BSC9131NJN1HHHB - 800MHz QorIQ Qonverge SoC | NXP | Small Cell
Référence : BSC9131NJN1HHHB ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 500 | $199.5 | $99 750,00 |
| 1 000 | $171 | $171 000,00 |
BSC9131NJN1HHHB Présentation
A QorIQ Qonverge SoC is a heterogeneous multiprocessor system-on-chip that unifies general-purpose CPU control code, real-time DSP baseband processing, and dedicated hardware acceleration (such as MAPLE-B2F for LTE turbo/decoding) onto a single die. This architecture allows telecom OEMs to reduce board area, BOM cost, and power consumption compared to multi-chip FPGA-plus-DSP designs, while keeping the control plane and data plane tightly coupled for deterministic latency on Layer-1 baseband workloads.
Key features of the BSC9131NJN1HHHB include 800 MHz dual-issue e500 CPU core, 800 MHz SC3850 VLIW DSP with dual MAC units, MAPLE-B2F accelerator for LTE turbo and Viterbi decoding, DDR3/DDR3L memory controller with ECC support, two RGMII gigabit Ethernet MACs, three multi-protocol serdes lanes (up to 3.125 GHz supporting CPRI and OBSAI for backhaul and antenna interfaces), and an industrial operating temperature range of -40 C to +105 C. The 45 nm CMOS process provides a balance of static and dynamic power for fan-less small cell enclosures.
Typical applications of the BSC9131NJN1HHHB include small cell LTE/eNodeB base stations where the e500 handles L2/L3 control while the SC3850 plus MAPLE-B2F accelerate LTE turbo/Viterbi decoding in real time; enterprise VoIP media gateways benefiting from integrated DSP for echo cancellation and transcoding; smart grid substation controllers combining protocol stack (IEC 61850, DNP3) processing with deterministic DSP packet handling; and industrial defense systems requiring reliable operation across an extended thermal envelope.
When designing with this device, allocate careful attention to power-rail sequencing, DDR3L termination, and thermal management of the 21x21 mm FCBGA. The device is reaching end-of-life from NXP, so plan supply continuity, second-source qualification, or last-time-buy orders with NXP or authorized distributors well in advance of PCN deadlines.
When evaluating longevity, note that the BSC9131 family is targeted by NXP with a documented End-of-Life notice; migration paths should be explored through NXP QorIQ successors such as the B series or LS series communications processors depending on the workload profile. The package is not a drop-in replacement for newer QorIQ families and will require PCB and BSP rework.
This page synthesizes distributor pricing, lifecycle status, application guidance, and cross-reference alternatives not found in the manufacturer datasheet alone - giving engineers and procurement teams a single reference for design decisions, sourcing, and obsolescence planning.
Alternatives de remplacement direct pour BSC9131NJN1HHHB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec BSC9131NJN1HHHB (même facteur de forme et même empreinte) — différant par Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
BSC9131NJN1KHKB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
BSC9131NSN1KHKB
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$218 / unité
Voir la fiche technique →BSC9131NJN1HHHB-S
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
BSC9132NJN1HHHB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
BSC9131NJN1HHHB Valeurs maximales et caractéristiques électriques
| Series | QorIQ Qonverge BSC |
| Core Processor | PowerPC e500 |
| Number of Cores | 1 (e500) + 1 (SC3850 DSP) |
| Bus Width | 32-bit |
| Core Speed | 800 MHz (e500) / 800 MHz (SC3850) |
| Co-Processors / DSP | StarCore SC3850 + MAPLE-B2F accelerator |
| Process Technology | 45 nm CMOS |
| RAM Controllers | DDR3, DDR3L |
| Graphics Acceleration | No |
| Ethernet | 2x RGMII (10/100/1000 Mbps) |
| Serial I/O | 3x multi-protocol serdes (CPRI/OBSAI up to 3.125 GHz) |
| Température de fonctionnement | -40 C to +105 C |
| Boîtier | 520-FCBGA (21x21 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant (per NXP product page) |
| Lead-Free | Yes |
Configuration des broches de BSC9131NJN1HHHB
| Broche A1 | GND — Ground reference |
| Broche F26 | VDD_CORE — Core supply voltage |
Applications typiques
BSC9131NJN1HHHB convient pour 6 applications: Small Cell LTE/eNodeB Base Station, Enterprise VoIP Media Gateway, Smart Grid Substation Controller, Industrial Control / Defense Embedded System, Network Appliance / Industrial Router, Wireless Backhaul Aggregation Node.
