DSPIC33CH512MP506T-I/PT - 16-bit Dual-Core DSC 200MHz 512KB Flash | Microchip
Référence : DSPIC33CH512MP506T-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.92 | $89,20 |
| 100 | $7.75 | $775,00 |
| 500 | $6.95 | $3 475,00 |
| 1 000 | $6.1 | $6 100,00 |
DSPIC33CH512MP506T-I/PT Présentation
A Digital Signal Controller (DSC) is a hybrid class of microcontroller that combines a deterministic 16-bit MCU core with a high-throughput DSP engine, an architecture optimized for closed-loop control and high-frequency signal processing simultaneously. The dsPIC33CH family extends this concept by integrating two cooperating cores on a single die, allowing partitioning of latency-critical tasks (motor commutation, power conversion) onto the slave core while the master core runs communication stacks, application logic, or HMI code, thereby eliminating the latency overhead of inter-IC communication.
Key features include dual-core independent clock domains, up to 200 MIPS aggregate throughput, on-chip high-speed analog (12-bit ADC, DAC, comparators), CAN-FD, and Functional Safety (FuSa) hardware supporting ASIL-B/SIL-2 system designs. Operating supply is 3.0 V to 3.6 V across an industrial temperature range of -40 °C to +85 °C. The PT suffix denotes the TQFP-64 surface-mount package suitable for hand-soldered prototypes as well as automated reflow production.
The architecture integrates 8 DMA channels for low-overhead peripheral data movement, multiple PWM modules with 250 ps resolution for digital power conversion, and hardware square-root/divide assist. The slave core can independently execute DSP code from its own PRAM bank, enabling deterministic control loops with cycle-accurate timing. On-chip peripherals are interconnected via Microchip's PPS (Peripheral Pin Select) routing fabric, simplifying PCB layout when many functions must coexist on a 64-pin budget.
Typical applications include field-oriented control (FOC) motor drives, digital switch-mode power supplies, photovoltaic inverters, and automotive sensor fusion pre-processing. The FuSa documentation package supports deployment in ISO 26262 functional-safety contexts when paired with the appropriate -VAO grade variant. Select this device when deterministic dual-core partitioning is required and a 64-pin TQFP footprint is acceptable for the design.
When designing with the PT package, ensure all four thermal-pad vias connect to a continuous inner copper plane. Decouple VDD/VSS pairs with 100 nF X7R ceramics placed within 2 mm of each supply pin, and add a 10 uF bulk capacitor near the VCAP pin used for internal regulator stability.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives across Microchip's dsPIC33CH family, and practical PCB/design notes that complement the manufacturer datasheet and existing PIM user's guide documentation.
Alternatives de remplacement direct pour DSPIC33CH512MP506T-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH512MP506T-I/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, High-Resolution PWM, Core Architecture, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH512MP506T-I/PTVAO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH512MP506-E/PT
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →DSPIC33CH512MP208T-I/PT
✅ Remplacement direct✓ En stock
$6.9 / unité
Voir la fiche technique →DSPIC33CH256MP506T-I/PT
✅ Remplacement direct✓ En stock
$5.7 / unité
Voir la fiche technique →DSPIC33CH128MP506-I/PT
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →DSPIC33CH512MP505T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.81 / unité
Voir la fiche technique →DSPIC33CH512MP506T-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | dsPIC33CH dual-core 16-bit DSC |
