DSPIC33EP512GP504T-E/ML - 16-bit 60 MIPS DSC 512KB Flash | Microchip
Référence : DSPIC33EP512GP504T-E/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.9 | $590,00 |
| 500 | $5.4 | $2 700,00 |
| 1 000 | $4.95 | $4 950,00 |
DSPIC33EP512GP504T-E/ML Présentation
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic control flow of a microcontroller. Within the power-management hierarchy, the dsPIC33EP family sits above general-purpose MCUs and alongside dedicated DSPs, making it the standard choice for closed-loop control systems that require fast math (multiply-accumulate, division, trigonometric) alongside CAN, I2C, SPI, and UART connectivity in a single 3.3V device.
Key features include the 16-bit dsPIC33EP core with DSP engine (single-cycle MAC, 40-bit accumulators), 512KB of self-programmable flash, 4 DMA channels, 5 timers, and rich analog and connectivity peripherals: CANbus, I2C, SPI, UART/USART, IrDA, and LINbus. The E temperature grade (-40C to +125C) and AEC-Q100 qualification make this tape-and-reel variant suitable for automotive and high-reliability industrial builds.
Architecturally, the core runs up to 60 MIPS from an internal PLL-driven FRC or external crystal, with a 3.0V to 3.6V supply and a maximum supply current of approximately 55 mA. Dual-fetch instruction pipeline plus hardware division and DSP instructions allow math-intensive loops (PID, filters, transformations) to execute deterministically without external coprocessors. The ML QFN exposed pad improves thermal performance and ground integrity versus leaded equivalents.
Typical applications include automotive body and powertrain-adjacent control nodes, digital power supplies and PFC stages, sensorless BLDC and PMSM motor control, and industrial CAN-networked sensors and actuators. The CAN module plus DMA makes it a natural fit for 500 kbps vehicle and factory bus nodes.
For design, budget flash erase/write cycles and reserve the configuration words carefully; on the 44-QFN package the exposed pad must be soldered to a solid ground pour for thermal and EMC performance. Verify the exact pin assignment in the manufacturer datasheet before layout, as peripheral remapping applies.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design notes not found in the standard manufacturer product listing.
Alternatives de remplacement direct pour DSPIC33EP512GP504T-E/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512GP504T-E/ML (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Packaging, Program Memory Size, RAM Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512GP504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP512GP504T-H/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256GP504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.68 / unité
Voir la fiche technique →DSPIC33EP128GP504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33EP256MC504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP512MC504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP512GP504T-E/ML Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC33EP |
| Core Speed | 60 MIPs |
| Program Memory Size | 512KB (170K x 24) FLASH |
| RAM Size | 24KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Maximum Supply Current | 55 mA |
| Boîtier | 44-QFN (8x8 mm) Exposed Pad |
| Température de fonctionnement | -40C to +125C (E grade) |
| Qualification | Automotive, AEC-Q100 |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| DMA Channels | 4 |
| Timers | 5 |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Technology | CMOS |
| Boundary Scan | Yes |
Guide de configuration des broches du DSPIC33EP512GP504T-E/ML 44-qfn (8x8 mm) exposed pad
Configuration des broches du DSPIC33EP512GP504T-E/ML (boîtier 44-qfn (8x8 mm) exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP512GP504T-E/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP512GP504T-E/ML convient pour 6 applications: Automotive CAN Network Nodes, Digital Power Supplies and PFC, BLDC and PMSM Motor Control, Industrial Sensors and Actuator Control, IoT Edge Nodes and Smart Devices, Audio and Signal Processing Front Ends.
Automotive CAN Network Nodes
The DSPIC33EP512GP504T-E/ML is purpose-built for automotive body-control and networked sensor nodes: its AEC-Q100 qualification and -40C to +125C E temperature grade meet automotive environmental requirements, while the integrated CAN module with 4 DMA channels sustains 500 kbps bus traffic with minimal CPU overhead. Firmware for gateway, actuator, or diagnostic nodes fits comfortably in the 512KB (170K x 24) flash with room for OTA bootloader banks. The 24KB RAM buffers multiple message objects, and LINbus, UART, and I2C cover local sub-networks and sensor interfaces on the same 3.3V rail.
Recommandé
Digital Power Supplies and PFC
Digital power control demands deterministic, fast control loops - exactly what the 60 MIPS dsPIC33EP core with single-cycle multiply-accumulate and hardware division provides. The DSPIC33EP512GP504T-E/ML executes voltage-mode or average-current-mode loop math at switching frequencies well into the hundreds of kHz, while 512KB flash holds compensator tables, soft-start state machines, and PMBus-style communication stacks over I2C, SPI, or UART. Running from a 3.0V-3.6V rail, the DSC interfaces directly with gate-driver logic and feedback ADCs. The E-grade temperature range supports the elevated ambient conditions inside power supplies.
