DSPIC33CH512MP505-E/M4 - 100MHz Dual-Core DSC, 512KB | Microchip
Référence : DSPIC33CH512MP505-E/M4 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.92 | $6,92 |
| 10 | $6.12 | $61,20 |
| 100 | $5.32 | $532,00 |
| 500 | $4.62 | $2 310,00 |
| 1 000 | $3.95 | $3 950,00 |
DSPIC33CH512MP505-E/M4 Présentation
A Digital Signal Controller (DSC) is a hybrid microcontroller/DSP that combines a microcontroller's deterministic interrupt handling and peripheral integration with a DSP's single-cycle MAC engine and dedicated math instructions; it sits in the product hierarchy between microcontroller (MCU) and digital signal processor (DSP), and is commonly deployed in high-performance motor control, digital power conversion, and precision sensing. The dsPIC33CH family is the dual-core evolution of Microchip's dsPIC33CK/DSC line, designed for systems that need hard real-time partitioning.
Key features of the -E/M4 variant include 512 KB program Flash, 72 KB SRAM, a 200 MHz PLL-derived system clock, integrated high-resolution PWM (1 ns edge placement) with 8 output pairs, four 12-bit ADCs with 3.5 MSPS aggregate sampling, two 12-bit DACs, four analog comparators, three op-amps, two CAN-FD modules, four UART/SPI/I2C configurable serial interfaces, and a temperature range of -40C to +125C (-E industrial grade). The 48-UQFN package provides a compact footprint while exposing up to 35 general-purpose I/O and the dedicated Master/Secondary inter-core MSI mailbox for deterministic IPC.
On the architectural side, the Main core boots first and can optionally launch the Secondary core from a programmable address, with shared peripherals routed via a programmable crossbar and pin ownership registers that decide which core drives each GPIO at any given moment; the two cores communicate through MSI FIFOs and shared SFRs, allowing hand-off of high-rate control loops without OS overhead. The on-chip 8-channel Event System, CTMU for capacitive touch, and dedicated crypto/hash engines further reduce external component count.
Typical applications include field-oriented control (FOC) of PMSM/BLDC motors, totem-pole bridgeless PFC power-factor correction, LLC/phase-shift full-bridge digital power supplies, and functional-safety ASIL-B/ASIL-C capable drive platforms. The dsPIC33CH dual-core pattern is specifically aimed at designs that previously required an external companion DSP or FPGA.
When designing with this part, pay close attention to the pin-ownership matrix early in pin allocation, because the Secondary core and Main core cannot simultaneously drive the same GPIO and conflicts must be resolved at boot-time via SFR writes. Layout the 48-UQFN with a continuous GND/PWR pour on the exposed pad for thermal dissipation - this package runs at full speed with up to 200 MHz internal clock and benefits from a 4-layer PCB.
This page synthesizes distributor pricing, dual-core vs single-core drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33CH512MP505-E/M4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH512MP505-E/M4 (même facteur de forme et même empreinte) — différant par Package, ADC, Core Architecture, Program Memory (Flash), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH512MP505-I/M4
✅ Remplacement direct✓ En stock
$6.85 / unité
Voir la fiche technique →DSPIC33CH256MP505-E/M4
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →DSPIC33CH128MP505-E/M4
✅ Remplacement direct✓ En stock
$4.5 / unité
Voir la fiche technique →DSPIC33CH512MP205-E/M4
✅ Remplacement direct✓ En stock
$7.18 / unité
Voir la fiche technique →DSPIC33CH512MP205T-I/M4
✅ Remplacement direct✓ En stock
$5.07 / unité
Voir la fiche technique →DSPIC33CH128MP205-I/M4
✅ Remplacement direct✓ En stock
$5.48 / unité
Voir la fiche technique →DSPIC33CH512MP505-E/M4 Valeurs maximales et caractéristiques électriques
| Product Family | dsPIC33CH (dual-core DSC) |
| Core Architecture | Dual-core: 1x Main (100 MIPS) + 1x Secondary (90 MIPS) |
| Main Core Speed | 100 MIPS / 200 MHz max |
| Secondary Core Speed | 90 MIPS / 180 MHz max |
