DSPIC33EP32MC504T-E/ML - 60MIPS 16-bit DSC, 32KB Flash | Microchip
MPN: DSPIC33EP32MC504T-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.2 | $42.00 |
| 100 | $3.8 | $380.00 |
| 500 | $3.45 | $1,725.00 |
| 1,000 | $3.2 | $3,200.00 |
DSPIC33EP32MC504T-E/ML Overview
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and deterministic control flow of a microcontroller. Within the power-management hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP: it executes single-cycle MAC and DSP instructions for control-loop math while also handling general I/O, communication, and analog tasks on one chip. This makes the dsPIC33E family a standard choice for embedded motor control and digital power conversion.
Key features include the 16-bit dsPIC33E core with DSP instruction extensions, high-speed PWM peripherals for motor control, advanced analog integration, 3.3V operation, and surface-mount packaging with an exposed pad for thermal and ground performance. The T suffix indicates Tape and Reel delivery for automated assembly, and the E suffix denotes the extended -40C to +125C operating range with AEC-Q100 qualification.
Architecturally, the device uses a modified Harvard pipeline that fetches 24-bit instructions from FLASH organized as 10.7K x 24 words, with dedicated hardware addressing modes (modulo and bit-reversed) that accelerate FIR filters, PID loops, and coordinate transforms common in field-oriented motor control.
Typical applications include precision BLDC and PMSM motor control, digital power supplies (PFC, LLC), automotive auxiliary control modules, and industrial drives where a single-chip solution must close fast current loops at 60 MIPs.
Design consideration: budget PCB copper under the exposed pad for heat spreading and verify that your programmer/debugger (e.g., ICSP tooling) supports the dsPIC33EP family before layout freeze.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-ready resource. Pricing shown is as of 2026-09-25.
Drop-in alternatives for DSPIC33EP32MC504T-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP32MC504T-E/ML (same form factor and footprint) — differing in Package, Qualification, RAM, Operating Temperature, Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP32MC504-E/MV
✅ Drop-In✓ In Stock
$3.35 / Unit
View Datasheet →DSPIC33EP32MC504T-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP32MC504T-H/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP32MC504T-E/TL
✅ Drop-In✓ In Stock
$3.2 / Unit
View Datasheet →DSPIC33EP32MC504T-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33E DSC core |
| Max CPU Speed | 60 MIPs |
| Program Memory (FLASH) | 32 KB (10.7K x 24) |
| RAM | 4 KB (distributor data; some sources list 2 KB - see validation note) |
| Supply Voltage | 3.3 V |
| Package | 44-QFN (8x8 mm) with exposed pad |
| Pin Count | 44 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (extended, E suffix) |
| Qualification | AEC-Q100 qualified (automotive) |
| Series | dsPIC 33EP (dsPIC33EP32MC504) |
| Packaging | Tape and Reel (T suffix) |
| Peripherals | High-Speed PWM, op amps and advanced analog (per family datasheet) |
| Typical Applications | Precision motor control, digital power, automotive |
DSPIC33EP32MC504T-E/ML 44-qfn (8x8 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP32MC504T-E/ML (44-qfn (8x8 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP32MC504T-E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP32MC504T-E/ML is suitable for 6 applications: BLDC / PMSM Motor Control, Digital Power Conversion, Automotive Auxiliary Control Modules, Industrial Drives and Automation, Sensor Signal Processing and Condition Monitoring, Embedded DSP Education and Prototyping.
BLDC / PMSM Motor Control
The DSPIC33EP32MC504T-E/ML is purpose-built for precision motor control: Microchip states the dsPIC33E family enables high-performance motor control systems with its 60 MIPs DSP-enhanced core and high-speed PWM peripherals. Single-cycle MAC instructions execute field-oriented control (FOC) current loops and SVPWM generation without external math coprocessors, while the ADC with simultaneous sampling captures phase currents for closed-loop commutation. Placed as the sole controller driving a three-phase inverter gate-driver stage, it closes torque loops at switching frequencies typical of industrial drives. The extended -40C to +125C grade and AEC-Q100 qualification make it suitable for thermally demanding motor enclosures, and the 44-QFN exposed pad provides a low-inductance ground reference for PWM-heavy layouts.
Recommended
Digital Power Conversion
In digital power supplies - PFC stages, LLC resonant converters, and DC-DC modules - the DSPIC33EP32MC504T-E/ML replaces analog control chips with firmware-defined control loops. Its 60 MIPs core executes PI/PID compensators at the switching frequency, while high-speed PWM peripherals generate phase-shifted or complementary drive signals with fine duty resolution. The integrated advanced analog inputs feed voltage/current feedback directly to the control loop, minimizing external component count. The extended temperature rating suits power stages where ambient heat is unavoidable, and AEC-Q100 qualification supports automotive on-board charger and 48V auxiliary converter designs. Firmware flexibility allows soft-start, burst mode, and protection (over-current, over-voltage) to be tuned without board respins, reducing time to market for power platform derivatives.
Recommended
Automotive Auxiliary Control Modules
With AEC-Q100 qualification and a -40C to +125C operating range, the DSPIC33EP32MC504T-E/ML targets automotive auxiliary functions such as pump/fan control, actuator drivers, lighting control, and sensor conditioning modules that sit outside safety-critical domains but still require automotive-grade components. The 60 MIPs DSC core handles sensor filtering (single-cycle MAC for FIR/IIR), CAN-adjacent communication tasks through its serial peripherals, and PWM actuator drive from a single chip, cutting BOM cost versus MCU-plus-external-logic architectures. The 44-QFN (8x8) exposed-pad package supports the thermal dissipation and low-inductance grounding expected in under-hood module layouts, and Tape and Reel delivery supports high-volume SMT lines used by Tier-1 suppliers.
