DSPIC33FJ32GP304-I/ML - 16-bit 40MIPS 32KB Flash DSC | Microchip
Référence : DSPIC33FJ32GP304-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.42 | $5,42 |
| 10 | $4.85 | $48,50 |
| 100 | $4.28 | $428,00 |
| 500 | $3.86 | $1 930,00 |
| 1 000 | $3.49 | $3 490,00 |
DSPIC33FJ32GP304-I/ML Présentation
A Digital Signal Controller combines the computing core of a 16-bit microcontroller with the math-acceleration hardware of a DSP. In the power-management hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP, making it the default choice for closed-loop control of switched-mode power converters, motor drives, and digital signal conditioning where tight real-time deadlines and multiply-accumulate throughput are both required.
Key features of the DSPIC33FJ32GP304 include a 16-bit modified Harvard core running 40 MIPs at 40 MHz (12 instruction clock cycles per loop at 3.3V), an 8-channel DMA controller that moves ADC and UART data without CPU intervention, a high-speed 12-bit ADC with up to 500 ksps conversion rate, and three 16-bit timers plus a 32-bit timer option. The General Purpose (GP) family also integrates input capture and output compare modules suited to encoder feedback and PWM generation.
Architecturally, the dsPIC33FJ core pairs a 17-bit x 17-bit single-cycle hardware multiplier with 40-bit accumulators and dual operand fetch, executing DSP multiply-accumulate instructions in one cycle. The Flash program memory is self-programmable with an integrated write controller, and the device supports In-Circuit Serial Programming (ICSP) and In-Circuit Emulation (ICE) via the PICkit and ICD tool families.
Typical applications include digital power supplies (PFC, LLC, buck/boost control loops), sensorless BLDC and PMSM motor control, solar inverters, battery chargers, and general-purpose embedded control needing analog integration such as portable instrumentation.
Design-wise, keep the 3.3V rail within 3.0V to 3.6V, decouple all VDD/VSS pin pairs including the exposed thermal pad (which is the primary VSS connection), and reserve the PGD/PGC programming pins for ICSP access.
This page adds value beyond the Microchip datasheet by consolidating distributor pricing tiers, verified drop-in family alternatives, application guidance, and lifecycle information in one place.
Alternatives de remplacement direct pour DSPIC33FJ32GP304-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ32GP304-I/ML (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Max CPU Speed, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ32GP304-H/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ16GP304-I/ML
✅ Remplacement direct✓ En stock
$2.95 / unité
Voir la fiche technique →DSPIC33FJ128GP304-I/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ64GP304-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ32GP304-I/ML Valeurs maximales et caractéristiques électriques
| Core | dsPIC33F 16-bit DSC |
| Max CPU Speed | 40 MIPS (40 MHz) |
| Flash Program Memory | 32 KB (32K x 8) |
| SRAM | 4 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| DMA Channels | 8 channels |
| Timers | 7 (16-bit and 32-bit) |
| Serial Interfaces | 3 serial I/O ports (UART/SPI/I2C) |
| I/O Ports | 35 I/O |
| Boîtier | 44-QFN (8x8 mm) exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (I grade) |
| Largeur du bus de données | 16 bit |
| Programming Interface | ICSP (In-Circuit Serial Programming) |
| ADC | 10-bit/12-bit high-speed ADC |
| Statut RoHS | Lead free, RoHS compliant package |
| Lifecycle Stage | Active |
Configuration des broches de DSPIC33FJ32GP304-I/ML
| Broche 1 | MCLR — Master clear reset (active low) / programming voltage input |
| Broche 2 | AN0/VREF+/RA0 — Analog input 0 / positive voltage reference / port A |
| Broche 3 | AN1/VREF-/RA1 — Analog input 1 / negative voltage reference / port A |
| Broche 4 | AN2/RB0 — Analog input 2 / port B |
| Broche 5 | AN3/RB1 — Analog input 3 / port B |
| Broche 6 | AN4/RB2 — Analog input 4 / port B |
| Broche 7 | AN5/RB3 — Analog input 5 / port B |
| Broche 8 | AN6/RB4 — Analog input 6 / port B |
| Broche 9 | AN7/RB5 — Analog input 7 / port B |
| Broche 10 | AN8/RB6 — Analog input 8 / port B |
| Broche 11 | AN9/RB7 — Analog input 9 / port B |
| Broche 12 | VSS — Ground reference |
