DSPIC33EV64GM104T-I/ML - 16-bit 5V 70 MIPS DSC | Microchip
Référence : DSPIC33EV64GM104T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.51 | $4,51 |
| 10 | $4.2 | $42,00 |
| 100 | $3.88 | $388,00 |
| 500 | $3.6 | $1 800,00 |
| 1 000 | $3.3 | $3 300,00 |
DSPIC33EV64GM104T-I/ML Présentation
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the math capability of a digital signal processor (DSP). Within the power-management hierarchy, a DSC such as this sits above a basic MCU: it executes deterministic control loops (PLL, motor control, power conversion) while providing general-purpose peripherals like CAN, UART and SPI. The dsPIC33EV family belongs to Microchip's 16-bit dsPIC33E architecture and is specifically designed for harsh-environment operation.
Key features include a 5V-tolerant operating range of 4.5V to 5.5V, which removes the need for a separate 3.3V rail in industrial and automotive 12V/24V systems; up to six PWM outputs for motor control; SENT protocol support for automotive sensor interfaces; and on-chip operational amplifiers that reduce external analog component count. The 64KB ECC Flash provides single-bit error correction for functional-safety oriented designs, and the device is listed by Microchip as Functional Safety (FuSa) capable.
Architecturally, the dsPIC33EV core is a modified Harvard 16-bit CMOS engine with DSP multiply-accumulate instructions, four DMA channels and seven timers, enabling deterministic real-time execution. Speed derating applies with temperature: DC to 70 MIPS at 0C to +85C, 60 MIPS at -40C to +125C, and 40 MIPS at up to +150C for the E-grade variants. The -I grade used here covers -40C to +125C.
Typical applications include automotive touch and control units, industrial motor drives and inverters, and appliance control boards where 5V noise immunity and CAN connectivity are required.
Design tip: at 70 MIPS the core runs from an internal PLL fed by a 7.37 MHz FRC oscillator, so verify flash wait-state and ECC settings in the configuration words when migrating speed grades.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC33EV64GM104T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EV64GM104T-I/ML (même facteur de forme et même empreinte) — différant par Package, Packaging, Operating Temperature, CAN, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EV32GM104T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.95 / unité
Voir la fiche technique →DSPIC33EV64GM104T-H/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EV128GM104T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.51 / unité
Voir la fiche technique →DSPIC33EV256GM104T-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV64GM104-I/ML
✅ Remplacement direct✓ En stock
$3.11 / unité
Voir la fiche technique →DSPIC33EV64GM104T-I/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33E DSC (modified Harvard) |
| Max MIPS | 70 MIPS |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Flash Memory | 64 KB (22K x 24) with ECC |
| SRAM | 8 KB |
| Boîtier | 44-QFN (8x8 mm) exposed pad |
| Température de fonctionnement | -40C to +125C (I grade) |
| PWM Outputs | Up to 6 |
| CAN | Yes (ECAN) |
| SENT Interface | Yes |
| On-chip Op Amps | Yes |
| DMA Channels | 4 |
| Timers | 7 |
| Process Technology | CMOS |
| Functional Safety Support | FuSa (Functional Safety) capable |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Target Applications | Automotive, industrial, appliances (harsh environments) |
Guide de configuration des broches du DSPIC33EV64GM104T-I/ML 44-qfn (8x8 mm) exposed pad
Configuration des broches du DSPIC33EV64GM104T-I/ML (boîtier 44-qfn (8x8 mm) exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EV64GM104T-I/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EV64GM104T-I/ML convient pour 6 applications: Automotive Control Units, Industrial Motor Drives and Inverters, Power Conversion and Digital Power Supplies, Appliance Control Boards, Automotive Sensor Signal Conditioning, Industrial Automation and CAN Networking.
Automotive Control Units
The DSPIC33EV64GM104T-I/ML fits automotive sensor and control units because it combines a 5V-noise-immune core with SENT protocol support and ECAN networking on a single die. Microchip explicitly positions the dsPIC33EV GM family for automotive touch and control units operating in harsh environments with noise and vibration. The 64KB ECC Flash corrects single-bit memory errors for functional-safety oriented designs, and the -40C to +125C I-grade rating covers under-hood adjacent zones. In a typical node, the SENT module reads digital sensors while the ECAN interface reports to the vehicle bus, with the four DMA channels offloading message handling to keep the 60 MIPS loop deterministic.
Recommandé
Industrial Motor Drives and Inverters
This controller suits motor drive applications through up to six PWM outputs, DSP multiply-accumulate instructions for field-oriented control (FOC), and on-chip op amps that amplify shunt-current signals without external amplifier ICs. The 5V supply provides wide noise margins in electrically noisy inverter cabinets, and the 70 MIPS core executes current-loop control at multi-kilohertz rates with deterministic latency. ECC Flash protects the control firmware against bit upsets from switching transients. Designers should use the seven timers for complementary PWM dead-time generation and ADC trigger synchronization, and exploit the four DMA channels to stream ADC current samples directly to RAM, freeing CPU cycles for the speed loop and CAN communications.
Recommandé
Power Conversion and Digital Power Supplies
Digital power supplies benefit from this DSC's combination of high-resolution PWM, fast ADC and DSP math in a 5V device. The dsPIC33EV core implements voltage-mode or average-current-mode control loops at switching frequencies of tens to hundreds of kilohertz, while the ECC-protected 64KB Flash safely stores compensation coefficients and fault logs. The on-chip op amps condition current-shunt signals, reducing BOM cost versus an external amplifier. Because the part runs directly from a 5V auxiliary rail common in switch-mode power supplies, no additional LDO is needed. The ECAN module enables digital power supplies in telecom rectifiers to report telemetry on a CAN bus, and the -40C to +125C rating covers outdoor power infrastructure.
