DSPIC33EP64GS502-E/SO - 16-bit DSC 60MIPS 64KB Flash | Microchip
Référence : DSPIC33EP64GS502-E/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.1 | $5,10 |
| 10 | $4.6 | $46,00 |
| 100 | $4.1 | $410,00 |
| 500 | $3.7 | $1 850,00 |
| 1 000 | $3.3 | $3 300,00 |
DSPIC33EP64GS502-E/SO Présentation
A Digital Signal Controller combines the computational throughput of a DSP with the peripheral integration and deterministic interrupt structure of a microcontroller. In the power-management hierarchy, the DSC sits at the control layer of a switch-mode power supply, replacing analog control loops with firmware-executed compensation while retaining hardware peripherals for time-critical functions. The dsPIC33EP family is Microchip's 16-bit enhanced core generation, and the GS50X sub-family is its digital-power-optimized branch.
Key differentiating features include the interconnected High-Speed PWM module engineered for switching power converters, high-speed 12-bit ADC inputs for voltage and current sensing, an integrated PGA (programmable gain amplifier), analog comparators, and a DAC for reference generation. The E suffix denotes the extended temperature grade, and the device is AEC-Q100 qualified and supports Functional Safety (FuSa) development, per DigiKey and MicrochipUSA product listings.
Architecturally, the device executes the dsPIC33E/PIC24E enhanced 16-bit core at up to 60 MIPS, with a DSP engine (multiply-accumulate, divide assist) that accelerates control-law math such as PID and notch-filter compensation. Program memory can be used unpartitioned or split into two boot partitions for bootloader redundancy. Interconnects tie the comparators and PWM directly into the analog peripherals, enabling cycle-accurate current limiting without CPU intervention - a key requirement for peak-current-mode SMPS.
Typical applications include AC-DC power supplies and interleaved power factor correction (Microchip's 350 W Interleaved PFC reference design targets this family), DC-DC converters, battery chargers, LED drivers, and solar micro-inverters. The extended temperature and AEC-Q100 qualification also allow use in automotive and industrial auxiliaries.
Design consideration: budget the high-speed ADC sample-and-hold and PWM dead-time allocation together, since the interconnect scheme determines effective loop latency; keep analog sense routing away from PWM switch nodes on the 0.3-inch SOIC footprint.
This page synthesizes distributor listings, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet (DS70005127).
Alternatives de remplacement direct pour DSPIC33EP64GS502-E/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GS502-E/SO (même facteur de forme et même empreinte) — différant par Package, Core, ADC Resolution, Analog Peripherals, Application Focus.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP64GS502-I/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP32GS502-E/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.55 / unité
Voir la fiche technique →DSPIC33EP16GS502-E/SO
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.08 / unité
Voir la fiche technique →DSPIC33EP64GP502-E/SO
✅ Remplacement direct✓ En stock
$3.26 / unité
Voir la fiche technique →DSPIC33EP64GS502-E/SO Valeurs maximales et caractéristiques électriques
| Core | dsPIC33EP (16-bit DSC) |
| Maximum CPU Speed | 60 MIPS |
| Program Memory Size | 64 KB (64K x 8) Flash |
| Program Memory Type | Flash |
| Boîtier | 28-SOIC (0.3 in wide body) |
| Plage de température de fonctionnement | -40C to +125C (E grade) |
| Qualification | AEC-Q100, Functional Safety (FuSa) |
| Analog Peripherals | High-Speed ADC, PGA, Comparators, DAC |
| PWM | High-Speed PWM (interconnected) |
| Application Focus | Digital Power, SMPS, Power Conversion |
| Program Memory Partitioning | Unpartitioned or dual-boot partitioned |
| Type de montage | Surface Mount |
| Family | dsPIC 33EP, GS50X (Digital Power) |
Guide de configuration des broches du DSPIC33EP64GS502-E/SO 28-soic (0.3 in wide body)
Configuration des broches du DSPIC33EP64GS502-E/SO (boîtier 28-soic (0.3 in wide body)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP64GS502-E/SO.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP64GS502-E/SO convient pour 6 applications: AC-DC Switch-Mode Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters and Point-of-Load Regulation, Battery Chargers, Digital LED Drivers, Solar Micro-Inverters and Power Conversion.
AC-DC Switch-Mode Power Supplies
The DSPIC33EP64GS502-E/SO is purpose-built for digitally controlled AC-DC SMPS, where its interconnected High-Speed PWM directly couples comparator outputs into cycle-by-cycle current limiting. The high-speed ADC samples output voltage and input current synchronously with the PWM period, allowing firmware to execute PID or higher-order compensation at switching frequencies common in flyback and forward converters. The E-grade -40C to +125C range and AEC-Q100 qualification make it suitable for adapters and industrial supplies operating in hot enclosures. Unlike analog controllers, the digital loop adapts compensation over load range, but designers must budget ADC conversion latency against the PWM period to preserve phase margin in fast loops.
Recommandé
Interleaved Power Factor Correction (PFC)
Microchip's 350 W Interleaved PFC reference design is built on the SMPS dsPIC DSC family that includes the DSPIC33EP64GS502-E/SO. Interleaved PFC requires two PWM channels phase-shifted by 180 degrees with independent current-loop control - the interconnected High-Speed PWM module provides precise phase offsets while dual high-speed ADC channels sample inductor currents of each leg. The on-chip comparators enforce cycle-level overcurrent trips without CPU intervention, protecting the boost switches during transients. The 60 MIPS core executes average-current-mode compensation and input-voltage feedforward in real time. Designers should synchronize ADC sampling to the midpoint of the PWM off-time to measure average inductor current accurately and minimize switching-noise pickup.
