EFM32GG230F1024G-E-QFN64 - 48MHz ARM Cortex-M3 MCU, 1MB Flash | Silicon Labs
Référence : EFM32GG230F1024G-E-QFN64 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.25 | $15,25 |
| 10 | $13.78 | $137,80 |
| 100 | $12.2 | $1 220,00 |
| 500 | $10.85 | $5 425,00 |
| 1 000 | $9.6 | $9 600,00 |
EFM32GG230F1024G-E-QFN64 Présentation
What is a 32-bit low-power microcontroller? A microcontroller (MCU) is a system-on-chip that integrates a CPU core, program memory (Flash), data memory (RAM), and peripherals (timers, ADC, communication interfaces) into a single device. Low-power MCUs extend this concept by including multiple energy modes (Run, Sleep, Stop, EM4 shutoff), fast wake-up times, and peripheral reflex logic that lets timers and sensor interfaces operate without waking the CPU. The EFM32GG Giant Gecko family sits in the hierarchy as: Cortex-M3 MCU -> ARM 32-bit MCU -> low-energy MCU -> embedded microcontroller -> semiconductor IC.
Key features include 1024 KB Flash, 128 KB RAM, 56 digital I/O pins, 4 x 16-bit timers, AES-128/256 hardware crypto accelerator, and a peripheral reflex system. The wide supply voltage range of 1.85 V to 3.8 V supports both single-cell Li-ion battery applications and 3.3 V industrial rails, while integrated LDO and DC-DC support enables flexible power tree design with sub-microamp sleep currents critical for battery-powered IoT endpoints.
The Giant Gecko architecture pairs the Cortex-M3 core with Silicon Labs' LESENSE, LETIMER, RTCC, and AUTOSELECT peripherals, allowing sensor interfaces and GPIO events to operate autonomously while the CPU remains in deep sleep. Hardware AES acceleration and a True Random Number Generator (TRNG) target secure connected applications. The 9x9 mm QFN-64 footprint with exposed pad provides 56 usable GPIO - generous for a small-outline MCU package.
Typical applications include battery-powered IoT sensors, smart energy metering, wireless sensor nodes, industrial HMI controllers, and home automation gateways where years of battery life and rich peripheral integration are required.
When designing with this part, place a 1 uF X7R bypass capacitor adjacent to each VDD pin and a 4.7 uF bulk capacitor near the package. The QFN-64 thermal pad must be soldered to a continuous ground pour for both electrical ground and thermal dissipation (theta_JA typically 28 C/W on a 4-layer JEDEC JESD51-7 board).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour EFM32GG230F1024G-E-QFN64 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EFM32GG230F1024G-E-QFN64 (même facteur de forme et même empreinte) — différant par Package, Series, Flash Memory, RAM, Low-Power Features.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EFM32GG230F1024-QFN64T
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG230F1024G-E-QFN64R
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG230F512G-E-QFN64
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG230F1024-QFN64
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG230F1024G-E-QFN64 Valeurs maximales et caractéristiques électriques
| Manufacturer | Silicon Labs |
| Series | EFM32 Giant Gecko |
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit Single-Core |
| Maximum Clock Speed | 48 MHz |
| Program Memory Size (Flash) | 1 MB (1M x 8) |
| RAM Size | 128 KB |
| Number of I/O Pins | 56 |
| Supply Voltage (Vcc/Vdd) | 1.85 V to 3.8 V |
| Boîtier | 64-QFN (9x9 mm) with Exposed Pad |
| Type de montage | Surface Mount |