| Program Flash | 512 KB |
| Tension d'alimentation | 3.0 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C (E = industrial) |
| Boîtier | 48-pin UQFN (M4), 6x6 mm |
| Type de montage | Surface Mount |
| ADC | 4x 12-bit, 3.5 MSPS aggregate |
| DAC | 2x 12-bit |
| Comparators | 4x analog comparators |
| Op-Amps | 3x on-chip operational amplifiers |
| High-Resolution PWM | 8 output pairs, 1 ns edge placement |
| CAN | 2x CAN-FD modules |
| UART/SPI/I2C | 4x configurable serial interfaces |
| Inter-Core Mailbox | MSI (Master-Slave Interface) FIFOs and shared SFRs |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33CH512MP505-E/M4
| Broche 1 | RP46/PWM4H/RE0 — Remappable peripheral I/O / PWM output / port E bit 0 |
| Broche 2 | RP47/PWM4L/RE1 — Remappable peripheral I/O / PWM complementary output / port E bit 1 |
| Broche 3 | AVDD — Analog supply voltage (3.3 V) |
| Broche 4 | AVSS — Analog ground |
| Broche 5 | OA1OUT/AN0/CMP1A/RA0 — Op-amp 1 output / analog input 0 / comparator 1 input A / port A bit 0 |
| Broche 6 | OA1IN-/AN1/RA1 — Op-amp 1 inverting input / analog input 1 / port A bit 1 |
| Broche 7 | OA1IN+/AN2/RA2 — Op-amp 1 non-inverting input / analog input 2 / port A bit 2 |
| Broche 8 | DAC1OUT/AN3/CMP1B/RA3 — DAC1 output / analog input 3 / comparator 1 input B / port A bit 3 |
| Broche 9 | OA3OUT/AN4/CMP2A/RA4 — Op-amp 3 output / analog input 4 / comparator 2 input A / port A bit 4 |
| Broche 10 | OA3IN-/AN5/RA5 — Op-amp 3 inverting input / analog input 5 / port A bit 5 |
| Broche 11 | OA3IN+/AN6/RA6 — Op-amp 3 non-inverting input / analog input 6 / port A bit 6 |
| Broche 12 | AVSS — Analog ground |
| Broche 13 | AVDD — Analog supply voltage (3.3 V) |
| Broche 14 | AN7/CMP2B/RA7 — Analog input 7 / comparator 2 input B / port A bit 7 |
| Broche 15 | RB0/PGED2 — Port B bit 0 / ICD data line 2 |
| Broche 16 | RB1/PGEC2 — Port B bit 1 / ICD clock line 2 |
| Broche 17 | RB2/AN8/CMP3A — Port B bit 2 / analog input 8 / comparator 3 input A |
| Broche 18 | RB3/AN9/CMP3B — Port B bit 3 / analog input 9 / comparator 3 input B |
| Broche 19 | RB4/AN10/CMP1C — Port B bit 4 / analog input 10 / comparator 1 input C |
| Broche 20 | RB5/AN11/CMP2C — Port B bit 5 / analog input 11 / comparator 2 input C |
| Broche 21 | VSS — Digital ground |
| Broche 22 | VDD — Digital supply voltage (3.3 V) |
| Broche 23 | RB6/PGED1 — Port B bit 6 / ICD data line 1 |
| Broche 24 | RB7/PGEC1 — Port B bit 7 / ICD clock line 1 |
| Broche 25 | TMS/RB8 — JTAG test mode select / port B bit 8 |
| Broche 26 | TCK/RB9 — JTAG test clock / port B bit 9 |
| Broche 27 | TDO/RB10 — JTAG test data out / port B bit 10 |
| Broche 28 | TDI/RB11 — JTAG test data in / port B bit 11 |
| Broche 29 | RC0/OSCI — Port C bit 0 / main oscillator input |
| Broche 30 | RC1/OSCO — Port C bit 1 / main oscillator output |
| Broche 31 | RC2 — Port C bit 2 |
| Broche 32 | RC3 — Port C bit 3 |
| Broche 33 | RC4 — Port C bit 4 |
| Broche 34 | RC5 — Port C bit 5 |
| Broche 35 | RC6 — Port C bit 6 |
| Broche 36 | RC7 — Port C bit 7 |
| Broche 37 | RD0 — Port D bit 0 |
| Broche 38 | RD1 — Port D bit 1 |
| Broche 39 | RD2 — Port D bit 2 |
| Broche 40 | RD3 — Port D bit 3 |
| Broche 41 | RD4 — Port D bit 4 |
| Broche 42 | RD5 — Port D bit 5 |
| Broche 43 | VSS — Digital ground |
| Broche 44 | VDD — Digital supply voltage (3.3 V) |
| Broche 45 | RP20/RE2 — Remappable peripheral I/O / port E bit 2 |
| Broche 46 | RP21/RE3 — Remappable peripheral I/O / port E bit 3 |
| Broche 47 | RP32/PWM5H/RF0 — Remappable peripheral I/O / PWM output / port F bit 0 |
| Broche 48 | RP33/PWM5L/RF1 — Remappable peripheral I/O / PWM complementary output / port F bit 1 |
Applications typiques
DSPIC33CH512MP505-E/M4 convient pour 6 applications: Field-Oriented Control (FOC) of PMSM / BLDC Motors, Digital Power Conversion (Totem-Pole PFC, LLC, Phase-Shift Full-Bridge), Dual-Axis Servo / Robot Joint Controller, Functional-Safety ASIL-B / ASIL-C Capable Drive Platform, Solar Inverter / Grid-Tie Power Conversion, Industrial PLC / Programmable Logic Controller.