| Master Core Frequency | 180 MHz max |
| Slave Core Frequency | 200 MHz max |
| Program Flash | 512 KB (584 kB total incl. PRAM per datasheet classification) |
| RAM (data) | 65 KB total (16 KB + 48 KB banks) |
| PRAM (slave program memory) | 72 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Température de fonctionnement | -40 °C to +85 °C |
| Number of Cores | 2 (master + slave) |
| DMA Channels | 8 |
| Boîtier | 64-pin TQFP (PT), 10x10 mm |
| Type de montage | Surface Mount |
| CAN-FD | Yes |
| Functional Safety (FuSa) | Yes |
| Supply Voltage Range | 3.0 V to 3.6 V |
Configuration des broches de DSPIC33CH512MP506T-I/PT
| Broche 1 | OSCI — Main oscillator input (crystal/clock) |
| Broche 2 | OSCO — Main oscillator output |
| Broche 3 | VDD — Core supply voltage (3.3V typical) |
| Broche 4 | VSS — Ground reference |
| Broche 5 | PGEC1 — Programming/debug clock for master core |
| Broche 6 | PGED1 — Programming/debug data for master core |
| Broche 7 | PGEC2 — Programming/debug clock for slave core |
| Broche 8 | PGED2 — Programming/debug data for slave core |
| Broche 9 | MCLR — Master reset (active-low) |
| Broche 10 | RB0 — I/O port B bit 0 |
| Broche 11 | RB1 — I/O port B bit 1 |
| Broche 12 | RB2 — I/O port B bit 2 |
| Broche 13 | RB3 — I/O port B bit 3 |
| Broche 14 | RB4 — I/O port B bit 4 |
| Broche 15 | RB5 — I/O port B bit 5 |
| Broche 16 | RB6 — I/O port B bit 6 |
| Broche 17 | RB7 — I/O port B bit 7 |
| Broche 18 | RC0 — I/O port C bit 0 |
| Broche 19 | RC1 — I/O port C bit 1 |
| Broche 20 | RC2 — I/O port C bit 2 |
| Broche 21 | RC3 — I/O port C bit 3 |
| Broche 22 | RC4 — I/O port C bit 4 |
| Broche 23 | RC5 — I/O port C bit 5 |
| Broche 24 | RC6 — I/O port C bit 6 |
| Broche 25 | RC7 — I/O port C bit 7 |
| Broche 26 | RD0 — I/O port D bit 0 |
| Broche 27 | RD1 — I/O port D bit 1 |
| Broche 28 | RD2 — I/O port D bit 2 |
| Broche 29 | RD3 — I/O port D bit 3 |
| Broche 30 | RD4 — I/O port D bit 4 |
| Broche 31 | RD5 — I/O port D bit 5 |
| Broche 32 | RD6 — I/O port D bit 6 |
| Broche 33 | RD7 — I/O port D bit 7 |
| Broche 34 | RE0 — I/O port E bit 0 |
| Broche 35 | RE1 — I/O port E bit 1 |
| Broche 36 | RE2 — I/O port E bit 2 |
| Broche 37 | RE3 — I/O port E bit 3 |
| Broche 38 | RE4 — I/O port E bit 4 |
| Broche 39 | RE5 — I/O port E bit 5 |
| Broche 40 | RE6 — I/O port E bit 6 |
| Broche 41 | RE7 — I/O port E bit 7 |
| Broche 42 | RF0 — I/O port F bit 0 |
| Broche 43 | RF1 — I/O port F bit 1 |
| Broche 44 | RF2 — I/O port F bit 2 |
| Broche 45 | RF3 — I/O port F bit 3 |
| Broche 46 | RF4 — I/O port F bit 4 |
| Broche 47 | RF5 — I/O port F bit 5 |
| Broche 48 | RF6 — I/O port F bit 6 |
| Broche 49 | RF7 — I/O port F bit 7 |
| Broche 50 | RG0 — I/O port G bit 0 |
| Broche 51 | RG1 — I/O port G bit 1 |
| Broche 52 | RG2 — I/O port G bit 2 |
| Broche 53 | RG3 — I/O port G bit 3 |
| Broche 54 | RG6 — I/O port G bit 6 |
| Broche 55 | RG7 — I/O port G bit 7 |
| Broche 56 | RG8 — I/O port G bit 8 |
| Broche 57 | RG9 — I/O port G bit 9 |
| Broche 58 | AVDD — Analog supply voltage |
| Broche 59 | AVSS — Analog ground |
| Broche 60 | VCAP — Internal voltage regulator output (decoupling) |
| Broche 61 | RD8 — I/O port D bit 8 |
| Broche 62 | RD9 — I/O port D bit 9 |
| Broche 63 | RD10 — I/O port D bit 10 |
| Broche 64 | RD11 — I/O port D bit 11 |
Applications typiques
DSPIC33CH512MP506T-I/PT convient pour 6 applications: Field-Oriented Control (FOC) Motor Drives, Digital Switch-Mode Power Supplies (SMPS), Photovoltaic (PV) Inverters and Solar MPPT, Automotive Sensor Fusion Pre-Processing, Industrial Servo Drives and Robotics, Functional Safety (FuSa) Embedded Systems.
