EFM32TG230F8-QFN64T - 32MHz ARM Cortex-M3 MCU | Silicon Labs
Référence : EFM32TG230F8-QFN64T ✓ ActifEFM32TG230F8-QFN64T Présentation
An MCU is a semiconductor that integrates a processor core, memory, peripherals, and I/O into one component. The ARM Cortex-M3 class provides a 32-bit processing architecture for embedded control, while the EFM32 family adds energy-management techniques that are useful in battery-operated products. In the product hierarchy, the EFM32TG230F8-QFN64T is an ARM Cortex-M3 microcontroller, an embedded processor, and a semiconductor component.
Key verified characteristics include a 32 MHz maximum clock speed, 8 KB Flash memory, 2 KB RAM, 56 digital I/O pins, two 16-bit timers, and a 64-QFN package measuring 9 x 9 mm. The ordering suffix T indicates the tray packaging supplied by the distributor, while the family part number identifies the base EFM32TG230F8-QFN64 device. These specifications suit compact sensor nodes, industrial monitoring, wearable accessories, and portable measurement products.
The EFM32TG230 platform supports energy-saving operation and rapid wake-up behavior, making it appropriate when standby current and responsiveness are more important than maximum compute throughput. Its 32 MHz Cortex-M3 core and timer resources are sufficient for protocol handling, digital control, sampling, and supervisory tasks. AES availability can also support secure data handling in connected or battery-powered products, subject to the complete device configuration confirmed in the manufacturer documentation.
Designers should allocate the 8 KB Flash and 2 KB RAM carefully, especially when downloading firmware, storing calibration data, or buffering samples. The 64-QFN footprint also requires a land pattern designed for fine-pitch assembly, so exposed-pad soldering and board-layout recommendations should follow the manufacturer package drawing. The verified search data does not provide a complete, pin-by-pin electrical pinout or confirmed operating-temperature details.
This product record combines manufacturer-family specifications, distributor package and memory data, available pricing information, and same-package replacement analysis. It is intended to help engineers evaluate the EFM32TG230F8-QFN64T for embedded designs while clearly separating verified facts from parameters that still require confirmation.
Alternatives de remplacement direct pour EFM32TG230F8-QFN64T — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EFM32TG230F8-QFN64T (même facteur de forme et même empreinte) — différant par Flash Memory, Operational Amplifiers, Package, Series, Timers.
EFM32TG230F32-QFN64T
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32TG230F16-QFN64T
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EFM32TG230F32-QFN64R
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EFM32TG230F16-QFN64R
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EFM32TG840F8-QFN64T
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →EFM32TG230F8-QFN64T Valeurs maximales et caractéristiques électriques
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Series | Tiny Gecko |
| Processor Core | ARM Cortex-M3 |
| Maximum Clock Speed | 32 MHz |
| Flash Memory | 8 KB |
| RAM | 2 KB |
| Digital I/O Pins | 56 |
| Timers | 2 x 16-bit timers |
| Supply Voltage Range | 1.85 V to 3.8 V |
| Boîtier | 64-QFN (9 x 9 mm) |
| Type de montage | Surface Mount |
| Shipping Package | Tray |
| Security Hardware | AES |
| Operational Amplifiers | 3 |
| Low-Power Features | Energy-saving modes and fast wake-up times |
| Architecture | ARMv7-M |
| Statut RoHS | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
Guide de configuration des broches du EFM32TG230F8-QFN64T tray
Configuration des broches du EFM32TG230F8-QFN64T (boîtier tray). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EFM32TG230F8-QFN64T.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EFM32TG230F8-QFN64T convient pour 6 applications: Battery-Powered Sensor Node, Industrial Monitoring Controller, Portable Medical Sensor Interface, Low-Power IoT Data Logger, Access and Control Panel, Secure Connected Sensor.
Battery-Powered Sensor Node
The EFM32TG230F8-QFN64T fits compact sensor nodes because its ARM Cortex-M3 core runs up to 32 MHz while the EFM32TG platform provides energy-saving modes and fast wake-up behavior. A 1.85 V to 3.8 V supply range supports common low-energy rails, while 56 digital I/O pins provide ample connections for sensors and status indicators. Its 8 KB Flash and 2 KB RAM require disciplined firmware sizing, but are adequate for sampling, thresholding, and short protocol handling. The principal benefit is responsive duty-cycled operation without using a higher-power general-purpose MCU; average current must be evaluated against sensor and radio duty cycles.
Recommandé
Industrial Monitoring Controller
The EFM32TG230F8-QFN64T is appropriate for industrial monitoring functions that combine local sensing, timers, and low-power behavior. Its two 16-bit timers can support periodic sampling or timing tasks, and 56 digital I/O pins reduce the need for external multiplexing in moderate-complexity controllers. The 32 MHz Cortex-M3 core provides sufficient performance for supervisory logic and communication framing. Because the device operates from 1.85 V to 3.8 V, system designers should include suitable regulation and protection for industrial transients. The small 64-QFN 9 x 9 mm package also supports compact controller boards without requiring a large through-hole footprint.