Recommended
Industrial Drives and Automation
For factory automation nodes - conveyor drives, servo auxiliaries, robotics joint controllers - the DSPIC33EP32MC504T-E/ML provides deterministic control-loop execution at 60 MIPs with integrated DSP math, eliminating the need to pair a general MCU with a separate DSP. High-speed PWM outputs drive IGBT/MOSFET gate stages, ADC channels sample position and current feedback, and serial peripherals link to higher-level PLCs or industrial Ethernet bridges. The 32KB FLASH (10.7K x 24) holds compact control firmware including protection state machines, while 4KB RAM buffers control variables and communication frames. Industrial ambient ratings (-40C to +85C covered by the same die in I grade) and the drop-in family compatibility let one PCB layout serve multiple grades and volume tiers across a product family.
Recommended
Sensor Signal Processing and Condition Monitoring
The DSP-enhanced 16-bit core makes the DSPIC33EP32MC504T-E/ML effective as an embedded signal-processing node for vibration, current-signature, and acoustic condition-monitoring systems. Modulo and bit-reversed addressing plus single-cycle MAC accelerate FFT and FIR computation on 12-bit ADC streams sampled from Microchip's advanced analog inputs, enabling on-sensor feature extraction before data reaches a gateway - reducing network bandwidth and latency for anomaly detection. The 44-QFN's 44 pins provide enough ADC channels and serial interfaces (UART/SPI/I2C) to multiplex multiple sensors into one controller. The extended temperature grade suits monitoring units mounted on motors, pumps, and drives where ambient temperatures regularly exceed standard commercial limits, and AEC-Q100 qualification carries over to rugged industrial deployments.
Recommended
Embedded DSP Education and Prototyping
The dsPIC33EP32MC504 family is widely used in academic and prototyping contexts because it exposes real DSP hardware - single-cycle MAC, modulo addressing, bit-reversed FFT indexing - at microcontroller-level cost and tooling complexity. At 60 MIPs with 32KB FLASH, students and engineers can implement FOC motor control, digital filters, and audio processing on a single 44-QFN chip programmed through standard ICSP tooling within Microchip's MPLAB ecosystem. The Tape and Reel format supports lab-kit volume assembly, while the availability of I, H, and E grade variants in identical packages teaches thermal-derating and qualification trade-offs. The same footprint across the family also lets prototype firmware scale from the 32KB part to 256KB family members without PCB changes.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP32MC504T-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP32MC504-E/MV | DSPIC33EP32MC504T-I/ML | DSPIC33EP32MC504T-H/ML | DSPIC33EP32MC504T-E/TL |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-VTLA (6x6 mm) - smaller body |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPs | 60 MIPs | 60 MIPs | 60 MHz / 60 MIPs | 60 MIPs |
| Program Memory | 32 KB (10.7K x 24) FLASH | 32 KB FLASH | 32 KB FLASH | 32 KB FLASH | 32 KB FLASH |
| Packaging Format | Tape & Reel (T) | Tray | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Drop-in Compatibility | Reference part | Pin-to-pin, same footprint | Pin-to-pin, same footprint | Pin-to-pin, same footprint | Same pinout, different body size - verify land pattern |
Key Differentiators
- Automotive AEC-Q100 extended-grade qualification (vs DSPIC33EP32MC504T-I/ML)
- Tape & Reel delivery for volume SMT (vs DSPIC33EP32MC504-E/MV)
- Balanced 32KB FLASH / 60 MIPs integration (vs DSPIC33EP256MC504T-I/TL)
Design Notes
Estimated: the 44-QFN 8x8 mm package uses an exposed pad that must be soldered to a ground pour for thermal performance. For motor-control or digital-power firmware running the core near 60 MIPs continuously, allocate at least a 4x4 array of thermal vias from the exposed pad to internal ground planes. Since the part is rated to +125C ambient (E grade), verify junction temperature with your actual switching losses; at elevated ambients near +105C, keep internal dissipation low by gating unused peripherals and using idle modes between control-loop iterations.
Decouple all VDD and AVDD pins with 100 nF ceramic capacitors placed within 2 mm of each pin, plus one bulk 4.7 uF to 10 uF capacitor per supply rail. Separate analog ground returns from PWM switching returns, joining them at the exposed pad. Route PWM outputs away from analog feedback traces; the high-speed PWM edges can couple into ADC inputs and corrupt current-sense readings in motor-control layouts. Follow Microchip's dsPIC33E family hardware design guidelines for oscillator and ICSP connector placement.
Confirm the temperature grade before layout sign-off: E (-40C to +125C, AEC-Q100), I (-40C to +85C), and H grade variants share the same footprint, so a wrong-grade substitution will pass DRC but fail field thermal requirements. Also verify programmer/debugger support for the dsPIC33EP family and confirm the RAM size in your toolchain linker script - distributor sources conflict (2 KB per Microchip USA vs 4 KB per Mouser), and memory over-allocation will only surface at link time.
Compliance Information
AEC-Q100 qualification explicitly stated by Microchip USA and GlobalSpec listings ('Automotive, AEC-Q100, dsPIC 33EP'). RoHS/REACH/lead-free status not stated in verified data - confirm via Microchip product page certificates.
