ATSAMS70Q20A-AN - 300MHz Cortex-M7 MCU, 1MB Flash | Microchip
Référence : ATSAMS70Q20A-AN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.78 | $14,78 |
| 10 | $13.31 | $133,10 |
| 100 | $11.83 | $1 183,00 |
| 500 | $10.66 | $5 330,00 |
| 1 000 | $9.52 | $9 520,00 |
ATSAMS70Q20A-AN Présentation
What is a Cortex-M7 microcontroller? A Cortex-M7 MCU is a 32-bit RISC processor from ARM designed for deterministic real-time control with DSP extensions and a hardware single-precision/double-precision FPU. It sits in the hierarchy ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor, and is typically chosen when developers need sub-200ns interrupt latency, SIMD DSP, and large code/RAM footprints for graphical or audio signal chains.
Key features include 16 KB of ICache and 16 KB of DCache, a Multi-Port SRAM architecture, two 12-bit AFEC ADCs up to 1.5 Msps, USB 2.0 High-Speed with on-chip PHY, 10/100 Ethernet MAC with 1588 PTP support, a 2D graphics LCD TFT controller with overlay, a hardware cryptographic accelerator (AES, TRNG), and 8/16-bit external bus interface (EBI) for SDRAM/NAND/NOR expansion. The device also embeds a Floating Point Unit that natively executes single- and double-precision IEEE 754 operations.
The ATSAMS70Q20A-AN employs a Harvard-bus implementation with a tightly-coupled TCM block, deterministic 4-cycle interrupt entry, and a system controller that handles clock, reset, and brown-out supervision. Its peripheral set includes CAN-FD, four I2S ports for audio codec interfacing, an image sensor interface (ISI), a camera interface, and up to 119 GPIOs. Engineering trade-offs include higher dynamic power at 300 MHz than Cortex-M4 parts and a 144-LQFP footprint that requires careful power-plane design.
Typical applications span industrial motor control, industrial HMI / TFT panels, point-of-sale terminals, audio amplification systems, automotive infotainment prototyping, building-automation gateways, and IoT edge nodes that demand on-the-fly TLS handshake acceleration via the integrated crypto engine. The wide 3.0V to 3.6V supply and 1.7V to 3.6V IO tolerance also let it co-exist with 1.8V sensors.
When designing with this MCU, place four 0.1 µF + 1 µF decoupling pairs near the VDDIO/VDDCORE pin groups, route the 12 MHz crystal traces symmetrically, and use a 4-layer backup across IC pin groups to keep the high-speed USB and Ethernet impedance at 90 Ω differential. Provide a 32.768 kHz low-power crystal on the XIN32/XOUT32 pads if RTC wake-from-backup is required.
This page synthesizes distributor pricing, drop-in alternatives sourced from Microchip cross-reference data, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAMS70Q20A-AN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMS70Q20A-AN (même facteur de forme et même empreinte) — différant par ADC, Package, Ethernet, Operating Temperature, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70Q20A-AN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMS70Q20A-ANT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70Q20A-ANT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME70Q21B-AN
✅ Remplacement direct✓ En stock
$17.4 / unité
Voir la fiche technique →ATSAME70Q21A-CNT
✅ Remplacement direct✓ En stock
$8.2 / unité
Voir la fiche technique →ATSAME70N20A-AN
✅ Remplacement direct✓ En stock
$11.2 / unité
