DSPIC33EP512MC502T-E/MM - 16-bit 60MIPS DSC 512KB Flash | Microchip
Référence : DSPIC33EP512MC502T-E/MM ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
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| 500 | $0 | $0,00 |
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DSPIC33EP512MC502T-E/MM Présentation
A digital signal controller combines the computational architecture of a digital signal processor with the peripherals and ease of use of a microcontroller. Within the power-management hierarchy, the DSC sits above a general-purpose MCU: it adds single-cycle DSP multiply-accumulate instructions, a barrel shifter, and dual operand fetch on top of a standard 16-bit MCU pipeline, making it a specialized member of the broader embedded processor family used for control-loop-intensive designs.
Key features include the dsPIC33EP core with DSP engine, dual motor-control PWM (MCPWM) modules supporting complementary and center-aligned outputs, a Quadrature Encoder Interface (QEI) for position feedback, a CAN 2.0B controller for automotive and industrial networks, I2C, SPI, and UART/USART serial interfaces, plus integrated analog with 10-bit/12-bit ADC channels, two op amps, and three comparators that reduce external component count in analog front ends.
Architecturally, the dsPIC33EP executes an enhanced Harvard 16-bit instruction set at 60 MIPS, with DMA channels offloading peripheral data movement to keep the CPU free for control algorithms. The on-chip MCPWM and QEI subsystems close sensorless or sensored feedback loops for brushless DC and permanent-magnet synchronous motor control, per Microchip's dsPIC33E family positioning for precision motor control systems.
Typical applications include BLDC and PMSM motor drives, digital power supplies and power factor correction, industrial automation nodes, and CAN-connected automotive or industrial sensors. The extended-temperature -E variant suits harsh under-hood and factory-floor environments.
Design consideration: the QFN-28 (MM) package requires a VCAP capacitor on the internal regulator output and a solid ground plane; place 0.1 uF decoupling at each VDD pin per Microchip layout guidelines.
This page synthesizes distributor data, drop-in alternatives, pinout, and practical design notes beyond the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP512MC502T-E/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512MC502T-E/MM (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, Qualification, Analog Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512MC502T-I/MM
✅ Remplacement direct✓ En stock
$3.38 / unité
Voir la fiche technique →DSPIC33EP512MC502-H/MM
✅ Remplacement direct✓ En stock
$4.02 / unité
Voir la fiche technique →DSPIC33EP512MC502T-E/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC502T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128MC502T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.4 / unité
Voir la fiche technique →DSPIC33EP512GP502T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.92 / unité
Voir la fiche technique →DSPIC33EP32GP502T-E/MM
✅ Remplacement direct✓ En stock
$2.98 / unité
Voir la fiche technique →DSPIC33EP512MC502T-E/MM Valeurs maximales et caractéristiques électriques
| Core | dsPIC33EP, 16-bit DSC |
| Core Speed | 60 MIPs (up to 70 MHz) |
| Program Memory | 512 KB (170K x 24) FLASH |
| RAM | 24 KB |
| Température de fonctionnement | -40C to +125C (E grade) |
| Boîtier | 28-QFN-S (6 x 6 mm), MM suffix |
| Type de montage | Surface Mount |
| CAN | CAN 2.0B controller |
| Serial Interfaces | I2C, SPI, UART/USART |
| Motor Control PWM | MCPWM with complementary outputs |
| QEI | Quadrature Encoder Interface |
| ADC | 10-bit / 12-bit ADC channels |
| Op Amps | 2 integrated op amps |
| Comparators | 3 comparators |
| DMA | Yes, DMA channels |
| Qualification | AEC-Q100 qualified (dsPIC33EP512MC502 family) |
| Packaging | Tape & Reel (T suffix) |
Configuration des broches de DSPIC33EP512MC502T-E/MM
| Broche 1 | MCLR — Master clear reset input / programming voltage |
| Broche 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference / change notification / port B bit 0 |
| Broche 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference / change notification / port B bit 1 |
