Altera

EP1C20F324C6N - Cyclone FPGA 20K LE 324-BGA | Intel / Altera

Référence : EP1C20F324C6N ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
1.5 V Vdss 324-FBGA (FineLine BGA), 19 × 19 mm, 1.0 mm pitch Package 405 MHz (per FindIC specification) Speed
À partir de $21.75 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-06
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $34.2 $342,00
100 $28.9 $2 890,00
250 $25.4 $6 350,00
1 000 $21.75 $21 750,00
ℹ️ Tous les prix sont en USD

EP1C20F324C6N Présentation

The Intel / Altera EP1C20F324C6N is a low-cost Cyclone® family Field Programmable Gate Array (FPGA) with 20,060 logic elements (LEs), 294,912 bits of embedded RAM, and 233 user I/Os, housed in a 324-ball FineLine BGA (FBGA-324) package measuring 19 mm × 19 mm with 1.0 mm ball pitch. The "C6" speed grade and "N" lead-free suffix indicate a commercial-temperature, lead-free device rated for operation up to approximately 405 MHz internal operation. The Cyclone family targets high-volume, cost-sensitive applications where designers need programmable logic without the power and cost overhead of high-end FPGAs.

A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that the designer can re-program after manufacture to implement arbitrary digital logic, glue logic, state machines, and parallel datapaths. In the system hierarchy, FPGAs sit alongside microcontrollers and ASICs in the broader class of programmable logic devices (PLDs), and are differentiated by their parallel architecture, ability to handle wide datapaths, and on-chip memory. The Cyclone family was Altera's (now Intel's) entry-level, high-volume FPGA line, fabricated on a 0.13 µm SRAM process, with on-chip multipliers, PLL-based clock management, and support for external memory interfaces including DDR SDRAM and FCRAM.

Key features of the EP1C20F324C6N include 20,060 LEs arranged in 2,006 logic array blocks (LABs), 294,912 bits (approximately 36 Kbit) of M4K embedded memory blocks, up to 233 user I/Os, embedded 18 × 18 multipliers for DSP operations, and up to two PLLs for clock generation and management. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS, and is configured via JTAG or Altera's serial configuration devices. The 1.5 V core supply and 1.5 V / 2.5 V / 3.3 V I/O supplies are powered from separate rails, with power consumption strongly dependent on toggle rate and utilization.

From an architectural standpoint, the Cyclone LE contains a 4-input look-up table (LUT), a programmable register, a carry chain for arithmetic, and a cascade chain for wide fan-in logic. The M4K memory blocks can be configured as true dual-port, simple dual-port, or single-port RAM, ROM, or FIFO buffers with parity support. The PLL blocks support clock multiplication, division, phase shifting, and external clock feedback for precise system-level timing alignment.

Typical applications for the EP1C20F324C6N include display controllers and LCD panel drivers, industrial I/O expansion and protocol bridging, low-cost video processing pipelines, glue logic in telecom and networking line cards, motor control and industrial automation, and consumer electronics such as set-top boxes, printers, and digital photo frames. The combination of moderate logic density, embedded multipliers, and on-chip RAM makes it well-suited to mid-complexity control-plane and datapath tasks.

When designing with this part, allocate at least four dedicated power layers or planes (1.5 V core, PLL analog supply, I/O banks, and GND) and follow the Altera Cyclone Hardware Design Guidelines for decoupling, including 100 nF + 10 µF per power pin and a bulk capacitor per supply rail. The 1.0 mm-pitch FBGA-324 requires a 4-6-4 trace escape on a high-layer-count PCB and ENIG or OSP surface finish for reliable BGA assembly.

This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone family, and practical design notes not found in the manufacturer datasheet alone.

Alternatives de remplacement direct pour EP1C20F324C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP1C20F324C6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Process Technology, Operating Temperature, Total RAM Bits.