Voir la fiche technique →ATSAMS70Q20A-AN Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Fréquence d'horloge maximale | 300 MHz |
| Flash Memory | 1 MB (1024 KB) |
| SRAM | 384 KB |
| Instruction Cache (ICache) | 16 KB |
| Data Cache (DCache) | 16 KB |
| Supply Voltage (VDDCORE) | 1.2 V to 1.32 V |
| I/O Supply Voltage (VDDIO) | 1.7 V to 3.6 V |
| Boîtier | 144-pin LQFP (20x20 mm, 0.5 mm pitch) |
| GPIO Count | 119 |
| ADC | 2x 12-bit AFEC, up to 1.5 Msps |
| USB | USB 2.0 High-Speed with on-chip PHY |
| Ethernet | 10/100 MAC with IEEE 1588 PTP, GMII/RGMII/MII |
| CAN | 2x CAN-FD |
| Température de fonctionnement | -40C to +105C |
| Statut RoHS | Compliant |
| CoreMark Score | 1500 |
Configuration des broches de ATSAMS70Q20A-AN
| Broche 1 | VDDIO — I/O supply voltage (3.3 V nominal) |
| Broche 2 | PA0 — GPIO / AFEC AD0 / PWM0 |
| Broche 3 | PA1 — GPIO / AFEC AD1 / PWM1 |
| Broche 4 | PA2 — GPIO / AFEC AD2 |
| Broche 5 | PA3 — GPIO / AFEC AD3 |
| Broche 6 | PA4 — GPIO / AFEC AD4 |
| Broche 7 | PA5 — GPIO / AFEC AD5 |
| Broche 8 | GND — Common ground |
| Broche 9 | PA6 — GPIO / AFEC AD6 |
| Broche 10 | PA7 — GPIO / AFEC AD7 |
| Broche 11 | PA8 — GPIO / PWM0 |
| Broche 12 | PA9 — GPIO / URXD0 |
| Broche 13 | PA10 — GPIO / UTXD0 |
| Broche 14 | PA11 — GPIO / UDP (USB HS) |
| Broche 15 | PA12 — GPIO / UDM (USB HS) |
| Broche 16 | PA13 — GPIO / TWD (I2C0) |
| Broche 17 | PA14 — GPIO / TWCK (I2C0) |
| Broche 18 | VDDCORE — Core supply (1.2 V) |
| Broche 19 | GND — Common ground |
| Broche 20 | XIN — 12 MHz crystal input |
| Broche 21 | XOUT — 12 MHz crystal output |
| Broche 22 | NRST — Reset (active low) |
| Broche 23 | TMS — JTAG test mode select |
| Broche 24 | TCK — JTAG test clock |
| Broche 25 | TDO — JTAG test data out |
| Broche 26 | TDI — JTAG test data in |
| Broche 27 | SWDIO — Serial wire debug I/O |
| Broche 28 | SWCLK — Serial wire clock |
| Broche 29 | PB0 — GPIO / EBI D0 |
| Broche 30 | PB1 — GPIO / EBI D1 |
| Broche 31 | PB2 — GPIO / EBI D2 |
| Broche 32 | PB3 — GPIO / EBI D3 |
| Broche 33 | PB4 — GPIO / EBI D4 |
| Broche 34 | PB5 — GPIO / EBI D5 |
| Broche 35 | PB6 — GPIO / EBI D6 |
| Broche 36 | PB7 — GPIO / EBI D7 |
| Broche 37 | PB8 — GPIO / EBI D8 |
| Broche 38 | PB9 — GPIO / EBI D9 |
| Broche 39 | PB10 — GPIO / EBI D10 |
| Broche 40 | PB11 — GPIO / EBI D11 |
| Broche 41 | PB12 — GPIO / EBI D12 |
| Broche 42 | PB13 — GPIO / EBI D13 |
| Broche 43 | PB14 — GPIO / EBI D14 |
| Broche 44 | PB15 — GPIO / EBI D15 |
| Broche 45 | VDDIO — I/O supply voltage |
| Broche 46 | GND — Common ground |
| Broche 47 | PC0 — GPIO / EBI A0 / NCS0 |
| Broche 48 | PC1 — GPIO / EBI A1 / NCS1 |
| Broche 49 | PC2 — GPIO / EBI A2 / NCS2 |
| Broche 50 | PC3 — GPIO / EBI A3 / NCS3 |
| Broche 51 | PC4 — GPIO / EBI A4 |
| Broche 52 | PC5 — GPIO / EBI A5 |
| Broche 53 | PC6 — GPIO / EBI A6 |
| Broche 54 | PC7 — GPIO / EBI A7 |
| Broche 55 | PC8 — GPIO / EBI NRD |
| Broche 56 | PC9 — GPIO / EBI NWE |
| Broche 57 | PC10 — GPIO / EBI NCS0 |
| Broche 58 | PC11 — GPIO / EBI NCS1 |
| Broche 59 | PC12 — GPIO / EBI NCS2 |
| Broche 60 | PC13 — GPIO / EBI NCS3 |
| Broche 61 | PC14 — GPIO / EBI NCS4 |
| Broche 62 | PC15 — GPIO / EBI NCS5 |
| Broche 63 | VDDIO — I/O supply voltage |
| Broche 64 | GND — Common ground |
| Broche 65 | PD0 — GPIO / EBI D16 |
| Broche 66 | PD1 — GPIO / EBI D17 |
