DSPIC33CK512MP306-E/PT - 100MIPS 512KB Flash DSC | Microchip
Référence : DSPIC33CK512MP306-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.47 | $5,47 |
| 10 | $4.92 | $49,20 |
| 100 | $4.38 | $438,00 |
| 500 | $3.92 | $1 960,00 |
| 1 000 | $3.51 | $3 510,00 |
DSPIC33CK512MP306-E/PT Présentation
A digital signal controller combines the computational power of a DSP with the peripheral integration and control-oriented architecture of a microcontroller. DSCs sit within the broader embedded processor hierarchy - microcontroller -> digital signal controller -> digital signal processor - and are optimized for closed-loop control loops such as field-oriented motor control, digital power conversion, and sensor signal processing.
Key features include the 100 MIPS dsPIC33C CPU core, 512 KB dual-panel flash enabling live firmware partitioning and boot from either partition, 64 KB of RAM, integrated operational amplifiers, 12-bit ADCs, and high-resolution PWM peripherals. According to the Mouser product listing, the device integrates OpAmps, 12-bit ADCs, and PWM modules specifically tailored for precision motor control and digital power stages.
Architecturally, the dsPIC33CK core supports DSP instructions with a barrel shifter, hardware multiply-accumulate, and a multiple internal bus architecture. The dual-panel flash (0x000000-0x058000 unpartitioned) allows the memory to be split into two independently bootable partitions, supporting safe firmware update schemes. Boundary scan capability simplifies board-level test.
Typical applications include precision motor control (FOC for BLDC/PMSM), digital power supplies and PFC stages, solar inverters, and industrial sensing front-ends, where 100 MIPS headroom and on-chip analog reduce external component count.
A key design consideration: the device operates from a 3 V to 3.6 V supply, so designers must provide a regulated 3.3 V rail and respect analog peripheral sharing between ADC and OpAmp modules.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC33CK512MP306-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CK512MP306-E/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, CAN Interface, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CK512MP306T-E/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CK512MP306T-I/PT
✅ Remplacement direct✓ En stock
$4.65 / unité
Voir la fiche technique →DSPIC33CK256MP205-E/PT
✅ Remplacement direct✓ En stock
$3.92 / unité
Voir la fiche technique →DSPIC33CH512MP506-E/PT
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →DSPIC33CK128MP506-E/MR
✅ Remplacement direct✓ En stock
$4.42 / unité
Voir la fiche technique →DSPIC33CK512MP306-E/PT Valeurs maximales et caractéristiques électriques
| Core | dsPIC33C 16-bit |
| Core Speed | 100 MIPS (100 MHz) |
| Program Memory Size | 512 KB (512K x 8) Flash |
| RAM Size | 64 KB |
| Tension d'alimentation | 3 V to 3.6 V |
| Boîtier | 64-TQFP (10x10 mm) |
| Température de fonctionnement | -40C to +125C (E grade) |
| On-chip OpAmps | Yes |
| ADC | 12-bit ADCs |
| PWM | High-resolution PWM peripherals |
| Dual Panel Flash | Yes (two bootable partitions) |
| Architecture Features | Barrel shifter, boundary scan, multiple internal bus architecture |
| Technology | CMOS |
| Type de montage | Surface Mount |
| Statut RoHS | ROHS3 Compliant |
| Packaging | Tray |
Guide de configuration des broches du DSPIC33CK512MP306-E/PT 64-tqfp (10x10 mm)
Configuration des broches du DSPIC33CK512MP306-E/PT (boîtier 64-tqfp (10x10 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CK512MP306-E/PT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CK512MP306-E/PT convient pour 6 applications: Precision BLDC/PMSM Motor Control (FOC), Digital Power Supplies and PFC, Solar Inverters and Energy Storage Converters, Industrial Sensor Front-Ends and Condition Monitoring, Automotive and E-Mobility Auxiliary Systems, Robotics and Multi-Axis Servo Drives.
