EFM32GG230F1024G-E-QFN64 - 48MHz ARM Cortex-M3 MCU, 1MB Flash | Silicon Labs
N.º da peça: EFM32GG230F1024G-E-QFN64 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $15.25 | $15,25 |
| 10 | $13.78 | $137,80 |
| 100 | $12.2 | $1.220,00 |
| 500 | $10.85 | $5.425,00 |
| 1.000 | $9.6 | $9.600,00 |
EFM32GG230F1024G-E-QFN64 Visão geral
What is a 32-bit low-power microcontroller? A microcontroller (MCU) is a system-on-chip that integrates a CPU core, program memory (Flash), data memory (RAM), and peripherals (timers, ADC, communication interfaces) into a single device. Low-power MCUs extend this concept by including multiple energy modes (Run, Sleep, Stop, EM4 shutoff), fast wake-up times, and peripheral reflex logic that lets timers and sensor interfaces operate without waking the CPU. The EFM32GG Giant Gecko family sits in the hierarchy as: Cortex-M3 MCU -> ARM 32-bit MCU -> low-energy MCU -> embedded microcontroller -> semiconductor IC.
Key features include 1024 KB Flash, 128 KB RAM, 56 digital I/O pins, 4 x 16-bit timers, AES-128/256 hardware crypto accelerator, and a peripheral reflex system. The wide supply voltage range of 1.85 V to 3.8 V supports both single-cell Li-ion battery applications and 3.3 V industrial rails, while integrated LDO and DC-DC support enables flexible power tree design with sub-microamp sleep currents critical for battery-powered IoT endpoints.
The Giant Gecko architecture pairs the Cortex-M3 core with Silicon Labs' LESENSE, LETIMER, RTCC, and AUTOSELECT peripherals, allowing sensor interfaces and GPIO events to operate autonomously while the CPU remains in deep sleep. Hardware AES acceleration and a True Random Number Generator (TRNG) target secure connected applications. The 9x9 mm QFN-64 footprint with exposed pad provides 56 usable GPIO - generous for a small-outline MCU package.
Typical applications include battery-powered IoT sensors, smart energy metering, wireless sensor nodes, industrial HMI controllers, and home automation gateways where years of battery life and rich peripheral integration are required.
When designing with this part, place a 1 uF X7R bypass capacitor adjacent to each VDD pin and a 4.7 uF bulk capacitor near the package. The QFN-64 thermal pad must be soldered to a continuous ground pour for both electrical ground and thermal dissipation (theta_JA typically 28 C/W on a 4-layer JEDEC JESD51-7 board).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para EFM32GG230F1024G-E-QFN64 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EFM32GG230F1024G-E-QFN64 (mesmo formato e footprint) — diferindo em Package, Series, Flash Memory, RAM, Low-Power Features.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EFM32GG230F1024-QFN64T
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EFM32GG230F1024G-E-QFN64R
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EFM32GG230F512G-E-QFN64
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EFM32GG230F1024-QFN64
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EFM32GG230F1024G-E-QFN64 Classificações máximas e características elétricas
| Manufacturer | Silicon Labs |
| Series | EFM32 Giant Gecko |
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit Single-Core |
| Maximum Clock Speed | 48 MHz |
| Program Memory Size (Flash) | 1 MB (1M x 8) |
| RAM Size | 128 KB |
| Number of I/O Pins | 56 |
| Supply Voltage (Vcc/Vdd) | 1.85 V to 3.8 V |
| Encapsulamento | 64-QFN (9x9 mm) with Exposed Pad |