Recommandé
Portable Medical Sensor Interface
The EFM32TG230F8-QFN64T can serve as the low-power controller in a portable medical sensor interface when the system is battery operated and demands rapid reactivation. Its 32 MHz Cortex-M3 core can handle sensor configuration, data conditioning, and status sequencing, while the low-power EFM32TG platform helps reduce standby consumption. The three listed operational amplifiers may support local analog conditioning where their exact electrical limits and routing are confirmed for the selected configuration. Its 8 KB Flash and 2 KB RAM are best suited to lightweight algorithms and small data buffers. Medical-system designers must separately verify clinical, safety, and environmental requirements beyond the device-level electrical specifications.
Recommandé
Low-Power IoT Data Logger
The EFM32TG230F8-QFN64T is well suited to an IoT data logger that wakes periodically, records sensor values, and returns to a low-power state. Fast wake-up behavior can reduce the time the core remains active, while the 32 MHz processor provides enough performance for timestamps, filtering, and packet preparation. The 56 digital I/O pins allow multiple digital sensors to share the controller. Storage should be sized around the 2 KB RAM constraint, and firmware must fit within 8 KB Flash, so compact buffering and offload strategies may be necessary. Compared with a continuously running MCU, the principal benefit is lower average energy use when the surrounding sensor and radio circuits are also duty-cycled.
Recommandé
Access and Control Panel
The EFM32TG230F8-QFN64T can implement a local access or equipment-control panel with buttons, indicators, and communications. Its 56 digital I/O pins are useful for direct keypad and discrete-output handling, while the two 16-bit timers support debounce intervals, periodic tasks, or actuator timing. The 32 MHz Cortex-M3 core is more than adequate for HMI state management and serial protocols. Power consumption benefits from the family’s energy-saving modes when the panel is idle, and the 64-QFN package helps reduce board area. Firmware limitations remain important: the 8 KB Flash and 2 KB RAM favor compact interfaces and should be checked against graphics, logging, and protocol requirements.
Recommandé
Secure Connected Sensor
The EFM32TG230F8-QFN64T is applicable to connected sensors where local data handling and security are required without a high-performance application processor. The verified Mouser listing identifies AES hardware, which can accelerate supported cryptographic operations and reduce software processing burden. Its 32 MHz Cortex-M3 core can authenticate commands, manage a sensor interface, and prepare encrypted data for transmission, subject to the implementation guidance in the EFM32TG230 documentation. The 8 KB Flash and 2 KB RAM limit protocol stacks and buffered data, so a carefully selected lightweight stack is necessary. Low-energy modes remain valuable in devices that transmit intermittently rather than continuously.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EFM32TG230F8-QFN64T — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EFM32TG230F32-QFN64T | EFM32TG230F16-QFN64T | EFM32TG230F32-QFN64R | EFM32TG230F16-QFN64R | EFM32TG840F8-QFN64T |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Flash Memory | 8 KB | 32 KB | 16 KB | 32 KB | 16 KB | 8 KB |
| Shipping Package | Tray | Tray | Tray | Reel | Reel | Tray |
Principaux différenciateurs
- Higher Flash capacity in the same TG230 family (vs EFM32TG230F8-QFN64T)
- Low-power-oriented 32 MHz Cortex-M3 platform (vs EFM32TG840F8-QFN64T)
- Verified tray orderable option with distributor availability (vs EFM32TG230F32-QFN64R)
Notes de conception
Use the manufacturer 64-QFN 9 x 9 mm land pattern rather than estimating pad geometry from the package outline. Confirm exposed-pad dimensions, solder-mask clearance, and paste volume in the current package drawing. A QFN package also requires controlled reflow; inadequate solder wetting or excessive paste can produce open joints beneath the exposed pad, so inspect the underside and verify the stencil design during process qualification.
Budget the 1.85 V to 3.8 V operating range against the complete board, including sensors, radios, pull-ups, and any operational-amplifier loads. Keep the MCU rail free of transients outside its verified limits. Because low-power behavior is a primary benefit of the EFM32TG platform, calculate average current from the MCU sleep and active states rather than using only active-mode current; external components can otherwise dominate battery life.
Plan firmware around the verified 8 KB Flash and 2 KB RAM limits before committing to a protocol stack or application architecture. Reserve memory for startup code, interrupt handlers, stack, communication buffers, and application updates. A 32 KB alternative such as EFM32TG230F32-QFN64T may simplify memory planning, but changing the memory-density suffix can affect device configuration, so validate the exact part with the manufacturer documentation.
Place decoupling capacitors close to the supply and ground pins and follow the manufacturer layout guidance for the exposed pad. Keep sensitive analog inputs away from fast-switching nodes and provide a quiet ground return for the three listed operational amplifiers. The EFM32TG230 datasheet and package drawing should control trace widths, via placement, and exposed-pad connections; these details were not exposed in the supplied search snippets and should not be inferred.
Informations de conformité
The supplied manufacturer and distributor snippets do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is marked not applicable because the verified data identifies an industrial and energy-sensitive embedded MCU rather than an automotive-qualified variant.
