DSPIC33CH64MP506T-I/PT - Dual-Core 100MHz DSC 64KB Flash | Microchip
Référence : DSPIC33CH64MP506T-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.38 | $5,38 |
| 10 | $4.9 | $49,00 |
| 100 | $4.2 | $420,00 |
| 500 | $3.6 | $1 800,00 |
| 1 000 | $2.74 | $2 740,00 |
DSPIC33CH64MP506T-I/PT Présentation
A digital signal controller combines the computational horsepower of a digital signal processor (DSP) with the peripheral integration and control-oriented architecture of a microcontroller (MCU). In the embedded systems hierarchy, the dsPIC33CH sits within the 16-bit DSC class between general-purpose MCUs and full 32-bit DSPs, making it a power management IC companion for digitally controlled power conversion and motion systems.
Key features of the dsPIC33CH family include an asymmetric dual-core architecture: a primary core running up to 100 MHz for general control and supervision, plus an independent secondary core dedicated to time-critical loops. The family integrates high-resolution PWM (HRPWM) with sub-nanosecond effective resolution, CAN Flexible Data-rate (CAN FD) for modern in-vehicle and industrial networks, and multiple serial interfaces. The MP506 variant provides 64 KB of flash and dedicated PRAM for inter-core communication.
Architecturally, the two cores can run different code at different clock speeds, allowing engineers to partition safety-critical or high-frequency control algorithms (such as peak current-mode power conversion) onto the secondary core while the primary core handles communication, housekeeping, and human-interface tasks. Debug of both cores is supported simultaneously through standard Microchip tools.
Typical applications include digital power supplies, wireless charging transmitters and receivers, server PSU and telecom rectifier control, drone electronic speed controllers, and automotive sensor modules where CAN FD and high-resolution PWM are required.
A key design consideration: the 3.0V to 3.6V supply range requires a clean 3.3V rail, and decoupling capacitors should be placed close to each VDD pin on the TQFP-64 footprint.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-22.
Alternatives de remplacement direct pour DSPIC33CH64MP506T-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH64MP506T-I/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core Architecture, Core, CAN Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH64MP506-I/PT
✅ Remplacement direct✓ En stock
$4.65 / unité
Voir la fiche technique →DSPIC33CH128MP506T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP506-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.62 / unité
Voir la fiche technique →DSPIC33CH256MP506T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.7 / unité
Voir la fiche technique →DSPIC33CH512MP506T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.1 / unité
Voir la fiche technique →DSPIC33CH64MP506T-I/PT Valeurs maximales et caractéristiques électriques
| Core Processor | dsPIC33 dual-core (16-bit) |
| Core Size | 16-bit dual-core |
| Maximum Operating Frequency | 100 MHz |
| Program Flash Memory | 64 KB |
| RAM | 16K + 4K (primary + secondary core) |
| Supply Voltage Range | 3 V to 3.6 V |
| Température de fonctionnement | -40C to +85C |
| CAN Interface | CAN FD (Flexible Data-rate) |
| PWM | High-Resolution PWM (HRPWM) |
| Boîtier | 64-TQFP (10x10 mm) |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Series | dsPIC33CH |
| Largeur du bus de données | 16 bit |
| Qualification | Functional Safety (FuSa) ready family |
| Statut RoHS | Compliant |
Guide de configuration des broches du DSPIC33CH64MP506T-I/PT 64-tqfp (10x10 mm)
Configuration des broches du DSPIC33CH64MP506T-I/PT (boîtier 64-tqfp (10x10 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CH64MP506T-I/PT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CH64MP506T-I/PT convient pour 6 applications: Digital Power Supplies, Wireless Power Transfer, Motor Control and Drones, Automotive Sensor Modules, Server Power and Datacenter Supplies, Industrial Automation and Networking Control.
Digital Power Supplies
The DSPIC33CH64MP506T-I/PT fits digital power conversion because its high-resolution PWM provides sub-nanosecond effective resolution for precise duty-cycle control, while the dedicated 100 MHz secondary core executes the voltage and current loops without being preempted by the primary core's communication tasks. In a server PSU or telecom rectifier, the secondary core runs peak current-mode control via HRPWM and the high-speed ADC, while the primary core manages PMBus/I2C telemetry and fault handling. Unlike single-core DSCs, this asymmetric partitioning isolates the time-critical loop from software jitter. PRAM between cores enables low-latency data exchange, and the 3.0V-3.6V supply simplifies bias generation from the auxiliary winding.
Recommandé
Wireless Power Transfer
Wireless charging transmitters and receivers demand precise phase-shifted full-bridge PWM and fast fault shutdown, both strengths of the DSPIC33CH64MP506T-I/PT. Microchip positions the dsPIC33CH family explicitly for wireless power applications. The secondary core modulates the HRPWM outputs for power transfer regulation while the primary core handles foreign-object detection algorithms, Qi communication decoding over UART/SPI, and CAN FD reporting in automotive WPT systems. The dual-core split guarantees the control loop timing is immune to communication interrupts, and the 64 KB flash accommodates the Qi protocol stack. 64-pin TQFP gives enough I/O for gate drives, demodulation, and sensing front ends on one controller.