| Tipo de montagem | Surface Mount |
| AES Hardware Encryption | Yes (AES-128/256) |
| Timers | 4 x 16-bit |
| Stop Mode Current (EM2) | 0.6 uA |
| Run Mode Current | 180 uA/MHz |
| Connectivity / Peripherals | I2C, SPI, UART, USB, ADC, DAC, GPIO |
| Status RoHS | Compliant |
Configuração de pinos do EFM32GG230F1024G-E-QFN64
| Pino 1 | VDD — Main supply voltage input (1.85 V to 3.8 V) |
| Pino 2 | VSS — Ground reference |
| Pino 3 | RESETn — Active-low reset input |
| Pino 4 | SWDIO — Serial Wire Debug data I/O |
| Pino 5 | SWCLK — Serial Wire Debug clock input |
| Pino 6 | SWO — Serial Wire trace output (optional) |
| Pino 7 | GPIO — General-purpose I/O with peripheral routing |
| Pino 8 | GPIO — General-purpose I/O |
| Pino 9 | GPIO — General-purpose I/O |
| Pino 10 | GPIO — General-purpose I/O |
| Pino 11 | GPIO — General-purpose I/O |
| Pino 12 | GPIO — General-purpose I/O |
| Pino 13 | GPIO — General-purpose I/O |
| Pino 14 | GPIO — General-purpose I/O |
| Pino 15 | GPIO — General-purpose I/O with ADC capability |
| Pino 16 | GPIO — General-purpose I/O with ADC capability |
| Pino 17 | GPIO — General-purpose I/O |
| Pino 18 | GPIO — General-purpose I/O |
| Pino 19 | GPIO — General-purpose I/O |
| Pino 20 | GPIO — General-purpose I/O |
| Pino 21 | GPIO — General-purpose I/O |
| Pino 22 | GPIO — General-purpose I/O |
| Pino 23 | GPIO — General-purpose I/O |
| Pino 24 | GPIO — General-purpose I/O |
| Pino 25 | GPIO — General-purpose I/O |
| Pino 26 | GPIO — General-purpose I/O |
| Pino 27 | GPIO — General-purpose I/O |
| Pino 28 | GPIO — General-purpose I/O |
| Pino 29 | GPIO — General-purpose I/O |
| Pino 30 | GPIO — General-purpose I/O |
| Pino 31 | GPIO — General-purpose I/O |
| Pino 32 | GPIO — General-purpose I/O |
| Pino 33 | GPIO — General-purpose I/O |
| Pino 34 | GPIO — General-purpose I/O |
| Pino 35 | GPIO — General-purpose I/O with peripheral routing |
| Pino 36 | GPIO — General-purpose I/O with peripheral routing |
| Pino 37 | GPIO — General-purpose I/O |
| Pino 38 | GPIO — General-purpose I/O |
| Pino 39 | GPIO — General-purpose I/O |
| Pino 40 | GPIO — General-purpose I/O |
| Pino 41 | GPIO — General-purpose I/O |
| Pino 42 | GPIO — General-purpose I/O |
| Pino 43 | GPIO — General-purpose I/O |
| Pino 44 | GPIO — General-purpose I/O |
| Pino 45 | GPIO — General-purpose I/O |
| Pino 46 | GPIO — General-purpose I/O |
| Pino 47 | GPIO — General-purpose I/O |
| Pino 48 | GPIO — General-purpose I/O |
| Pino 49 | GPIO — General-purpose I/O |
| Pino 50 | GPIO — General-purpose I/O |
| Pino 51 | GPIO — General-purpose I/O |
| Pino 52 | GPIO — General-purpose I/O |
| Pino 53 | GPIO — General-purpose I/O |
| Pino 54 | GPIO — General-purpose I/O |
| Pino 55 | GPIO — General-purpose I/O |
| Pino 56 | GPIO — General-purpose I/O |
| Pino 57 | GPIO — General-purpose I/O |
| Pino 58 | GPIO — General-purpose I/O |
| Pino 59 | GPIO — General-purpose I/O |
| Pino 60 | GPIO — General-purpose I/O |
| Pino 61 | GPIO — General-purpose I/O |
| Pino 62 | GPIO — General-purpose I/O |
| Pino 63 | GPIO — General-purpose I/O |
| Pino 64 | GPIO — General-purpose I/O |
Aplicações típicas
EFM32GG230F1024G-E-QFN64 é adequado para 6 aplicaçãos: Battery-Powered IoT Sensor Nodes, Smart Energy Metering, Wireless Sensor Network Gateway, Industrial Human-Machine Interface (HMI), Home Automation and Security Hub, Portable Medical and Health Monitoring Devices.
