DSPIC33FJ64GP202-E/SP - 16-bit DSC 64KB Flash 40MIPS | Microchip
Référence : DSPIC33FJ64GP202-E/SP ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.59 | $5,59 |
| 10 | $5.31 | $53,10 |
| 100 | $5.03 | $503,00 |
| 500 | $4.76 | $2 380,00 |
| 1 000 | $4.48 | $4 480,00 |
DSPIC33FJ64GP202-E/SP Présentation
A Digital Signal Controller combines the computational engine of a Digital Signal Processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power management hierarchy of embedded processing, the dsPIC33F family sits alongside PIC24 16-bit MCUs, sharing the same core architecture while adding a dedicated hardware DSP engine with a barrel shifter, 40-bit accumulator, and single-cycle MAC instructions for digital filter algorithms and high-speed precision digital control loops.
Key features of this part include the 40 MIPS (nanoWatt XLP-class low-power) CMOS core, DMA controller for data movement without CPU intervention, boundary-scan capability for board-level test, and multiple low-power modes supporting the nanoWatt technology platform. The device operates from a 3.0 V to 3.6 V single supply and provides 21 general-purpose I/O on its 28-pin footprint.
Technically, the dsPIC33FJ64GP202 belongs to the dsPIC33FJ64GPX02/X04 family documented in the Microchip 16-bit DSC family datasheet (a 436-page reference covering devices up to 128 KB Flash and 16 KB SRAM with advanced analog). Its Flash is self-programmable, and seamless migration paths exist to PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages.
Typical applications include motor control, digital power conversion, sensor signal processing, and general-purpose embedded control where DSP-grade math throughput is required without an external DSP. The extended temperature E-grade variant suits automotive and industrial environments.
Design consideration: as a 3.3 V-only device, level-shifting is required for 5 V peripherals; always connect MCLR, VDD/VSS pairs, and use the family datasheet Section 2.1 Basic Connection Requirements before first power-up.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ64GP202-E/SP — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ64GP202-E/SP (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Core Architecture, Operating Temperature, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ64GP202-I/SP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33FJ32MC202-E/SP
✅ Remplacement direct✓ En stock
$3.6 / unité
Voir la fiche technique →DSPIC33FJ32MC202-I/SP
✅ Remplacement direct✓ En stock
$3.25 / unité
Voir la fiche technique →DSPIC33FJ32GP202-E/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ128GP202-E/SP
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ64GP202-E/SP Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33F RISC with DSP engine |
| Max Clock Frequency | 40 MHz |
| Performance | 40 MIPS |
| Program Memory | 64 KB (64K x 8) Flash |
| SRAM | 16 KB |
| DMA Channels | Yes (DMA controller) |
| Tension d'alimentation | 3.0 V to 3.6 V (3.3 V nominal) |
| I/O Ports | 21 I/O |
| Temperature Range | -40C to +125C (E, extended/automotive) |
| Qualification | AEC-Q100 qualified |
| Boîtier | 28-pin SPDIP (SP) |
| Type de montage | Through-Hole |
| Packaging | Tube |
| Low Power Technology | nanoWatt (XLP-class low-power modes) |
| Boundary Scan | Yes |
| Lifecycle Stage | Active |
Guide de configuration des broches du DSPIC33FJ64GP202-E/SP 28-pin spdip (sp)
Configuration des broches du DSPIC33FJ64GP202-E/SP (boîtier 28-pin spdip (sp)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33FJ64GP202-E/SP.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33FJ64GP202-E/SP convient pour 6 applications: Digital Motor Control, Digital Power Conversion, Automotive Electronic Modules, Sensor Signal Processing, Industrial Automation & Control, Audio and Speech Processing.
Digital Motor Control
The 40 MIPS DSP engine with single-cycle MAC and 40-bit accumulator enables field-oriented control (FOC) and sensorless BLDC/PMSM algorithms at PWM frequencies of 20 kHz or more. The DMA controller moves ADC results to RAM without CPU intervention, keeping loop jitter minimal. The 28-pin SPDIP through-hole package simplifies prototyping of drive boards and evaluation fixtures, and the E-grade -40C to +125C rating suits enclosures mounted near motors where ambient temperatures rise. Pin-compatible MC-family variants (e.g., DSPIC33FJ32MC202-E/SP) offer motor-control-specific peripheral emphasis if the 64 KB Flash budget is not required.
Recommandé
Digital Power Conversion
High-speed precision digital control loops - the core design target of the dsPIC33F family per Microchip - make this DSC well suited to digital SMPS, PFC stages, and battery chargers. The 40 MHz/40 MIPS core executes compensator math with deterministic latency, while the hardware DSP engine accelerates filter-based control. The 3.0 V to 3.6 V single-supply operation and nanoWatt low-power modes support standby requirements. The AEC-Q100 E-grade qualification covers automotive onboard-charger and DC-DC module qualification flows, and the 28-pin SPDIP footprint eases revision of power-supply prototyping boards before mass production migration.
Recommandé
Automotive Electronic Modules
With AEC-Q100 qualification and a -40C to +125C operating range, the DSPIC33FJ64GP202-E/SP targets automotive body electronics, sensor conditioning, and actuator control modules. The 64 KB self-programmable Flash supports field firmware updates, boundary-scan capability aids production test, and the 21 I/O pins interface switches, lamps, and LIN/UART communication peripherals. The 28-pin SPDIP package is convenient for low-volume automotive retrofit and motorsport applications where through-hole reliability and hand-reworkability matter. For temperature-benign zones, the identical -I/SP industrial grade reduces cost without PCB changes.