| Broche 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select 1 / port B bit 2 |
| Broche 5 | AN3/INDX/CN5/RB3 — Analog input 3 / QEI index / port B bit 3 |
| Broche 6 | VSS — Ground reference |
| Broche 7 | VDD — Positive supply |
| Broche 8 | AN4/RB4 — Analog input 4 / port B bit 4 (multiplexed with peripheral functions per datasheet) |
| Broche 9 | AN5/RB5 — Analog input 5 / port B bit 5 (multiplexed with peripheral functions per datasheet) |
| Broche 10 | VDD — Positive supply |
| Broche 11 | AN6/RB6 — Analog input 6 / port B bit 6 (multiplexed with OC1/INT0 per datasheet) |
| Broche 12 | AN7/RB7 — Analog input 7 / port B bit 7 (multiplexed with OC2/FLT1 per datasheet) |
| Broche 13 | AN8/RB8 — Analog input 8 / port B bit 8 (multiplexed with OC3 per datasheet) |
| Broche 14 | AN9/RB9 — Analog input 9 / port B bit 9 (multiplexed with OC4 per datasheet) |
| Broche 15 | RB10/PGD — Port B bit 10 / in-circuit debug data (multiplexed per datasheet) |
| Broche 16 | RB11/PGC — Port B bit 11 / in-circuit debug clock (multiplexed per datasheet) |
| Broche 17 | AN10/RB12 — Analog input 10 / port B bit 12 (multiplexed per datasheet) |
| Broche 18 | AN11/RB13 — Analog input 11 / port B bit 13 (multiplexed with T1CK/OSCI per datasheet) |
| Broche 19 | AN12/RB14 — Analog input 12 / port B bit 14 (multiplexed with T2CK/OSCO per datasheet) |
| Broche 20 | AN13/RB15 — Analog input 13 / port B bit 15 |
| Broche 21 | VSS — Ground reference |
| Broche 22 | OSC1/CLKI/RA2 — Oscillator input / external clock input / port A bit 2 |
| Broche 23 | OSCO/CLKO/RA3 — Oscillator output / clock output / port A bit 3 |
| Broche 24 | SOSCI/RC13 — Secondary oscillator input / port C bit 13 |
| Broche 25 | SOSCO/T1CK/RC14 — Secondary oscillator output / Timer1 clock / port C bit 14 |
| Broche 26 | VDD — Positive supply |
| Broche 27 | VCAP/VDDCORE — Internal core regulator capacitor connection |
| Broche 28 | VSS — Ground reference |
Applications typiques
DSPIC33EP512MC502T-E/MM convient pour 6 applications: BLDC/PMSM Motor Control, Digital Power Supplies and PFC, Industrial Automation and CAN Nodes, Automotive Sensor and Actuator Modules, Portable and Battery-Powered Instruments, Power Management and Embedded Control Subsystems.
BLDC/PMSM Motor Control
The DSPIC33EP512MC502T-E/MM fits sensored and sensorless motor drives because its dual MCPWM modules generate complementary, center-aligned, dead-time-controlled gate signals while the QEI reads encoder position and the 12-bit ADC samples phase currents. Two on-chip op amps and three comparators condition shunt current signals, reducing external BOM. Running FOC at 60 MIPS with single-cycle MAC instructions keeps the current loop at tens of kHz. Place it between gate drivers and the current-sense front end; the trade-off is that heavy FOC with field weakening consumes significant 512 KB FLASH headroom, which this variant covers comfortably.
Recommandé
Digital Power Supplies and PFC
Digital power conversion exploits the same assets: high-resolution PWM with complementary outputs, fast 10/12-bit ADC triggered from PWM boundaries for cycle-by-cycle current sensing, and comparators for hardware overcurrent protection that acts without CPU latency. The 60 MIPS core executes average-current-mode control or PFC loops with DSP instructions, while DMA moves ADC results off the pipeline. Integrated op amps can build error amplifiers or current shunt conditioning. In a 3.3 V domain with the -40C to +125C E-grade rating, this controller suits telecom rectifiers and industrial PSU control boards where firmware-based control replaces analog control ICs.
Recommandé
Industrial Automation and CAN Nodes
On factory networks, the integrated CAN 2.0B controller with DMA provides a robust field-bus interface without an external CAN controller; only a transceiver is added on CANTX/CANRX. Combined with UART, SPI, and I2C, the DSC bridges sensors, HMI peripherals, and actuators to a CANopen or J1939 backbone. The 512 KB FLASH accommodates protocol stacks, bootloaders, and application logic, while the extended temperature range supports cabinet-less installations. Its QFN-28 footprint suits compact I/O modules; the trade-off versus larger packages is fewer I/O pins, so plan pin multiplexing carefully in dense designs.