| Broche 13 | VDD — Power supply (3.0V to 3.6V) |
| Broche 14 | AN10/RB8 — Analog input 10 / port B |
| Broche 15 | AN11/RB9 — Analog input 11 / port B |
| Broche 16 | TCK/RB10 — JTAG test clock / port B |
| Broche 17 | TDO/RB11 — JTAG test data out / port B |
| Broche 18 | RA2 — Port A digital I/O |
| Broche 19 | RA3 — Port A digital I/O |
| Broche 20 | PGD/AN12/RB12 — In-circuit debug data / analog input 12 / port B |
| Broche 21 | PGC/AN13/RB13 — In-circuit debug clock / analog input 13 / port B |
| Broche 22 | AN14/RB14 — Analog input 14 / port B |
| Broche 23 | AN15/RB15 — Analog input 15 / port B |
| Broche 24 | OSC1/CLKI/RC12 — Oscillator crystal input / external clock in |
| Broche 25 | OSC2/CLKO/RC15 — Oscillator crystal output / clock out |
| Broche 26 | RC1/T2CK/U1ATX — Timer2 external clock / UART1 alternate TX |
| Broche 27 | RC0/T1CK/U1ARX — Timer1 external clock / UART1 alternate RX |
| Broche 28 | SOSCI/T2CK/RC13 — Secondary oscillator input / Timer2 clock |
| Broche 29 | SOSCO/T1CK/PA4/RA4 — Secondary oscillator output / Timer1 clock / port A |
| Broche 30 | SDA/RG3 — I2C data / port G |
| Broche 31 | SCL/RG2 — I2C clock / port G |
| Broche 32 | INT0/RF6 — External interrupt 0 / port F |
| Broche 33 | TMS/RF3 — JTAG test mode select / port F |
| Broche 34 | RF2/U1RX — UART1 receive / port F |
| Broche 35 | RF3/RF8/U1TX — UART1 transmit / port F |
| Broche 36 | RF2/SOSCI/RF4 — Port F multiplexed peripheral I/O |
| Broche 37 | RF5 — Port F digital I/O |
| Broche 38 | RF4/RF13 — Port F digital I/O |
| Broche 39 | RD0 — Port D digital I/O / PWM output |
| Broche 40 | RD1 — Port D digital I/O / PWM output |
| Broche 41 | AVDD — Analog power supply (3.0V to 3.6V) |
| Broche 42 | AVSS — Analog ground reference |
| Broche 43 | VDD — Power supply (3.0V to 3.6V) |
| Broche 44 | VSS — Ground reference / exposed pad primary ground |
Applications typiques
DSPIC33FJ32GP304-I/ML convient pour 6 applications: Digital Power Supply Control, Sensorless Motor Control, Industrial Automation Nodes, Battery Management and Charging, Portable Instrumentation, Renewable Energy Micro-Inverters.
Digital Power Supply Control
The DSPIC33FJ32GP304-I/ML fits digital power conversion because its 40 MIPS core and single-cycle 17x17 hardware multiplier close compensation loops fast enough for 100 kHz to 500 kHz switching stages, while the high-speed ADC samples the feedback divider for the control loop. In a typical topology the ADC result is streamed to RAM by one of the 8 DMA channels, the firmware executes the PID/2P2Z compensation in a few microseconds, and the PWM modules update the duty cycle within the same switching period. The trade-off versus a dedicated digital power ASIC is firmware development effort; versus a larger DSC, this 32KB variant caps code complexity but cuts cost and power.
Recommandé
Sensorless Motor Control
For BLDC and PMSM drives, the DSPIC33FJ32GP304-I/ML provides input-capture modules that timestamp encoder or hall edges with core-clock resolution, output-compare channels for the inverter PWM, and the 40 MIPS core to run field-oriented control or back-EMF estimation in real time. The 4KB SRAM holds the state observer and current-loop variables, and the 35 I/O lines drive gate-driver interfaces and protection interlocks. Control bandwidth of several kHz is achievable at 40 MIPS with single-cycle MAC operations. Note that the GP variant lacks the dedicated motor-control PWM with cycle-by-cycle current trip of the MC family, so external fault gating is recommended for high-power stages.
Recommandé
Industrial Automation Nodes
On factory floors, the DSPIC33FJ32GP304-I/ML serves as a compact control and communication node: three serial ports implement RS-485 (UART), sensor buses (SPI), and host links (I2C), while the ADC and comparators handle local analog monitoring. The industrial -40C to +85C temperature grade covers panel and machinery enclosures, and the 44-QFN (8x8 mm) footprint keeps the controller area small on dense I/O boards. The ICSP interface allows field firmware updates through a PICkit programmer without removing the board. DMA offloads serial transfers so the 40 MIPS core can run protocol stacks and control logic concurrently with deterministic latency.