Recommandé
BLDC and PMSM Motor Control
Sensorless FOC on brushless DC and permanent-magnet synchronous motors requires dense math every PWM period; the dsPIC33EP's 40-bit accumulators and MAC instructions execute Clarke/Park transforms and PI loops at 60 MIPS without floating-point hardware. The DSPIC33EP512GP504T-E/ML's 5 timers generate complementary PWM and rotor-position estimation windows, while its DMA offloads ADC sequencing. For motor-control-centric designs, the same-package DSPIC33EP512MC504-I/ML offers an MC-series peripheral emphasis without PCB changes, and the 512KB flash holds field-weakening tables plus a CAN or UART commissioning interface for drive tuning.
Recommandé
Industrial Sensors and Actuator Control
Factory-floor nodes need robust communication plus local intelligence: the DSPIC33EP512GP504T-E/ML combines CAN, I2C, SPI, and UART/USART in one 44-QFN device, letting a single controller bridge a plant CAN backbone to I2C sensors and SPI DACs. The 512KB flash supports linearization tables, self-diagnostics, and firmware-update bootloaders; the 24KB RAM handles multi-protocol buffers via 4 DMA channels. Boundary-scan support eases production test, and the -40C to +125C grade tolerates enclosure heat near motors and drives, improving system MTBF versus commercial-grade parts.
Recommandé
IoT Edge Nodes and Smart Devices
For smart-building and IIoT edge nodes, the DSPIC33EP512GP504T-E/ML provides the math horsepower to run filtering, FFT-based diagnostics, or simple inference locally before reporting upstream. Its 60 MIPS core and DSP instructions process vibration or power-quality data, while UART/I2C connect to radio modules and sensors; 512KB flash accommodates protocol stacks alongside application logic. The 3.0V-3.6V CMOS supply and configurable power modes allow battery-backed or energy-harvesting designs, and the compact 8x8 mm QFN fits space-constrained sensor housings without compromising integration.
Recommandé
Audio and Signal Processing Front Ends
The dsPIC33EP DSP engine suits real-time audio processing such as active noise control, tone generation, and acoustic diagnostics. The DSPIC33EP512GP504T-E/ML's single-cycle MAC and 40-bit accumulators implement IIR/FIR filters at 60 MIPS, and SPI or I2S-style bit-banged interfaces connect CODECs and ADCs. The 512KB (170K x 24) flash stores long filter coefficient sets and preset tables for configurable products, while UART and CAN allow integration into larger systems. The 44-QFN exposed-pad package provides solid ground reference important for low-noise analog performance in audio paths.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512GP504T-E/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512GP504-I/ML | DSPIC33EP512GP504T-H/ML | DSPIC33EP256GP504-I/ML | DSPIC33EP256MC504-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) Exposed Pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512KB (170K x 24) | 512KB (170K x 24) | 512KB (170K x 24) | 256KB | 256KB |
| RAM | 24KB | 24KB | 49,152 words data RAM (per Microchip USA) | 24KB | 24KB |
| Core Speed | 60 MIPs | 60 MIPs | 60 MHz max clock | 60 MIPs | 60 MIPs |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Connectivity | CAN, I2C, IrDA, LIN, SPI, UART/USART | CAN, I2C, SPI, UART/USART | CAN, I2C, SPI, UART/USART | CAN, I2C, SPI, UART/USART | CAN, I2C, SPI, UART (MC peripherals) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principaux différenciateurs
- Extended automotive temperature grade (vs DSPIC33EP512GP504-I/ML)
- Double the program memory of the 256KB family members (vs DSPIC33EP256GP504-I/ML)
- General-purpose peripheral balance (vs DSPIC33EP512MC504-I/ML)
Notes de conception
The 44-QFN (ML) exposed pad is the device's primary ground and thermal path. Solder it to a contiguous ground pour with an array of thermal vias (typically 4x4, 0.3 mm drill) connecting to internal ground planes - relying on peripheral pins alone will degrade EMC performance and thermal margins, especially at 60 MHz core operation. Use a solder-paste stencil with approximately 50-70% coverage on the pad to prevent voiding and device float during reflow.
Supply the device from a clean 3.0V-3.6V rail; maximum supply current is approximately 55 mA at full-speed 60 MIPS operation, so size the regulator accordingly and add margin for I/O loading. Decouple each VDD pin pair with 100 nF ceramics placed within 2 mm of the pins, plus one bulk 4.7-10 uF capacitor per rail. Estimated: a 12V-to-3.3V buck stage feeding this MCU alone dissipates little, but shared-rail loads must be totaled against the regulator rating.
Two recurring dsPIC33EP pitfalls: (1) configuration words (oscillator source, PLL divider, watchdog, code protection) are burned at programming time - verify them in the project settings before every production build, because wrong PLL settings silently halve the 60 MIPS clock. (2) Peripheral pin select (PPS) remapping must be explicitly locked after assignment; unlocked remaps can be corrupted by runaway code. Always cross-check final pin usage against the manufacturer datasheet for the ML package before PCB release.
Informations de conformité
AEC-Q100 automotive qualification confirmed per datasheets.com and Hotenda listings. RoHS/REACH/lead-free status not stated in the provided data.
