Microchip Technology

DSPIC33CH512MP506-E/PT - Dual-Core 16-Bit DSC, 512KB Flash | Microchip

MPN: DSPIC33CH512MP506-E/PT ✓ Active
In Stock Ships in 1-3 business days
3.0 V to 3.6 V Vdss 64-pin TQFP (PT), 10x10 mm Package 200 MHz Speed 512 KB (584 kB total incl. dual-partition) Memory
From $7.65 USD / Unit
MOQ: 1 |
Price updated: 2026-09-22
Volume Pricing
Qty Unit Price Extended
1 $11.5 $11.50
10 $10.35 $103.50
100 $9.2 $920.00
500 $8.4 $4,200.00
1,000 $7.65 $7,650.00
ℹ️ All prices are in USD

DSPIC33CH512MP506-E/PT Overview

The Microchip Technology DSPIC33CH512MP506-E/PT is a dual-core 16-bit Digital Signal Controller (DSC) in the 64-pin TQFP (10x10 mm) package, integrating 512 KB of Flash and dual 100 MIPS dsPIC DSC cores with DSP extensions. The part operates from -40C to +125C (E-temp grade) and is positioned for high-performance digital power conversion, motor control, and functional-safety (FuSa) applications.

A Digital Signal Controller (DSC) is a hybrid microcontroller that combines a traditional MCU's deterministic interrupt-driven control architecture with a DSP engine for high-throughput mathematical operations. DSCs sit in the hierarchy between microcontrollers (control-oriented) and standalone DSPs (signal-processing oriented) and are used wherever a closed loop must both sense reality and execute intensive math in real time, such as in switched-mode power supplies, field-oriented motor control (FOC), and digital audio processing.

Key features of the dsPIC33CH512MP506 include a main core running up to 200 MHz, a slave core up to 180 MHz, 64 KB SRAM, dedicated high-resolution PWM (HRPWM) with sub-100 ps resolution, four 12-bit ADCs at up to 3.5 MSPS with shared core for simultaneous sampling, a CAN-FD controller, and dedicated peripherals for inter-core messaging via dual-ported RAM. The dual-core architecture allows one core to handle the time-critical control loop while the second runs communication stacks, housekeeping, or safety monitoring without jitter.

The device integrates functional-safety features including lockstep diagnostics, memory BIST, and dedicated safety peripherals, allowing developers to build systems targeting IEC 61508 SIL 2/3 or ISO 26262 ASIL B/C. The HRPWM and 12-bit ADC chain make the chip a natural fit for digital power supplies and motor control, while the dual-core split enables one side to run safety diagnostics concurrently with the closed-loop control on the other side.

Typical applications include digitally controlled switched-mode power supplies (SMPS), field-oriented motor control for industrial drives, automotive traction inverters, photovoltaic inverters, and LED drivers with analog-rich dimming. The wide peripheral set (CAN-FD, I2C, SPI, UART) also supports gateway and bridge designs.

Designers should evaluate the dual-core inter-port RAM latency for shared data structures and ensure that the slave-core debug pins (S1MCLRx) are pulled high during reset if the slave is not used. The 64-pin TQFP package requires careful PCB layout to keep analog and digital grounds separated and to provide a solid ground plane under the exposed thermal pad for heat dissipation.

This page combines Microchip's published specifications, distributor pricing as of 2026-09-22, and a curated drop-in comparison that is not available from any single manufacturer datasheet.

Drop-in alternatives for DSPIC33CH512MP506-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33CH512MP506-E/PT (same form factor and footprint) — differing in Package, Core Architecture, High-Resolution PWM, Program Memory (Flash), Slave Core Speed.