Recommandé
Appliance Control Boards
Home and commercial appliances demand low-cost controllers with strong EMI immunity, motor-control peripherals and robust I/O - exactly the profile Microchip cites for the dsPIC33EV family (appliances, industrial and automotive harsh environments). Running the core at 5V gives the DSPIC33EV64GM104T-I/ML superior noise immunity on appliance PCBs near relays, triacs and switched motors, compared with 3.3V MCUs. The six PWM outputs drive BLDC compressor or fan motors, the op amps condition NTC or shunt feedback, and 64KB Flash holds UI state machines and fault diagnostics. The 44-QFN 8x8 package keeps board area compact while the exposed pad aids heat dissipation from the 70 MIPS core.
Recommandé
Automotive Sensor Signal Conditioning
The SENT interface and on-chip op amps make this DSC a natural fit for automotive sensor acquisition nodes. SENT (Single Edge Nibble Transmission) is the standard point-to-point protocol connecting sensors to ECUs, and hardware support removes software timing burden from the core. The internal op amps amplify resistive-bridge or shunt signals before the ADC, and the DSP MAC instructions implement digital filtering and linearization of thermocouple, pressure or position data. The 5V supply directly powers legacy 5V sensor bridges without level shifting. With -40C to +125C operation, ECC Flash for measurement integrity, and CAN for ECU connectivity, one 44-QFN device replaces an analog front-end plus MCU combination.
Recommandé
Industrial Automation and CAN Networking
In factory automation nodes, the ECAN module of the DSPIC33EV64GM104T-I/ML links I/O and actuator boards onto industrial CAN networks, while the 70 MIPS core handles local sequencing, protocol processing and closed-loop control. The 5V I/O directly interfaces with industrial sensors, PLC signals and optocouplers without level translators, improving robustness on long cable runs. Seven timers generate precise gating and measurement intervals, and four DMA channels service UART, SPI and CAN traffic with minimal CPU load. The FuSa capability and ECC Flash support safety-relevant I/O modules, and the -40C to +125C package rating tolerates unventilated control cabinets mounted next to drives and power electronics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EV64GM104T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EV32GM104T-I/ML | DSPIC33EV64GM104T-H/ML | DSPIC33EV128GM104T-I/ML | DSPIC33EV256GM104T-I/ML | DSPIC33EV64GM104-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) exposed pad | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB (22K x 24) ECC | 32 KB ECC | 64 KB ECC | 128 KB ECC | 256 KB ECC | 64 KB ECC |
| RAM | 8 KB | 4 KB | 8 KB | 16 KB | 32 KB | 8 KB |
| Max MIPS | 70 MIPS (0C to +85C) | 70 MIPS | 70 MIPS (40 MIPS to +150C) | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +125C (I grade) | -40C to +125C | -40C to +150C | -40C to +125C | -40C to +125C | -40C to +125C |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Peripherals (CAN/SENT/PWM/OpAmps) | ECAN, SENT, 6x PWM, op amps, 4 DMA, 7 timers | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
Principaux différenciateurs
- Largest flash in the drop-in footprint at lowest cost point (vs DSPIC33EV32GM104T-I/ML)
- Full-speed industrial temperature operation (vs DSPIC33EV64GM104T-H/ML)
- Cost-efficient code headroom vs top-of-family (vs DSPIC33EV256GM104T-I/ML)
Notes de conception
The dsPIC33EV core requires a regulated 4.5V-5.5V supply. Provide separate VDD/VSS pairs per datasheet grouping with 0.1uF ceramic decoupling at each pair plus one bulk 10uF capacitor near the 44-QFN. On boards with noisy motors or inverters, add a ferrite bead between the 5V rail and VDD to suppress conducted EMI. Note the speed-temperature derating: design the clock configuration for 60 MIPS if the full -40C to +125C I-grade range is used, reserving 70 MIPS for the 0C to +85C window per the family datasheet operating conditions.
The 8x8 mm 44-QFN exposed pad is the primary thermal and ground path. Solder the exposed pad to a ground pour with an array of thermal vias (typically 3x3 or 4x4) to keep junction temperature low at 70 MIPS operation and to provide a low-inductance ground reference for the CAN and PWM outputs. Keep the ICSP programming pins (PGD/PGC) and MCLR routed to a 5-pin header even in production designs to permit in-circuit reprogramming and diagnostics without desoldering the QFN.
Do not substitute the /MR 6x6 mm QFN variant onto a /ML 8x8 mm land pattern - the footprints are mechanically incompatible. Verify configuration words (oscillator source, ECC settings, watchdog) when migrating code between flash-size family members such as the 32KB and 64KB GM104 parts, since memory bounds and config addresses differ. Finally, when using SENT and ECAN simultaneously, check the pin-mapping (RPx remappable pins) in the datasheet I/O table to avoid peripheral pin conflicts during firmware porting.
Informations de conformité
RoHS/lead-free status inferred from current-production Microchip QFN parts; formal environmental documents should be downloaded from Microchip's product page. AEC-Q100 qualification is not explicitly stated in the provided data for this MPN - verify with Microchip for automotive-grade requirements.