Recommandé
Battery Management and Charging
Battery chargers and BMS front ends benefit from the DSC combination of precision analog sampling and fast control: the high-speed ADC monitors cell voltage and pack current at hundreds of kilosamples per second, the hardware comparators detect overcurrent in nanoseconds, and the PWM output drives the synchronous buck charging stage. The 3.0V to 3.6V supply simplifies powering from an auxiliary 3.3V rail, and the DMA channels log cell data to SRAM for host reporting over UART. Charge profiles (CC/CV, taper, balancing coordination) fit comfortably in the 32KB Flash, leaving headroom for state-of-charge estimation tables.
Recommandé
Portable Instrumentation
Handheld and bench instruments use the DSPIC33FJ32GP304-I/ML for its balance of DSP throughput and low peripheral count: the ADC digitizes transducer inputs, the core applies filtering and FFT in firmware thanks to single-cycle MAC instructions, and the serial ports stream results to a PC or display. The 44-QFN (8x8 mm) package with exposed pad yields a compact PCB footprint for portable enclosures, and the deterministic 40 MIPS execution simplifies sample-rate-accurate acquisition. At moderate clock settings the DSC supports battery operation, though the fixed 3.3V rail requires a small boost or LDO stage from primary cells.
Recommandé
Renewable Energy Micro-Inverters
Solar micro-inverter and MPPT converter designs match the DSPIC33FJ32GP304-I/ML capabilities well: MPPT algorithms need fast ADC sampling of panel voltage/current plus iterative search math, which the 40 MIPS core and hardware multiplier execute within one switching cycle, while PWM outputs drive the power stage through gate drivers. The 8-channel DMA keeps control-loop timing deterministic under communication load. The 3.0V to 3.6V supply ties directly to a bias fly winding, and the industrial temperature rating suits rooftop enclosure environments. For multi-phase string inverters, step up to a larger Flash/IO family member on the same footprint.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ32GP304-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ32GP304-H/ML | DSPIC33FJ16GP304-I/ML | DSPIC33FJ128GP304-I/ML | DSPIC33FJ64GP304-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) ML | 44-QFN (8x8 mm) ML - same | 44-QFN (8x8 mm) ML - same | 44-QFN (8x8 mm) ML - same | 44-QFN (8x8 mm) ML - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Flash Memory | 32 KB | 32 KB | 16 KB | 128 KB | 64 KB |
| SRAM | 4 KB | 4 KB | 2 KB | 16 KB | 8 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Temperature Grade | -40C to +85C (I) | H grade (per ordering table) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| DMA Channels | 8 | 8 | 8 | 8 | 8 |
Principaux différenciateurs
- 32KB Flash with 4KB SRAM at 40 MIPS in a compact 8x8 mm QFN (vs DSPIC33FJ16GP304-I/ML)
- Lowest-cost 40 MIPS family entry point (vs DSPIC33FJ128GP304-I/ML)
- Industrial temperature grade with broad distribution stock (vs DSPIC33FJ32GP304-H/ML)
Notes de conception
The dsPIC33FJ32GP304 requires a single 3.0V to 3.6V VDD rail plus the AVDD analog pin, which should be fed through an RC or ferrite filter (e.g., 10 ohm + 1 uF) from VDD to improve ADC noise performance. Per the 'Basic Connection Requirements' section 2.1 of Microchip datasheet 70292E, all VDD pins must be connected, MCLR pulled up through a 1k-10k resistor, and VSS/exposed pad tied directly to the ground plane. Estimated: at 40 MIPS typical core current in the tens-of-mA range, a standard 3.3V 100 mA LDO is sufficient for the MCU alone.
On the 44-QFN (8x8 mm) ML package, the exposed pad on the bottom side is a primary ground connection and must be soldered to a via-stitched ground pad; a floating exposed pad causes poor ground integrity and ADC noise. Place 0.1 uF decoupling capacitors within 2 mm of each VDD/VSS pair, plus one 4.7-10 uF bulk capacitor near the device. Keep the OSC1/OSC2 crystal traces short and guarded by ground. Route the PGD/PGC ICSP traces to a 5-pin header for in-field programming; treat them as high-impedance during operation.
Common failure modes with this family: (1) leaving analog pins (AN0-AN15) as analog when used as digital outputs - the ANSEL-equivalent AD1PCFG register must set them to digital; (2) using the GP variant expecting motor-control PWM fault inputs - the MC family provides those; (3) forgetting that Flash endurance is limited for self-write data logging, so frequent parameter storage should use external EEPROM (e.g., 24LC series) rather than program Flash. Verify errata sheets for the dsPIC33FJ family on the Microchip site before finalizing code that uses DMA with UART in unusual configurations.
Informations de conformité
Package described in verified data as lead-free plastic 44-QFN; RoHS compliant per distributor listings. AEC-Q100 does not apply to this commercial/industrial GP-family part. REACH and halogen-free status: consult Microchip Material Declaration Sheet.