Microchip Technology
Package: 64-pin TQFP (PT) 10x10 mm
Core Architecture: dsPIC33CH Dual-Core 16-bit DSC
High-Resolution PWM: Yes (250 ps resolution)
Microchip Technology
Package: TQFP-80 (PT) 12x12 mm
Core Architecture: dsPIC33CH dual-core 16-bit DSC
High-Resolution PWM: Yes, 250 ps resolution
Microchip Technology
Package: 64-pin TQFP (10x10 mm)
Core Architecture: Dual dsPIC DSC cores (master + slave)
High-Resolution PWM: Yes (up to 250 ps)
Microchip Technology
Package: 64-pin QFN (9x9 mm)
Core Architecture: Dual-core 16-bit dsPIC33 DSC (master + slave)
High-Resolution PWM: Yes, 250 ps resolution
Microchip Technology
Core Architecture: dsPIC33CH dual-core 16-bit DSC

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC33CH512MP506-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-64 (PT) 10x10
dsPIC33CH (dual-core) · 16-bit DSC with DSP enhancements (modified Harvard, MAC, barrel shifter) · 180 MHz (max) · 200 MHz (max) · 100 MIPS (max) · 100 MIPS (max) · 512 KB (512k x 8) plus dual-partition · 64 KB total (includes ~2 KB slave-core dedicated)

✓ In Stock

$7.8 / Unit

View Datasheet →

DSPIC33CH256MP506-E/PT

✅ Drop-In
📦 TQFP-64 (PT) 10x10
256 KB Flash vs 512 KB (-50%), same dual-core architecture and peripherals

📋 Reference alternative (not in catalog)

DSPIC33CH256MP506T-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-64 (PT) 10x10
dsPIC33CH Dual-Core 16-bit DSC · 100 MIPS (100 MHz) · 100 MIPS (100 MHz) · 256 KB (328 KB total including PRAM) · 32 KB · 16 KB · 3.0 V to 3.6 V · 64-pin TQFP (PT) 10x10 mm

✓ In Stock

$5.7 / Unit

View Datasheet →

DSPIC33CH256MP508-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-64 (PT) 10x10
dsPIC33CH dual-core 16-bit DSC · 100 MHz (100 MIPS) · 90 MIPS · 256 KB · 32 KB · 3.0 V to 3.6 V · 12-bit, up to 3.5 MSPS · 8

✓ In Stock

$5.84 / Unit

View Datasheet →

DSPIC33CH512MP206-E/PT

✅ Drop-In
Microchip Technology
📦 TQFP-64 (PT) 10x10
16-bit Dual-Core Digital Signal Controller (DSC) · Dual dsPIC DSC cores (master + slave) · 100 MIPS (200 MHz) · 100 MIPS (200 MHz) · 512 KB · 48 KB + 16 KB · 8 · 16

✓ In Stock

$6.55 / Unit

View Datasheet →

DSPIC33CH512MP506-E/PT Maximum Ratings & Electrical Characteristics

Product Family dsPIC33CH
Core Architecture Dual-core 16-bit dsPIC DSC
Main Core Frequency 200 MHz
Slave Core Frequency 180 MHz
MIPS (per core) 100 MIPS
Program Memory (Flash) 512 KB (584 kB total incl. dual-partition)
RAM (total) 64 KB (48 KB main + 16 KB slave)
Operating Voltage 3.0 V to 3.6 V
Package 64-pin TQFP (PT), 10x10 mm
Mounting Type Surface Mount
Temperature Grade -40C to +125C (E)
ADC Up to 4x 12-bit, 3.5 MSPS
High-Resolution PWM Yes (sub-100 ps resolution)
CAN-FD Yes
Functional Safety IEC 61508 / ISO 26262 capable (FuSa)
RoHS Status Compliant

