BSC9131NXE1KHKB - 800MHz 32-Bit Processor | NXP
Référence : BSC9131NXE1KHKB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.2823 | $48,28 |
| 10 | $48.2823 | $482,82 |
| 100 | $48.2823 | $4 828,23 |
| 500 | $48.2823 | $24 141,15 |
| 1 000 | $48.2823 | $48 282,30 |
BSC9131NXE1KHKB Présentation
A system-on-chip is an integrated semiconductor that combines a general-purpose processor, specialized digital signal processing, memory interfaces, security functions, and accelerator hardware. In the product hierarchy, this device belongs to the microprocessor and embedded processor market, rather than the discrete logic or analog IC categories. Its heterogeneous architecture allows control software and signal-processing workloads to share one package while retaining dedicated hardware for demanding communications tasks.
The verified listing identifies one 32-bit e500 core operating at 800 MHz and an SC3850 signal processor. Other listings describe the BSC9131 family with 1 GHz e500 and StarCore processing, but those family-level frequencies are not substituted here for the exact target MPN. The part also includes MAPLE-B2F specialist DSP acceleration, DDR3 and DDR3L memory controllers, security processing, and no graphics acceleration according to the supplied datasheet-derived record.
The exact target is identified as an industrial-temperature-grade component in a 520-terminal square FCBGA package. Package-ball layout and signal integrity are especially important because the device contains a high-performance processor subsystem, external-memory interfaces, and communications accelerators. Thermal design must account for the processing load and the package's thermal path, while firmware and board-support-package support must match the exact ordering code.
Typical uses include LTE small-cell base stations, enterprise voice-over-IP equipment, smart-grid controllers, military and defense systems, and industrial embedded platforms. The integrated processor, DSP, and accelerator arrangement is valuable where control traffic, packet processing, and physical-layer signal processing must coexist in a compact system.
Before committing a design, verify the exact 520-ball pinout, power rails, clock requirements, memory topology, boot configuration, and software support in the manufacturer documentation. Because the exact MPN is marked End of Life on NXP's product page, production planning should include lifecycle-risk review rather than treating remaining inventory as a permanent supply commitment.
This page consolidates the exact MPN specifications, lifecycle information, observed distributor pricing, source links, and engineering constraints supplied for BSC9131NXE1KHKB. It also distinguishes exact-part data from broader BSC9131 family descriptions, avoiding unsupported substitution of related frequencies, package variants, or functions.
Alternatives de remplacement direct pour BSC9131NXE1KHKB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesBSC9131NXE1KHKB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Product Type | Microprocessor unit |
| Processor Architecture | 32-bit RISC |
| Exact MPN Clock Frequency | 800 MHz |
| General-Purpose Core | Power Architecture e500 |
| DSP Core | StarCore SC3850 |
| Core Count | 1 core |
| Bus Width | 32-bit |
| Process Technology | 45 nm |
| Specialist Accelerator | MAPLE-B2F baseband acceleration processing |
| Security Accelerator | SEC 4.4 |
| RAM Controllers | DDR3 and DDR3L |
| Graphics Acceleration | No |
| Boîtier | 520-ball FCBGA |
| Package Shape | Square |
| Terminal Count | 520 balls |
| Temperature Grade | Industrial |
| Température de fonctionnement | -40°C to +105°C |
| Shipping Package | Tray |
| Statut du cycle de vie | End of Life |
Guide de configuration des broches du BSC9131NXE1KHKB tray
Configuration des broches du BSC9131NXE1KHKB (boîtier tray). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour BSC9131NXE1KHKB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
BSC9131NXE1KHKB convient pour 6 applications: LTE Small-Cell Base Stations, Enterprise VoIP Platforms, Smart-Grid Control Equipment, Industrial Communication Controllers, Military and Defense Embedded Systems, Signal-Processing Edge Equipment.
LTE Small-Cell Base Stations
BSC9131NXE1KHKB fits small-cell base-station controllers because it combines an 800 MHz 32-bit Power Architecture e500 core with an SC3850 DSP and MAPLE-B2F baseband accelerator. This heterogeneous arrangement allows control, packet-handling, and signal-processing tasks to share a 45 nm system-on-chip rather than rely on separate processors. Its DDR3 and DDR3L controllers support external working memory, while the -40°C to +105°C industrial range suits outdoor equipment. The principal limitation is End-of-Life supply risk, so production programs must secure traceability and long-term inventory before committing volumes.