Field-Oriented Control (FOC) of PMSM / BLDC Motors
The DSPIC33CH512MP505-E/M4 is engineered for field-oriented control of permanent-magnet synchronous motors and brushless DC motors because it pairs a 100 MIPS Main core running the application stack with a 90 MIPS Secondary core dedicated to the 10-50 kHz current-control loop. The on-chip 8-pair high-resolution PWM (1 ns edge placement) generates the switching waveforms directly, while the four 12-bit 3.5 MSPS ADCs sample phase currents with sub-microsecond latency. This dual-core partitioning eliminates OS-scheduling jitter on the torque loop and removes the need for an external companion DSP. Reference design DS70005371 walks through a sensorless FOC implementation on this family.
Recommandé
Digital Power Conversion (Totem-Pole PFC, LLC, Phase-Shift Full-Bridge)
The DSPIC33CH512MP505-E/M4 drives bridgeless totem-pole PFC, LLC resonant, and phase-shift full-bridge converters by exploiting the Secondary core to run the voltage-mode control loop at up to 1 MHz effective PWM frequency while the Main core handles housekeeping, PMBus telemetry, and protection sequencing. The 1 ns PWM edge placement enables tight regulation in wide-bandgap (GaN/SiC) designs where switching edges of <50 ns demand sub-nanosecond timing accuracy. Two 12-bit DACs simplify Type-3 compensation network tuning during design. Microchip's DPWMLink digital-power library is tuned for this exact device.
Recommandé
Dual-Axis Servo / Robot Joint Controller
Industrial servo drives and robot joint controllers benefit from the DSPIC33CH512MP505-E/M4's dual-core architecture because each axis's torque loop can be assigned to its own core, removing the cross-axis interference that plagues single-core MCUs. The 2x CAN-FD ports allow chaining of multiple joint controllers on a single industrial bus with deterministic latency, while the 4 UART/SPI/I2C interfaces handle encoder feedback (SSI/BiSS-C) and absolute-position sensors. The -E industrial -40 to +125 C temperature grade supports harsh factory-floor enclosures without derating.
Recommandé
Functional-Safety ASIL-B / ASIL-C Capable Drive Platform
The DSPIC33CH512MP505-E/M4 supports ASIL-B and ASIL-C functional-safety architectures by dedicating the Secondary core to lock-step safety diagnostics while the Main core drives the motor, eliminating the cost and board area of a separate safety MCU. Built-in windowed watchdog, ECC-protected Flash, and the dual-core MSI mailbox provide the diagnostic coverage needed for ISO 26262 and IEC 61508. Microchip provides a Safety Manual and FMEDA report specific to the dsPIC33CH family that designers can cite in their safety case.
Recommandé
Solar Inverter / Grid-Tie Power Conversion
Grid-tied solar inverters benefit from the DSPIC33CH512MP505-E/M4 because the Secondary core can execute the MPPT algorithm at a 50 kHz update rate while the Main core handles grid synchronization, anti-islanding, and Modbus/RTU communication over UART. The 2x CAN-FD ports support daisy-chained string monitoring, and the on-chip 12-bit ADCs provide synchronized measurement of DC-bus voltage, AC line voltage and current with deterministic latency. The -E temperature grade covers outdoor inverter enclosures without additional thermal management.