Recommandé
Automotive Sensor and Actuator Modules
The dsPIC33EP512MC502 family is AEC-Q100 qualified per Microchip distributor data, and the -E extended temperature grade (-40C to +125C) targets under-hood and body-control environments. CAN connectivity supports in-vehicle networking, the 12-bit ADC reads analog sensor signals, and the MCPWM drives actuators such as throttle, flap, or pump motors. The 28-QFN-S 6 x 6 mm package conserves board area in space-constrained modules. Designers should budget a conservative junction temperature margin and verify the specific qualification level against Microchip's automotive qualification documentation before release.
Recommandé
Portable and Battery-Powered Instruments
Handheld meters, dataloggers, and measurement instruments benefit from the DSC's single-supply 3.3 V operation, integrated op amps and comparators for analog front ends, and DSP capability for signal processing such as RMS computation or filtering on sampled inputs. The compact 28-QFN-S (6 x 6 mm) package enables small PCBs, while 512 KB FLASH hosts rich firmware including menus, logging, and communication. Low-power modes reduce average consumption between measurements; consult the datasheet idle/doze current figures for battery-life budgets. UART or SPI links to wireless modules add connectivity without host processing burden.
Recommandé
Power Management and Embedded Control Subsystems
As a general embedded controller with DSP capability, the DSPIC33EP512MC502T-E/MM supervises power sequencing, fan control, and monitoring tasks in larger systems. Multiple PWM outputs drive cooling fans or small converters, ADC channels track voltages and temperatures, and comparators provide fast fault trips. CAN, I2C, and SPI interfaces report telemetry to a host controller or backplane. The E-grade temperature rating allows use in closed enclosures without forced cooling assumptions. Because the device is flash self-programmable, firmware field updates over CAN or UART keep deployed units serviceable across their industrial lifetime.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512MC502T-E/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512MC502T-I/MM | DSPIC33EP512MC502-H/MM | DSPIC33EP256MC502T-E/MM | DSPIC33EP32GP502T-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6 x 6 mm), MM | 28-QFN-S (6 x 6 mm) - same | 28-QFN-S (6 x 6 mm) - same | 28-QFN-S (6 x 6 mm) - same | 28-QFN-S (6 x 6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / MIPS | dsPIC33EP, 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs | 60 MIPs |
| Program FLASH | 512 KB (170K x 24) | 512 KB (170K x 24) | 512 KB (170K x 24) | 256 KB (85K x 24) | 32 KB |
| Motor Control Peripherals (MCPWM/QEI) | Yes | Yes | Yes | Yes | No (GP variant) |
| CAN 2.0B | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Extended -40C to +125C operation (vs DSPIC33EP512MC502T-I/MM)
- Maximum flash in the 28-pin MC family (vs DSPIC33EP256MC502T-E/MM)
- Dedicated motor-control peripherals (vs DSPIC33EP512GP502T-E/MM)
Notes de conception
The dsPIC33EP core is fed by an internal regulator whose output appears at pin 27 (VCAP/VDDCORE); connect a low-ESR capacitor per the Microchip datasheet's recommended value to this pin - omitting or undersizing it causes erratic resets. Decouple every VDD pin (7, 10, 26) with 0.1 uF ceramics placed within 2 mm of the pin, and keep VDD distribution on a short shared trace. Do not connect an external supply to VDDCORE.
The 28-QFN-S (MM) package has an exposed pad under the die that should be soldered to a grounded copper pad for mechanical integrity and thermal relief, even though a 60 MIPS DSC at 3.3 V dissipates only tens to low hundreds of milliwatts (estimated from typical dsPIC33EP active current figures). Use at least a 4-6 via fence from the exposed pad to the ground plane, and keep the crystal/OSC traces short and guarded by ground for stable oscillator startup.
Shared analog/digital pins default to analog mode after reset; ADC-input pins used as digital I/O must be explicitly cleared in the ANSELx registers or inputs will read 0. When using PGC/PGD (pins 15-16) as general I/O in production, ensure ICSP remains accessible via test points. Finally, confirm flash endurance/write constraints before implementing self-programming bootloaders, and reserve MCLR (pin 1) with an RC and pull-up per Microchip programming requirements.
For motor-control PWM outputs, keep gate-driver traces short and symmetric between complementary pairs to preserve dead-time accuracy; route current-sense feedback to the on-chip op amp inputs away from PWM switching edges. The ADC sampling triggered from PWM boundaries benefits from a quiet analog ground region; partition the ground plane so digital return currents from the CAN and UART transceivers do not cross the analog section.
Informations de conformité
Distributor data (Microchip USA) states the dsPIC33EP512MC502 family is AEC-Q100 qualified. RoHS/REACH/lead-free status for this exact ordering code was not present in retrieved data; verify on Microchip's official product page.