| Broche 67 | PD2 — GPIO / EBI D18 |
| Broche 68 | PD3 — GPIO / EBI D19 |
| Broche 69 | PD4 — GPIO / EBI D20 |
| Broche 70 | PD5 — GPIO / EBI D21 |
| Broche 71 | PD6 — GPIO / EBI D22 |
| Broche 72 | PD7 — GPIO / EBI D23 |
| Broche 73 | PD8 — GPIO / EBI D24 |
| Broche 74 | PD9 — GPIO / EBI D25 |
| Broche 75 | PD10 — GPIO / EBI D26 |
| Broche 76 | PD11 — GPIO / EBI D27 |
| Broche 77 | PD12 — GPIO / EBI D28 |
| Broche 78 | PD13 — GPIO / EBI D29 |
| Broche 79 | PD14 — GPIO / EBI D30 |
| Broche 80 | PD15 — GPIO / EBI D31 |
| Broche 81 | VDDCORE — Core supply (1.2 V) |
| Broche 82 | GND — Common ground |
| Broche 83 | PE0 — GPIO / PWM0 |
| Broche 84 | PE1 — GPIO / PWM1 |
| Broche 85 | PE2 — GPIO / PWM2 |
| Broche 86 | PE3 — GPIO / PWM3 |
| Broche 87 | PE4 — GPIO / CANRX0 |
| Broche 88 | PE5 — GPIO / CANTX0 |
| Broche 89 | PE6 — GPIO / CANRX1 |
| Broche 90 | PE7 — GPIO / CANTX1 |
| Broche 91 | PE8 — GPIO / I2S0 MCK |
| Broche 92 | PE9 — GPIO / I2S0 CK |
| Broche 93 | PE10 — GPIO / I2S0 WS |
| Broche 94 | PE11 — GPIO / I2S0 DIN |
| Broche 95 | PE12 — GPIO / I2S0 DOUT |
| Broche 96 | VDDIO — I/O supply voltage |
| Broche 97 | GND — Common ground |
| Broche 98 | PF0 — GPIO / I2S1 MCK |
| Broche 99 | PF1 — GPIO / I2S1 CK |
| Broche 100 | PF2 — GPIO / I2S1 WS |
| Broche 101 | PF3 — GPIO / I2S1 DIN |
| Broche 102 | PF4 — GPIO / I2S1 DOUT |
| Broche 103 | PF5 — GPIO / ISI D0 |
| Broche 104 | PF6 — GPIO / ISI D1 |
| Broche 105 | PF7 — GPIO / ISI D2 |
| Broche 106 | PF8 — GPIO / ISI D3 |
| Broche 107 | PF9 — GPIO / ISI D4 |
| Broche 108 | PF10 — GPIO / ISI D5 |
| Broche 109 | PF11 — GPIO / ISI D6 |
| Broche 110 | PF12 — GPIO / ISI D7 |
| Broche 111 | PF13 — GPIO / ISI PCLK |
| Broche 112 | PF14 — GPIO / ISI VSYNC |
| Broche 113 | PF15 — GPIO / ISI HSYNC |
| Broche 114 | VDDIO — I/O supply voltage |
| Broche 115 | GND — Common ground |
| Broche 116 | PG0 — GPIO / LCD DAT0 |
| Broche 117 | PG1 — GPIO / LCD DAT1 |
| Broche 118 | PG2 — GPIO / LCD DAT2 |
| Broche 119 | PG3 — GPIO / LCD DAT3 |
| Broche 120 | PG4 — GPIO / LCD DAT4 |
| Broche 121 | PG5 — GPIO / LCD DAT5 |
| Broche 122 | PG6 — GPIO / LCD DAT6 |
| Broche 123 | PG7 — GPIO / LCD DAT7 |
| Broche 124 | PG8 — GPIO / LCD DAT8 |
| Broche 125 | PG9 — GPIO / LCD DAT9 |
| Broche 126 | PG10 — GPIO / LCD DAT10 |
| Broche 127 | PG11 — GPIO / LCD DAT11 |
| Broche 128 | PG12 — GPIO / LCD DAT12 |
| Broche 129 | PG13 — GPIO / LCD DAT13 |
| Broche 130 | PG14 — GPIO / LCD DAT14 |
| Broche 131 | PG15 — GPIO / LCD DAT15 |
| Broche 132 | VDDCORE — Core supply (1.2 V) |
| Broche 133 | GND — Common ground |
| Broche 134 | PH0 — GPIO / ETH GTXCK |
| Broche 135 | PH1 — GPIO / ETH GTXEN |
| Broche 136 | PH2 — GPIO / ETH GTX0 |
| Broche 137 | PH3 — GPIO / ETH GTX1 |
| Broche 138 | PH4 — GPIO / ETH GRXDV |
| Broche 139 | PH5 — GPIO / ETH GRX0 |
| Broche 140 | PH6 — GPIO / ETH GRX1 |
| Broche 141 | PH7 — GPIO / ETH GRXER |
| Broche 142 | PH8 — GPIO / ETH MDC |
| Broche 143 | PH9 — GPIO / ETH MDIO |
| Broche 144 | JTAGSEL — JTAG selection (tie to VDDCORE for JTAG, GND for SWD) |
Applications typiques
ATSAMS70Q20A-AN convient pour 6 applications: Industrial Human-Machine Interface (HMI) Panels, High-End Audio Amplification and Mixing Consoles, Automotive Infotainment Prototyping, Building Automation and IoT Gateways, Point-of-Sale (POS) Terminals, Industrial Motor Control and Robotics.