Altera
Package: 324-ball FBGA (FineLine BGA)
Speed Grade: 6
Process Technology: 130 nm CMOS
Comparer avec EP1C20F324C6N →
Intel
Package: FBGA-324 (324-BGA, 19 × 19 mm, 1.0 mm pitch)
Speed Grade: 7 (-7)
Process Technology: 130 nm CMOS
Comparer avec EP1C20F324C6N →
Intel
Package: 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch)
Speed Grade: C7 (commercial)
Process Technology: 0.13 um CMOS, SRAM-based
Comparer avec EP1C20F324C6N →
Altera
Speed Grade: 8
Process Technology: 130 nm
Total RAM Bits: 294,912
Comparer avec EP1C20F324C6N →
Intel
Package: 324-ball FBGA (FineLine BGA)
Speed Grade: C8 (commercial, -8)
Process Technology: 130 nm CMOS
Comparer avec EP1C20F324C6N →
Altera
Package: 324-BGA (1.0 mm pitch, FineLine)
Speed Grade: 8 (commercial, ~320 MHz internal)
Process Technology: SRAM-based, 130 nm
Comparer avec EP1C20F324C6N →
Intel
Package: 324-FBGA (19x19 mm)
Speed Grade: I7 (industrial)
Process Technology: 130 nm
Comparer avec EP1C20F324C6N →
Intel
Package: 324-pin FineLine BGA (FBGA-324), 19 × 19 mm, 1.0 mm pitch
Process Technology: 0.13 µm CMOS
Operating Temperature: -40 °C to +100 °C (industrial)
Comparer avec EP1C20F324C6N →
Intel
Package: 400-ball FineLine BGA (FBGA-400)
Process Technology: 0.13 µm SRAM
Operating Temperature: 0°C to 85°C (commercial)
Comparer avec EP1C20F324C6N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP1C20F324C8N

✅ Remplacement direct
Intel
📦 324-FBGA (19x19, 1.0 mm pitch)
Cyclone · Cyclone I · Intel (formerly Altera) · 130 nm CMOS · 20,060 · 2,006 · 294,912 bits · 233

✓ En stock

$42.36 / unité

Voir la fiche technique →

EP1C20F324I7N

✅ Remplacement direct
Intel
📦 324-FBGA (19x19, 1.0 mm pitch)
Cyclone (first generation) · 20,060 LE · 294,912 bits (288 kbit) · 233 · 20060 (per Cyclone Family datasheet) · 26 (18x18) · 4 · 1.5 V

✓ En stock

$53.1 / unité

Voir la fiche technique →

EP1C20F324C7N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 324-FBGA (19x19, 1.0 mm pitch)
Cyclone · 20060 · 2006 · 294912 · 233 · 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) · C7 (commercial)

✓ En stock

$56.04 / unité

Voir la fiche technique →

EP1C20F324C6

✅ Remplacement direct
Altera
📦 324-FBGA (19x19, 1.0 mm pitch)
Cyclone · 20,060 · 294,912 bits (64 M4K blocks × 4,608 bits) · 233 · 130 nm CMOS · 1.5 V · LVCMOS / LVTTL (3.3 V, 2.5 V, 1.8 V, 1.5 V), LVDS · 4

✓ En stock

$105 / unité

Voir la fiche technique →

EP1C20F324I7

✅ Remplacement direct
Intel
📦 324-FBGA (19x19, 1.0 mm pitch)
Cyclone · Cyclone I (EP1C20) · 20,060 LE · 294,912 bit · 2006 · 233 · 4 · 288 Kbit

✓ En stock

$85.2 / unité

Voir la fiche technique →

EP1C20F324C6N Valeurs maximales et caractéristiques électriques

Series Cyclone®
Family Cyclone I
Logic Elements (LEs) 20,060
Logic Array Blocks (LABs) 2,006
Total RAM Bits 294,912 (36 Kbit)
Embedded Multipliers (18×18) Yes (M4K + DSP blocks per datasheet)
User I/Os 233
Number of CLBs / Logic Cells 20,060 cells (20060 CLBs per datasheet)
Supply Voltage - Core 1.5 V
Maximum Operating Frequency 405 MHz (per FindIC specification)
Process Technology CMOS, 0.13 µm SRAM-based
Boîtier 324-FBGA (FineLine BGA), 19 × 19 mm, 1.0 mm pitch
Type de montage Surface Mount (BGA)
Speed Grade C6
Température de fonctionnement 0 °C to +85 °C (commercial, "C" prefix)
Lead-Free / RoHS Yes (lead-free, "N" suffix per part number decoder)
PLLs 2 (per Cyclone family datasheet)
Configuration JTAG, Passive Serial, Active Serial (EPCS)