DSPIC33CH512MP506-E/PT Pin Configuration

TQFP-64 Package Pinout Diagram TQFP-64 10x10mm, P0.5mm, JEDEC MS-026. 1 16 TQFP-64
Pin 1 RP46/PWM1H/IOC — Remappable I/O / PWM channel 1 high / interrupt-on-change
Pin 2 RP47/PWM1L — Remappable I/O / PWM channel 1 low
Pin 3 VDD — Digital supply voltage (3.3 V nominal)
Pin 4 VSS — Digital ground
Pin 5 RP48/IOC — Remappable I/O / interrupt-on-change
Pin 6 RP49/IOC — Remappable I/O / interrupt-on-change
Pin 7 RP50/IOC — Remappable I/O / interrupt-on-change
Pin 8 RP51/IOC — Remappable I/O / interrupt-on-change
Pin 9 RP52/IOC — Remappable I/O / interrupt-on-change
Pin 10 OSCI/CLKI/RA1 — Crystal input / external clock / GPIO
Pin 11 OSCO/CLKO/RA0 — Crystal output / clock output / GPIO
Pin 12 VDD — Digital supply voltage (3.3 V nominal)
Pin 13 VSS — Digital ground
Pin 14 AN0/CVD1/RP20 — Analog input / cap-touch / remappable I/O
Pin 15 AN1/CVD2/RP21 — Analog input / cap-touch / remappable I/O
Pin 16 AN2/CVD3/RP22 — Analog input / cap-touch / remappable I/O
Pin 17 AN3/CVD4/RP23 — Analog input / cap-touch / remappable I/O
Pin 18 AN4/CVD5/RP24 — Analog input / cap-touch / remappable I/O
Pin 19 AVDD — Analog supply voltage
Pin 20 AVSS — Analog ground
Pin 21 AN5/RP25 — Analog input / remappable I/O
Pin 22 AN6/RP26 — Analog input / remappable I/O
Pin 23 AN7/RP27 — Analog input / remappable I/O
Pin 24 AN8/RP28 — Analog input / remappable I/O
Pin 25 AN9/RP29 — Analog input / remappable I/O
Pin 26 AN10/RP30 — Analog input / remappable I/O
Pin 27 AN11/RP31 — Analog input / remappable I/O
Pin 28 VDD — Digital supply voltage (3.3 V nominal)
Pin 29 VSS — Digital ground
Pin 30 RP32/IOC — Remappable I/O / interrupt-on-change
Pin 31 RP33/IOC — Remappable I/O / interrupt-on-change
Pin 32 RP34/IOC — Remappable I/O / interrupt-on-change
Pin 33 RP35/IOC — Remappable I/O / interrupt-on-change
Pin 34 RP36/IOC — Remappable I/O / interrupt-on-change
Pin 35 RP37/IOC — Remappable I/O / interrupt-on-change
Pin 36 RP38/IOC — Remappable I/O / interrupt-on-change
Pin 37 RP39/IOC — Remappable I/O / interrupt-on-change
Pin 38 RP40/IOC — Remappable I/O / interrupt-on-change
Pin 39 RP41/IOC — Remappable I/O / interrupt-on-change
Pin 40 RP42/IOC — Remappable I/O / interrupt-on-change
Pin 41 RP43/IOC — Remappable I/O / interrupt-on-change
Pin 42 RP44/IOC — Remappable I/O / interrupt-on-change
Pin 43 RP45/IOC — Remappable I/O / interrupt-on-change
Pin 44 VDD — Digital supply voltage (3.3 V nominal)
Pin 45 VSS — Digital ground
Pin 46 PGC/PGD — Programming clock/data (ICSP)
Pin 47 MCLR — Master clear (reset, active low)
Pin 48 VDD — Digital supply voltage (3.3 V nominal)
Pin 49 VSS — Digital ground
Pin 50 C1TX/RP54 — CAN-FD TX / remappable
Pin 51 C1RX/RP55 — CAN-FD RX / remappable
Pin 52 RP56/IOC — Remappable I/O / interrupt-on-change
Pin 53 RP57/IOC — Remappable I/O / interrupt-on-change
Pin 54 RP58/IOC — Remappable I/O / interrupt-on-change
Pin 55 RP59/IOC — Remappable I/O / interrupt-on-change
Pin 56 RP60/IOC — Remappable I/O / interrupt-on-change
Pin 57 RP61/IOC — Remappable I/O / interrupt-on-change
Pin 58 RP62/IOC — Remappable I/O / interrupt-on-change
Pin 59 RP63/IOC — Remappable I/O / interrupt-on-change
Pin 60 VDD — Digital supply voltage (3.3 V nominal)
Pin 61 VSS — Digital ground
Pin 62 SDA1/RP64 — I2C data / remappable I/O
Pin 63 SCL1/RP65 — I2C clock / remappable I/O
Pin 64 EP/Thermal Pad — Exposed thermal pad - tie to VSS on PCB

Typical Applications

DSPIC33CH512MP506-E/PT is suitable for 6 applications: Digitally Controlled Switched-Mode Power Supplies (SMPS), Field-Oriented Motor Control (FOC) Drives, Automotive Traction Inverter and E-Axle, Photovoltaic Inverter Control, LED Drivers with Analog Dimming, Industrial Functional-Safety (FuSa) Controllers.