Small Cell LTE/eNodeB Base Station
The BSC9131NJN1HHHB is purpose-built for small cell LTE/eNodeB base stations where the PowerPC e500 CPU at 800 MHz handles L2/L3 control-plane protocols while the StarCore SC3850 DSP plus the MAPLE-B2F accelerator execute real-time LTE turbo and Viterbi decoding at line rate. The integrated DDR3/DDR3L controller with ECC handles high-throughput baseband data, while three multi-protocol serdes lanes (CPRI/OBSAI up to 3.125 GHz) connect directly to radio units without an external framer FPGA. The 45 nm CMOS implementation keeps power within small cell thermal envelopes, enabling fan-less pico/femtocell deployments on poles or walls. The industrial -40 C to +105 C temperature range supports outdoor enclosure designs.
Recommandé
Enterprise VoIP Media Gateway
For enterprise VoIP media gateways, the BSC9131NJN1HHHB's combination of an 800 MHz e500 running the SIP/RTP control stack and the SC3850 DSP performing G.711/G.722/G.729 codec transcoding delivers deterministic media processing on a single device. The dual RGMII gigabit Ethernet ports support redundant LAN/WAN paths to PBX cores, while the DDR3/DDR3L controller maintains low-latency buffer access for jitter-sensitive voice frames. Compared with a CPU-only approach, the heterogeneous DSP acceleration offloads echo cancellation and conferencing mixing, freeing CPU cycles for higher-layer features such as TLS, SRTP, and SIP TLS handshakes. The single-chip integration reduces BOM versus discrete CPU+DSP designs and simplifies thermal management in 1U rackmount appliances.
Recommandé
Smart Grid Substation Controller
In smart grid substation controllers compliant with IEC 61850, DNP3, and Modbus, the BSC9131NJN1HHHB's -40 C to +105 C industrial temperature range ensures reliable operation in unconditioned outdoor cabinets. The e500 CPU executes the supervisory stack - GOOSE messaging, sampled value processing, and SCADA bridging - while the SC3850 DSP handles real-time metering DSP functions such as FFT-based harmonic analysis. The DDR3/DDR3L controller with ECC, combined with PARITY-protected internal buses, supports the long-term data integrity required by utility-grade assets. The three serdes lanes provide fiber or copper Ethernet uplinks for protection-class communications, and the integrated gigabit Ethernet MACs interface to substation LAN segments. Hardware encryption acceleration under MAPLE-B2F supports secure telemetry and key management.
Recommandé
Industrial Control / Defense Embedded System
Military and industrial defense platforms benefit from the BSC9131NJN1HHHB's extended -40 C to +105 C operating range, integrated DSP accelerator, and ruggedized FCBGA package. The e500 core runs the secure control OS (e.g., INTEGRITY, VxWorks), while the SC3850 DSP executes signal intelligence, sonar, or radar front-end DSP algorithms. MAPLE-B2F turbo/Viterbi acceleration is reused for forward-error-correction in tactical radio links. The device's 45 nm CMOS process provides the dynamic power scaling needed for battery-backed portable platforms. Hardware-level reliability features such as parity protection, ECC memory, and JTAG boundary scan support long-lifecycle programs and DO-160/ MIL-STD-810 qualification efforts.
Recommandé
Network Appliance / Industrial Router
When used as the main CPU in compact network appliances and industrial routers, the BSC9131NJN1HHHB provides 800 MHz of general-purpose packet processing plus DSP-assisted QoS, encryption, and deep-packet inspection. The two RGMII gigabit Ethernet MACs handle WAN/LAN segment connectivity, while the serdes lanes provide SFP+ or backhaul uplinks. The DDR3/DDR3L controller with ECC keeps packet buffers reliable for industrial traffic profiles. Compared to a discrete NPU plus MCU approach, this single-chip heterogeneous design simplifies firmware development and reduces board area. The -40 C to +105 C thermal envelope supports DIN-rail and outdoor deployments where cooling is passive.
