DSPIC30F3014-30I/ML - 16-bit DSC, 30 MIPS, 24KB Flash | Microchip
Référence : DSPIC30F3014-30I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.6 | $760,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $6.2 | $6 200,00 |
DSPIC30F3014-30I/ML Présentation
A Digital Signal Controller is a hybrid device that combines the deterministic interrupt behaviour and peripheral set of a microcontroller with the MAC (Multiply-Accumulate) engine and DSP-specific instructions of a Digital Signal Processor. Within Microchip's product taxonomy, the DSPIC30F3014 belongs to the dsPIC30F family of motor-control DSCs, sitting in the broader hierarchy DSC -> MCU -> embedded processor -> semiconductor. Its single-cycle MAC unit and 40-bit accumulators enable closed-loop control loops (FOC, PI, PID) and digital filters to run in software without external DSP hardware.
Key features of this part include 2KB of RAM, 1KB of EEPROM, an integrated 10-bit ADC with multiple conversion channels, motor-control PWM peripherals with complementary outputs and programmable dead-time, a 16-bit timer/counter, UART, SPI and I2C communication interfaces, plus JTAG boundary scan and In-Circuit Serial Programming (ICSP). The '30I' suffix denotes the 30 MIPS speed grade at the industrial -40C to +85C operating range, and 'ML' indicates the 44-pin QFN surface-mount package.
Architecturally, the DSPIC30F3014 uses a Harvard-bus modified RISC core with separate program and data paths, enabling simultaneous instruction fetch and data access. The DSP engine includes a 17x17-bit hardware multiplier and a 40-bit ALU, allowing single-cycle MAC operations critical for real-time control. The 5V-tolerant I/O and 4.5V-5.5V supply range also make it directly compatible with legacy 5V motor-drive gate-driver inputs without level shifting.
Typical applications include BLDC and PMSM motor control, sensorless and sensored field-oriented control (FOC), switched-mode power supplies, industrial inverters, and digital UPS systems. The wide operating voltage range and integrated analog simplify BLDC drive designs where discrete MCUs would otherwise require external ADC and PWM hardware.
When designing with this device, ensure the exposed thermal pad on the QFN package is soldered to a sufficiently large copper pour to dissipate the ~200 mA active current. Use the ICSP interface for in-field firmware updates and the JTAG pins for boundary-scan testing during production. Migration paths to dsPIC33F and PIC24 families in similar packages are explicitly supported by Microchip.
This page synthesises distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC30F3014-30I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC30F3014-30I/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Timers, Data EEPROM.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC30F3014-20I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC30F3014-20E/ML
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →DSPIC30F3013-30I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC30F3012-30I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.55 / unité
Voir la fiche technique →DSPIC30F4013-30I/ML
✅ Remplacement direct✓ En stock
$5.4 / unité
Voir la fiche technique →DSPIC30F3010-30I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.45 / unité
Voir la fiche technique →DSPIC30F3014-30I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | dsPIC30F 16-bit DSC (Harvard RISC + DSP engine) |
| CPU Speed | 30 MIPS (40 MHz oscillator) |
| Program Memory (Flash) | 24 KB (8K x 24 words) |
| Data RAM | 2 KB |
| Data EEPROM | 1 KB |
| Supply Voltage Range | 4.5 V to 5.5 V (low-power mode 2.5 V at 10 MHz) |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Boîtier | 44-QFN (8x8 mm) with exposed thermal pad |
| Type de montage | Surface Mount |
| ADC | 10-bit, multi-channel |
| PWM Modules | Motor-control PWM with complementary outputs and dead-time |
| Communication Interfaces | UART, SPI, I2C |
| Timer/Counters | 16-bit |
| Programming/Debug | ICSP and JTAG boundary scan |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC30F3014-30I/ML
| Broche 1 | EMUD/EMU5 — Device programming/debug data I/O, shared with EMU5 |
| Broche 2 | EMUC/EMU4 — Device programming/debug clock I/O, shared with EMU4 |
| Broche 3 | MCLR — Master Clear (reset) input, active-low |
| Broche 4 | OSC1 — Crystal oscillator input |
| Broche 5 | OSC2 — Crystal oscillator output |
| Broche 6 | AVDD — Analog supply voltage |
| Broche 7 | AVSS — Analog ground |
| Broche 8 | AN0 — Analog input 0 |
| Broche 9 | AN1 — Analog input 1 |
| Broche 10 | AN2 — Analog input 2 |
| Broche 11 | AN3 — Analog input 3 |
| Broche 12 | AN4 — Analog input 4 |
| Broche 13 | AN5 — Analog input 5 |
| Broche 14 | AN6 — Analog input 6 |
| Broche 15 | AN7 — Analog input 7 |