Guide de configuration des broches du EP1C20F324C6N 324-fbga (fineline bga), 19 × 19 mm, 1.0 mm pitch

Configuration des broches du EP1C20F324C6N (boîtier 324-fbga (fineline bga), 19 × 19 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.

Schéma de brochage du boîtier 324-fbga (fineline bga), 19 × 19 mm, 1.0 mm pitch pour le EP1C20F324C6N

Aucune donnée de brochage détaillée disponible pour EP1C20F324C6N.

Consultez la fiche technique pour la configuration complète des broches.

Applications typiques

EP1C20F324C6N convient pour 6 applications: Industrial Protocol Bridge / Glue Logic, Display Controller / LCD Panel Driver, Motor Control and Industrial Automation, Low-Cost Video Processing Pipeline, Telecom Line Card Glue Logic, Consumer Set-Top Box and Printer Controller.

🏭

Industrial Protocol Bridge / Glue Logic

The EP1C20F324C6N is well-suited to industrial protocol bridging and glue-logic roles where moderate logic density and a large user-IO count are required. Its 20,060 logic elements (LEs) and 233 user I/Os in the 324-FBGA package give designers headroom for UART/SPI/I2C bridging, PROFINET or Modbus protocol conversion, and parallel-to-serial multiplexing across multiple industrial buses. The 1.5 V core and bank-isolated I/Os (LVTTL/LVCMOS/PCI/SSTL) simplify interfacing to 3.3 V MCUs and 5 V-tolerant peripherals via series resistors, while the two on-chip PLLs allow clean clock recovery from any reference. Compared with a CPLD, the Cyclone provides 18×18 multipliers and 294 Kbit of block RAM for buffering packet data, but the designer must still manage commercial temperature grade (0–85 °C) or migrate to the I7 variant for cabinet environments.

📺

Display Controller / LCD Panel Driver

The EP1C20F324C6N's 20,060 LEs and 233 user I/Os make it a strong fit for mid-resolution LCD and TFT display controllers, where parallel RGB data buses and timing-control signals consume significant pin and logic resources. The 324-FBGA package provides ample I/O for 18/24-bit color interfaces plus control signals, while the 294 Kbit M4K memory can be configured as line buffers or frame-row FIFOs to smooth data flow between the host processor and panel. The two on-chip PLLs synthesize the pixel clock from a low-frequency reference with sub-nanosecond jitter, which is critical for avoiding visual artifacts in LCDs and OLEDs. Designers typically pair the EP1C20F324C6N with an SDRAM or DDR memory controller block (Cyclone I supports external SDRAM but not DDR) and implement color-space conversion in hardware. For higher-resolution panels above XGA, designers should migrate to Cyclone II or later, which adds dedicated DDR memory support.

🏭

Motor Control and Industrial Automation

In motor-control and industrial-automation applications, the EP1C20F324C6N delivers precise multi-axis PWM generation, encoder feedback decoding, and field-oriented control (FOC) state machines with deterministic latency. The 20,060 LEs comfortably host a single-axis FOC algorithm plus auxiliary protection logic, while the 18×18 embedded multipliers accelerate Park/Clarke transforms and PID loops. The 233 user I/Os of the 324-FBGA package expose enough pins for three-phase PWM outputs, Hall-sensor or QEI encoder inputs, current-sense ADCs, and CAN/SPI communication to a supervisory MCU. The two PLLs synthesize high-resolution PWM carrier frequencies from a single crystal reference. For -40 °C to +100 °C cabinet environments, choose the EP1C20F324I7N industrial-temperature variant; the C6N commercial-grade part is limited to 0–85 °C operation.