Recommandé
Wireless Backhaul Aggregation Node
In wireless backhaul aggregation nodes bridging small cells to the core network, the BSC9131NJN1HHHB's CPRI/OBSAI-capable serdes lanes interface directly to remote radio heads, while the e500 core runs the backhaul IPsec/GRE/MPLS stack and the SC3850 DSP provides timing synchronization and packet-classification acceleration. The DDR3/DDR3L controller maintains timing-critical PTP/1588 datasets, and ECC protects against soft errors in fielded radios. The 520-FCBGA package is suited to conduction-cooled enclosures on tower tops or street cabinets. Industrial-grade temperature support and the integrated BOM reduction (vs multi-chip NPU+DSP+FPGA) reduce mean time between failure and field maintenance windows.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour BSC9131NJN1HHHB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | BSC9131NJN1KHKB | BSC9131NSN1KHKB | BSC9131NJN1HHHB-S | BSC9132NJN1HHHB |
|---|---|---|---|---|---|
| Package | 520-FCBGA (21x21 mm) | 520-FCBGA (21x21 mm) - same | 520-FCBGA (21x21 mm) - same | 520-FCBGA (21x21 mm) - same | 520-FCBGA (21x21 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Processor | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Speed | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 1 GHz |
| DSP Core | StarCore SC3850 + MAPLE-B2F | StarCore SC3850 + MAPLE-B2F | StarCore SC3850 + MAPLE-B2F | StarCore SC3850 + MAPLE-B2F | Dual SC3850 + MAPLE-B2F |
| RAM Controllers | DDR3, DDR3L | DDR3, DDR3L | DDR3, DDR3L | DDR3, DDR3L | DDR3, DDR3L |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Lifecycle Status | Last Time Buy (NXP EOL) | Last Time Buy | Last Time Buy | Last Time Buy | Active |
Principaux différenciateurs
- True heterogeneous SoC - CPU + DSP + hardware accelerator on one die (vs BSC9132NJN1HHHB)
- Industrial -40 C to +105 C operating range (vs BSC9131NJN1KHKB)
- Integrated DDR3/DDR3L controller with ECC (vs Discrete CPU + external DSP)
- Three multi-protocol serdes lanes up to 3.125 GHz (vs B4860 macro-cell SoC)
Notes de conception
The 520-FCBGA (21x21 mm) package of the BSC9131NJN1HHHB is best cooled by a thermal interface material bonded to an integrated heat spreader or chassis cold plate. Estimated: at 1.0 V core and full 800 MHz dual-core loading, junction temperature rise over ambient in a still-air enclosure can exceed 35 C without airflow. Provide at minimum 200 LFM forced-air cooling or conduction to a metal chassis to keep Tj within the -40 C to +105 C operating range.
Route DDR3/DDR3L traces with matched impedance (target 50 ohm single-ended, 100 ohm differential) and length-matching within 25 mil across the byte lanes to the BSC9131NJN1HHHB. Place VTT termination resistors as close as possible to the DRAM and decouple each DDR supply rail with 100 nF + 10 uF ceramic capacitors plus bulk polymer. Maintain at least 4 PCB layers with a dedicated ground plane to control return paths for the 3.125 GHz serdes signals.
Sequence core, I/O, DDR, and serdes power rails on the BSC9131NJN1HHHB according to NXP's recommended power-up order. Use NXP-recommended PMIC solutions when available; otherwise, ensure each rail reaches regulation within the specified monotonic ramp time and apply POR sequencing with a supervisor. Estimated: inrush current on the 1.0 V core rail can exceed 6 A during warm-boot; size the input fuse and bulk capacitors accordingly.
Plan supply continuity for the BSC9131NJN1HHHB because NXP has flagged the part End of Life. Place last-time-buy orders with authorized distributors well before the PCN deadline and qualify a successor (e.g., LS1046A) in parallel. Do not assume DDR3L-only footprints - the BSC9131 supports both DDR3 and DDR3L; verify the chosen DIMM is supported in your BSP revision.
For the three multi-protocol serdes lanes (CPRI/OBSAI up to 3.125 GHz) of the BSC9131NJN1HHHB, route AC-coupled differential pairs over a continuous reference plane. Maintain 85 ohm differential impedance, keep intra-pair skew under 5 ps, and use via back-drilling for layer transitions. Confirm pre-emphasis and de-emphasis settings against NXP SerDes configuration register recommendations.
Informations de conformité
RoHS compliant per NXP product page; AEC-Q100 is not applicable to this communications SoC. Halogen-free status unknown in provided data.