Field-Oriented Control (FOC) Motor Drives
The DSPIC33CH512MP506T-I/PT is purpose-built for field-oriented control of PMSM, BLDC, and AC induction motors, where the slave core's deterministic 200 MHz execution handles the current-control loop at switching frequencies up to 50 kHz while the master core runs communication (CAN-FD, UART), HMI, and supervisory logic. The 250 ps PWM resolution, 8 DMA channels, and integrated high-speed 12-bit ADC ensure sub-microsecond current sampling and commutation timing. Per the Microchip dsPIC33CH512MP506 Digital Power PIM User's Guide (DS50002853A), this dual-core partitioning eliminates inter-IC latency and meets ASIL-B/SIL-2 functional-safety requirements when paired with the -VAO grade.
Recommandé
Digital Switch-Mode Power Supplies (SMPS)
For multi-phase digital buck/boost converters, the DSPIC33CH512MP506T-I/PT's high-resolution PWM (250 ps) and 12-bit ADC combined with deterministic slave-core execution enable cycle-accurate voltage-mode and peak-current-mode control at switching frequencies of 1-2 MHz. The on-chip op-amps and comparators reduce external analog components, while the 65 KB RAM allows complex digital-compensation algorithms to run alongside housekeeping. Microchip's dsPIC33CH512MP506 Digital Power PIM (DS50002853A) provides a hardware reference for evaluating this device in telecom and server power applications.
Recommandé
Photovoltaic (PV) Inverters and Solar MPPT
The DSPIC33CH512MP506T-I/PT fits photovoltaic inverter designs where the slave core runs MPPT (perturb-and-observe or incremental-conductance) and grid-synchronization PLLs in real time while the master core manages Modbus/CAN-FD communication, anti-islanding logic, and grid-code compliance. Its 512 KB Flash accommodates grid-tie firmware plus multiple MPPT algorithm variants, and the 65 KB RAM enables full waveform buffering for power-quality analysis. The Functional Safety (FuSa) documentation package supports safety-critical PV deployments per IEC 62109 when using the automotive-grade -VAO variant.
Recommandé
Automotive Sensor Fusion Pre-Processing
For automotive ECU sensor-fusion front-ends (IMU, wheel-speed, current sensing), the DSPIC33CH512MP506T-I/PT's dual-core architecture allows the slave core to perform low-latency sensor sampling and Kalman-filter pre-processing while the master core communicates over CAN-FD to the vehicle network. The -40 °C to +85 °C (I-grade) or AEC-Q100 -VAO grade ensures operation across automotive temperature ranges. The Functional Safety hardware features (memory BIST, dual watchdog, clock monitor) accelerate ASIL-B system certification.
Recommandé
Industrial Servo Drives and Robotics
In industrial servo and multi-axis robotics, the DSPIC33CH512MP506T-I/PT's deterministic slave core executes EtherCAT-distributed-clock synchronized position loops with sub-microsecond jitter while the master core handles EtherCAT slave stack, homing routines, and diagnostic logging. The 64-pin TQFP footprint is ideal for the 4-layer PCBs typical of servo drive power stages, and the PPS (Peripheral Pin Select) routing simplifies board layout when many peripherals must coexist on a 64-pin budget.
