DSPIC33EP32MC504T-E/TL - 60 MIPs 16-bit DSC, 32KB Flash | Microchip
Référence : DSPIC33EP32MC504T-E/TL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.95 | $4,95 |
| 10 | $4.45 | $44,50 |
| 100 | $3.98 | $398,00 |
| 500 | $3.58 | $1 790,00 |
| 1 000 | $3.2 | $3 200,00 |
DSPIC33EP32MC504T-E/TL Présentation
A digital signal controller combines the compute architecture of a microcontroller with the mathematical throughput of a DSP. Within the power management hierarchy of embedded systems, a DSC sits above a general-purpose MCU for control-loop-intensive tasks: it executes single-cycle multiply-accumulate (MAC) instructions and DSP-style addressing modes, making it the natural choice for motor control, digital power conversion, and sensor signal processing where a standard 8-bit or basic 16-bit MCU struggles to close control loops fast enough.
Key features of this device include the 16-bit dsPIC33EP core clocked for 60 MIPS execution, 32KB of self-programmable FLASH organized as 10.7K x 24-bit instruction words, 2KB of on-chip SRAM, and an extended temperature range (-40C to +125C) indicated by the E temperature suffix. The T in the ordering code denotes tape-and-reel packaging for automated assembly. AEC-Q100 qualification makes this device suitable for automotive applications where consumer-grade parts are not acceptable.
The dsPIC33EP family integrates enhanced on-chip peripherals for precision motor control systems, including high-speed PWM, analog-to-digital conversion, and communication interfaces, per Microchip's family overview. The 3.3V supply domain keeps interfacing simple with modern logic and sensor ICs.
Typical applications include BLDC and PMSM motor control drives, automotive auxiliary systems, digital power supplies (PFC, LLC controllers), industrial automation nodes, and embedded control in harsh thermal environments where the extended -40C to +125C rating is required.
A key design consideration is memory headroom: 32KB FLASH and 2KB RAM are ample for single-loop control firmware, but complex multi-axis systems or protocol stacks may need the 256KB variants in the same family footprint.
This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes in one place - information engineers otherwise have to assemble manually from multiple datasheet and distributor sources.
Alternatives de remplacement direct pour DSPIC33EP32MC504T-E/TL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP32MC504T-E/TL (même facteur de forme et même empreinte) — différant par Packaging, RAM, Package, Core Architecture, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP32MC504T-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.05 / unité
Voir la fiche technique →DSPIC33EP32MC504-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC504T-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.32 / unité
Voir la fiche technique →DSPIC33EP64MC504T-I/TL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.55 / unité
Voir la fiche technique →DSPIC33EP32MC504T-E/TL Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC33EP DSC |
| Max CPU Speed | 60 MIPs |
| Program Memory (FLASH) | 32KB (10.7K x 24) |
| RAM | 2KB |
| Tension d'alimentation | 3.3 V |
| Boîtier | 44-VTLA (6x6 mm), exposed pad |
| Nombre de broches | 44 |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +125C (E grade) |
| Qualification | AEC-Q100 qualified (automotive) |
| Packaging | Tape and Reel (T suffix) |
| Series | dsPIC 33EP (dsPIC33EP32MC504) |
| Product Type | Digital Signal Controller (DSC) / Microcontroller IC |
| Program Memory Type | FLASH |
Guide de configuration des broches du DSPIC33EP32MC504T-E/TL 44-vtla (6x6 mm), exposed pad
Configuration des broches du DSPIC33EP32MC504T-E/TL (boîtier 44-vtla (6x6 mm), exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP32MC504T-E/TL.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP32MC504T-E/TL convient pour 6 applications: BLDC/PMSM Motor Control Drives, Automotive Auxiliary Control Modules, Digital Power Supplies (PFC/LLC), Industrial Automation Nodes, Sensor Signal Processing, Embedded Control in Harsh Thermal Environments.
BLDC/PMSM Motor Control Drives
The DSPIC33EP32MC504T-E/TL is purpose-built for precision motor control: its 60 MIPs 16-bit DSP core executes field-oriented control (FOC) current loops with single-cycle MAC instructions, sustaining loop rates well above the electrical frequency of typical BLDC and PMSM motors. The dsPIC33EP family integrates high-resolution PWM peripherals for complementary and independent PWM outputs with dead-time control, plus fast ADC sampling for phase-current measurement. Firmware footprint of 32KB FLASH comfortably holds sensorless FOC or Hall-based commutation for a single motor. In automotive-grade drives (pumps, fans, actuators), the AEC-Q100 qualification and -40C to +125C E-grade rating remove the qualification risk of consumer MCUs. Expect deterministic interrupt latency and hardware DSP support that a general-purpose PIC16 cannot match at any price point in this class.
Recommandé
Automotive Auxiliary Control Modules
With AEC-Q100 qualification and an extended -40C to +125C operating range, the DSPIC33EP32MC504T-E/TL addresses automotive auxiliary electronic modules: seat and mirror actuators, HVAC damper control, pump and fan control, and lighting sequencers. The 3.3V core interfaces cleanly with modern automotive transceivers, and the exposed-pad 44-VTLA (6x6 mm) package provides compact thermal performance on standard 4-layer PCBs. The 32KB FLASH accommodates module firmware including LIN-type communication stacks and diagnostic routines. Because it is a standard catalog Microchip part (not a custom ASIC), it suits mid-volume automotive programs where development tooling - MPLAB X and compatible programmers/debuggers - reduces NRE. Designers should still confirm the specific AEC-Q100 grade level and PPAP availability with Microchip for the exact OEM program requirements.