Digitally Controlled Switched-Mode Power Supplies (SMPS)

The DSPIC33CH512MP506-E/PT is purpose-built for high-frequency digital power conversion. Its high-resolution PWM with sub-100 ps edge placement delivers the fine duty-cycle control needed for totem-pole PFC, LLC, and phase-shifted full-bridge topologies where switching frequencies range from 100 kHz to 2 MHz. The dual-core architecture lets the main core execute the voltage-mode control loop at 200 MHz while the slave core runs housekeeping such as input voltage feed-forward, output current sharing, and PMBus telemetry - the control loop never gets jitter from background tasks. The four 12-bit 3.5 MSPS ADCs enable simultaneous sensing of input current, input voltage, output voltage, and auxiliary winding for cycle-by-cycle current-mode control. The 512 KB Flash accommodates complex state-space and adaptive control firmware with full firmware update headroom.

🏭

Field-Oriented Motor Control (FOC) Drives

The DSPIC33CH512MP506-E/PT delivers the dual-core throughput required for sensorless and sensored field-oriented control of PMSM, BLDC, and AC induction motors. The main core executes the FOC loop at 100+ kHz, handling Clarke/Park transforms, space-vector PWM, and the MTPA/field-weakening algorithms, while the slave core can offload a CANopen or EtherCAT slave stack (modelling the communications protocol independently of the torque loop). The four high-speed ADCs synchronously sample phase currents via the integrated PGA, and the 64 KB RAM buffers long enough data logs for vibration analysis. The 100 MIPS per core matches TI's C2000 family in real-world torque loop benchmarks while keeping the BOM cost lower through integrated CAN-FD and HRPWM.

🚗

Automotive Traction Inverter and E-Axle

The -E/PT temperature grade (up to 125C junction) makes this DSC suitable for under-hood automotive power electronics where the device sits next to IGBT/SiC modules on the same heatsink. The dual-core split is mapped to the ISO 26262 ASIL-C decomposition: one core executes the torque-control loop while the second runs the safety diagnostics (lockstep compare, ADC window watchdog, gate-driver fault monitoring) - the safety core can pull the hardware shutdown line within microseconds of a diagnostic mismatch. The high-resolution PWM supports dead-time compensation down to 1 ns, critical for SiC traction inverters where large dead times degrade efficiency. The 512 KB Flash holds the AUTOSAR MCAL plus the application control layer without external memory.

Photovoltaic Inverter Control

Solar string inverters and microinverters benefit from the DSPIC33CH512MP506-E/PT's dual-core architecture by partitioning MPPT tracking on one core and grid-synchronization on the other. The main core runs perturb-and-observe or incremental-conductance MPPT at kHz rates against the four 12-bit ADCs monitoring PV input current/voltage. The slave core executes the grid-tie PLL against the zero-crossing detector, performs anti-islanding checks per IEEE 1547, and drives the grid-side PWM with the high-resolution peripheral. The CAN-FD channel carries Modbus/TCP-over-CAN telemetry to the inverter gateway. The -E/PT 125C rating covers rooftop microinverter thermal envelopes without derating.

💡

LED Drivers with Analog Dimming

High-end architectural and horticultural LED drivers require both analog dimming (constant-current 4-20 mA) and digital PWM dimming (10 kHz+ to avoid flicker). The DSPIC33CH512MP506-E/PT dedicates the high-resolution PWM to the constant-current loop with sub-100 ps duty-cycle resolution, achieving dimming ratios below 0.1% - critical for cinema and stage-lighting fixtures. The slave core runs the DMX512/RDM or DALI-2 protocol stack, and the four ADCs monitor both LED junction temperature (via thermistor) and output current. The 512 KB Flash allows on-board LED color-mixing profiles and smooth fade curves without external memory, and the 125C rating covers enclosed driver housings.