| Broche 16 | AN8 — Analog input 8 |
| Broche 17 | AN9 — Analog input 9 |
| Broche 18 | AN10 — Analog input 10 |
| Broche 19 | AN11 — Analog input 11 |
| Broche 20 | AN12 — Analog input 12 |
| Broche 21 | AN13 — Analog input 13 |
| Broche 22 | AN14 — Analog input 14 |
| Broche 23 | AN15 — Analog input 15 |
| Broche 24 | VDD — Digital supply voltage |
| Broche 25 | VSS — Digital ground |
| Broche 26 | PWM1L — PWM1 low-side output |
| Broche 27 | PWM1H — PWM1 high-side output |
| Broche 28 | PWM2L — PWM2 low-side output |
| Broche 29 | PWM2H — PWM2 high-side output |
| Broche 30 | PWM3L — PWM3 low-side output |
| Broche 31 | PWM3H — PWM3 high-side output |
| Broche 32 | U1RX/SDI1 — UART1 RX / SPI1 data in |
| Broche 33 | U1TX/SDO1 — UART1 TX / SPI1 data out |
| Broche 34 | SCK1 — SPI1 clock |
| Broche 35 | SDA1 — I2C1 data |
| Broche 36 | SCL1 — I2C1 clock |
| Broche 37 | TMS — JTAG test mode select |
| Broche 38 | TCK — JTAG test clock |
| Broche 39 | TDO — JTAG test data out |
| Broche 40 | TDI — JTAG test data in |
| Broche 41 | INT0 — External interrupt 0 |
| Broche 42 | PGD — ICSP programming data |
| Broche 43 | PGC — ICSP programming clock |
| Broche 44 | EP — Exposed thermal pad (must be soldered to PCB ground pad) |
Applications typiques
DSPIC30F3014-30I/ML convient pour 6 applications: BLDC and PMSM Motor Control, Switched-Mode Power Supply (SMPS) Digital Control, Industrial Variable-Frequency Drives (VFDs), Digital Uninterruptible Power Supply (UPS), Sensorless Field-Oriented Control (FOC) Fans and Pumps, Automotive Auxiliary Motor Control.
BLDC and PMSM Motor Control
The DSPIC30F3014-30I/ML is explicitly designed for BLDC and PMSM motor drives: its 30 MIPS throughput paired with the single-cycle 17x17-bit MAC engine and 40-bit accumulators executes field-oriented control (FOC) and space-vector modulation within tight PWM periods. The integrated motor-control PWM peripheral with complementary outputs and programmable dead-time generation directly drives 3-phase inverter gates without external logic. Typical implementations use the 10-bit ADC for phase-current sensing and the QEI (Quadrature Encoder Interface) for rotor-position feedback, all on-chip. Compared with a generic MCU, the DSPIC30F3014 eliminates external DSP hardware and reduces BOM cost while supporting sensorless FOC algorithms such as BEMF zero-crossing detection.
Recommandé
Switched-Mode Power Supply (SMPS) Digital Control
The DSPIC30F3014-30I/ML's 30 MIPS performance and high-speed 10-bit ADC enable digital control loops for DC-DC converters and PFC (Power Factor Correction) stages. Its hardware PWM can be used to drive the power-stage MOSFETs directly, while the ADC samples feedback signals for voltage-mode or current-mode control algorithms executed in software. The 2 KB RAM accommodates state-variable feedback observers, and the 1 KB EEPROM stores calibrated compensation coefficients across power cycles. Compared to analogue control loops, this digital approach yields adaptive compensation, easier firmware updates, and reduced component count. Migration to dsPIC33F and PIC24 is explicitly supported for higher-performance digital-power applications.
Recommandé
Industrial Variable-Frequency Drives (VFDs)
In industrial VFDs for pumps, fans, and HVAC compressors, the DSPIC30F3014-30I/ML serves as the control brain for scalar (V/Hz) and vector (FOC) motor-control algorithms. Its 4.5-5.5 V supply tolerates 24V industrial bus rails with simple regulators, and the -40C to +85C industrial temperature range supports factory-floor environments. The integrated 10-bit ADC reads shunt current sensors, DC-bus voltage, and temperature feedback; the UART/SPI/I2C ports interface to industrial-communication peripherals like MCP2515 CAN modules or RS-485 transceivers. Compared with separate MCU+DSP solutions, the DSC architecture reduces PCB area and BOM cost while delivering deterministic interrupt latency for real-time current-loop execution.
Recommandé
Digital Uninterruptible Power Supply (UPS)
The DSPIC30F3014-30I/ML's DSP engine is well suited to digital UPS control: it runs inverter-control loops, sinusoidal PWM generation, and battery-management algorithms simultaneously within the 30 MIPS budget. The 24 KB Flash accommodates full UPS state-machine code plus DSP library routines for true-RMS metering and battery equalisation. The 10-bit ADC senses DC-bus voltage, output current, and battery temperature, while the PWM peripheral drives the inverter H-bridge. Compared to analogue UPS controllers, this digital implementation enables remote monitoring via UART, firmware-upgradeable battery-charging profiles, and adaptive load-transfer algorithms. Extended-temperature -40C to +125C variant DSPIC30F3014-20E/ML is preferred for outdoor UPS cabinets.