Recommandé
DC-DC Converters and Point-of-Load Regulation
In synchronous buck and boost DC-DC converters, the DSPIC33EP64GS502-E/SO offers complementary PWM outputs with programmable dead-time insertion, essential for preventing shoot-through in half-bridge topologies. The high-speed ADC, combined with the integrated PGA, lets a small sense-resistor voltage be amplified on-chip before conversion, reducing external component count on the 28-SOIC footprint. Firmware-based control enables mode switching (voltage-mode, current-mode, burst) at runtime for high light-load efficiency. The extended temperature rating suits telecom and automotive point-of-load environments. Because loop bandwidth is firmware limited, this DSC fits converters operating up to hundreds of kilohertz; for MHz-class converters, dedicated analog controllers remain preferable.
Recommandé
Battery Chargers
Multi-chemistry battery chargers benefit from the DSPIC33EP64GS502-E/SO's combination of accurate analog sensing and flexible PWM: constant-current and constant-voltage phases are implemented in firmware, while the DAC and comparators provide hardware limits for cell protection. The high-speed ADC monitors battery voltage, current and temperature (via NTC on an analog input), and the 60 MIPS core runs charging state machines plus coulomb counting simultaneously. The dual-partition program memory supports field firmware updates to add new charge profiles without a service visit - important for charging stations. The E-grade temperature range covers automotive and outdoor charging enclosures. Designers should use the hardware comparator trip for cell overvoltage so protection does not depend on firmware execution time.
Recommandé
Digital LED Drivers
High-power LED lighting - street lights, industrial luminaires, horticultural fixtures - requires dimming, thermal fold-back and power factor compliance. The DSPIC33EP64GS502-E/SO drives constant-current LED buck stages with its High-Speed PWM while the high-speed ADC monitors LED current and heatsink temperature; firmware dimming curves (0-10 V, DALI-style or PWM input) are simple to implement on the 60 MIPS core. The integrated comparators enable fast short-circuit protection for the LED string. The -40C to +125C E-grade suits sealed outdoor drivers with high internal temperatures, and AEC-Q100 qualification supports automotive lighting. Enclosed luminaires often exceed +85C ambient inside the housing, making the extended-temperature SOIC the correct grade choice.
Recommandé
Solar Micro-Inverters and Power Conversion
Micro-inverters combine MPPT, DC-AC inversion and grid synchronization - a workload matched to the DSPIC33EP64GS502-E/SO's interconnected PWM and dual high-speed ADC channels sampling panel voltage/current and grid voltage simultaneously. The 60 MIPS DSP core with multiply-accumulate support executes MPPT algorithms plus sine-wave modulation in real time. Hardware comparators provide anti-islanding and overcurrent trip thresholds independent of software latency, a grid-safety requirement. The dual-partition Flash enables firmware field updates on deployed units. Because grid-tie designs demand certified safety behavior, designers must verify that critical protection paths use the hardware interconnects rather than firmware-only checks, and validate against local interconnection standards before deployment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GS502-E/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP64GS502-I/SO | DSPIC33EP32GS502-E/SO | DSPIC33EP16GS502-E/SO | DSPIC33EP64GP502-E/SO |
|---|---|---|---|---|---|
| Package | 28-SOIC (0.3 in) | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Program Memory | 64 KB | 64 KB | 32 KB | 16 KB | 64 KB |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Digital Power Peripherals (HS PWM, HS ADC, PGA) | Yes | Yes | Yes | Yes | No (GP family) |
| AEC-Q100 Qualified | Yes | No | Yes (E grade) | Yes (E grade) | Yes (E grade) |
| Dual-Partition Boot Support | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Extended temperature and AEC-Q100 qualification (vs DSPIC33EP64GS502-I/SO)
- Full 64 KB Flash in the extended-temperature package (vs DSPIC33EP32GS502-E/SO)
- Digital-power peripheral set with interconnected PWM (vs DSPIC33EP64GP502-E/SO)
Notes de conception
On the 0.3-inch 28-SOIC footprint, separate the analog ground return of the high-speed ADC/PGA pins from the PWM power ground; use a single-point star connection at the controller. Keep sense traces (ADC inputs) short and away from PWM switch nodes to limit capacitive coupling. Place 0.1 uF ceramic decoupling directly across each VDD/VSS pair plus a 10 uF bulk capacitor. Route crystal/OSC traces short and guard them with ground. The SOIC body dissipates little heat, but the exposed lead-frame helps only with wide copper pour on pin-connected nets.
Do not assume the E-grade and I-grade parts are interchangeable in qualification documentation: the E/SO carries the AEC-Q100 claim, the I/SO does not. Verify VDD range and ADC input voltage limits against the family datasheet before connecting sense dividers - overvoltage on analog inputs through the PGA is a common failure source. When using dual-partition mode, remember the programming tools must be configured for partitioned operation or verification will fail. Finally, the E/2N UQFN variant is NOT pin-compatible with the SOIC despite identical functionality.
Estimated: for a typical SMPS control application drawing tens of milliamps at a low controller VDD, controller dissipation is modest (<100 mW) and thermal design is dominated by external power devices, not the DSC. However, junction temperature headroom at +125C ambient is limited: with theta_JA around 90-100 C/W for a SOIC-28 on a typical 2-layer board (estimate - confirm exact value in the family datasheet), even 50 mW of internal dissipation raises the junction roughly 5 C. Reserve margin in the E-grade application by minimizing simultaneous high-speed peripheral clock activity where possible.
Informations de conformité
AEC-Q100 qualification and Functional Safety (FuSa) support confirmed via DigiKey and MicrochipUSA listings. RoHS/REACH/lead-free certificates not present in provided web data - verify on the Microchip product page.