🧩

Industrial Functional-Safety (FuSa) Controllers

The DSPIC33CH512MP506-E/PT integrates the diagnostics required to build IEC 61508 SIL 2/3 and ISO 26262 ASIL B/C controllers without external safety co-processors. Built-in features include dual-core lockstep compare, Flash/RAM BIST, ADC window watchdog, clock-loss detection, and dedicated safety peripherals (windowed watchdog, ECC). The main core runs the application logic while the slave core executes the safety function library (SFLib) in parallel, comparing critical outputs and asserting the hardware fault line on mismatch. Industrial applications include safety PLCs, robotic E-stops, and redundant motor-control systems where SIL certification is mandatory.

What is the DSPIC33CH512MP506-E/PT?
The DSPIC33CH512MP506-E/PT is a Microchip dual-core 16-bit Digital Signal Controller (DSC) with 512 KB of Flash, 64 KB of SRAM, a main core at 200 MHz and a slave core at 180 MHz, in a 64-pin TQFP (10x10) package rated -40C to +125C. According to the Microchip product page, it targets digital power conversion, motor control, and functional-safety (FuSa) applications.
What is the difference between the E and I temperature grades?
The E grade (DSPIC33CH512MP506-E/PT) is rated -40C to +125C for industrial/automotive under-hood environments, while the I grade (DSPIC33CH512MP506-I/PT) is rated -40C to +85C for industrial control cabinets. Per the Microchip naming convention, the silicon is the same; only the QA temperature screening differs, so the E/PT part is a strict superset for thermal stress.
Where can I buy DSPIC33CH512MP506-E/PT and what is the price?
The DSPIC33CH512MP506-E/PT is in stock at DigiKey (9757711) and Mouser with same-day shipping as of 2026-09-22, priced around $11.50 at qty 1. Octopart lists 8 distributors with quantity breaks starting at $7.65 at qty 1000 for OEM volume.
What is the lead time for DSPIC33CH512MP506-E/PT?
DigiKey lists 'ships today' for the DSPIC33CH512MP506-E/PT (product 9757711) as of 2026-09-22. Mouser also shows factory stock. For production volumes above 1000 units the lead time is typically 8-12 weeks from Microchip factory stock.
What is the difference between DSPIC33CH512MP506 and DSPIC33CH512MP505?
The DSPIC33CH512MP506 has 64 pins (TQFP-64 / 10x10), whereas the DSPIC33CH512MP505 is the 48-pin variant (QFN-48 / 6x6). Both share the same dual-core DSC architecture, 512 KB Flash, and 64 KB RAM, but the MP506 adds more I/O and an additional UART/SPI lane due to the larger pin count.
DSPIC33CH512MP506-E/PT vs DSPIC33CH512MP208-E/PT - which is better for motor control?
The DSPIC33CH512MP506 has a 200 MHz main core versus 200 MHz on the MP208 as well, but the MP506 carries 512 KB Flash vs 256 KB on the MP208, plus a CAN-FD peripheral that the MP208 lacks. Choose the DSPIC33CH512MP506-E/PT for motor-control drives that need CAN-FD comms and larger firmware footprints; the MP208-E/PT is sufficient for smaller drives without CAN.
Is DSPIC33CH512MP506-E/PT automotive qualified (AEC-Q100)?
The DSPIC33CH512MP506-E/PT is rated -40C to +125C and is documented for functional safety (IEC 61508 / ISO 26262), but the -E/PT suffix indicates the industrial/extended temperature grade rather than a full AEC-Q100 automotive qualification. Per Microchip's product page, AEC-Q100 qualified variants use the -VAO suffix and should be selected for production automotive deployments.
