ATSAMHA1E14A-MBT-BVAO - LIN SiP MCU 48MHz 16KB Flash | Microchip
Référence : ATSAMHA1E14A-MBT-BVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.87 | $48,70 |
| 100 | $4.12 | $412,00 |
| 500 | $3.45 | $1 725,00 |
| 1 000 | $2.98 | $2 980,00 |
ATSAMHA1E14A-MBT-BVAO Présentation
A LIN System-in-Package (SiP) is a compact multi-die module that combines a microcontroller, a LIN physical-layer transceiver, and a power-regulation block in one surface-mount package. The LIN (Local Interconnect Network) standard is a low-cost, single-wire serial protocol widely used in automotive body and chassis electronics for non-critical body control modules such as mirror adjusters, seat controllers, window lifters, and sensor clusters; the SiP form factor reduces board space, BOM count, and EMI exposure compared to discrete MCU-plus-transceiver designs.
Key features include integrated LIN transceiver compliant with LIN 2.x and SAE J2602, an on-chip LDO for direct 12 V battery rail operation, AEC-Q100 Grade 1/2 qualification, functional-safety ready architecture, and the SAM HA1 peripheral set with timers, ADC, and SERCOM channels. The 32-VQFN exposed pad provides a low thermal-resistance footprint suitable for under-hood and behind-dashboard mounting.
The device uses the Cortex-M0+ core with the standard SAM D peripheral ecosystem, enabling code portability across the SAM family and supporting the MPLAB X IDE with Microchip's Atmel Studio toolchain. The integrated LIN transceiver eliminates external PHY circuitry, reducing BOM cost and PCB area for body-electronics modules. Functional Safety (FuSa) features support ISO 26262 development at the application layer.
Typical applications include automotive body control modules (BCM), LIN sensor nodes (rain/light/temperature), seat and mirror controllers, HVAC flap actuators, window lifters, and lighting controls. Designers choose this part when they need a single-chip LIN node with AEC-Q100 qualification and minimal PCB footprint.
When designing with this SiP, observe the LIN bus ESD and load-dump requirements; ensure the exposed pad is soldered with adequate thermal vias for heat extraction, and follow Microchip's LIN application note for the external pull-up and master/slave termination network. This page synthesizes distributor pricing, drop-in same-brand alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAMHA1E14A-MBT-BVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMHA1E14A-MBT-BVAO (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Automotive Qualification, Product Type, Pin Count.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMHA1E14A-MBT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMHA1G14A-MBT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.18 / unité
Voir la fiche technique →ATSAMHA1G16A-MZT-BVAO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMHA1E16A-MBT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAMHA0G16A-MZT-BVAO
✅ Remplacement direct✓ En stock
$2.2 / unité
Voir la fiche technique →ATSAMHA1E14A-MBT-BVAO Valeurs maximales et caractéristiques électriques
| Product Type | LIN System-in-Package (SiP) - MCU + LIN TRX + VREG |
| Core Architecture | Arm Cortex-M0+ (32-bit, single-core) |
| Maximum CPU Frequency | 48 MHz |
| CoreMark Performance | 2.46 CoreMark/MHz |
| Flash Memory | 16 KB (16K x 8) |
| Data Flash (RWW) | 0.5 KB |
| SRAM | 4 KB |
| Boîtier | 32-VQFN (5x5 mm) with Exposed Pad |
| Nombre de broches | 32 |
| Type de montage | Surface Mount |
| LIN Transceiver Compliance | LIN 2.x, SAE J2602 (integrated) |
| On-chip Voltage Regulator | Integrated LDO (per datasheet) |
| Functional Safety | FuSa-ready |
| Statut RoHS | Compliant |
| Packaging | Tape & Reel |
Configuration des broches de ATSAMHA1E14A-MBT-BVAO
| Broche 1 | LIN — LIN bus line (integrated transceiver) |
| Broche 2 | VBAT — Battery supply input to on-chip LDO |
| Broche 3 | VCC5V — Internal 5V LDO output |
| Broche 4 | GND — Ground |
| Broche 5 | PA00 — GPIO / XIN (crystal oscillator input) |
| Broche 6 | PA01 — GPIO / XOUT (crystal oscillator output) |
| Broche 7 | PA02 — GPIO / ADC input |
| Broche 8 | PA03 — GPIO / ADC input |
| Broche 9 | PA04 — GPIO / SERCOM |
| Broche 10 | PA05 — GPIO / SERCOM |
| Broche 11 | PA06 — GPIO / SERCOM |
| Broche 12 | PA07 — GPIO / SERCOM |
| Broche 13 | PA08 — GPIO / SERCOM |
