DSPIC33FJ128GP708T-I/PT - 16-bit 40 MIPS DSC 128KB | Microchip
Référence : DSPIC33FJ128GP708T-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.68 | $66,80 |
| 100 | $5.94 | $594,00 |
| 500 | $5.35 | $2 675,00 |
| 1 000 | $4.82 | $4 820,00 |
DSPIC33FJ128GP708T-I/PT Présentation
A digital signal controller combines the computational architecture of a microcontroller with the numeric acceleration of a digital signal processor. In the power-management hierarchy, the dsPIC33F sits above general-purpose MCUs (such as the PIC18 family) and alongside dedicated DSPs, offering a single-chip solution for embedded control systems that need both real-time control loops and signal processing. It belongs to the broader category of 16-bit microcontrollers and digital signal controllers.
Key features include the high-performance dsPIC33F core running at 40 MIPS from an internal oscillator, 3V to 3.6V single-supply operation, and rich connectivity: CAN bus, I2C, SPI, UART/USART, IrDA, and LIN bus. Peripherals such as DMA, brown-out detect/reset, power-on reset, and I2S audio support reduce external component count in mixed-signal designs.
Architecturally, the dsPIC33F core pairs a 16-bit modified Harvard pipeline with DSP multiply-accumulate instructions and dual operand fetch, enabling efficient FIR/IIR filtering and FFT computation while retaining deterministic, interrupt-driven control behavior expected of a general-purpose MCU. Flash program memory is self-programmable for field updates, and the ICSP (In-Circuit Serial Programming) interface allows debugging via tools such as the MPLAB SNAP with only two I/O pins plus reset.
Typical applications include digital power supplies and motor control (using the high-speed PWM capability of the family), industrial automation nodes over CAN, and sensor signal processing where DSP filtering plus UART/I2C communication is required in one chip. Its industrial temperature grade (I, -40C to +85C) suits harsh environments.
Design consideration: operate from a clean 3.3V rail within the 3V to 3.6V range and decouple all VDD/VDDCORE pins per the Microchip datasheet layout guidance; the internal FRC oscillator reduces BOM cost but an external crystal is recommended for CAN timing accuracy.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-26.
Alternatives de remplacement direct pour DSPIC33FJ128GP708T-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ128GP708T-I/PT (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Programming Interface, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ128GP708-I/PT
✅ Remplacement direct✓ En stock
$5.64 / unité
Voir la fiche technique →DSPIC33FJ128GP310T-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.46 / unité
Voir la fiche technique →PIC24FJ128GA008T-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ128GP708T-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | dsPIC33F 16-bit DSC |
| Maximum CPU Speed | 40 MIPS |
| Program Memory Size | 128KB (128K x 8) Flash |
| RAM Size | 16KB (16K x 8) |
| Supply Voltage Range | 3 V to 3.6 V |
| Operating Supply Voltage (max) | 3.6 V |
| Number of I/O | 69 |
| Nombre de broches | 80 |
| Boîtier | 80-TQFP (12 x 12 mm body, PT suffix) |
| Style de montage | Surface Mount |
| Interface Types | CAN, I2C, IrDA, LIN, SPI, UART/USART |
| Oscillator Type | Internal |
| Peripherals | AC'97, Brown-out Detect/Reset, DMA, I2S, POR |
| Program Memory Type | Flash |
| Largeur du bus de données | 16 bit |
| Plage de température de fonctionnement | -40C to +85C (I grade) |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
Guide de configuration des broches du DSPIC33FJ128GP708T-I/PT 80-tqfp (12 x 12 mm body, pt suffix)
Configuration des broches du DSPIC33FJ128GP708T-I/PT (boîtier 80-tqfp (12 x 12 mm body, pt suffix)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33FJ128GP708T-I/PT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33FJ128GP708T-I/PT convient pour 6 applications: Industrial CAN Networking Nodes, Digital Power Supplies, Motor Control Drives, Audio Signal Processing, Sensor Acquisition and IoT Gateways, Embedded Development and Education.
Industrial CAN Networking Nodes
The DSPIC33FJ128GP708T-I/PT fits industrial automation nodes because its integrated CAN 2.0B controller eliminates an external CAN peripheral, while the 40 MIPS dsPIC33F core handles protocol stacks and local control loops deterministically. In a typical node, the device reads sensors via SPI or I2C, executes a PID loop at 10-40 MIPS, and transmits status over CAN through a 3.3V-compatible transceiver. The -40C to +85C industrial grade and brown-out/power-on reset peripherals support unattended factory-floor operation. The internal oscillator reduces BOM cost, though an external crystal is recommended for strict CAN bit-timing budgets.
Recommandé
Digital Power Supplies
Digital power conversion benefits from the dsPIC33FJ family's high-speed PWM capability and DSP math: the 40 MIPS core executes compensator calculations fast enough for switching frequencies in the hundreds of kilohertz. The DSPIC33FJ128GP708T-I/PT samples voltage/current feedback through its ADC, runs IIR compensation filters using hardware multiply-accumulate, and drives PWM outputs with cycle-by-cycle current limiting support. Its 128KB Flash accommodates state machines, fault logging, and firmware update loaders simultaneously. Because the core operates from 3.0V to 3.6V, gate drivers with 3.3V logic inputs interface directly without level shifting.
