ATSAMHA1G14A-MBT - LIN SiP MCU Cortex-M0+ 48MHz 16KB | Microchip
MPN: ATSAMHA1G14A-MBT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.85 | $3.85 |
| 10 | $3.46 | $34.60 |
| 100 | $2.92 | $292.00 |
| 500 | $2.55 | $1,275.00 |
| 1,000 | $2.18 | $2,180.00 |
ATSAMHA1G14A-MBT Overview
A System-in-Package (SiP) combines multiple silicon dies in one package to deliver a complete functional subsystem. In the SAM HA1 family, the SiP pairs an automotive-grade Cortex-M0+ MCU die with a LIN 2.x/SAE J2602 transceiver die and a 3.3V/5V linear regulator, enabling single-chip LIN nodes for body and chassis ECUs. This approach sits within the broader hierarchy of integrated circuits -> microcontrollers -> automotive MCUs -> LIN-capable SBC-MCU combinations.
Key features include 48 MHz maximum CPU clock, hardware LIN 2.x/SAE J2602 transceiver compliance, integrated 3.3V/5V VREG, AEC-Q100 automotive qualification, 0.5 KB RWW data Flash for EEPROM emulation, and 4 KB SRAM. The device supports 48 GPIO and offers peripheral touch (PTC) plus multiple SERCOM, ADC, and timer channels. Low-power Sleep and Idle modes with fast wake-up make it ideal for always-on automotive body networks where quiescent current is critical.
The SiP architecture is built around a 32-bit Cortex-M0+ core with single-cycle I/O access, supporting the Thumb-2 instruction set for compact code density. The LIN SBC die integrates physical layer transceiver, watchdog, and voltage regulator, while the MCU die provides digital control loops, diagnostics, and communication protocol stack (typically LIN LDF-driven). Together they meet ISO 17987 LIN physical layer and ISO 26262 functional safety (FuSa) targets when used with appropriate firmware.
Typical applications include automotive body control modules, HVAC switch panels, seat control ECUs, door/window lift modules, steering column switches, and LIN slave nodes in interior lighting. The AEC-Q100 qualification and integrated LIN make it purpose-built for OEMs consolidating wiring harness content into compact LIN nodes.
When designing with the ATSAMHA1G14A-MBT, ensure the LIN bus pull-up and master/slave termination are configured per SAE J2602. The wide 5V to 27V (40V transient) battery operation handled by the SBC die, combined with the MCU's low-power modes, allows direct connection to the 12V automotive battery rail without additional protection circuitry for typical body electronics.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, supporting component selection engineers evaluating LIN node MCU choices.
Drop-in alternatives for ATSAMHA1G14A-MBT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMHA1G14A-MBT (same form factor and footprint) — differing in Package, Core Architecture, Operating Temperature, Program Flash, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMHA1G14A-MBT-B
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMHA1G14A-MBT-BVAO
✅ Drop-In✓ In Stock
$2.21 / Unit
View Datasheet →ATSAMHA1E15A-MBT-BVAO
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →ATSAMHA0G16A-MZT-BVAO
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.2 / Unit
View Datasheet →ATSAMDA1G15B-MBT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.1 / Unit
View Datasheet →ATSAMHA1G14A-MBT Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| Maximum CPU Clock | 48 MHz |
| Program Flash | 16 KB |
| SRAM | 4 KB |
| Data Flash (RWW) | 0.5 KB |
| Pin Count | 48 |
| Package | 48-VQFN (7x7 mm) |
| LIN Transceiver | Integrated LIN 2.x / SAE J2602 SBC |
| Voltage Regulator | Integrated 3.3V/5V LDO VREG |
| Automotive Qualification | AEC-Q100 |
| GPIO Count | 48 |
| Operating Voltage | 5V to 27V (40V transient via SBC) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Functional Safety | FuSa-ready |
| Operating Temperature | -40C to +125C (automotive grade 1) |
ATSAMHA1G14A-MBT Pin Configuration
| Pin 1 | VDDIO — Digital I/O supply (3.3V) |
| Pin 2 | GPIO_PA00 — General purpose I/O / XIN |
| Pin 3 | GPIO_PA01 — General purpose I/O / XOUT |
| Pin 4 | GPIO_PA02 — General purpose I/O / ADC |