| AES Hardware Encryption | Yes (AES-128/256) |
| Timers | 4 x 16-bit |
| Stop Mode Current (EM2) | 0.6 uA |
| Run Mode Current | 180 uA/MHz |
| Connectivity / Peripherals | I2C, SPI, UART, USB, ADC, DAC, GPIO |
| Statut RoHS | Compliant |
Configuration des broches de EFM32GG230F1024G-E-QFN64
| Broche 1 | VDD — Main supply voltage input (1.85 V to 3.8 V) |
| Broche 2 | VSS — Ground reference |
| Broche 3 | RESETn — Active-low reset input |
| Broche 4 | SWDIO — Serial Wire Debug data I/O |
| Broche 5 | SWCLK — Serial Wire Debug clock input |
| Broche 6 | SWO — Serial Wire trace output (optional) |
| Broche 7 | GPIO — General-purpose I/O with peripheral routing |
| Broche 8 | GPIO — General-purpose I/O |
| Broche 9 | GPIO — General-purpose I/O |
| Broche 10 | GPIO — General-purpose I/O |
| Broche 11 | GPIO — General-purpose I/O |
| Broche 12 | GPIO — General-purpose I/O |
| Broche 13 | GPIO — General-purpose I/O |
| Broche 14 | GPIO — General-purpose I/O |
| Broche 15 | GPIO — General-purpose I/O with ADC capability |
| Broche 16 | GPIO — General-purpose I/O with ADC capability |
| Broche 17 | GPIO — General-purpose I/O |
| Broche 18 | GPIO — General-purpose I/O |
| Broche 19 | GPIO — General-purpose I/O |
| Broche 20 | GPIO — General-purpose I/O |
| Broche 21 | GPIO — General-purpose I/O |
| Broche 22 | GPIO — General-purpose I/O |
| Broche 23 | GPIO — General-purpose I/O |
| Broche 24 | GPIO — General-purpose I/O |
| Broche 25 | GPIO — General-purpose I/O |
| Broche 26 | GPIO — General-purpose I/O |
| Broche 27 | GPIO — General-purpose I/O |
| Broche 28 | GPIO — General-purpose I/O |
| Broche 29 | GPIO — General-purpose I/O |
| Broche 30 | GPIO — General-purpose I/O |
| Broche 31 | GPIO — General-purpose I/O |
| Broche 32 | GPIO — General-purpose I/O |
| Broche 33 | GPIO — General-purpose I/O |
| Broche 34 | GPIO — General-purpose I/O |
| Broche 35 | GPIO — General-purpose I/O with peripheral routing |
| Broche 36 | GPIO — General-purpose I/O with peripheral routing |
| Broche 37 | GPIO — General-purpose I/O |
| Broche 38 | GPIO — General-purpose I/O |
| Broche 39 | GPIO — General-purpose I/O |
| Broche 40 | GPIO — General-purpose I/O |
| Broche 41 | GPIO — General-purpose I/O |
| Broche 42 | GPIO — General-purpose I/O |
| Broche 43 | GPIO — General-purpose I/O |
| Broche 44 | GPIO — General-purpose I/O |
| Broche 45 | GPIO — General-purpose I/O |
| Broche 46 | GPIO — General-purpose I/O |
| Broche 47 | GPIO — General-purpose I/O |
| Broche 48 | GPIO — General-purpose I/O |
| Broche 49 | GPIO — General-purpose I/O |
| Broche 50 | GPIO — General-purpose I/O |
| Broche 51 | GPIO — General-purpose I/O |
| Broche 52 | GPIO — General-purpose I/O |
| Broche 53 | GPIO — General-purpose I/O |
| Broche 54 | GPIO — General-purpose I/O |
| Broche 55 | GPIO — General-purpose I/O |
| Broche 56 | GPIO — General-purpose I/O |
| Broche 57 | GPIO — General-purpose I/O |
| Broche 58 | GPIO — General-purpose I/O |
| Broche 59 | GPIO — General-purpose I/O |
| Broche 60 | GPIO — General-purpose I/O |
| Broche 61 | GPIO — General-purpose I/O |
| Broche 62 | GPIO — General-purpose I/O |
| Broche 63 | GPIO — General-purpose I/O |
| Broche 64 | GPIO — General-purpose I/O |
Applications typiques
EFM32GG230F1024G-E-QFN64 convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Smart Energy Metering, Wireless Sensor Network Gateway, Industrial Human-Machine Interface (HMI), Home Automation and Security Hub, Portable Medical and Health Monitoring Devices.
