DSPIC33CK256MP606T-I/MR - 100MHz 256KB DSC, CAN FD | Microchip
Référence : DSPIC33CK256MP606T-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.52 | $6,52 |
| 10 | $5.91 | $59,10 |
| 100 | $5.24 | $524,00 |
| 500 | $4.83 | $2 415,00 |
| 1 000 | $4.47 | $4 470,00 |
DSPIC33CK256MP606T-I/MR Présentation
A digital signal controller combines the compute throughput of a digital signal processor with the peripheral integration and control-loop responsiveness of a microcontroller. Within the power-management hierarchy, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred choice for high-frequency closed-loop control such as field-oriented motor control, digital power conversion, and embedded sensing where deterministic interrupt latency matters.
Key differentiating features include the 100 MHz dsPIC DSC core with DSP instruction extensions, dual-partition flash enabling live firmware updates between partitions, a high-speed 12-bit ADC, dedicated motor-control PWM peripherals, on-chip operational amplifiers, and CAN FD connectivity for automotive and industrial networks. Functional Safety (FuSa) support documents make the part suitable for safety-relevant designs.
Architecturally, the dsPIC33CK core uses a modified Harvard pipeline with multiple internal buses, 8 DMA channels, and 4 external interrupt sources, allowing the ADC, PWM, and DMA to operate in tight loops with minimal CPU intervention. The dual-panel flash architecture supports partition swapping for robust OTA-style updates.
Typical applications include brushless DC and PMSM motor control for industrial drives, digitally controlled power supplies and 48 V to 12 V DC/DC converter reference designs such as the EPC9143, automotive CAN FD nodes, and precision sensing systems.
Design consideration: connect every VDD and VSS pin pair; per Microchip documentation, leaving any supply pin unconnected can cause programming failures on this family.
This page synthesizes distributor availability, same-package drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33CK256MP606T-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CK256MP606T-I/MR (même facteur de forme et même empreinte) — différant par CAN Interface, Package, Core, RAM, On-chip Op-Amps.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CK256MP606T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CK256MP606T-H/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CK256MP506T-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.98 / unité
Voir la fiche technique →DSPIC33CK128MP506-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.42 / unité
Voir la fiche technique →DSPIC33CK256MP606-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.42 / unité
Voir la fiche technique →DSPIC33CK256MP606T-I/MR Valeurs maximales et caractéristiques électriques
| Core | dsPIC33CK 16-bit DSC, single core |
| CPU Speed | 100 MHz (100 MIPS) |
| Program Memory (Flash) | 256 KB (256K x 8), dual partition |
| RAM | 64 KB |
| CAN Interface | CAN FD |
| ADC | 12-bit |
| Peripheral Highlights | OpAmps, high-resolution PWM |
| DMA Channels | 8 |
| External Interrupts | 4 |
| Nombre de broches | 64 |
| Boîtier | 64-QFN (9x9 mm), MR |
| Type de montage | Surface Mount |
| Temperature Grade | I (industrial, -40C to +85C) |
| Functional Safety Support | Yes (FuSa package documentation) |
| Packaging | Tape and Reel (T) |
Guide de configuration des broches du DSPIC33CK256MP606T-I/MR 64-qfn (9x9 mm), mr
Configuration des broches du DSPIC33CK256MP606T-I/MR (boîtier 64-qfn (9x9 mm), mr). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CK256MP606T-I/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CK256MP606T-I/MR convient pour 6 applications: Precision Motor Control (FOC), Digital Power Conversion, Automotive CAN FD Nodes, Industrial Automation and Sensing, Battery Management and Power Tools, Audio Signal Processing and Class-D Amplifiers.
Precision Motor Control (FOC)
The DSPIC33CK256MP606T-I/MR fits brushless DC and PMSM field-oriented control because its 100 MHz (100 MIPS) core executes Clarke/Park transforms and PI current loops at PWM frequencies well above audible range, while the 12-bit ADC samples phase currents with minimal latency. Dedicated high-resolution PWM peripherals generate complementary dead-banded gate signals, and the on-chip op-amps amplify low-level shunt-resistor currents, removing external amplifiers and cutting BOM cost. The 8-channel DMA transfers ADC results to RAM without CPU intervention, keeping interrupt load deterministic for the control loop. Placed at the heart of an inverter board, the DSC handles both the fast inner current loop and slower speed/position loops in a single chip, with CAN FD available for drive-level networking. Design trade-off: the 64-QFN (9x9 mm) package needs a solid ground pad and via array to dissipate switching-adjacent heat in enclosed drives.
Recommandé
Digital Power Conversion
In digitally controlled power supplies, the DSPIC33CK256MP606T-I/MR closes voltage- and current-mode loops with sub-microsecond latency: the 12-bit ADC is triggered directly by the PWM peripheral, and the 100 MHz core executes compensator math within one switching period even at hundreds of kHz. Microchip demonstrates this domain with the EPC9143 48 V-to-12 V DC/DC brick reference design, which pairs an eGaN FET stage with a dsPIC33CK-family DSC, proving the architecture in high-frequency GaN converters. The high-resolution PWM provides fine duty-cycle resolution critical for tight output regulation, while 8 DMA channels stream telemetry to CAN FD for power-shelf or telecom-rectifier monitoring. The dual-partition flash allows firmware update of the control law without bricking the converter. Consideration: keep the analog supply of the ADC clean with dedicated LC filtering so switching noise does not degrade conversion accuracy.