Recommandé
Enterprise VoIP Platforms
The integrated e500 processor, SC3850 DSP, and MAPLE-B2F accelerator make BSC9131NXE1KHKB applicable to enterprise voice-over-IP platforms that combine packet control with real-time media processing. Its 800 MHz exact-order clock provides compute capacity for protocol handling and signal-processing tasks, while DDR3 and DDR3L controllers support working memory. The industrial temperature range permits deployment in network appliances and controlled communications enclosures. Integration reduces the number of processors in a voice gateway, but firmware, DSP libraries, timing, and security assets must remain compatible with the exact ordering code.
Recommandé
Smart-Grid Control Equipment
BSC9131NXE1KHKB can support smart-grid controllers that need deterministic communications, control processing, and specialized signal handling in one package. The 32-bit e500 core handles general workloads, the SC3850 DSP supports real-time processing, and MAPLE-B2F provides baseband acceleration for communications-oriented workloads. DDR3 and DDR3L controllers permit compact memory designs, while the -40°C to +105°C range is relevant to industrial edge equipment. Engineers must qualify the complete power, thermal, network, and functional-safety design rather than treating the processor alone as safety-certified.
Recommandé
Industrial Communication Controllers
The BSC9131NXE1KHKB is suitable for industrial communication controllers because its e500 CPU, SC3850 DSP, and MAPLE-B2F accelerator combine general-purpose and real-time workloads in a 520-ball FCBGA. Its 800 MHz exact-order frequency supports packet and protocol processing, and DDR3/DDR3L interfaces provide access to external memory. The -40°C to +105°C industrial grade supports controlled factory and utility environments. Because no exact drop-in replacement was verified, maintenance platforms should preserve software images, boot media, schematics, and BOM traceability alongside obsolete-part inventory.
Recommandé
Military and Defense Embedded Systems
BSC9131NXE1KHKB offers an integrated compute and signal-processing architecture for military and defense embedded systems where control code and communications workloads coexist. The e500 core, SC3850 DSP, and MAPLE-B2F accelerator are packaged on a 45 nm device, reducing the number of discrete processing components. Its industrial -40°C to +105°C specification must be checked against the actual environmental envelope and qualification requirements. No AEC-Q100 claim is supported, and deployment into a defense program requires separate export-control, reliability, security, and long-term supply review.
Recommandé
Signal-Processing Edge Equipment
BSC9131NXE1KHKB suits signal-processing edge equipment because the SC3850 DSP and MAPLE-B2F accelerator operate alongside the 800 MHz e500 processor. Designers can allocate protocol and supervisory functions to the general-purpose core while reserving dedicated resources for communications and real-time workloads. DDR3 and DDR3L controllers support external memory access, and the industrial temperature range covers controlled industrial enclosures. Integration can simplify board partitioning, but high-speed routing across the 520-ball FCBGA requires verified reference stackups, clean power delivery, and signal-integrity simulation before release.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour BSC9131NXE1KHKB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Notes de conception
Do not treat the 1 GHz wording found in generic BSC9131 family summaries as the frequency of BSC9131NXE1KHKB. The exact distributor record specifies 800 MHz. Likewise, do not infer a replacement from an MPN sharing the BSC9131 prefix. Freeze the full ordering code, datasheet revision, firmware image, boot configuration, package ball map, and supply temperature grade together.
The 520-ball FCBGA requires a complete multi-rail power architecture that cannot be reconstructed from the supplied excerpts. Before layout, obtain every ball assignment, voltage, tolerance, sequencing rule, current limit, and decoupling recommendation from the exact manufacturer documentation. Treat any converter sizing as unavailable until those values are verified; incorrect rail assumptions can prevent boot, corrupt memory interfaces, or damage the processor.
Validate junction temperature across worst-case processor, DDR, accelerator, clock, and I/O activity rather than using ambient temperature alone. The package exposes its thermal path through a 520-ball FCBGA, so board copper, vias, enclosure conduction, and heat spreading must be modeled. Because the supplied data only confirms a -40°C to +105°C operating range, calculate dissipated power from actual rail currents and processor utilization after obtaining authoritative operating-current data.
The e500, SC3850, accelerator, and DDR3/DDR3L interfaces make high-speed signal integrity a central PCB constraint. Use the manufacturer reference design and exact package ball map, preserve recommended layer transitions and reference planes, and complete stackup-aware simulations before release. Do not improvise a 520-ball escape-routing strategy from generic FBGA rules because power, grounds, test points, and high-speed nets may be ball-specific.
Informations de conformité
The supplied manufacturer and distributor excerpts do not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-mineral status. Industrial temperature grade is not treated as evidence of automotive qualification.