Precision BLDC/PMSM Motor Control (FOC)
Microchip positions the dsPIC33CK family specifically for high-performance, precision motor control systems. The 100 MIPS dsPIC33C core executes field-oriented control (FOC) inner loops at 10-20 kHz switching frequencies with substantial computational margin, aided by DSP multiply-accumulate instructions and a barrel shifter. On-chip 12-bit ADCs sample phase currents with fast conversion times, and the integrated operational amplifiers amplify low-side shunt voltages without external op-amps, reducing BOM cost. The high-resolution PWM modules drive three-phase inverter gates with fine duty-cycle granularity. Placed in the controller slot of a 3.3 V logic domain, the DSC communicates with gate drivers via PWM outputs and handles position estimation from encoder or sensorless observers, all on a single chip.
Recommandé
Digital Power Supplies and PFC
The DSPIC33CK512MP306-E/PT suits digital AC-DC and DC-DC power conversion because its 100 MIPS core closes voltage and current loops at 100-500 kHz with deterministic interrupt latency. The 12-bit ADC, triggered directly by the PWM module, samples input/output voltages and inductor currents precisely synchronized to the switching instant, minimizing ripple artifacts. High-resolution PWM generates complementary outputs with programmable dead-time for half-bridge and totem-pole PFC topologies. The 512 KB dual-panel flash supports live firmware updates in the field without a separate bootloader chip - critical for server PSUs requiring upgradeability. Supply the controller from a clean 3.3 V rail, and exploit the integrated OpAmps for current-shunt conditioning to further shrink the analog front-end.
Recommandé
Solar Inverters and Energy Storage Converters
Solar micro-inverters and string inverters demand MPPT algorithms, grid synchronization, and safety monitoring simultaneously - workloads the 100 MIPS DSPIC33CK512MP306 handles on one core with dedicated DSP instructions. Dual 12-bit ADC channels sample PV voltage/current and grid waveforms concurrently, while high-resolution PWM drives boost and DC-AC stages. The 64 KB RAM accommodates control histories and filtering buffers, and the 512 KB dual-panel flash allows secure firmware updates over powerline or wireless links without bricking deployed units. Extended -40C to +125C operation suits outdoor sealed enclosures. Designers should partition control-critical loops into the highest-priority interrupts and reserve main-loop bandwidth for MPPT and communication.
Recommandé
Industrial Sensor Front-Ends and Condition Monitoring
Vibration, pressure, and current sensors in industrial condition-monitoring nodes benefit from the on-chip analog integration of the DSPIC33CK512MP306. The 12-bit ADC acquires sensor signals while the integrated operational amplifiers provide gain staging for low-amplitude shunt or piezo outputs, eliminating external amplifier ICs. The 100 MIPS DSP core applies FFT and digital filtering directly on the node, transmitting only spectral features rather than raw waveforms - reducing bus traffic. The 512 KB flash stores calibration tables and local feature-extraction routines, and 64 KB RAM buffers acquisition windows. Extended temperature rating tolerates cabinet and motor-adjacent mounting from -40C to +125C.
Recommandé
Automotive and E-Mobility Auxiliary Systems
The -E extended temperature grade (-40C to +125C) and ROHS3 compliance make the DSPIC33CK512MP306-E/PT appropriate for harsh-environment auxiliary control such as pump drives, actuators, thermal management, and battery-junction monitoring in e-mobility platforms. Its 100 MIPS core runs multi-axis or high-frequency FOC loops for electric coolant pumps and fans, while the 12-bit ADC and OpAmps handle current and temperature acquisition. Dual-panel flash enables safety-minded firmware updates in the field. Note: this standard-grade part is not AEC-Q100 qualified; for formal automotive qualification requirements, verify suitability with Microchip or select an automotive-qualified family variant before design-in.