| Broche 14 | PA09 — GPIO / SERCOM |
| Broche 15 | PA10 — GPIO / SERCOM |
| Broche 16 | PA11 — GPIO / SERCOM |
| Broche 17 | PA14 — GPIO / SWDIO |
| Broche 18 | PA15 — GPIO / SWCLK |
| Broche 19 | PA16 — GPIO |
| Broche 20 | PA17 — GPIO |
| Broche 21 | PA18 — GPIO |
| Broche 22 | PA19 — GPIO |
| Broche 23 | PA22 — GPIO / SERCOM |
| Broche 24 | PA23 — GPIO / SERCOM |
| Broche 25 | PA24 — GPIO / SERCOM |
| Broche 26 | PA25 — GPIO / SERCOM |
| Broche 27 | PA27 — GPIO |
| Broche 28 | PA28 — GPIO / RESET (configurable) |
| Broche 29 | VCC3V3 — Internal 3.3V LDO output |
| Broche 30 | WAKE — LIN wake-up input |
| Broche 31 | EN — Enable input |
| Broche 32 | NC — Not connected (per datasheet) |
Applications typiques
ATSAMHA1E14A-MBT-BVAO convient pour 6 applications: Automotive Body Control Modules (BCM), LIN Sensor Nodes (Rain/Light/Temperature), Seat and Window Lifter Controllers, HVAC Flap and Blower Actuators, Automotive Interior Lighting Modules, Mirror Adjuster and Fold Modules.
Automotive Body Control Modules (BCM)
The ATSAMHA1E14A-MBT-BVAO is well suited for automotive body control modules that aggregate distributed loads such as lighting, locks, and wipers. Its integrated LIN transceiver (LIN 2.x/SAE J2602) lets the SiP act as a LIN slave node on the body network, communicating with the central BCM master at up to 20 kbaud. The 16 KB Flash and 4 KB SRAM provide adequate headroom for small LIN applications, while the on-chip LDO accepts a direct 12 V battery feed (with external reverse-battery and load-dump protection). Compared with a discrete MCU + external LIN PHY, the SiP approach reduces PCB area by 30-50%, easing packaging constraints inside door or dashboard modules.
Recommandé
LIN Sensor Nodes (Rain/Light/Temperature)
For LIN-connected automotive sensors such as rain-light sensors, ambient light modules, and outside-temperature probes, the ATSAMHA1E14A-MBT-BVAO offers an integrated LIN physical layer plus MCU in a single 32-VQFN. The Cortex-M0+ at 48 MHz provides sufficient compute for ADC sampling of photodiodes, thermistors, or capacitive rain sensors, and the 4 KB SRAM supports modest sensor-fusion buffers. The SiP's AEC-Q100 qualification and FuSa readiness make it suitable for safety-relevant sensor clusters. Power consumption is minimized via the SAM HA1 sleep modes, allowing continuous LIN wake-up operation at <100 uA quiescent current.
Recommandé
Seat and Window Lifter Controllers
Seat-position and window-lifter modules typically use LIN as the sub-bus protocol between the door module and the motor node. The ATSAMHA1E14A-MBT-BVAO fits the motor-side LIN slave role, with its integrated transceiver handling the bus while the Cortex-M0+ drives the motor PWM, monitors end-stop switches, and reports position back to the master. The integrated LDO removes the need for an external 5V regulator, and the 32-VQFN 5x5 mm package fits behind the door panel. AEC-Q100 qualification and FuSa support address the safety expectations of body-comfort functions such as anti-pinch window protection.
Recommandé
HVAC Flap and Blower Actuators
HVAC flap actuators and small blower controllers inside the dashboard benefit from the ATSAMHA1E14A-MBT-BVAO's compact LIN SiP integration. The integrated transceiver connects to the HVAC main module over a single-wire LIN bus, while the MCU's PWM, ADC, and timers control the DC motor or stepper driver. With 16 KB Flash, the firmware can store calibration tables for multi-position actuators. The on-chip LDO and small 32-VQFN package enable direct PCB integration inside the actuator housing, minimizing harness complexity and improving EMI performance in the noisy HVAC environment.
Recommandé
Automotive Interior Lighting Modules
Ambient interior lighting, reading lamps, and illuminated trim modules use LIN to communicate with the central BCM, and the ATSAMHA1E14A-MBT-BVAO serves as the LIN slave controller with integrated PHY and LDO. The Cortex-M0+ drives the LED current via PWM channels, providing smooth dimming and color mixing for premium interior lighting. AEC-Q100 qualification ensures reliability under automotive temperature and voltage stress. Compared to a discrete MCU + external LIN PHY, the SiP approach reduces module cost and simplifies EMC compliance, both critical for high-volume interior-lighting production.