🎥

Low-Cost Video Processing Pipeline

The EP1C20F324C6N can implement entry-level video processing functions such as scaling, de-interlacing, color-space conversion, and on-screen display (OSD) overlay for SDTV and standard-definition video. The 20,060 LEs and 18×18 embedded multipliers handle real-time horizontal/vertical scaling filters and chroma keying, while 294 Kbit of M4K memory serves as line buffers for 4:2:2 chroma data. The 233 user I/Os of the 324-FBGA expose parallel ITU-R BT.656 or D1 video buses plus audio I2S, and the two PLLs synthesize 27 MHz video reference clocks cleanly. Compared with a DSP, the Cyclone provides deterministic parallel processing without software overhead, but the user must implement external SDRAM controllers for frame buffering since the part lacks internal memory large enough for full frames. For HD or full-HD processing migrate to Cyclone IV or Cyclone V.

🌐

Telecom Line Card Glue Logic

In telecom line cards and access equipment, the EP1C20F324C6N serves as flexible glue logic between network processors, framers, SERDES, and backplane interfaces. Its 20,060 LEs accommodate TDM bus cross-connects, LIU (line-interface-unit) configuration state machines, and per-channel alarm monitoring, while the 324-FBGA's 233 user I/Os expose enough parallel buses for multi-port T1/E1 or low-density Ethernet aggregation. The 18×18 multipliers support V.90 modem equalization or simple DSP functions for line testing. The two PLLs clean up recovered clocks from the network side. Designers typically pair the EP1C20F324C6N with a higher-level processor running protocol stacks, offloading only the deterministic glue and alarm logic to the FPGA. Note that the Cyclone I is commercial-grade; for outdoor cabinets, the I7N industrial variant is required.

📱

Consumer Set-Top Box and Printer Controller

The EP1C20F324C6N fits cost-sensitive consumer products such as entry-level set-top boxes, digital photo frames, and mid-range printers that require custom control logic without the expense of an ASIC. The 20,060 LEs handle MPEG transport-stream demultiplexing, IR remote decoding, and front-panel key-scanning in a set-top box, or print-engine sequencing, USB-host glue, and LCD status rendering in a printer. The 233 user I/Os of the 324-FBGA accommodate multiple peripheral buses (USB, I2S, I2C, SPI, parallel NAND), while the two PLLs synthesize audio and video clocks from a single 27 MHz reference. The commercial temperature grade is sufficient for indoor consumer environments. Designers moving to high-volume production may migrate to Cyclone II for lower unit cost, but the EP1C20F324C6N remains a useful prototyping or low-volume-production device.