Recommandé
Robotics and Multi-Axis Servo Drives
Robotic joint controllers and multi-axis servo drives require simultaneous position, velocity, and torque loops per axis. The DSPIC33CK512MP306 dedicates its full 100 MIPS to one axis's cascaded control loops, executing torque-loop updates at 20-50 kHz with DSP-accelerated math (hardware MAC, barrel shifter) while managing encoder interpolation in the main loop. Integrated OpAmps condition motor phase-current shunts, and the 12-bit ADC captures them synchronized to PWM switching events for low-noise torque measurement. 512 KB flash holds trajectory tables and fieldbus stacks, and 64 KB RAM supports motion buffering. The 64-TQFP pinout exposes enough PWM, UART, and SPI peripherals to network multiple axes over CAN or RS-485.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CK512MP306-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CK512MP306T-E/PT | DSPIC33CK256MP205-E/PT | DSPIC33CH512MP506-E/PT | DSPIC33CK128MP506-E/MR |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10) | 64-TQFP (10x10) - same | TQFP (PT) - same family footprint | TQFP (PT) - same family footprint | TQFP (MR variant) - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS main + secondary core | 100 MIPS |
| Flash Memory | 512 KB | 512 KB | 256 KB | 512 KB | 128 KB |
| Cores | 1 x dsPIC33CK | 1 x dsPIC33CK | 1 x dsPIC33CK | 2 x dsPIC33C (dual core) | 1 x dsPIC33CK |
| Operating Temperature | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| On-chip Analog (OpAmps/ADC) | OpAmps + 12-bit ADCs | OpAmps + 12-bit ADCs | OpAmps + 12-bit ADCs | OpAmps + 12-bit ADCs | OpAmps + 12-bit ADCs |
Principaux différenciateurs
- Largest flash in the same 64-pin family footprint (vs DSPIC33CK256MP205-E/PT)
- Single-core determinism for tightest control loops (vs DSPIC33CH512MP506-E/PT)
- Extended temperature with full memory configuration (vs DSPIC33CK512MP306T-I/PT)
Notes de conception
The dsPIC33CK512MP306 requires a 3 V to 3.6 V supply with 3.3 V nominal. Decouple each VDD pin pair with 0.1 uF ceramics placed within 2 mm of the pins, plus one bulk 10 uF capacitor near the device. When the on-chip OpAmps and ADC are active, supply ripple appears directly at the analog results - use an LDO with at least 60 dB PSRR at 100 kHz or an LC filter feeding the VDD/VDDCORE domain. Estimated: a 100 mA average core load from a 5 V rail at 90% buck efficiency dissipates under 20 mW in the regulator, so thermal design is trivial; the constraint is noise, not heat.
For the 64-TQFP (10x10), pour a solid ground plane on layer 2 and keep the high-resolution PWM traces to gate drivers short and away from ADC input traces to prevent switching coupling into phase-current samples. Route ADC/OpAmp inputs as guard-ring guarded traces when signals exceed 100 mV amplitude precision requirements. Use the datasheet-recommended 10 uF + 0.1 uF decoupling on VCAP/VDDCORE as specified by Microchip; never share this capacitor among devices. Exposed corner pins 1 marker aligns with the TQFP pin-1 chamfer - verify orientation against the 10x10 land pattern in IPC-compliant footprints.
Two frequent mistakes: (1) forgetting that the dual-panel flash partitions (0x000000-0x058000 unpartitioned) change linker scripts - code compiled for unpartitioned mode will not boot from partition B without rebuilding, so decide partitioned vs unpartitioned at project start. (2) Treating the -E and -I suffixes as interchangeable: -E is rated to +125C while -I industrial parts are rated lower, so substituting an -I part into an extended-temperature design risks field failures. Also confirm ADC/OpAmp pin-multiplexing conflicts before finalizing the pinout, since several analog functions share pins on the MP30x pin map.
Informations de conformité
ROHS3 compliant and lead-free per ics-embedded.com part data. Extended temperature grade (-E). AEC-Q100 qualification not stated in provided data; verify with Microchip for formal automotive use.