Recommandé
Motor Control and Drones
For drone ESCs and industrial drives, the DSPIC33CH64MP506T-I/PT executes field-oriented control (FOC) on the secondary core at high update rates while the primary core manages telemetry, flight-controller links, and safety supervision. The high-resolution PWM yields fine average voltage control at the switching frequencies (typically 20-100 kHz) used in compact multirotor motors, reducing current ripple and acoustic noise. Microchip lists drones among target applications for the family. CAN FD enables integration into larger vehicle networks, and the 16K+4K split RAM keeps control variables local to the secondary core, avoiding cross-core contention during fast transient load events such as sudden throttle steps.
Recommandé
Automotive Sensor Modules
Automotive sensor nodes benefit from the DSPIC33CH64MP506T-I/PT's CAN FD interface and Functional Safety (FuSa)-ready dsPIC33CH family positioning noted in distributor parameter tables. The primary core preprocesses sensor data (via the ADC and DSP instructions) while the secondary core or primary core handles CAN FD framing for the vehicle network, achieving deterministic response for safety-related measurements. The -40C to +85C industrial temperature grade of the /I suffix covers most under-hood auxiliary locations, and the 64-TQFP provides ample GPIO for multiple sensor channels. For full AEC-Q100 requirements, designers should verify the applicable qualified ordering code with Microchip before release.
Recommandé
Server Power and Datacenter Supplies
Server power supplies and datacenter rectifiers use the DSPIC33CH64MP506T-I/PT to implement digitally controlled LLC and PFC stages: the secondary core runs both high-frequency loops with HRPWM phase management, while the primary core services PMBus telemetry demanded by datacenter power managers. Microchip names server power supplies as a key target application for the dsPIC33CH dual-core family. The dual-core architecture lets firmware updates to communication code proceed without re-qualifying the control loop, shortening iteration cycles. The 3.3V supply rail and 64 KB flash keep BOM cost low for high-volume PSU platforms, with pin-compatible higher-flash variants available for feature-rich firmware.
Recommandé
Industrial Automation and Networking Control
In industrial automation nodes, the DSPIC33CH64MP506T-I/PT combines CAN FD fieldbus connectivity with deterministic local control. The primary core runs the protocol stack, diagnostic web of queues, and housekeeping while the secondary core closes servo or process control loops, so bus traffic cannot disturb control timing - a key advantage over single-core MCUs. The DSP engine (16-bit MAC, dual fetch) accelerates filter implementation for sensor conditioning. The -40C to +85C operating range suits factory floor cabinets, and the 64-pin TQFP offers enough remappable I/O via PPS for encoder inputs, PWM outputs, and multiple UART/SPI/I2C channels consolidated in one 100 MHz controller.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH64MP506T-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH64MP506-I/PT | DSPIC33CH128MP506T-I/PT | DSPIC33CH256MP506T-I/PT | DSPIC33CH512MP506T-I/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB | 64 KB | 128 KB | 256 KB | 512 KB |
| Core Architecture | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH | Dual-core 16-bit dsPIC33CH |
| Max Core Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| CAN Interface | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging Format | Tape & Reel (T) | Tray | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
Principaux différenciateurs
- Lowest-cost dual-core entry point in the 64-pin 33CH family (vs DSPIC33CH128MP506T-I/PT)
- Same die as tray version with volume-friendly packaging (vs DSPIC33CH64MP506-I/PT)
- Dual-core isolation versus single-core dsPIC33CK64MP506 (vs DSPIC33CK64MP506)
Notes de conception
The DSPIC33CH64MP506T-I/PT requires a 3.0V to 3.6V rail. Place a 0.1uF ceramic decoupling capacitor at every VDD/VDDCORE pin pair, plus at least one 10uF bulk capacitor per power domain. When both cores execute simultaneously and the CAN FD transceiver switches, supply transients can dip below the minimum if decoupling is inadequate - verify with a scope at the package pins, not the regulator output. Estimated: a 100 MHz core drawing tens of mA with 0.1uF local decoupling keeps supply ripple well within spec for typical layouts.
The 64-TQFP (10x10 mm) has 0.5 mm pitch and 0.27 mm typical lead width; use solder-mask-defined or non-solder-mask-defined pads per IPC guidance for your assembly process. Route the high-resolution PWM outputs away from analog inputs feeding the ADC used by the control loop, and use a solid ground plane under the controller. Add series termination or keep traces short on HRPWM outputs to gate drivers to limit ringing at switching edges.
The T suffix means Tape & Reel (3000 units/reel); the non-T tray version (DSPIC33CH64MP506-I/PT) is functionally identical for prototypes. Remember that /MR variants use a different QFN land pattern and are NOT footprint-compatible despite the identical die. Confirm flash budget before committing: 64 KB is tight if you add a CAN FD stack plus bootloader; the pin-compatible 128MP506T is the no-rework upgrade path.
Informations de conformité
RoHS compliance per JLCPCB part database listing for this MPN. Lead-free per standard Microchip TQFP commercial parts. AEC-Q100 qualification not stated for this commercial /I ordering code; the dsPIC33CH family is noted as Functional Safety (FuSa) ready in distributor data. REACH and halogen-free status not stated in provided data.