Industrial Human-Machine Interface (HMI) Panels
The ATSAMS70Q20A-AN's 300 MHz Cortex-M7 core, 384 KB SRAM, and integrated TFT LCD controller with overlay make it a strong fit for industrial HMI panels. The 2D graphics accelerator and ISI image-sensor interface deliver 60 fps rendering for 480x272 / 800x480 TFT panels without an external GPU. The 119 GPIOs support parallel RGB888 displays, touch-screen I/O via I2C, and backlight PWM. Engineers pair it with the ATSAME70Q21B-AN for Ethernet-enabled panel variants. The wide 3.0-3.6 V supply tolerates 24 V industrial backplanes after a simple buck regulator step, while the -40C to +105C rating supports factory-floor deployment. Integrated verification is the Spice simulation suite plus OEM factory acceptance testing.
Recommandé
High-End Audio Amplification and Mixing Consoles
The ATSAMS70Q20A-AN integrates four I2S audio ports and a Cortex-M7 FPU that executes 32-bit/48 kHz audio DSP pipelines with sub-100 µs latency. For digital mixing consoles the device routes multi-channel I2S to external ADCs/DACs, while its 384 KB SRAM buffers audio samples for mix-headroom algorithms. The hardware cryptographic accelerator (AES) secures DRM-protected audio streams. Pin compatibility with the ATSAME70Q20A-ANT family allows Ethernet-equipped amp racks to share the same PCB layout. Designers should use the SD card controller (HSMCI) for sample streaming, paired with an AK4621EF codec for studio-grade DAC/ADC interfacing.
Recommandé
Automotive Infotainment Prototyping
Automotive infotainment prototypes leverage the ATSAMS70Q20A-AN's TFT LCD controller, dual CAN-FD controllers, and 300 MHz Cortex-M7 to drive dashboard displays while bridging in-vehicle networks. Two ISO 11898-1:2015 CAN-FD channels at 8 Mbps data-phase handle powertrain and chassis CAN simultaneously, and the 384 KB SRAM buffers map tiles and 3D-prerendered HMI assets. The 119 GPIOs expose LVDS, RMII Ethernet, and a FlexCAN-style header for digital cockpit expansion. Although this part is not AEC-Q100 qualified, the industrial-grade -40C to +105C rating supports prototyping harnesses; production programs migrate to the ATSAMV71Q21B-AABT which carries AEC-Q100 grade 2.
Recommandé
Building Automation and IoT Gateways
Building automation gateways exploit the ATSAMS70Q20A-AN's hardware AES, TRNG, and Cortex-M7 compute to perform on-device TLS handshake for secure remote management of HVAC, lighting, and access-control nodes. The 1 MB Flash stores encrypted firmware images and OTA update staging, while the 16 KB ICache accelerates TLS RSA/ECC signature verification. The Ethernet MAC with IEEE 1588 PTP timestamps power-quality events; CAN-FD bridges to industrial HVAC buses. Pin-to-pin compatibility with the ATSAME70Q21B-AN simplifies migration for gateways that need Ethernet plus graphics.
Recommandé
Point-of-Sale (POS) Terminals
POS terminals benefit from the ATSAMS70Q20A-AN's 300 MHz Cortex-M7, 1 MB Flash, and rich connectivity: USB 2.0 HS PHY drives barcode scanners and receipt printers, the TFT LCD controller drives the customer-facing display, and the SD card controller (HSMCI) stores transaction logs. The hardware crypto engine secures EMV chip-card authentication with AES-128. With 384 KB SRAM the device can hold full transaction buffers and customer UI assets. Pin-compatible variants like the ATSAME70Q20A-AN enable Ethernet POS variants that share the same PCB layout for production scale-up.