Recommandé
Digital Power Supplies (PFC/LLC)
Digital power conversion demands fast, deterministic control loops - precisely what the 60 MIPs DSP core of the DSPIC33EP32MC504T-E/TL provides. Single-cycle multiply-accumulate and DSP addressing allow voltage and current compensation loops for PFC, LLC, buck, and boost topologies to run at tens of kHz sampling rates with cycle-by-cycle current limiting implemented in firmware. The dsPIC33EP family's high-speed PWM module supports complementary outputs with programmable dead time and ADC-trigger synchronization, essential for peak-current-mode and average-current-mode control. The 32KB FLASH holds compensation tables, soft-start, and protection logic for a single converter stage. For automotive or industrial power supplies in thermally aggressive enclosures, the E-grade temperature rating ensures the controller itself is never the weak link in the reliability chain.
Recommandé
Industrial Automation Nodes
In factory automation, the DSPIC33EP32MC504T-E/TL serves as an intelligent actuator or sensor node controller: it closes servo or stepper control loops with its 60 MIPs DSP engine while its 32KB FLASH hosts the node application and serial communication handling. The 2KB RAM supports modest buffering for packetized industrial buses. The -40C to +125C E-grade range covers drive cabinets and motor-adjacent mounting points where ambient temperatures exceed standard commercial ratings, and surface-mount 6x6 mm VTLA packaging fits compact distributed I/O boards. Using a dsPIC DSC rather than a plain MCU means filtering, FFT-based vibration diagnostics, or adaptive control can run on the same chip that performs the basic control task, eliminating a second DSP component and reducing board area, BOM count, and firmware integration effort for OEM machine builders.
Recommandé
Sensor Signal Processing
The DSP capability of the DSPIC33EP32MC504T-E/TL - hardware MAC, barrel shifter, and bit-reversed addressing - makes it effective for on-node digital filtering and spectral analysis of sensor data: vibration monitoring, acoustic analysis, and precision analog front-end post-processing. The 60 MIPs core sustains FIR/IIR filtering and windowing at sample rates that would saturate a conventional 16-bit MCU, while the integrated ADC provides direct signal capture without an external converter for moderate resolution requirements. The 3.3V supply matches modern MEMS and analog sensor outputs, and the extended temperature rating suits outdoor and engine-bay sensor modules. For designs where only basic filtering is needed, a cheaper PIC16LF suffices; choose this DSC when real-time DSP math and control must coexist in a single certified, automotive-grade part.
Recommandé
Embedded Control in Harsh Thermal Environments
For any embedded system exposed to wide temperature swings - outdoor enclosures, industrial ovens, agricultural equipment, engine compartments - the -40C to +125C E-grade rating of the DSPIC33EP32MC504T-E/TL removes the most common derating constraint. Combined with AEC-Q100 qualification, the device tolerates thermal cycling stress that marginal consumer parts cannot, improving field reliability of long-life products. The 44-pin VTLA (6x6 mm) with exposed pad provides a low-thermal-resistance path to the PCB ground plane, keeping junction temperatures manageable even at sustained 60 MIPs execution. Designers should budget copper area under the exposed pad (multiple thermal vias to inner ground layers) per Microchip layout guidance. Firmware tasks range from simple supervisory control to DSP-based monitoring, with 32KB FLASH adequate for the majority of single-function control programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP32MC504T-E/TL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP32MC504T-I/TL | DSPIC33EP32MC504-I/TL | DSPIC33EP256MC504T-I/TL |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-VTLA (6x6 mm), exposed pad | 44-VTLA (6x6 mm) - identical | 44-VTLA (6x6 mm) - identical | 44-VTLA (6x6 mm) - identical |
| Core Speed | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs |
| FLASH Program Memory | 32KB (10.7K x 24) | 32KB (10.7K x 24) | 32KB (10.7K x 24) | 256KB (85.3K x 24) |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Packaging | Tape & Reel (T suffix) | Tape & Reel | Tube/Tray | Tape & Reel |
Principaux différenciateurs
- Extended temperature range for automotive designs (vs DSPIC33EP32MC504T-I/TL)
- Smallest adequate memory in the pin-compatible TL family (vs DSPIC33EP256MC504T-I/TL)
- Automotive-grade qualification on a catalog part (vs PIC16LF19176-E/PT)
Notes de conception
The 44-VTLA (6x6 mm) package has an exposed pad on the underside that must be soldered to a ground copper area. Use an array of thermal vias (typically 5x5, ~0.3 mm drill, filled or tented) connecting the pad to internal ground planes. Follow Microchip's QFN land-pattern recommendation for the solder mask opening. Skipping the exposed pad connection degrades both thermal performance and ground integrity, and can cause intermittent operation at high core clock rates.
Run the device from a clean 3.3V rail with 100 nF ceramic decoupling capacitors placed within 2 mm of every VDD pin, plus bulk capacitance of at least 4.7 uF per rail. When the core executes 60 MIPS code from FLASH with peripherals active, supply current transients are fast; a shared rail with inductive routing can produce brown-out resets. Enable the internal brown-out detector and configure the power-on reset timer per the dsPIC33EP family reference manual section on power management.
Do not confuse the /TL and /ML package suffixes when placing orders or footprints: both are 44-pin QFN-type packages but with different outlines (6x6 mm VTLA vs the larger ML outline), so they are NOT interchangeable on one PCB. Also confirm the temperature suffix matches the application: the E grade (-40C to +125C) is required for automotive and high-heat designs; substituting an I-grade part saves little money and risks field failures above 85C.
Informations de conformité
AEC-Q100 automotive qualification and extended temperature range confirmed by multiple distributor listings (Microchip USA, Lisleapex, Kynix). RoHS/REACH/lead-free status not stated in the retrieved web data - confirm on the Microchip product page.
