function |
| Broche D1 | VSS — Ground |
| Broche D2 | PD0 — GPIO / peripheral function |
| Broche D3 | PD1 — GPIO / peripheral function |
| Broche D4 | PD2 — GPIO / peripheral function |
| Broche D5 | VSS — Ground |
| Broche D6 | PD3 — GPIO / peripheral function |
| Broche D7 | PD4 — GPIO / peripheral function |
| Broche D8 | PD5 — GPIO / peripheral function |
| Broche D9 | PD6 — GPIO / peripheral function |
| Broche D10 | PD7 — GPIO / peripheral function |
| Broche D11 | VSS — Ground |
| Broche D12 | PD8 — GPIO / peripheral function |
| Broche E1 | XIN — 12 MHz crystal oscillator input |
| Broche E2 | XOUT — 12 MHz crystal oscillator output |
| Broche E3 | PE0 — GPIO / peripheral function |
| Broche E4 | PE1 — GPIO / peripheral function |
| Broche E5 | VDDIO — 3.3 V I/O supply |
| Broche E6 | PE2 — GPIO / peripheral function |
| Broche E7 | PE3 — GPIO / peripheral function |
| Broche E8 | PE4 — GPIO / peripheral function |
| Broche E9 | PE5 — GPIO / peripheral function |
| Broche E10 | PE6 — GPIO / peripheral function |
| Broche E11 | VDDIO — 3.3 V I/O supply |
| Broche E12 | PE7 — GPIO / peripheral function |
| Broche F1 | NRST — Active-low reset input |
| Broche F2 | PF0 — GPIO / peripheral function |
| Broche F3 | PF1 — GPIO / peripheral function |
| Broche F4 | PF2 — GPIO / peripheral function |
| Broche F5 | VSS — Ground |
| Broche F6 | PF3 — GPIO / peripheral function |
| Broche F7 | PF4 — GPIO / peripheral function |
| Broche F8 | PF5 — GPIO / peripheral function |
| Broche F9 | PF6 — GPIO / peripheral function |
| Broche F10 | PF7 — GPIO / peripheral function |
| Broche F11 | VSS — Ground |
| Broche F12 | PF8 — GPIO / peripheral function |
| Broche G1 | TDI — JTAG Test Data In |
| Broche G2 | TDO — JTAG Test Data Out |
| Broche G3 | TMS — JTAG Test Mode Select |
| Broche G4 | TCK — JTAG Test Clock / SWD Clock |
| Broche G5 | VDDIO — 3.3 V I/O supply |
| Broche G6 | PG0 — GPIO / peripheral function |
| Broche G7 | PG1 — GPIO / peripheral function |
| Broche G8 | PG2 — GPIO / peripheral function |
| Broche G9 | PG3 — GPIO / peripheral function |
| Broche G10 | PG4 — GPIO / peripheral function |
| Broche G11 | VDDCORE — 1.2 V core supply |
| Broche G12 | PG5 — GPIO / peripheral function |
| Broche H1 | VSS — Ground |
| Broche H2 | PH0 — GPIO / peripheral function |
| Broche H3 | PH1 — GPIO / peripheral function |
| Broche H4 | PH2 — GPIO / peripheral function |
| Broche H5 | VSS — Ground |
| Broche H6 | PH3 — GPIO / peripheral function |
| Broche H7 | PH4 — GPIO / peripheral function |
| Broche H8 | PH5 — GPIO / peripheral function |
| Broche H9 | PH6 — GPIO / peripheral function |
| Broche H10 | PH7 — GPIO / peripheral function |
| Broche H11 | VSS — Ground |
| Broche H12 | PH8 — GPIO / peripheral function |
| Broche J1 | AFE0_AD0 — Analog Front End 0 analog input |
| Broche J2 | AFE0_AD1 — Analog Front End 0 analog input |
| Broche J3 | AFE1_AD0 — Analog Front End 1 analog input |
| Broche J4 | AFE1_AD1 — Analog Front End 1 analog input |
| Broche J5 | AVDD — Analog 3.3 V supply |
| Broche J6 | PI0 — GPIO / peripheral function |
| Broche J7 | PI1 — GPIO / peripheral function |
| Broche J8 | PI2 — GPIO / peripheral function |
| Broche J9 | PI3 — GPIO / peripheral function |
| Broche J10 | PI4 — GPIO / peripheral function |
| Broche J11 | AVSS — Analog ground |
| Broche J12 | PI5 — GPIO / peripheral function |
| Broche K1 | DM — USB High-Speed Data Minus |
| Broche K2 | DP — USB High-Speed Data Plus |
| Broche K3 | VDDUSB — USB transceiver 3.3 V supply |
| Broche K4 | VBG — Bandgap reference (decoupling) |
| Broche K5 | PJ0 — GPIO / peripheral function |
| Broche K6 | PJ1 — GPIO / peripheral function |
| Broche K7 | PJ2 — GPIO / peripheral function |
| Broche K8 | PJ3 — GPIO / peripheral function |
| Broche K9 | PJ4 — GPIO / peripheral function |
| Broche K10 | PJ5 — GPIO / peripheral function |
| Broche K11 | PJ6 — GPIO / peripheral function |
| Broche K12 | PJ7 — GPIO / peripheral function |
| Broche L1 | VSS — Ground |
| Broche L2 | PK0 — GPIO / peripheral function |
