EFM32TG230F8-QFN64T - 32MHz ARM Cortex-M3 MCU | Silicon Labs
料号： EFM32TG230F8-QFN64T ✓ 量产中EFM32TG230F8-QFN64T 概述
An MCU is a semiconductor that integrates a processor core, memory, peripherals, and I/O into one component. The ARM Cortex-M3 class provides a 32-bit processing architecture for embedded control, while the EFM32 family adds energy-management techniques that are useful in battery-operated products. In the product hierarchy, the EFM32TG230F8-QFN64T is an ARM Cortex-M3 microcontroller, an embedded processor, and a semiconductor component.
Key verified characteristics include a 32 MHz maximum clock speed, 8 KB Flash memory, 2 KB RAM, 56 digital I/O pins, two 16-bit timers, and a 64-QFN package measuring 9 x 9 mm. The ordering suffix T indicates the tray packaging supplied by the distributor, while the family part number identifies the base EFM32TG230F8-QFN64 device. These specifications suit compact sensor nodes, industrial monitoring, wearable accessories, and portable measurement products.
The EFM32TG230 platform supports energy-saving operation and rapid wake-up behavior, making it appropriate when standby current and responsiveness are more important than maximum compute throughput. Its 32 MHz Cortex-M3 core and timer resources are sufficient for protocol handling, digital control, sampling, and supervisory tasks. AES availability can also support secure data handling in connected or battery-powered products, subject to the complete device configuration confirmed in the manufacturer documentation.
Designers should allocate the 8 KB Flash and 2 KB RAM carefully, especially when downloading firmware, storing calibration data, or buffering samples. The 64-QFN footprint also requires a land pattern designed for fine-pitch assembly, so exposed-pad soldering and board-layout recommendations should follow the manufacturer package drawing. The verified search data does not provide a complete, pin-by-pin electrical pinout or confirmed operating-temperature details.
This product record combines manufacturer-family specifications, distributor package and memory data, available pricing information, and same-package replacement analysis. It is intended to help engineers evaluate the EFM32TG230F8-QFN64T for embedded designs while clearly separating verified facts from parameters that still require confirmation.
直接替换替代料： EFM32TG230F8-QFN64T ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EFM32TG230F8-QFN64T （相同外形与封装尺寸） ——差异在于 Flash Memory, Operational Amplifiers, Package, Series, Timers.
EFM32TG230F32-QFN64T
✅ 直接替换📋 参考替代料（不在目录中）
EFM32TG230F16-QFN64T
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EFM32TG230F32-QFN64R
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EFM32TG230F16-QFN64R
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EFM32TG840F8-QFN64T
✅ 直接替换联系询价
查看数据手册 →EFM32TG230F8-QFN64T 最大额定值与电气特性
| Product Type | 32-bit ARM Cortex-M3 microcontroller |
| Series | Tiny Gecko |
| Processor Core | ARM Cortex-M3 |
| Maximum Clock Speed | 32 MHz |
| Flash Memory | 8 KB |
| RAM | 2 KB |
| Digital I/O Pins | 56 |
| Timers | 2 x 16-bit timers |
| Supply Voltage Range | 1.85 V to 3.8 V |
| 封装 | 64-QFN (9 x 9 mm) |
| 安装类型 | Surface Mount |
| Shipping Package | Tray |
| Security Hardware | AES |
| Operational Amplifiers | 3 |
| Low-Power Features | Energy-saving modes and fast wake-up times |
| Architecture | ARMv7-M |
| RoHS 状态 | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
EFM32TG230F8-QFN64T tray 引脚配置指南
EFM32TG230F8-QFN64T（tray 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EFM32TG230F8-QFN64T.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EFM32TG230F8-QFN64T 适用于 6 应用s: Battery-Powered Sensor Node, Industrial Monitoring Controller, Portable Medical Sensor Interface, Low-Power IoT Data Logger, Access and Control Panel, Secure Connected Sensor.
Battery-Powered Sensor Node
The EFM32TG230F8-QFN64T fits compact sensor nodes because its ARM Cortex-M3 core runs up to 32 MHz while the EFM32TG platform provides energy-saving modes and fast wake-up behavior. A 1.85 V to 3.8 V supply range supports common low-energy rails, while 56 digital I/O pins provide ample connections for sensors and status indicators. Its 8 KB Flash and 2 KB RAM require disciplined firmware sizing, but are adequate for sampling, thresholding, and short protocol handling. The principal benefit is responsive duty-cycled operation without using a higher-power general-purpose MCU; average current must be evaluated against sensor and radio duty cycles.
推荐
Industrial Monitoring Controller
The EFM32TG230F8-QFN64T is appropriate for industrial monitoring functions that combine local sensing, timers, and low-power behavior. Its two 16-bit timers can support periodic sampling or timing tasks, and 56 digital I/O pins reduce the need for external multiplexing in moderate-complexity controllers. The 32 MHz Cortex-M3 core provides sufficient performance for supervisory logic and communication framing. Because the device operates from 1.85 V to 3.8 V, system designers should include suitable regulation and protection for industrial transients. The small 64-QFN 9 x 9 mm package also supports compact controller boards without requiring a large through-hole footprint.