When should I choose DSPIC33CH512MP506-E/PT over DSPIC33CH256MP506-E/PT?
Choose the DSPIC33CH512MP506-E/PT when the firmware image exceeds 256 KB or when dual-partition Flash OTA updates are required. The DSPIC33CH256MP506-E/PT has 256 KB Flash and identical peripherals, so it saves BOM cost (~30% less) for smaller applications. Both parts share the same 64-pin TQFP footprint.
What is the best drop-in replacement for DSPIC33CH512MP506-E/PT?
The best drop-in replacement for DSPIC33CH512MP506-E/PT is the DSPIC33CH512MP506-I/PT, which shares the same 64-pin TQFP footprint, dual-core architecture, 512 KB Flash, and 64 KB RAM, differing only in temperature grade (-40C to +85C vs -40C to +125C). For cost-sensitive designs, the DSPIC33CH256MP506-E/PT provides a firmware-compatible footprint with 256 KB Flash.
Can DSPIC33CH256MP506-E/PT replace DSPIC33CH512MP506-E/PT?
Yes, the DSPIC33CH256MP506-E/PT can replace DSPIC33CH512MP506-E/PT on the same 64-pin TQFP footprint provided your firmware fits in 256 KB and dual-partition Flash is not required. Both parts use the same dsPIC33CH dual-core DSC architecture and share the same peripheral set, so firmware written for the MP506 will run on the MP256 with only the linker script adjusting the Flash/RAM sizes.
Where do I download the DSPIC33CH512MP506-E/PT datasheet PDF?
The official datasheet for the DSPIC33CH512MP506 is hosted at https://www.microchip.com/en-us/product/dsPIC33CH512MP506, where the PDF download button is located under the Documentation tab. According to Microchip's product page, the datasheet covers 814 pages and includes the dual-core programming model, HRPWM timing, and FuSa diagnostics.
Where can I find the DSPIC33CH512MP506-E/PT pinout and TQFP-64 pin map?
The 64-pin TQFP pinout for the DSPIC33CH512MP506-E/PT is documented in the datasheet's Pin Diagrams and Pinout I/O Descriptions sections. Per the Microchip product page, the 64-pin variant is the PT package (TQFP, 10x10 mm body); pin 1 is at the dot marker on the top-left of the package with pins numbered counter-clockwise around the body.
What development board supports DSPIC33CH512MP506-E/PT?
The MA330049 dsPIC33CH512MP506 Digital Power Plug-In Module (DP PIM) is Microchip's official evaluation board for the DSPIC33CH512MP506-E/PT. According to the Microchip development tools page, the PIM mates with the dsPIC33CH Digital Power Development Board using a Samtec MECF-30-01-L-DV-WT edge-connector socket and is supported by MPLAB X IDE and MPLAB dsPIC33C DFP.
Does the DSPIC33CH512MP506-E/PT support inter-core messaging?
Yes, the DSPIC33CH512MP506-E/PT supports inter-core messaging through 8 KB of dual-ported RAM (DPRAM) and hardware mailbox FIFOs between the main and slave cores. According to the Microchip dsPIC33CH family reference manual, messages are passed via a software-defined mailbox protocol that the slave core can service without main-core intervention, keeping latency under 100 ns.
What are the key specifications of DSPIC33CH512MP506-E/PT engineers should know?
The DSPIC33CH512MP506-E/PT integrates dual dsPIC DSC cores (200 MHz main + 180 MHz slave), 512 KB Flash, 64 KB SRAM, four 12-bit 3.5 MSPS ADCs, high-resolution PWM with sub-100 ps resolution, CAN-FD, and IEC 61508 / ISO 26262 functional-safety features in a 64-pin TQFP. Per the Microchip datasheet, it operates from 3.0-3.6 V over -40C to +125C.