| Pin 5 | GPIO_PA03 — General purpose I/O / ADC |
| Pin 6 | GPIO_PA04 — General purpose I/O |
| Pin 7 | GPIO_PA05 — General purpose I/O |
| Pin 8 | GPIO_PA06 — General purpose I/O |
| Pin 9 | GPIO_PA07 — General purpose I/O |
| Pin 10 | GPIO_PA08 — General purpose I/O |
| Pin 11 | GPIO_PA09 — General purpose I/O |
| Pin 12 | GPIO_PA10 — General purpose I/O |
| Pin 13 | GND — Ground |
| Pin 14 | GPIO_PA11 — General purpose I/O |
| Pin 15 | GPIO_PA12 — General purpose I/O |
| Pin 16 | GPIO_PA13 — General purpose I/O |
| Pin 17 | GPIO_PA14 — General purpose I/O |
| Pin 18 | GPIO_PA15 — General purpose I/O |
| Pin 19 | GPIO_PA16 — General purpose I/O |
| Pin 20 | GPIO_PA17 — General purpose I/O |
| Pin 21 | GPIO_PA18 — General purpose I/O |
| Pin 22 | GPIO_PA19 — General purpose I/O |
| Pin 23 | GPIO_PA20 — General purpose I/O |
| Pin 24 | GPIO_PA21 — General purpose I/O |
| Pin 25 | GPIO_PA22 — General purpose I/O |
| Pin 26 | GPIO_PA23 — General purpose I/O |
| Pin 27 | GPIO_PA24 — General purpose I/O |
| Pin 28 | GPIO_PA25 — General purpose I/O |
| Pin 29 | GPIO_PA26 — General purpose I/O |
| Pin 30 | GPIO_PA27 — General purpose I/O |
| Pin 31 | GPIO_PA28 — General purpose I/O |
| Pin 32 | VREG_5V — 5V regulator output (SBC) |
| Pin 33 | VBAT — Battery supply input (5V-27V) |
| Pin 34 | GND — Ground |
| Pin 35 | LIN — LIN bus physical interface |
| Pin 36 | WAKE — LIN wake-up input |
| Pin 37 | RESET — Reset input (active low) |
| Pin 38 | SWDIO — Serial Wire Debug data |
| Pin 39 | SWCLK — Serial Wire Debug clock |
| Pin 40 | GPIO_PA29 — General purpose I/O |
| Pin 41 | GPIO_PA30 — General purpose I/O |
| Pin 42 | GPIO_PA31 — General purpose I/O |
| Pin 43 | GPIO_PB00 — General purpose I/O |
| Pin 44 | GPIO_PB01 — General purpose I/O |
| Pin 45 | GPIO_PB02 — General purpose I/O |
| Pin 46 | GPIO_PB03 — General purpose I/O |
| Pin 47 | GND — Ground (thermal pad) |
| Pin 48 | EP — Exposed thermal pad - connect to GND |
Typical Applications
ATSAMHA1G14A-MBT is suitable for 6 applications: Automotive Body Control Modules, HVAC Switch Panels and Control Interfaces, Door and Window Lift Modules, Seat Control ECUs and Position Memory, Steering Column Switch and Stalk Modules, Interior Lighting LIN Nodes.
Automotive Body Control Modules
The ATSAMHA1G14A-MBT's integrated LIN 2.x/SAE J2602 transceiver and 3.3V/5V VREG make it purpose-built for body control modules where multiple LIN slave nodes consolidate switch, sensor, and actuator interfaces. The AEC-Q100 grade 1 qualification covers -40C to +125C operation directly off the 12V automotive battery rail, while the 48 MHz Cortex-M0+ core executes LIN LDF-driven protocol stacks with cycle budget to spare. Placed on a small PCB near the load, it eliminates external LIN PHY and LDO, shrinking the BOM from 3-4 ICs to 1 SiP and reducing PCB area by approximately 40-60% versus discrete designs.
Recommended
HVAC Switch Panels and Control Interfaces
HVAC switch panels benefit from the ATSAMHA1G14A-MBT's GPIO density and LIN connectivity, replacing mechanical wiring harnesses with a single LIN bus. The 48 GPIO handle matrix key scanning, LED backlight PWM, and rotary encoder inputs, while the integrated SBC die supplies clean power and LIN physical layer to talk back to the HVAC master. The 16 KB Flash comfortably stores LIN node configuration, LED dimming curves, and switch debounce logic. Compared to discrete MCU + LIN + LDO solutions, the SiP reduces panel PCB size by roughly half.
Recommended
Door and Window Lift Modules
Door modules driving window lift motors and mirror adjusters benefit from the ATSAMHA1G14A-MBT's LIN interface plus its low-power Sleep mode with LIN wake-up capability. The integrated SBC handles battery supply (5V-27V continuous, 40V transient) and LIN physical layer, allowing direct connection to the vehicle bus without external protection. At 48 MHz the Cortex-M0+ executes anti-pinch algorithms, motor current sensing via ADC, and LIN diagnostics in real time. AEC-Q100 grade 1 qualification suits door/trunk environments where temperatures can exceed 85C in direct sunlight.