Recommandé
Sensor Signal Processing
Digital filter algorithms - a stated design goal of the dsPIC33F family - run efficiently on the DSP engine's single-cycle MAC and barrel shifter, enabling FIR/IIR filtering of ADC-captured sensor data in real time. Applications include vibration monitoring, weigh-scale front ends, ultrasonic processing, and infrared analysis. The 16 KB SRAM buffers sample blocks for FFT or windowing operations driven via DMA. The 3.3 V supply matches modern analog front ends, and the SPDIP through-hole package supports lab-grade signal-chain prototyping on perfboard and socketed test fixtures before SMD production migration.
Recommandé
Industrial Automation & Control
In factory automation, the 40 MIPS core handles PID loops, protocol stacks, and HMI scanning concurrently, while DMA offloads serial data movement. The 21 I/O map to optocoupler inputs, relay drivers, and encoder inputs, and the extended -40C to +125C rating tolerates cabinet and rooftop installations. The 64 KB Flash accommodates Modbus or custom RTU stacks plus control firmware with headroom for OTA-style updates via self-programming. Through-hole mounting on SPDIP improves serviceability in control-card retrofits where technicians replace socketed ICs in the field rather than swapping entire SMD boards.
Recommandé
Audio and Speech Processing
The GP (General Purpose) family's audio-capable peripherals and 40 MIPS DSP engine support speech compression, DTMF generation/detection, and simple audio effect processing. Block-based processing benefits from the 16 KB SRAM and DMA-driven ADC streaming, while the hardware MAC accelerates codec arithmetic. The 3.3 V operation interfaces cleanly with audio ADCs and amplifiers in the signal chain. Designers should budget the 64 KB Flash carefully - speech codecs and tables can consume significant program memory - and the pin-compatible dsPIC33FJ128GP202 (128 KB Flash) provides a no-PCB-change upgrade path when code outgrows the device.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ64GP202-E/SP — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ64GP202-I/SP | DSPIC33FJ32MC202-E/SP | DSPIC33FJ32GP202-E/SP | DSPIC33FJ128GP202-E/SP |
|---|---|---|---|---|---|
| Package | 28-SPDIP | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same | 28-SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 64 KB | 64 KB | 32 KB | 32 KB | 128 KB |
| Performance | 40 MIPS @ 40 MHz | 40 MIPS @ 40 MHz | 40 MIPS @ 40 MHz | 40 MIPS @ 40 MHz | 40 MIPS @ 40 MHz |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Peripheral Family | GP (General Purpose) | GP (General Purpose) | MC (Motor Control) | GP (General Purpose) | GP (General Purpose) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principaux différenciateurs
- Extended automotive temperature grade (vs DSPIC33FJ64GP202-I/SP)
- Double the Flash of the 32 KB pin-compatible siblings (vs DSPIC33FJ32GP202-E/SP)
- GP-family peripheral emphasis with DSP engine (vs DSPIC33FJ32MC202-E/SP)
- Trade-off: through-hole SPDIP vs modern SMD density (vs DSPIC33FJ32GP304-I/ML)
Notes de conception
The device operates from a single 3.0 V to 3.6 V rail. Follow the family datasheet Section 2.1 'Basic Connection Requirements': connect all VDD pins to the supply and all VSS pins to ground, place a 0.1 uF ceramic capacitor at each VDD/VSS pair as close to the pins as possible, and add a 4.7 uF to 10 uF bulk capacitor near the regulator. I/O is not 5 V tolerant - use level shifters or series resistors when interfacing legacy 5 V logic or RS-232 transceivers. Estimated: at 40 MHz typical core current is in the tens of mA range; verify exact figures in the electrical characteristics chapter of the datasheet.
MCLR must be pulled up (typically 10 kOhm) to VDD and never driven directly; it doubles as the programming/high-voltage ICSP entry pin. The OSC1/OSC2 pins support crystal, ceramic resonator, or external clock via the FRC/PLL configuration bits - misconfigured oscillator settings can brick accessibility, so enable clock switching or FRC fallback in firmware before switching to a crystal-only configuration. Configuration bits live in Flash, not fuses, so a bad image can disable debug access; use the PGD/PGC ICSP pins reserved in your PCB design for recovery.
Because the SPDIP package is through-hole, keep the crystal loop short on the solder side and ground the crystal case. Route analog supply separately from digital loads if using the on-chip ADC, and follow Microchip's 16-bit DSC analog layout guidance: isolate VREF lines, use a star ground at the device, and filter the analog supply with an RC (e.g., 10 Ohm + 1 uF). The nanoWatt low-power modes require clean, quiet rails - excessive ripple on VDD during Sleep can increase wake-up latency and reset behavior.
At 40 MHz operation, keep clock traces short and avoid running them parallel to communication lines for more than a few centimeters. DMA-driven peripherals can create bursty current draw; adding local decoupling (0.1 uF + 1 uF) near the device reduces ground bounce on the through-hole package's longer leads. Estimated: SPDIP lead inductance is roughly an order of magnitude higher than QFN packages, so switching-edge ringing is more pronounced - series termination (22-33 Ohm) on fast output lines driving cables is a low-cost mitigation.
Informations de conformité
AEC-Q100 automotive qualification confirmed by distributor part description ('64kb flash 3.3v automotive aec-q100'). Lead-free noted in packaging descriptions; detailed RoHS/REACH certificates should be pulled from the Microchip product page for the exact date code.