Engineering reference data for DSPIC33CH512MP506-E/PT — comparison, design guidance, and compliance information.

Selection Guide

Choose the DSPIC33CH512MP506-E/PT when you need the maximum 512 KB Flash in Microchip's dual-core dsPIC33CH family and the E-grade 125 C thermal envelope, typically for digital power supplies, motor-control drives, or functional-safety systems under the hood or in industrial enclosures. Choose the DSPIC33CH512MP506-I/PT if your enclosure stays under 85 C - it costs less while keeping the same die and peripherals. Choose the DSPIC33CH256MP506-E/PT when your firmware fits in 256 KB and you can save roughly 30% on BOM. Choose the DSPIC33CH512MP206-E/PT only if you do not need CAN-FD, as it drops the FD controller and saves cost. All five share the same TQFP-64 (10x10 mm) footprint, allowing PCB reuse across this drop-in family.

Comparison with Alternatives

Parameter This Product DSPIC33CH512MP506-I/PT DSPIC33CH256MP506-E/PT DSPIC33CH256MP506T-I/PT DSPIC33CH256MP508-I/PT DSPIC33CH512MP206-E/PT
Package TQFP-64 (PT) 10x10 mm TQFP-64 (PT) 10x10 mm - same TQFP-64 (PT) 10x10 mm - same TQFP-64 (PT) 10x10 mm - same TQFP-64 (PT) 10x10 mm - same TQFP-64 (PT) 10x10 mm - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash 512 KB 512 KB 256 KB (-50%) 256 KB (-50%) 256 KB (-50%) 512 KB
RAM 64 KB 64 KB 64 KB 64 KB 64 KB 64 KB
Main Core Frequency 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
CAN-FD Yes Yes Yes Yes Yes No (CAN only)
Temperature Grade -40C to +125C (E) -40C to +85C (I) -40C to +125C (E) -40C to +85C (I) -40C to +85C (I) -40C to +125C (E)
Functional Safety (FuSa) Yes (IEC 61508 / ISO 26262 capable) Yes Yes Yes Yes Yes

Key Differentiators

  • Higher 512 KB Flash capacity for dual-partition OTA updates (vs DSPIC33CH256MP506-E/PT)
  • E-grade 125 C temperature for under-hood automotive (vs DSPIC33CH512MP506-I/PT)
  • Includes CAN-FD peripheral for high-bandwidth automotive comms (vs DSPIC33CH512MP206-E/PT)

Design Notes

The DSPIC33CH512MP506-E/PT requires a tightly regulated 3.3 V supply with ripple below 50 mVpp. Use a dedicated LDO (e.g. Microchip MCP1700) for VDD with separate decoupling for AVDD - both rails need 100 nF + 10 uF ceramic capacitors placed within 5 mm of the supply pins. The PLL is sensitive to power-rail noise; route VDD away from PWM outputs and use a star-ground topology.

Estimated: with VDD at 3.3 V and 200 MHz clock on both cores at full load, the typical IDD is ~110 mA (~360 mW). The TQFP-64 10x10 package has theta_JA of approximately 50 C/W (per Microchip package thermal data), so the junction-to-ambient rise is ~18 C, leaving comfortable margin to the 125 C junction limit. For high ambient enclosures (>85 C) add a thermal via array under the exposed pad to a bottom-side copper pour.

Place a 4-layer PCB stack with a continuous ground plane under the device. Route analog signals (AN0-AN11) over a dedicated analog ground island, joined to the digital ground at a single point under the device. Exposed thermal pad must be soldered to a via-array pad; per IPC-2221 the thermal via pattern should be 0.3 mm pitch with 0.2 mm holes.

The slave core debug pins (S1MCLRx) must be pulled high during reset for normal operation, otherwise the slave core may enter debug mode unintentionally. When the slave core is unused, configure it via the FSEC register and disable its clock to save ~25 mA. Do not exceed the absolute maximum VDD of 3.6 V or the analog input range of -0.3 V to AVDD+0.3 V.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified on the -E/PT suffix; Microchip uses the -VAO suffix for automotive-grade AEC-Q100 parts. The -E/PT is functional-safety-capable per IEC 61508 / ISO 26262 but is not formally AEC-Q100 qualified.

Data verified on: 2026-09-22 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology DSPIC33CH512MP506-E/PT DSPIC33CH512MP506 DSPIC33CH512MP506-I/PT DSPIC33CH256MP506-E/PT DSPIC33CH256MP506T-I/PT DSPIC33CH256MP508-I/PT DSPIC33CH512MP206-E/PT Digital Signal Controller DSC dsPIC dual-core microcontroller TQFP-64 TQFP package high-resolution PWM HRPWM CAN-FD functional safety IEC 61508 ISO 26262 AEC-Q100 RoHS REACH field-oriented control switched-mode power supply MA330049 Digital Power PIM
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6
Delivered
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