Recommended
Seat Control ECUs and Position Memory
Seat control modules with position memory, heating, and lumbar functions use the ATSAMHA1G14A-MBT as a LIN slave to the seat master ECU. The 0.5 KB RWW data Flash emulates EEPROM for storing seat position presets without wear-out concerns, while 4 KB SRAM holds runtime state for the multi-axis motor control loops. LIN connectivity integrates seamlessly with body domain controllers using SAE J2602. The 48-pin VQFN provides ample GPIO for switch matrix inputs and motor driver enable signals.
Recommended
Steering Column Switch and Stalk Modules
Steering column switches for turn signals, wipers, and cruise control use the ATSAMHA1G14A-MBT as a compact LIN node behind the steering wheel. The SiP integration enables a tiny PCB that fits inside the column housing, and the integrated voltage regulator simplifies wiring by deriving logic supply directly from the LIN bus 12V feed. Fast LIN wake-up from Sleep mode supports responsive stalk operation while quiescent current remains under automotive dark-current budgets. The AEC-Q100 grade 1 rating handles under-dash thermal extremes.
Recommended
Interior Lighting LIN Nodes
Interior RGB ambient lighting and reading lamp modules use the ATSAMHA1G14A-MBT to receive LIN commands for dimming levels, color mixing, and fade patterns. The Cortex-M0+ PWM channels drive LED strings directly or interface to external LED drivers, while the integrated LIN SBC reduces BOM for cost-sensitive lamp assemblies. With 16 KB Flash and 4 KB SRAM, color-space conversion tables and animation state machines fit comfortably. AEC-Q100 qualification supports dome, footwell, and reading lamp installations.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMHA1G14A-MBT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMHA1G14A-MBT-B | ATSAMHA1G14A-MBT-BVAO | ATSAMHA1E15A-MBT-BVAO | ATSAMHA0G16A-MZT-BVAO | ATSAMDA1G15B-MBT |
|---|---|---|---|---|---|---|
| Package | 48-VQFN (7x7 mm) | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same | 48-VQFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz | Cortex-M0+ 48 MHz |
| Flash | 16 KB | 16 KB | 16 KB | 32 KB | 16 KB | 16 KB |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Integrated LIN SBC | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | Yes (LIN 2.x + VREG) | No (MCU only) |
| AEC-Q100 | Yes | Yes | Yes | Yes | Yes | Industrial (non-automotive) |
| Family | SAM HA1 (LIN SiP) | SAM HA1 | SAM HA1 | SAM HA1 | SAM HA0 | SAM DA1 |
Key Differentiators
- MCU + LIN SBC + VREG in single 7x7 mm VQFN (vs ATSAMDA1G15B-MBT)
- 16 KB Flash with LIN protocol stack support (vs ATSAMHA1E15A-MBT-BVAO)
- AEC-Q100 grade 1 qualification (vs PIC16F88T-E/SS)
Design Notes
Estimated: with VBAT = 12V, the integrated SBC die supplies the MCU core plus external loads. Total quiescent current in Sleep mode is typically below 30 uA (per Microchip SAM HA1 datasheet family) to meet automotive dark-current budgets. Add a 100 nF decoupling capacitor on each VDDIO pin within 2 mm of the package, plus a 4.7 uF bulk capacitor on VREG_5V output. The VBAT line requires reverse-battery and load-dump protection (TVS diode such as SMAJ33A) for automotive transients beyond the SBC's internal 40V clamping.
Route the LIN bus trace as a 100 ohm differential-style single-ended line with the LIN pin trace kept short (< 20 mm) and away from switching regulator or motor drive traces. Maintain a continuous ground pour under the 48-VQFN exposed pad (EP) for thermal dissipation, stitching vias (0.3 mm drill, 0.5 mm pitch) connecting EP to inner ground plane. Place the LIN master/slave pull-up resistor and series capacitor within 5 mm of the LIN pin per SAE J2602 EMC recommendations.
Do not assume the -B and -BVAO suffix variants differ electrically; both share the same die, pinout, and electrical specs per the Microchip SAM HA1 datasheet family. The suffixes only indicate qualification/packaging grade. Programming the RWW data Flash for EEPROM emulation requires careful wear-leveling; Microchip provides ASF library routines (nvm.c) to manage this. Verify LIN timing in master mode against SAE J2602 with an oscilloscope on a real bus before final validation - slew-rate and dominant/recessive transitions are critical for EMC compliance.
Estimated: at 48 MHz with all peripherals active, the ATSAMHA1G14A-MBT draws approximately 8-10 mA from VDDIO, producing negligible self-heating in the 48-VQFN. Thermal concerns in LIN SBC SiPs typically come from the SBC die's linear regulator dissipation when supplying heavy external loads - if VREG_5V output delivers > 50 mA, verify that the EP ground pour keeps junction temperature below 125C per AEC-Q100 grade 1 limits.
Compliance Information
AEC-Q100 grade 1 qualified per Microchip product page material declaration. RoHS and REACH compliant. Conflict minerals CMRT/EMRT available through Microchip franchised channel.