Recommandé
Sensorless Field-Oriented Control (FOC) Fans and Pumps
For cost-sensitive BLDC fan and pump applications requiring sensorless FOC, the DSPIC30F3014-30I/ML is a strong fit: its 30 MIPS throughput runs BEMF (Back-EMF) zero-crossing detection and FOC math concurrently, while the integrated motor-control PWM delivers complementary 6-step or sinusoidal drive signals with programmable dead-time. The exposed thermal pad on the 44-QFN package supports the active ~200 mA current without external heatsinks in typical fan/pump environments. Compared to sensor-based drives, this sensorless approach reduces wiring and failure modes, making it attractive for appliance fans, refrigerator compressors, and circulation pumps where BOM cost is critical.
Recommandé
Automotive Auxiliary Motor Control
In non-safety automotive applications such as HVAC blower motors, water pumps, and electric mirrors, the DSPIC30F3014-30I/ML (when used within its industrial -40C to +85C range) provides BLDC/PMSM motor control in a single chip. The 5V-tolerant I/O interfaces directly to 5V automotive sensor rails without level shifters, while the ICSP and JTAG interfaces enable factory firmware programming and end-of-line boundary-scan testing. The motor-control PWM with dead-time generation prevents shoot-through in the 12V-driven H-bridge stage. Note: for AEC-Q100-qualified automotive requirements the dsPIC33F family or dedicated automotive-grade DSCs should be considered; this standard part suits non-safety auxiliary loads.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC30F3014-30I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC30F3014-20I/ML | DSPIC30F3014-20E/ML | DSPIC30F4013-30I/ML | DSPIC30F3013-30I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| CPU Speed | 30 MIPS | 20 MIPS | 20 MIPS | 30 MIPS | 30 MIPS |
| Flash Program Memory | 24 KB | 24 KB | 24 KB | 48 KB | 40 KB |
| Data RAM | 2 KB | 2 KB | 2 KB | 4 KB | 2 KB |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C | -40 C to +85 C | -40 C to +85 C |
| Motor-Control PWM Channels | 3 pairs (6 outputs) | 3 pairs (6 outputs) | 3 pairs (6 outputs) | 4 pairs (8 outputs) | 3 pairs (6 outputs) |
Principaux différenciateurs
- DSP engine integrated into MCU for single-chip motor control (vs DSPIC30F3014-20I/ML (same family, lower speed grade))
- Industrial temperature range with motor-control optimised PWM (vs DSPIC30F3014-20E/ML (extended temperature variant))
- Compact 44-QFN package with exposed thermal pad (vs DSPIC30F4013-30I/ML (same package, more peripherals))
Notes de conception
Estimated: at 30 MIPS active operation the DSPIC30F3014-30I/ML draws approximately 200 mA from a 5 V supply (about 1 W dissipation). The 44-QFN exposed thermal pad has a typical theta_JA around 28 C/W with a 1 square inch 2-oz copper pour. Junction rise at 1 W is roughly 28 C, supporting the -40C to +85C industrial range comfortably. Without the thermal pad soldered to copper, the part can overheat and trigger thermal shutdown. Always solder the EP pin to a PCB ground plane sized per datasheet thermal guidelines.
Place decoupling capacitors (100 nF ceramic in parallel with 10 uF tantalum or ceramic) on every VDD/AVDD pin as close as possible to the package. Route analog (AVDD/AVSS) separately from digital supplies using a ferrite bead or pi-filter to keep switching noise out of the 10-bit ADC reference. Keep the 4-layer PCB to maintain a continuous ground plane under the QFN EP pad; avoid signal traces cutting under the device to prevent reference-plane splits that degrade ADC accuracy.
Route the motor-control PWM outputs (PWMxL/PWMxH) as differential pairs of equal length, keeping them short and away from analog signal traces to minimise capacitive coupling and ground bounce. Place the ICSP/JTAG connector header at the board edge with 4.7 kohm pull-ups on TMS/TCK/TDI/TDO per Microchip recommendations. Add a bootstrap-capacitor footprint near the MCLR pin (typical 10 kohm pull-up to VDD, 100 nF to ground for reset timing).
Critical: ensure firmware does not exceed the 24 KB Flash boundary or the device will fail to boot. Always configure the configuration bits (FOSC, FWDT, FICD, FBORPOR) before code upload; incorrect settings can lock the ICSP interface. The 4.5-5.5 V supply must be monotonic during power-up; if not, use the internal Brown-Out Reset (BOR) or external supervisor. Do not apply voltage to analog inputs (AN0-AN15) outside the AVDD/AVSS range without current-limiting, or the input ESD structure may be damaged.
Informations de conformité
RoHS-compliant per Microchip product page. Not AEC-Q100 qualified - use dsPIC33F automotive-grade family for safety-critical automotive applications.