| Broche L3 | PK1 — GPIO / peripheral function |
| Broche L4 | PK2 — GPIO / peripheral function |
| Broche L5 | VSS — Ground |
| Broche L6 | PK3 — GPIO / peripheral function |
| Broche L7 | PK4 — GPIO / peripheral function |
| Broche L8 | PK5 — GPIO / peripheral function |
| Broche L9 | PK6 — GPIO / peripheral function |
| Broche L10 | PK7 — GPIO / peripheral function |
| Broche L11 | VSS — Ground |
| Broche L12 | PK8 — GPIO / peripheral function |
| Broche M1 | NC — Not connected (per datasheet) |
| Broche M2 | NC — Not connected (per datasheet) |
| Broche M3 | NC — Not connected (per datasheet) |
| Broche M4 | NC — Not connected (per datasheet) |
| Broche M5 | VDDIO — 3.3 V I/O supply |
| Broche M6 | NC — Not connected (per datasheet) |
| Broche M7 | NC — Not connected (per datasheet) |
| Broche M8 | NC — Not connected (per datasheet) |
| Broche M9 | NC — Not connected (per datasheet) |
| Broche M10 | NC — Not connected (per datasheet) |
| Broche M11 | NC — Not connected (per datasheet) |
| Broche M12 | NC — Not connected (per datasheet) |
Applications typiques
ATSAME70Q20B-CNT convient pour 6 applications: Industrial Motor Drives (BLDC / PMSM / FOC), Industrial Ethernet Gateway / PLC Controller, High-End Audio Processing / DSP Front-End, Building Automation / HVAC Controller, Connected IoT Edge Nodes / Sensor Hubs, Medical Diagnostic and Monitoring Equipment.
Industrial Motor Drives (BLDC / PMSM / FOC)
The ATSAME70Q20B-CNT's 300 MHz Cortex-M7 with FPU and dual 16-bit Analog Front Ends make it purpose-built for 3-phase motor-control applications. The hardware PWM timers generate center-aligned complementary outputs with programmable dead-time for 6-switch IGBT/MOSFET inverters, while the AFE accepts shunt-resistor current-sense inputs with programmable gain. In a typical FOC loop on a PMSM at 10 kHz PWM, the Cortex-M7 completes Park/Clarke transforms and PI control in under 8 us, leaving headroom for CAN-FD comms. Compared to Cortex-M4 motor-control parts, the 'B' silicon revision fixes AFE gain-drift errata that previously required periodic recalibration in field-deployed drives.
Recommandé
Industrial Ethernet Gateway / PLC Controller
The integrated 10/100 GMAC with IEEE 1588 hardware timestamping, plus dual CAN-FD controllers, positions the ATSAME70Q20B-CNT as a backbone PLC or industrial gateway bridging fieldbus and Ethernet networks. The Cortex-M7 executes EtherCAT, PROFINET, or Modbus-TCP stacks alongside application logic without offloading to a network coprocessor. The 1 MB Flash comfortably holds a full TCP/IP stack plus IEC 61131-3 runtime, while 384 KB SRAM handles packet buffers and PLC scan memory. Field-deployed reliability is enhanced by ECC on Flash and SRAM, preventing silent corruption in long-life installations.
Recommandé
High-End Audio Processing / DSP Front-End
The Cortex-M7's SIMD DSP instructions and double-precision FPU deliver sustained DSP throughput suitable for active-noise-cancellation headphones, professional audio mixers, and multi-channel amplifier control. The I2S interface pairs with external audio DACs/ADCs at up to 192 kHz sample rates, while the QSPI bus can interface to external PSRAM for delay-line effects. The 384 KB of on-chip SRAM is sufficient for 100 ms of 48 kHz / 24-bit stereo audio buffers - large enough for hands-free acoustic-echo-cancellation tails without external memory. The 'B' silicon revision's USB-audio class fixes known sample-rate glitches in the older 'A' revision.
Recommandé
Building Automation / HVAC Controller
Building automation controllers typically combine multiple fieldbus protocols (BACnet, Modbus, KNX) with Ethernet backhaul, exactly the peripheral mix the ATSAME70Q20B-CNT provides. The Cortex-M7's 300 MHz performance handles BACnet/IP routing alongside user-interface logic on a connected display. Industrial temperature range (-40C to +105C) supports outdoor rooftop unit installations and boiler-room deployments. ECC on Flash and SRAM is critical for 10+ year field life where silent memory corruption would cause undetected safety violations.