Recommandé
Motor Control Drives
Brushed, brushless DC, and permanent-magnet motor drives use the DSPIC33FJ128GP708T-I/PT for field-oriented control: the 16-bit core with DSP instructions computes Clarke/Park transforms and PI current loops within single PWM periods. Sibling parts such as the dsPIC33FJ128MC708A are motor-control-specific, but the GP708 shares the same core, PWM infrastructure, and 80-TQFP footprint, making it suitable for general drives that also need CAN or UART connectivity to a host. The DMA controller offloads ADC result transfers so the CPU budget stays available for control math at 40 MIPS, and the industrial temperature grade suits enclosed drives.
Recommandé
Audio Signal Processing
Audio applications leverage the DSPIC33FJ128GP708T-I/PT's I2S and AC'97 peripheral support: the device can interface directly to audio codecs and perform DSP filtering, mixing, or effects with its hardware multiply-accumulate unit at 40 MIPS. The 128KB Flash holds code plus filter coefficient tables, while 16KB SRAM buffers audio blocks for block-based processing. Compared with a general-purpose MCU, the DSC executes FIR filtering an order of magnitude faster, sustaining real-time throughput for sample rates of 48 kHz and beyond. Typical products include professional microphones, active speakers, and automotive audio front ends using the UART/IrDA ports for control.
Recommandé
Sensor Acquisition and IoT Gateways
The DSPIC33FJ128GP708T-I/PT serves as the main controller in sensor acquisition systems: 69 I/O lines, multiple SPI/I2C/UART ports, and DMA allow simultaneous polling of many sensors while the DSP core performs filtering and feature extraction locally. Edge processing on the 40 MIPS core reduces the bandwidth sent to a gateway over CAN or UART, which is valuable in battery-adjacent or wired industrial IoT installations. The 3.0V to 3.6V supply matches common 3.3V sensor rails directly. The internal oscillator permits crystal-less designs for non-timing-critical sensor nodes, cutting bill-of-materials cost in volume production.
Recommandé
Embedded Development and Education
Because the Explorer 16/32 Development Board supports dsPIC devices through Plug-In Modules (PIMs), the DSPIC33FJ128GP708T-I/PT is well suited for prototyping and teaching 16-bit embedded systems. Students and engineers use MPLAB X with MPLAB SNAP for in-circuit debugging and ICSP flashing via just two I/O pins plus MCLR, exactly as in production hardware. The 80-TQFP package exposes 69 I/O for lab exercises on CAN, SPI, I2C, and UART simultaneously. Tape-and-reel packaging (T suffix) supports pick-and-place assembly in teaching labs that populate their own boards at volume.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ128GP708T-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ128GP708-I/PT | DSPIC33FJ128GP310T-I/PT | PIC24FJ128GA008T-I/PT |
|---|---|---|---|---|
| Package | 80-TQFP (12x12) | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same | 80-TQFP (12x12) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC | PIC24F 16-bit MCU (no DSP core) |
| Flash Program Memory | 128KB (128K x 8) | 128KB | 128KB | 128KB |
| Packaging Format | Tape & Reel (T suffix) | Tray (no T suffix) | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Hardware DSP acceleration in an MCU-class part (vs PIC24FJ128GA008T-I/PT)
- Integrated audio interface set (vs DSPIC33FJ128GP310T-I/PT)
- Complete connectivity integration (vs DSPIC33FJ128GP708-I/PT)
Notes de conception
Supply the DSPIC33FJ128GP708T-I/PT from a regulated 3.3V rail held within the datasheet 3.0V to 3.6V window. Decouple every VDD/VSS pair with 100nF ceramics placed within 2-3 mm of the pins, plus one bulk 10uF capacitor per board region. On 80-pin TQFP devices, omitting a single VDD decoupler can cause core-glitch resets during simultaneous output switching. Estimated: with ~50 mA typical core current, a 200 mV transient on a poorly decoupled rail is enough to trip brown-out reset.
Reserve the ICSP programming pins (PGC/PGD) and MCLR on a standard header during PCB layout - Microchip documents that MPLAB SNAP implements in-circuit debugging and ICSP using two device I/O pins plus reset. Route PGC/PGD short and away from noisy PWM/CAN traces. Keep the crystal (if used for CAN timing) within 10 mm of the OSC pins with ground guard traces, since the internal FRC oscillator is convenient but marginal for tight CAN bit-timing budgets at long bus lengths.
Do not confuse the T and non-T order codes when releasing the BOM: DSPIC33FJ128GP708T-I/PT is tape-and-reel for pick-and-place, while DSPIC33FJ128GP708-I/PT is tray-packed - same die, different delivery. Also, all dsPIC33F I/O is 3.3V logic; connecting 5V-tolerant assumptions from older PIC16/PIC18 5V designs will overstress pins. Verify the peripheral set of any same-footprint substitute (e.g., MC vs GP variants) against your schematic before qualifying the swap.
Estimated: at 40 MIPS with moderate I/O loading, core plus I/O dissipation is typically well under 0.5W, and the 80-TQFP 12 x 12 mm theta_JA of roughly 40-60 C/W on a standard 4-layer PCB keeps junction temperature rise below ~30C at 85C ambient worst case. No heatsink is required; ensure ground pour under the package to spread heat and provide the return path for high-speed DSP switching activity.
Informations de conformité
Verified distributor data did not include explicit compliance certificate lines for this exact suffix. Microchip active production parts are generally RoHS/lead-free compliant; confirm on the official Microchip product page before shipping to regulated markets.