Recommandé
Automotive CAN FD Nodes
The integrated CAN FD controller makes the DSPIC33CK256MP606T-I/MR a strong fit for automotive and industrial network nodes such as pump controllers, actuator drivers, and sensor hubs. CAN FD raises payload to 64 bytes and supports faster arbitration/data phases than classical CAN, letting one node transport diagnostic and control traffic on the same bus. The -E and -H temperature variants of this same die extend operation to +125C and +150C respectively, and the -E grade is noted as AEC-Q100 qualified per Microchip USA, giving a qualification path within one PCB footprint. On-chip 256 KB dual-partition flash supports field firmware updates over the CAN bus itself, while 64 KB RAM buffers network stacks and DSP pre-processing simultaneously. Layout tip: route the CAN transceiver within a few centimeters of the DSC pins and place the common-mode choke at the connector for EMC compliance.
Recommandé
Industrial Automation and Sensing
For factory automation endpoints, the DSPIC33CK256MP606T-I/MR combines real-time DSP computation with rich analog acquisition: the 12-bit ADC digitizes sensor channels, on-chip op-amps condition millivolt-level signals such as pressure bridges or current shunts, and DMA streams results without CPU overhead. The 100 MIPS core runs filtering (FIR/IIR), FFT-based vibration analysis, or sensor-fusion math locally, reducing data sent upstream. The industrial temperature grade (-40C to +85C) matches typical factory-floor enclosures, and the Functional Safety (FuSa) documentation package supports safety-managed machinery designs per DigiKey's categorization of the part. CAN FD links the node into deterministic industrial networks. Because all VDD/VSS pins must be connected per Microchip documentation, verify full supply-pin routing in multi-layer boards. Trade-off: the 64-pin QFN requires careful PCB fanout versus a TQFP, but saves significant board area in dense I/O modules.
Recommandé
Battery Management and Power Tools
The DSPIC33CK256MP606T-I/MR suits battery management and cordless power-tool controllers where cell monitoring, fuel gauging, and motor drive coexist. The 12-bit ADC and on-chip op-amps measure cell voltages and pack current through shunts, the 100 MHz core executes coulomb counting and protection state machines, and high-resolution PWM drives the tool motor inverter with FOC efficiency. 64 KB RAM holds look-up tables and logging buffers, while CAN FD or UART links communicate state-of-charge data to chargers and displays. The dual-partition flash enables safe firmware updates in the field, important for evolving charge algorithms. The -E/-H temperature variants support thermally aggressive tool housings. Design note: trigger ADC conversions synchronously with PWM to avoid sampling during switching transients, and keep the analog ground plane separate under the ADC pins to preserve measurement accuracy across the -40C to +85C ambient range.
Recommandé
Audio Signal Processing and Class-D Amplifiers
With a 100 MHz DSP-enhanced core and 64 KB RAM, the DSPIC33CK256MP606T-I/MR can implement audio pre-processing and closed-loop Class-D modulation. The DSP instruction set accelerates FIR/IIR filters, dynamic-range compression, and feedback-quieting algorithms for loudspeaker protection, while high-resolution PWM generates the switching waveform for the output stage. The 12-bit ADC samples the feedback and audio inputs, and DMA moves sample blocks without CPU stalls, keeping loop latency low enough for stable modulation at practical switching frequencies. The 256 KB dual-partition flash stores multiple tuning presets that can be switched or updated via CAN FD in installed-audio deployments. For analog quality, filter the ADC reference supply and keep the PWM return paths away from the analog front-end. The industrial temperature grade and QFN thermal pad support fanless amplifier enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CK256MP606T-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CK256MP606T-E/MR | DSPIC33CK256MP606T-H/MR | DSPIC33CK256MP506T-I/MR | DSPIC33CK128MP506-E/MR | DSPIC33CK256MP606-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB dual partition | 256 KB dual partition | 256 KB dual partition | 128 KB | 128 KB | 256 KB dual partition |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Temperature Range | -40C to +85C (I grade) | to +125C (E grade) | to +150C (H grade) | -40C to +85C (I grade) | to +125C (E grade) | -40C to +85C (I grade) |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Extended-temperature drop-in siblings available on the same footprint (vs DSPIC33CK256MP606T-E/MR)
- Double the flash of the MP506 tier at the same 64-pin QFN footprint (vs DSPIC33CK128MP506-E/MR)
- Automotive qualification path without redesign (vs DSPIC33CK256MP606T-H/MR)
Notes de conception
Connect every VDD and VSS pin pair on the 64-QFN package. Per the dsPIC33CK256MP606 development documentation (NorthernSoftware), leaving even one supply pin unconnected can cause programming to fail. Decouple each pair with a 0.1 uF ceramic capacitor placed within 2-3 mm of the pins, add one bulk capacitor (4.7-10 uF) near the package, and solder the exposed QFN pad to a stitched ground via array to minimize ground bounce during simultaneous PWM switching at 100 MHz operation.
For motor-control and digital-power layouts, trigger ADC sampling directly from the PWM peripheral and route the current-shunt analog traces away from gate-drive returns. Keep the analog reference (VREF) path star-routed with dedicated decoupling; switching transients from the inverter stage sharing the same ground region can shift 12-bit conversions by multiple LSBs. Use the QFN center pad as the single low-inductance ground reference and avoid splitting ground planes under the DSC.
When migrating between temperature grades (-I, -E, -H), the parts are pin-to-pin and firmware-compatible, but verify derating of maximum clock at the highest ambient for the -H grade per the family datasheet before finalizing thermal design. Also note the dual-partition flash behavior: the device boots from a selectable partition; an incorrect FBOOT configuration can make a freshly programmed board appear dead, so confirm partition settings in your programmer project before mass production.
Informations de conformité
Compliance certificates not present in provided web data; the -E/MR variant is described as AEC-Q100 qualified per Microchip USA. Verify RoHS/REACH certificates on the Microchip product page for the specific date code.