Récapitulatif des produits recommandés

EPCS4 Altera active-serial configuration flash for Cyclone I Utilisé dans : Industrial Protocol Bridge / Glue Logic, Motor Control and Industrial Automation, Telecom Line Card Glue Logic, Consumer Set-Top Box and Printer Controller EP1C12Q240C8N Intel Utilisé dans : Industrial Protocol Bridge / Glue Logic MT48LC16M16A2 SDRAM companion for frame buffering Utilisé dans : Display Controller / LCD Panel Driver EPCS16 Larger configuration flash for full bitstream storage Utilisé dans : Display Controller / LCD Panel Driver EP1C20F324I7N Intel Utilisé dans : Motor Control and Industrial Automation MT48LC4M32B2 SDRAM for video frame buffers Utilisé dans : Low-Cost Video Processing Pipeline ADV7180 Video decoder for analog SD inputs Utilisé dans : Low-Cost Video Processing Pipeline DS21348 T1/E1 line interface unit companion Utilisé dans : Telecom Line Card Glue Logic EP1C12F256C6N Intel Utilisé dans : Consumer Set-Top Box and Printer Controller
What is the logic element count of the EP1C20F324C6N?
The EP1C20F324C6N contains 20,060 logic elements (LEs) organized into 2,006 logic array blocks (LABs). According to the Altera Cyclone FPGA Family Data Sheet, each LE consists of a 4-input look-up table (LUT), a programmable register, carry-chain logic, and cascade-chain logic, making this part suitable for moderate-complexity datapath and control-plane designs in cost-sensitive applications.
Is the EP1C20F324C6N still in production?
No, the EP1C20F324C6N is marked obsolete on multiple distributor listings, including DigiKey and Mouser, as the original Cyclone family has been superseded by Cyclone II, Cyclone III, Cyclone IV, and Cyclone V generations. For new designs Intel recommends Cyclone IV E or Cyclone V E/SE; however the EP1C20F324C6N remains available from authorized distributors and the open market for legacy maintenance, repair, and operations (MRO).
What is the package and ball pitch of the EP1C20F324C6N?
The EP1C20F324C6N is packaged in a 324-ball FineLine BGA (FBGA-324) measuring 19 mm × 19 mm with a 1.0 mm ball pitch. According to the Altera Cyclone datasheet, the "F324" device suffix denotes this specific BGA package variant, and the die occupies the center of the array with power and ground balls distributed throughout for signal-integrity optimization.
How much on-chip memory does the EP1C20F324C6N have?
The EP1C20F324C6N includes 294,912 bits of embedded RAM (approximately 36 Kbit) implemented as M4K memory blocks. According to the Cyclone datasheet, each M4K block can be configured as true dual-port, simple dual-port, or single-port RAM, ROM, or FIFO with parity support, supporting per-block operation up to 200 MHz and variable widths from ×1 to ×36.
Where can I buy the EP1C20F324C6N today?
The EP1C20F324C6N is available from authorized distributors including DigiKey (P/N 763645) and Mouser, plus independent stockists listed on Octopart and TrustedParts. As of 2026-09-06, expected lead times for new orders are typically 6-10 weeks due to obsolete-status supply constraints; users should confirm current RoHS and original-manufacturer traceability before placing volume orders.
What is the price of the EP1C20F324C6N?
As of 2026-09-06, the EP1C20F324C6N prices on the open market typically range from $38.50 at qty 1 to approximately $21.75 at qty 1000, reflecting its obsolete status and limited remaining inventory. Pricing varies by distributor and date code; request formal quotes from multiple sources for production orders, and note that tape-and-reel (TR) versus tray packaging may also affect the unit price.
What is the lead time for the EP1C20F324C6N?
The lead time for the EP1C20F324C6N is typically 6-10 weeks from authorized distributors as of 2026-09-06, due to the part's obsolete status in the Altera/Intel Cyclone product roadmap. Independent distributors may stock small quantities for immediate shipment, but engineers should plan longer procurement windows and qualify a second source where possible.
Is the EP1C20F324C6N in stock anywhere?
Stock availability for the EP1C20F324C6N is limited and variable as of 2026-09-06. Distributors including DigiKey and Mouser occasionally list small quantities, while independent stockists listed on Octopart and TrustedParts may offer higher volumes; engineers should use real-time inventory checkers to confirm current stock before placing orders.
EP1C20F324C6N vs EP1C20F324I7 - which is better for industrial applications?
For industrial applications requiring operation across -40 °C to +100 °C, the EP1C20F324I7 is the appropriate choice because the "I" temperature grade in its suffix denotes the industrial operating range, whereas the EP1C20F324C6N is commercial-grade (0 °C to +85 °C). Both share the same 324-FBGA package and 20,060-LE silicon, so the I7 is a drop-in replacement for designs that must operate outside controlled-temperature environments.
EP1C20F324C6N vs EP1C20F324C8N - what is the difference?
The EP1C20F324C6N and EP1C20F324C8N differ only in speed grade: C6 is a faster speed bin than C8, meaning C6 achieves higher internal Fmax and tighter timing margins at the same voltage. For new designs targeting lower power or relaxed timing, the C8 variant may be acceptable; for high-performance or timing-critical paths, prefer C6 over C8.
When should I choose the EP1C20F324C6N over a Cyclone II or Cyclone IV device?
Choose the EP1C20F324C6N only when maintaining compatibility with an existing Cyclone-I-based design or when supporting legacy MRO applications where PCB rework is not feasible. For new designs, prefer Cyclone IV E (EP4CE6/10/15/22) or Cyclone V E (5CEBA series), which provide lower power, higher logic density, embedded transceivers on select parts, longer lifecycle, and improved Quartus tool support.
What is the best drop-in replacement for the EP1C20F324C6N?
The best same-package drop-in replacement for the EP1C20F324C6N is the EP1C20F324C8N (same 324-FBGA footprint, same 20,060 LEs, slower speed grade) followed by the EP1C20F324I7 (industrial-temperature upgrade). Both retain pin-for-pin compatibility with the C6N variant on the FBGA-324 footprint, allowing PCB reuse without layout changes.
Can the Cyclone IV EP4CE22F324 be used as a drop-in replacement for the EP1C20F324C6N?
No, the Cyclone IV EP4CE22F324 is not pin-compatible with the EP1C20F324C6N even though it shares the 324-FBGA package, because Cyclone IV uses different bank voltages, JTAG pin assignments, and configuration pinout than Cyclone I. A board redesign or adapter PCB is required when migrating from Cyclone I to Cyclone IV.
Where can I download the EP1C20F324C6N datasheet PDF?
The EP1C20F324C6N datasheet PDF is available as the Cyclone FPGA Family Data Sheet, hosted at alterasemi.com/datasheet/alterasemi/EP1C20F324C6N.pdf, with secondary copies on datasheets.com and datasheetq.com. The document covers Cyclone I architecture, DC/AC characteristics, configuration modes, JTAG, and ordering information for the entire family including the EP1C20F324 variant.
Where can I find the EP1C20F324C6N pinout diagram?
The pinout for the EP1C20F324C6N is published in the Cyclone FPGA Family Data Sheet on page-level pin tables for the F324 FineLine BGA package. According to the datasheet, the FBGA-324 ball map lists all user I/O bank assignments, dedicated configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[0..3], DCLK), JTAG pins (TCK, TMS, TDI, TDO), and power/ground balls arranged on a 19 × 19 mm substrate.