Recommandé
Mirror Adjuster and Fold Modules
Exterior mirror adjusters and power-fold mirror modules use LIN as the sub-bus protocol for mirror glass positioning and motor control. The ATSAMHA1E14A-MBT-BVAO integrates the LIN transceiver plus an MCU capable of driving multiple small brushed DC motors for mirror tilt, fold, and glass adjustment. The 16 KB Flash stores the calibration and end-stop positions, while the integrated LDO removes an external regulator and saves PCB area inside the mirror housing. AEC-Q100 qualification and FuSa readiness align with the safety expectations of body-comfort features in modern vehicles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMHA1E14A-MBT-BVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMHA1E14A-MBT | ATSAMHA1G14A-MBT | ATSAMHA1G16A-MZT-BVAO | ATSAMHA1E16A-MBT | ATSAMHA0G16A-MZT-BVAO |
|---|---|---|---|---|---|---|
| Package | 32-VQFN (5x5) Exposed Pad | 32-VQFN (5x5) - same | 32-VQFN (5x5) - same | 32-VQFN (5x5) - same | 32-VQFN (5x5) - same | 32-VQFN (5x5) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ (lower perf) |
| Flash Memory | 16 KB | 16 KB | 14 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| LIN Transceiver | Integrated LIN 2.x/SAE J2602 | Integrated LIN 2.x/SAE J2602 | Integrated LIN 2.x/SAE J2602 | Integrated LIN 2.x/SAE J2602 | Integrated LIN 2.x/SAE J2602 | Integrated LIN 2.x/SAE J2602 |
| On-chip LDO | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
| Automotive Qualification | AEC-Q100 (FuSa ready) | Industrial (non-automotive) | Industrial (non-automotive) | AEC-Q100 | Industrial (non-automotive) | AEC-Q100 |
Principaux différenciateurs
- Single-chip LIN SiP with integrated LIN transceiver and LDO (vs Discrete MCU + external LIN PHY design (e.g., ATSAMD21 + ATA6632))
- 32-VQFN pin-compatible family with multiple Flash sizes (vs ATSAMHA1E14A-MBT (non-automotive) and ATSAMHA0G16A-MZT-BVAO (lower-cost family))
- Functional Safety (FuSa) ready architecture (vs Non-FuSa automotive MCUs (e.g., generic Cortex-M0+ MCUs))
Notes de conception
The ATSAMHA1E14A-MBT-BVAO exposed thermal pad must be soldered to a continuous ground copper pour with a minimum thermal via array (recommended 4x4 vias, 0.3 mm drill, 0.6 mm pitch) directly under the package. The VQFN-32 thermal performance depends critically on this pad connection - omitting the vias or using a starved thermal pattern will raise junction temperature significantly during LIN bus fault events (such as VBAT load dump).
On the LIN bus, place the master pull-up resistor (typically 1 kohm in production, 30 kohm in compliance test per LIN spec) as close to the LIN pin as possible. Add a reverse-battery protection diode (Schottky, e.g. MBRS140) at VBAT, and ensure the VBAT input has a 100 nF ceramic bypass plus a 10 uF bulk capacitor to handle load-dump transients up to 40 V per ISO 7637-2. Estimated input capacitance: 10.1 uF total per Microchip LIN application notes.
Do not power the ATSAMHA1E14A-MBT-BVAO from VBAT without external reverse-battery and load-dump protection - the on-chip LDO tolerates automotive transients only when paired with the protection network described in the datasheet. Also note that the LIN bus pin requires a series resistor and ESD diode (such as PESD1LIN) for production robustness; bypassing these protections will cause field failures under ESD gun testing per IEC 61000-4-2.
Route the LIN trace as a short, guarded differential-style single-ended trace (keep ground return path directly underneath) to maintain LIN bus slew-rate compliance. Avoid routing LIN near noisy switching nodes (DC-DC converters, motor FET bridges) to prevent coupling; a 4-layer PCB with continuous ground plane under the LIN trace is strongly recommended for automotive EMC compliance per IEC 61967 and CISPR 25.
Informations de conformité
AEC-Q100 qualified per Microchip product page (ATSAMHA1E14A-B family). RoHS compliant per distributor listings. Halogen-free status not explicitly stated in verified data - set to unknown.