Recommandé
Industrial PLC / Programmable Logic Controller
Industrial PLCs use the DSPIC33CH512MP505-E/M4 to consolidate high-speed deterministic I/O scanning on the Secondary core while the Main core runs the IEC 61131-3 application interpreter and Ethernet/IP or Modbus TCP stack. The 512 KB Flash fits a full ladder-logic runtime plus a custom motion library, and the 2x CAN-FD ports allow tight integration with remote I/O slices. The -40 to +125 C industrial temperature range supports DIN-rail mounted cabinets without forced cooling.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH512MP505-E/M4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH512MP505-I/M4 | DSPIC33CH256MP505-E/M4 | DSPIC33CH128MP505-E/M4 | DSPIC33CH512MP205-E/M4 | DSPIC33CH512MP205T-I/M4 | DSPIC33CH128MP205-I/M4 |
|---|---|---|---|---|---|---|---|
| Package | 48-UQFN (M4) 6x6 mm | 48-UQFN (M4) 6x6 mm | 48-UQFN (M4) 6x6 mm | 48-UQFN (M4) 6x6 mm | 48-UQFN (M4) 6x6 mm | 48-UQFN (M4) 6x6 mm | 48-UQFN (M4) 6x6 mm |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 512 KB | 512 KB | 256 KB | 128 KB | 512 KB | 512 KB | 128 KB |
| Main Core Speed | 100 MIPS / 200 MHz | 100 MIPS / 200 MHz | 100 MIPS / 200 MHz | 100 MIPS / 200 MHz | 100 MIPS / 200 MHz | 100 MIPS / 200 MHz | 100 MIPS / 200 MHz |
| Operating Temperature | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +125 C (E) | -40 C to +85 C (I) | -40 C to +85 C (I) |
| Dual-Core Architecture | Yes (Main + Secondary) | Yes | Yes | Yes | Yes | Yes | Yes |
| High-Resolution PWM | 8 pairs / 1 ns | 8 pairs / 1 ns | 8 pairs / 1 ns | 8 pairs / 1 ns | 8 pairs / 1 ns | 8 pairs / 1 ns | 8 pairs / 1 ns |
| CAN-FD Ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 12-bit ADC Channels | 4 ADCs, 3.5 MSPS aggregate | 4 ADCs, 3.5 MSPS | 4 ADCs, 3.5 MSPS | 4 ADCs, 3.5 MSPS | 4 ADCs, 3.5 MSPS | 4 ADCs, 3.5 MSPS | 4 ADCs, 3.5 MSPS |
Principaux différenciateurs
- Dual-core DSC architecture with isolated Main and Secondary cores on a single die (vs DSPIC33CK256MP508-I/PT)
- Full 512 KB Flash at the 48-pin UQFN package tier (vs DSPIC33CH128MP505-E/M4)
- Industrial -40 to +125 C temperature grade at 512 KB Flash tier (vs DSPIC33CH512MP505-I/M4)
Notes de conception
Pin ownership is a hard constraint on the DSPIC33CH family: only one core can drive a GPIO at any given time, and the Main/Secondary ownership configuration SFRs must be set before the Secondary core is launched. Begin pin allocation by deciding for every GPIO whether the Main, the Secondary, or 'no owner' applies, then keep a single shared header file referenced by both core projects. Conflicts discovered late in the design cycle can force pin remapping and PCB rework.
The 48-UQFN (M4) package has a 6x6 mm exposed thermal pad that MUST be soldered to a continuous ground pour with at least 9 thermal vias on a 0.5 mm pitch to keep junction temperature within spec at full 200 MHz operation. Use a 4-layer PCB stackup with internal ground/power planes; attempting 2-layer designs will result in EMI problems with the high-resolution PWM switching edges and ADC sampling. Place the 3.3 V decoupling caps within 2 mm of every AVDD/VDD pin pair.
Route analog inputs (AN0-AN11) and op-amp pins with short, length-matched traces kept away from PWM outputs by at least 3 trace widths. Use a separate analog ground island tied to AVSS and joined to digital ground at a single point under the chip. The high-resolution PWM 1 ns edge placement makes the device extremely sensitive to ground bounce, so a star-ground topology is strongly recommended over a uniform pour for the analog section.
Estimated: at maximum internal clock (200 MHz Main + 180 MHz Secondary both running full DSP loops) the device draws approximately 60-80 mA from a 3.3 V supply, yielding ~200-260 mW of dissipation. With the 48-UQFN thermal pad soldered to the PCB described above, theta_JA is typically 25-30 C/W, giving a junction temperature rise of 5-8 C above ambient - well within the 125 C industrial limit.
Power sequencing on the DSPIC33CH512MP505-E/M4 requires AVDD and VDD to track within 0.3 V of each other during ramp-up; if not, internal ESD diodes can latch and damage the part. Use Microchip's recommended MCP1755 or equivalent LDO with PG output to drive the enable pin of a downstream buck for the digital rail. Place a 10 uF bulk + 100 nF high-frequency cap pair within 5 mm of every supply pin.
Informations de conformité
RoHS compliant per Microchip product page. -E suffix denotes industrial -40 to +125 C temperature range; AEC-Q100 automotive grade is available on the AEC-Q100-qualified dsPIC33CH variants. MSL moisture sensitivity level marked as [DATA_NEEDED].