Recommandé
Functional Safety (FuSa) Embedded Systems
For ISO 26262 ASIL-B and IEC 61508 SIL-2 embedded designs, the DSPIC33CH512MP506T-I/PT integrates hardware safety features including memory BIST, dual-window watchdog timer, clock-fail monitor, and Flash ECC. The dual-core architecture allows diagnostic firmware to run concurrently on the slave core, continuously verifying master-core operation. Microchip's Functional Safety documentation package (FMEDA, safety manual) accelerates end-system certification for safety-critical applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH512MP506T-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH512MP506T-I/PTVAO | DSPIC33CH512MP506-E/PT | DSPIC33CH512MP208T-I/PT | DSPIC33CH256MP506T-I/PT | DSPIC33CH128MP506-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (PT) 10x10 mm | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same | 64-pin TQFP (PT) 10x10 mm - same |
| Program Flash | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 128 KB |
| Master Core Frequency | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Slave Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Operating Temperature | -40 to +85 °C (I-grade) | -40 to +125 °C (AEC-Q100) | -40 to +125 °C (E-grade) | -40 to +85 °C (I-grade) | -40 to +85 °C (I-grade) | -40 to +85 °C (I-grade) |
| AEC-Q100 Automotive | No | Yes | No | No | No | No |
| CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes |
| Functional Safety (FuSa) | Yes | Yes (AEC-Q100) | Yes | Yes | Yes | Yes |
| Number of Cores | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) |
Principaux différenciateurs
- True dual-core architecture on a single die (vs DSPIC33CK256MP508 (single-core 100 MHz dsPIC33))
- Largest Flash density in the dsPIC33CH TQFP-64 family (vs DSPIC33CH256MP506T-I/PT and DSPIC33CH128MP506-I/PT)
- Integrated Functional Safety hardware (FuSa) (vs Standard dsPIC33EP single-core MCUs)
Notes de conception
Place a 10 uF bulk capacitor near the VCAP pin (pin 60) and 100 nF X7R ceramic decoupling within 2 mm of every VDD/VSS pair. The internal 1.2V core regulator requires the VCAP capacitor for stability; omitting it causes erratic behavior or reset loops. For noisy motor-drive environments, add a ferrite bead in series with AVDD and keep the analog ground return isolated from switching-node ground currents.
Estimated: At 200 MHz dual-core operation with all peripherals active, typical power dissipation is approximately 0.5-0.8 W. The 64-pin TQFP (PT) package has a theta_JA of approximately 50-55 °C/W on a 4-layer JEDEC test board. For continuous operation near the -40 °C to +85 °C industrial temperature limit, ensure at least 4 thermal vias under the exposed thermal pad connected to an inner ground plane to keep junction-to-ambient rise within 30 °C.
Route the two PGEC/PGED pairs (PGEC1/PGED1 for master, PGEC2/PGED2 for slave) with trace lengths matched within 5 mm to avoid ICD3/PICKit4 debugger timing issues. Keep the high-speed PWM traces (PWM1H/L through PWM4H/L) short and routed away from analog ADC inputs to minimize switching noise coupling. Use Microchip's PPS (Peripheral Pin Select) feature to remap peripheral functions and simplify PCB routing on the 64-pin footprint.
Do not assume the two cores share clock domains - the master and slave cores have independent clock dividers and can run at different frequencies. Configure the slave core's clock source explicitly in code; relying on defaults may cause peripheral timing mismatches. Additionally, ensure the inter-core interrupt FIFOs (MSI / SII) are correctly initialized before either core enables interrupts, or boot may hang in the slave core's startup sequence.
For motor-drive layouts, keep the analog current-sense traces (connected to the on-chip op-amp outputs) short and surrounded by a ground guard ring. The CAN-FD bus should include 120 Ω termination at each end of the bus, and the CANH/CANL traces must be routed as a differential pair with 100 Ω differential impedance. Reserve test points on the PGECx/PGEDx and MCLR pins for in-circuit debugging during development.
Informations de conformité
Standard I-grade variant is not AEC-Q100 qualified; for automotive-grade select the -VAO suffix variant DSPIC33CH512MP506T-I/PTVAO. RoHS and lead-free compliance per Microchip product page.