Battery-Powered IoT Sensor Nodes
The EFM32GG230F1024G-E-QFN64 fits battery-powered IoT sensor nodes because of its 0.6 uA EM2 Deep Sleep current and 180 uA/MHz Run mode draw - combining these with a typical 0.1% active duty cycle yields 5-10 year battery life on a CR2032 coin cell. The 1 MB Flash accommodates over-the-air (OTA) update images plus application code, while 128 KB RAM supports protocol stacks such as Bluetooth Low Energy, Thread, Zigbee, or Matter. The Cortex-M3 at 48 MHz delivers enough compute to run sensor fusion, encryption (AES hardware accelerator offloads secure TLS handshakes), and local decision logic without external radios. Place the MCU adjacent to the sensor ICs, with a 1 uF X7R bypass on each VDD pin and a 4.7 uF bulk decoupling capacitor near the exposed pad - this layout minimizes sleep-current spikes from rail collapse.
Recomendado
Smart Energy Metering
In smart electricity, water, and gas meters, the EFM32GG230F1024G-E-QFN64 serves as the metering compute and connectivity host. The integrated 12-bit ADC (typical of Giant Gecko) combined with the AES-128/256 hardware accelerator enables tamper-resistant metrology with secure data logging, while the wide 1.85-3.8 V supply range supports direct connection to battery-backed or harvested power rails. The Cortex-M3 at 48 MHz handles metrology algorithms, time-of-use tariff logic, and DLMS/COSEM or wireless M-Bus protocol stacks within the 1 MB Flash budget. The 128 KB RAM is sufficient for buffering daily load profiles and supporting display refresh. The 64-QFN exposed pad provides 28 C/W theta_JA on a 4-layer JEDEC board - adequate for indoor meter enclosures without active cooling.
Recomendado
Wireless Sensor Network Gateway
As a wireless sensor network gateway host, the EFM32GG230F1024G-E-QFN64 routes data from sub-GHz or 2.4 GHz sensor nodes to backhaul IP networks. The 56 GPIO pins and rich peripheral set (multiple UART, SPI, I2C) let designers connect a companion radio SoC (such as EFR32) plus Ethernet PHY, SD card storage, and local user interfaces. The 128 KB RAM holds packet buffers for time-slotted protocols, while 1 MB Flash stores gateway firmware plus stack libraries. The Cortex-M3 at 48 MHz is sufficient for protocol bridging, encryption using the on-chip AES, and local alarm processing even when forwarding thousands of packets per hour. The 64-QFN (9x9 mm) package fits inside small gateway enclosures, and the MCU's low sleep current keeps standby gateway power below 100 mW.
Recomendado
Industrial Human-Machine Interface (HMI)
The EFM32GG230F1024G-E-QFN64 drives industrial HMI panels that combine a small TFT or OLED display, capacitive touch, and fieldbus communication. The 1 MB Flash stores graphical assets, fonts, and the application state machine, while the 128 KB RAM holds frame buffers for small displays and protocol state. The Cortex-M3 at 48 MHz refreshes typical QVGA panels over SPI at 30+ FPS using only basic DMA channels, and EBI (external bus interface) on compatible Giant Gecko variants supports larger parallel LCDs. AES hardware encrypts remote firmware updates over Modbus TCP or EtherCAT, addressing industrial cybersecurity requirements. The 64-QFN (9x9 mm) package footprint keeps the HMI controller compact, and the wide -40 C to +85 C industrial temperature range supports factory floor deployment.
Recomendado
Home Automation and Security Hub
In home automation gateways and security panels, the EFM32GG230F1024G-E-QFN64 provides the local compute and connectivity backbone. The 1 MB Flash stores Z-Wave, Zigbee, or Matter stack libraries plus application firmware with room for future feature additions. The 128 KB RAM supports simultaneous radio coexistence and secure handshake buffers. On-chip AES-128/256 hardware acceleration secures wireless commissioning and prevents device spoofing. The 56 GPIO drive LED indicators, keypads, sirens, and sensors without external expanders. The Cortex-M3 at 48 MHz runs event-driven automation logic with sub-millisecond response. The 64-QFN (9x9 mm) package and 1.85-3.8 V supply simplify power tree design from a single 3.3 V rail or USB-powered supply.