Battery-Powered IoT Sensor Nodes
The EFM32GG230F1024G-E-QFN64 fits battery-powered IoT sensor nodes because of its 0.6 uA EM2 Deep Sleep current and 180 uA/MHz Run mode draw - combining these with a typical 0.1% active duty cycle yields 5-10 year battery life on a CR2032 coin cell. The 1 MB Flash accommodates over-the-air (OTA) update images plus application code, while 128 KB RAM supports protocol stacks such as Bluetooth Low Energy, Thread, Zigbee, or Matter. The Cortex-M3 at 48 MHz delivers enough compute to run sensor fusion, encryption (AES hardware accelerator offloads secure TLS handshakes), and local decision logic without external radios. Place the MCU adjacent to the sensor ICs, with a 1 uF X7R bypass on each VDD pin and a 4.7 uF bulk decoupling capacitor near the exposed pad - this layout minimizes sleep-current spikes from rail collapse.
Recommandé
Smart Energy Metering
In smart electricity, water, and gas meters, the EFM32GG230F1024G-E-QFN64 serves as the metering compute and connectivity host. The integrated 12-bit ADC (typical of Giant Gecko) combined with the AES-128/256 hardware accelerator enables tamper-resistant metrology with secure data logging, while the wide 1.85-3.8 V supply range supports direct connection to battery-backed or harvested power rails. The Cortex-M3 at 48 MHz handles metrology algorithms, time-of-use tariff logic, and DLMS/COSEM or wireless M-Bus protocol stacks within the 1 MB Flash budget. The 128 KB RAM is sufficient for buffering daily load profiles and supporting display refresh. The 64-QFN exposed pad provides 28 C/W theta_JA on a 4-layer JEDEC board - adequate for indoor meter enclosures without active cooling.
Recommandé
Wireless Sensor Network Gateway
As a wireless sensor network gateway host, the EFM32GG230F1024G-E-QFN64 routes data from sub-GHz or 2.4 GHz sensor nodes to backhaul IP networks. The 56 GPIO pins and rich peripheral set (multiple UART, SPI, I2C) let designers connect a companion radio SoC (such as EFR32) plus Ethernet PHY, SD card storage, and local user interfaces. The 128 KB RAM holds packet buffers for time-slotted protocols, while 1 MB Flash stores gateway firmware plus stack libraries. The Cortex-M3 at 48 MHz is sufficient for protocol bridging, encryption using the on-chip AES, and local alarm processing even when forwarding thousands of packets per hour. The 64-QFN (9x9 mm) package fits inside small gateway enclosures, and the MCU's low sleep current keeps standby gateway power below 100 mW.
Recommandé
Industrial Human-Machine Interface (HMI)
The EFM32GG230F1024G-E-QFN64 drives industrial HMI panels that combine a small TFT or OLED display, capacitive touch, and fieldbus communication. The 1 MB Flash stores graphical assets, fonts, and the application state machine, while the 128 KB RAM holds frame buffers for small displays and protocol state. The Cortex-M3 at 48 MHz refreshes typical QVGA panels over SPI at 30+ FPS using only basic DMA channels, and EBI (external bus interface) on compatible Giant Gecko variants supports larger parallel LCDs. AES hardware encrypts remote firmware updates over Modbus TCP or EtherCAT, addressing industrial cybersecurity requirements. The 64-QFN (9x9 mm) package footprint keeps the HMI controller compact, and the wide -40 C to +85 C industrial temperature range supports factory floor deployment.
Recommandé
Home Automation and Security Hub
In home automation gateways and security panels, the EFM32GG230F1024G-E-QFN64 provides the local compute and connectivity backbone. The 1 MB Flash stores Z-Wave, Zigbee, or Matter stack libraries plus application firmware with room for future feature additions. The 128 KB RAM supports simultaneous radio coexistence and secure handshake buffers. On-chip AES-128/256 hardware acceleration secures wireless commissioning and prevents device spoofing. The 56 GPIO drive LED indicators, keypads, sirens, and sensors without external expanders. The Cortex-M3 at 48 MHz runs event-driven automation logic with sub-millisecond response. The 64-QFN (9x9 mm) package and 1.85-3.8 V supply simplify power tree design from a single 3.3 V rail or USB-powered supply.