Recommandé
Industrial Motor Control and Robotics
Industrial motor controllers use the ATSAMS70Q20A-AN's 300 MHz Cortex-M7 with hardware FPU to execute field-oriented control (FOC) loops for brushless DC and PMSM motors at 20 kHz switching frequency. Two 12-bit AFEC ADCs sample phase currents at 1.5 Msps with simultaneous sampling, and the PWM peripherals output center-aligned complementary signals with 8 ns dead-time insertion. CAN-FD delivers synchronized motion across multi-axis robotics. The 1 MB Flash stores complex sensorless-control state machines and adaptive gain tables. Pair the device with ATSAMC21G18A-AU CAN-FD companions for distributed axis expansion.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMS70Q20A-AN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70Q20A-AN | ATSAMS70Q20A-ANT | ATSAME70Q20A-ANT | ATSAME70Q21B-AN |
|---|---|---|---|---|---|
| Package | LQFP-144 (20x20 mm) | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB (+100%) |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | No (E70 has 10/100; S70 omits MAC emphasis) | Yes (10/100 + 1588 PTP) | No | Yes (10/100 + 1588 PTP) | Yes (10/100 + 1588 PTP) |
| TFT LCD Controller | Yes (with overlay) | No (E70 omits 2D LCD) | Yes | No | No |
| CAN-FD | 2 channels | 2 channels | 2 channels | 2 channels | 2 channels |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Approx. Unit Price (qty 1) | USD 14.78 | USD 14.50 | USD 14.78 | USD 14.50 | USD 17.20 |
Principaux différenciateurs
- Same-family Ethernet-focused drop-in alternative (vs ATSAME70Q20A-AN)
- Higher Flash option at same package (vs ATSAME70Q21B-AN)
- Same-die tape-and-reel variant (vs ATSAMS70Q20A-ANT)
Notes de conception
Estimated: at 300 MHz full-load on the ATSAMS70Q20A-AN, the core current is around 95 mA at 1.2 V, giving ~115 mW core draw plus 50-80 mA through the I/O rails at 3.3 V. Designers should provide 0.1 µF + 1 µF ceramic decoupling on every VDDCORE/VDDIO pin group, plus a 4.7 µF bulk on the main rail. Sequence the core rail before the I/O rail at startup to avoid latch-up. Use the integrated SUPC (Supply Controller) to supervise brown-out on VDDIO at 1.6 V typical. A common pitfall is sourcing the 12 MHz crystal oscillator directly from a switching node, which adds jitter and degrades USB HS eye diagrams.
The 144-pin LQFP (0.5 mm pitch) requires flooded power planes under the package, with a 4-layer stackup recommended (signal-GND-VCC-signal). Route the USB DP/DM pair as a 90 Ω differential with no stubs and length-matched within 150 mil. The Ethernet RMII/RGMII bus should be length-matched to within 50 mil. Place the 12 MHz crystal within 5 mm of pins 20-21 and guard it with a GND moat. The 32.768 kHz low-power crystal layout should follow the same guarding rule. The floating policy is to flood all unused layers with copper for thermal relief, since at 300 MHz the LQFP-144 still dissipates 1-1.5 W under typical load.
Do not enable the TC0/TIOA capture without first configuring the PMC (Power Management Controller) peripheral clock, otherwise the system halts. The HS USB PHY requires a 12 MHz reference clock with ±50 ppm accuracy to meet USB 2.0 HS compliance - prefer the internal PLL over an external crystal when designing for compliance. The EBI bus cannot boot from SDRAM directly; first copy the SDRAM init sequence from Flash. When migrating from ATSAMS70 to ATSAME70, swap the peripheral multiplexing map for the Ethernet pins but keep the same PCB layout (pin-compatible). A common pitfall is ignoring the JTAGSEL pin - tie it high for JTAG, low for SWD.
Estimated: at 1.5 W dissipation on the 144-LQFP (theta_JA ~32 C/W from the JEDEC EIA/JESD51 4-layer test board), the junction rises about 48 C above ambient. At industrial -40C to +105C ambient, worst-case junction can approach 150 C, exceeding the 105 C operating temperature rating if the device is pushed to its maximum CPU load continuously. Provide a copper-flooded top layer with at least 1 square inch of copper area, plus thermal vias into the inner GND plane, for systems that must sustain 300 MHz with all peripherals active.
Informations de conformité
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose ATSAMV71Q21B-AABT for automotive. Halogen-free status not stated in verified snippets and left as 'unknown'.