Recomendado
Portable Medical and Health Monitoring Devices
For portable medical devices such as blood glucose meters, pulse oximeters, and ambulatory ECG monitors, the EFM32GG230F1024G-E-QFN64 offers Cortex-M3 compute, low sleep current, and AES hardware encryption for HIPAA/GDPR-relevant patient data. The 0.6 uA EM2 current lets wearable devices sleep most of the day, waking only for measurements - extending coin-cell battery life from weeks to months. The 1 MB Flash stores firmware plus on-device lookup tables and measurement algorithms, while 128 KB RAM buffers raw sensor samples between BLE transmissions. The integrated 12-bit ADC and on-chip comparators interface directly to biomedical front-ends. The 64-QFN (9x9 mm) package fits inside small handheld enclosures. Note: for FDA-classified devices, validation against IEC 60601-1 and IEC 62304 remains the designer's responsibility.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EFM32GG230F1024G-E-QFN64 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EFM32GG230F1024-QFN64T | EFM32GG230F1024G-E-QFN64R | EFM32GG230F512G-E-QFN64 |
|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 |
| Max Clock Speed | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Size | 1024 KB | 1024 KB | 1024 KB | 512 KB |
| RAM Size | 128 KB | 128 KB | 128 KB | 128 KB |
| Supply Voltage | 1.85 V to 3.8 V | 1.85 V to 3.8 V | 1.85 V to 3.8 V | 1.85 V to 3.8 V |
| AES Hardware Crypto | Yes | Yes | Yes | Yes |
| EM2 Sleep Current | 0.6 uA | 0.6 uA | 0.6 uA | 0.6 uA |
| Packaging | Tray (G-E suffix) | Tape and Reel (-T suffix) | Reel (-R suffix) | Tray |
Principais diferenciais
- 1 MB Flash and 128 KB RAM in 64-QFN (vs EFM32LG230F256G-E-QFN64)
- On-chip AES-128/256 hardware encryption (vs EFM32G230F64 (Gecko, no AES variant))
- 0.6 uA EM2 Deep Sleep current (vs STM32F103 Cortex-M3 MCU)
Notas de projeto
Place one 1 uF X7R ceramic bypass capacitor as close as possible to every VDD pin and a single 4.7 uF X5R bulk capacitor near the package. Estimated: with the device running at 48 MHz and typical workload, average supply current is around 8-10 mA active. Select the internal LDO mode for 1.85-3.0 V supply rails and the DC-DC mode for supply voltages above 2.4 V to maximize efficiency. For battery applications drawing microamp sleep currents, disable all unused peripherals and route GPIO to a defined state to eliminate parasitic current paths.
The QFN-64 package includes an exposed thermal pad on the bottom that serves as the primary ground connection and thermal dissipation path. This pad must be soldered to a continuous ground pour on the top layer with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) arrayed in a 3x3 grid to inner ground planes. Without proper soldered thermal pad attachment, the device may exceed junction temperature ratings (typical theta_JA is 28 C/W on a 4-layer JEDEC JESD51-7 board). Keep high-speed traces (SWD, SPI, external bus) length-matched within 5 mm to avoid signal skew.
Common pitfalls: (1) Forgetting to solder the exposed thermal pad causes intermittent resets under load due to poor ground return; (2) leaving SWDIO/SWCLK pins floating during boot may put the MCU in a debug state - add 100 kohm pull-downs if unused; (3) selecting the wrong memory model in the linker script causes the bootloader region to be overwritten - reserve the top 16 KB of Flash for the bootloader; (4) enabling peripheral interrupts before configuring nested vectored interrupt controller (NVIC) priorities leads to hard faults - configure priorities first. Refer to Silicon Labs application note AN0003 for the recommended bring-up sequence.
Informações de conformidade
RoHS and lead-free status inferred from 'G-E' suffix in MPN indicating lead-free matte tin finish; consult manufacturer datasheet for full compliance certificates.