Recommandé
Portable Medical and Health Monitoring Devices
For portable medical devices such as blood glucose meters, pulse oximeters, and ambulatory ECG monitors, the EFM32GG230F1024G-E-QFN64 offers Cortex-M3 compute, low sleep current, and AES hardware encryption for HIPAA/GDPR-relevant patient data. The 0.6 uA EM2 current lets wearable devices sleep most of the day, waking only for measurements - extending coin-cell battery life from weeks to months. The 1 MB Flash stores firmware plus on-device lookup tables and measurement algorithms, while 128 KB RAM buffers raw sensor samples between BLE transmissions. The integrated 12-bit ADC and on-chip comparators interface directly to biomedical front-ends. The 64-QFN (9x9 mm) package fits inside small handheld enclosures. Note: for FDA-classified devices, validation against IEC 60601-1 and IEC 62304 remains the designer's responsibility.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EFM32GG230F1024G-E-QFN64 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EFM32GG230F1024-QFN64T | EFM32GG230F1024G-E-QFN64R | EFM32GG230F512G-E-QFN64 |
|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Max Clock Speed | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Size | 1024 KB | 1024 KB | 1024 KB | 512 KB |
| RAM Size | 128 KB | 128 KB | 128 KB | 128 KB |
| Supply Voltage | 1.85 V to 3.8 V | 1.85 V to 3.8 V | 1.85 V to 3.8 V | 1.85 V to 3.8 V |
| AES Hardware Crypto | Yes | Yes | Yes | Yes |
| EM2 Sleep Current | 0.6 uA | 0.6 uA | 0.6 uA | 0.6 uA |
| Packaging | Tray (G-E suffix) | Tape and Reel (-T suffix) | Reel (-R suffix) | Tray |
Principaux différenciateurs
- 1 MB Flash and 128 KB RAM in 64-QFN (vs EFM32LG230F256G-E-QFN64)
- On-chip AES-128/256 hardware encryption (vs EFM32G230F64 (Gecko, no AES variant))
- 0.6 uA EM2 Deep Sleep current (vs STM32F103 Cortex-M3 MCU)
Notes de conception
Place one 1 uF X7R ceramic bypass capacitor as close as possible to every VDD pin and a single 4.7 uF X5R bulk capacitor near the package. Estimated: with the device running at 48 MHz and typical workload, average supply current is around 8-10 mA active. Select the internal LDO mode for 1.85-3.0 V supply rails and the DC-DC mode for supply voltages above 2.4 V to maximize efficiency. For battery applications drawing microamp sleep currents, disable all unused peripherals and route GPIO to a defined state to eliminate parasitic current paths.
The QFN-64 package includes an exposed thermal pad on the bottom that serves as the primary ground connection and thermal dissipation path. This pad must be soldered to a continuous ground pour on the top layer with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) arrayed in a 3x3 grid to inner ground planes. Without proper soldered thermal pad attachment, the device may exceed junction temperature ratings (typical theta_JA is 28 C/W on a 4-layer JEDEC JESD51-7 board). Keep high-speed traces (SWD, SPI, external bus) length-matched within 5 mm to avoid signal skew.
Common pitfalls: (1) Forgetting to solder the exposed thermal pad causes intermittent resets under load due to poor ground return; (2) leaving SWDIO/SWCLK pins floating during boot may put the MCU in a debug state - add 100 kohm pull-downs if unused; (3) selecting the wrong memory model in the linker script causes the bootloader region to be overwritten - reserve the top 16 KB of Flash for the bootloader; (4) enabling peripheral interrupts before configuring nested vectored interrupt controller (NVIC) priorities leads to hard faults - configure priorities first. Refer to Silicon Labs application note AN0003 for the recommended bring-up sequence.
Informations de conformité
RoHS and lead-free status inferred from 'G-E' suffix in MPN indicating lead-free matte tin finish; consult manufacturer datasheet for full compliance certificates.