推荐
Portable Medical Sensor Interface
The EFM32TG230F8-QFN64T can serve as the low-power controller in a portable medical sensor interface when the system is battery operated and demands rapid reactivation. Its 32 MHz Cortex-M3 core can handle sensor configuration, data conditioning, and status sequencing, while the low-power EFM32TG platform helps reduce standby consumption. The three listed operational amplifiers may support local analog conditioning where their exact electrical limits and routing are confirmed for the selected configuration. Its 8 KB Flash and 2 KB RAM are best suited to lightweight algorithms and small data buffers. Medical-system designers must separately verify clinical, safety, and environmental requirements beyond the device-level electrical specifications.
推荐
Low-Power IoT Data Logger
The EFM32TG230F8-QFN64T is well suited to an IoT data logger that wakes periodically, records sensor values, and returns to a low-power state. Fast wake-up behavior can reduce the time the core remains active, while the 32 MHz processor provides enough performance for timestamps, filtering, and packet preparation. The 56 digital I/O pins allow multiple digital sensors to share the controller. Storage should be sized around the 2 KB RAM constraint, and firmware must fit within 8 KB Flash, so compact buffering and offload strategies may be necessary. Compared with a continuously running MCU, the principal benefit is lower average energy use when the surrounding sensor and radio circuits are also duty-cycled.
推荐
Access and Control Panel
The EFM32TG230F8-QFN64T can implement a local access or equipment-control panel with buttons, indicators, and communications. Its 56 digital I/O pins are useful for direct keypad and discrete-output handling, while the two 16-bit timers support debounce intervals, periodic tasks, or actuator timing. The 32 MHz Cortex-M3 core is more than adequate for HMI state management and serial protocols. Power consumption benefits from the family’s energy-saving modes when the panel is idle, and the 64-QFN package helps reduce board area. Firmware limitations remain important: the 8 KB Flash and 2 KB RAM favor compact interfaces and should be checked against graphics, logging, and protocol requirements.
推荐
Secure Connected Sensor
The EFM32TG230F8-QFN64T is applicable to connected sensors where local data handling and security are required without a high-performance application processor. The verified Mouser listing identifies AES hardware, which can accelerate supported cryptographic operations and reduce software processing burden. Its 32 MHz Cortex-M3 core can authenticate commands, manage a sensor interface, and prepare encrypted data for transmission, subject to the implementation guidance in the EFM32TG230 documentation. The 8 KB Flash and 2 KB RAM limit protocol stacks and buffered data, so a carefully selected lightweight stack is necessary. Low-energy modes remain valuable in devices that transmit intermittently rather than continuously.
推荐
推荐产品汇总
工程参考数据： EFM32TG230F8-QFN64T ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EFM32TG230F32-QFN64T | EFM32TG230F16-QFN64T | EFM32TG230F32-QFN64R | EFM32TG230F16-QFN64R | EFM32TG840F8-QFN64T |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Flash Memory | 8 KB | 32 KB | 16 KB | 32 KB | 16 KB | 8 KB |
| Shipping Package | Tray | Tray | Tray | Reel | Reel | Tray |
关键差异点
- Higher Flash capacity in the same TG230 family （对比 EFM32TG230F8-QFN64T)
- Low-power-oriented 32 MHz Cortex-M3 platform （对比 EFM32TG840F8-QFN64T)
- Verified tray orderable option with distributor availability （对比 EFM32TG230F32-QFN64R)
设计说明
Use the manufacturer 64-QFN 9 x 9 mm land pattern rather than estimating pad geometry from the package outline. Confirm exposed-pad dimensions, solder-mask clearance, and paste volume in the current package drawing. A QFN package also requires controlled reflow; inadequate solder wetting or excessive paste can produce open joints beneath the exposed pad, so inspect the underside and verify the stencil design during process qualification.
Budget the 1.85 V to 3.8 V operating range against the complete board, including sensors, radios, pull-ups, and any operational-amplifier loads. Keep the MCU rail free of transients outside its verified limits. Because low-power behavior is a primary benefit of the EFM32TG platform, calculate average current from the MCU sleep and active states rather than using only active-mode current; external components can otherwise dominate battery life.
Plan firmware around the verified 8 KB Flash and 2 KB RAM limits before committing to a protocol stack or application architecture. Reserve memory for startup code, interrupt handlers, stack, communication buffers, and application updates. A 32 KB alternative such as EFM32TG230F32-QFN64T may simplify memory planning, but changing the memory-density suffix can affect device configuration, so validate the exact part with the manufacturer documentation.
Place decoupling capacitors close to the supply and ground pins and follow the manufacturer layout guidance for the exposed pad. Keep sensitive analog inputs away from fast-switching nodes and provide a quiet ground return for the three listed operational amplifiers. The EFM32TG230 datasheet and package drawing should control trace widths, via placement, and exposed-pad connections; these details were not exposed in the supplied search snippets and should not be inferred.
合规信息
The supplied manufacturer and distributor snippets do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is marked not applicable because the verified data identifies an industrial and energy-sensitive embedded MCU rather than an automotive-qualified variant.