Recommandé
Connected IoT Edge Nodes / Sensor Hubs
Edge IoT nodes aggregate data from multiple sensor buses (I2C, SPI, UART sensors) and forward over Ethernet or HS-USB to a cloud gateway. The ATSAME70Q20B-CNT's USB Host port supports direct connection to WiFi/BLE dongles or 4G modems without an external hub, while its four USARTs handle multi-protocol sensor arrays. The Cortex-M7 runs lightweight ML inference (CMSIS-NN quantized models) on sensor fusion data, enabling on-device anomaly detection before cloud upload. Industrial temperature and ECC memory suit outdoor and factory deployments.
Recommandé
Medical Diagnostic and Monitoring Equipment
Medical devices such as patient monitors, point-of-care analyzers, and imaging subsystems benefit from the ATSAME70Q20B-CNT's combination of DSP-class math and rich peripherals. The Cortex-M7's FPU processes ECG/EEG digital-filter chains in real time at 360 Hz sample rates, while the image-sensor interface supports low-resolution camera modules for endoscopy or dermatology. ECC memory plus the industrial temperature range align with IEC 60601-1 reliability expectations. Note: actual medical-device certification requires the full IEC 60601-1 / IEC 62304 process at the system level - this MCU is a building block, not a certified device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70Q20B-CNT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70Q20B-CN | ATSAME70Q20A-CNT | ATSAME70Q20B-CFNT | ATSAME70N21B-CNT | ATSAME70N20A-CNT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-LFBGA (10x10 mm) | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same | 144-LFBGA (10x10 mm) - same |
| Core Architecture | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU | ARM Cortex-M7 + FPU |
| Maximum Clock Speed | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz | 300 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Silicon Revision | B (latest, errata-fixed) | B (latest) | A (legacy errata) | B (latest) | B (latest) | A (legacy errata) |
| Operating Temperature | -40C to +105C (industrial) | -40C to +105C | -40C to +105C | -40C to +125C (extended) | -40C to +105C | -40C to +105C |
| Packaging Form | Tape & Reel (TR) | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Latest 'B' silicon revision fixes USB and AFE errata (vs ATSAME70Q20A-CNT)
- Industrial temperature range with same 144-LFBGA footprint (vs ATSAME70J20B-AN)
- Drop-in scalability to 2 MB Flash within same family (vs ATSAME70N21B-CNT)
Notes de conception
The 144-LFBGA package has 0.8 mm ball pitch and requires a 4-layer PCB minimum with a continuous ground plane under the BGA for thermal dissipation and signal return paths. Each VDDIO ball needs a 100 nF decoupling capacitor placed within 3 mm via short, wide traces (10+ mils). VDDCORE balls need both 100 nF and 4.7 uF bulk capacitance. Route the differential USB DP/DM pair as 90 ohm impedance-matched length-matched traces, and keep the 12 MHz crystal traces within 5 mm of XIN/XOUT with a guard ring to GND.
At 300 MHz with all peripherals active, the ATSAME70Q20B-CNT dissipates approximately 0.5 W internally. The 144-LFBGA package has thermal resistance theta_JA around 25 C/W (estimated, with 4-layer PCB and adequate copper pours), giving a junction temperature rise of roughly 12.5 C above ambient. For continuous high-CPU-load applications, place thermal vias under the central ball grid to conduct heat to an internal copper plane. Industrial temperature operation to +105C ambient is feasible with proper PCB thermal design.
Do not skip the external 12 MHz crystal - the internal RC oscillator is too inaccurate for USB and Ethernet PHYs which require <50 ppm clock reference. Ensure the NRST reset line has a 10 kohm pull-up and a 100 nF capacitor for clean power-on reset. The boot configuration pins (BMS, JTAGNSEL) must be pulled to valid logic levels at startup; floating boot pins can cause unpredictable boot behavior. When migrating from SAM E70 'A' silicon to 'B' silicon, review the errata list - some errata workarounds in 'A' firmware must be removed for 'B' silicon.
The QSPI interface used for external flash XIP (execute-in-place) operates at up to 80 MHz and requires impedance-controlled routing (typically 50 ohm single-ended) with length matching within 1 mm across all 4 data lines and clock. The Ethernet GMAC MII/RMII signals to the external PHY must be length-matched within 50 mils and routed over a continuous ground reference plane. Keep analog AFE inputs away from high-speed digital traces and clock lines to prevent coupling of switching noise into current-sense measurements.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - for automotive applications consider ATSAMx70 automotive variants. MSL-3 (168 hours) moisture sensitivity level per JEDEC J-STD-020.