Données de référence d'ingénierie pour EP1C20F324C6N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP1C20F324C6N when you need a low-cost, lead-free, commercial-temperature Cyclone-I FPGA in the 324-FBGA package and your design fits within 20,060 LEs and 233 user I/Os. Choose the EP1C20F324I7N (industrial) for environments that require operation below 0 °C or above +85 °C, including outdoor enclosures and industrial cabinets. Choose the EP1C20F324C8N for power-optimized or cost-sensitive designs that do not need the C6 speed grade's full timing margin. Avoid the EP1C20F324C6 (without N suffix) for new designs in RoHS-regulated markets. For all new designs targeting future-proofing and longer lifecycle, consider migrating to Cyclone IV E (EP4CE) or Cyclone V E (5CEBA) families, which provide lower power and improved Quartus support, but require a board redesign.

Comparaison avec les alternatives

Paramètre Ce produit EP1C20F324C8N EP1C20F324I7N EP1C20F324C7N EP1C20F324C6 EP1C20F324I7
Brand Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel) Altera (now Intel)
Package 324-FBGA (19x19 mm, 1.0 mm pitch) 324-FBGA (19x19 mm, 1.0 mm pitch) - same 324-FBGA (19x19 mm, 1.0 mm pitch) - same 324-FBGA (19x19 mm, 1.0 mm pitch) - same 324-FBGA (19x19 mm, 1.0 mm pitch) - same 324-FBGA (19x19 mm, 1.0 mm pitch) - same
Logic Elements 20,060 20,060 20,060 20,060 20,060 20,060
Speed Grade C6 C8 (slower) I7 (faster, industrial) C7 (between C6 and C8) C6 (identical speed) I7 (faster, industrial)
Operating Temperature 0 to +85 °C (commercial) 0 to +85 °C -40 to +100 °C (industrial) 0 to +85 °C 0 to +85 °C -40 to +100 °C (industrial)
Lead-Free / RoHS Yes (N suffix, lead-free) Yes (lead-free) Yes (lead-free) Yes (lead-free) No (without N suffix) No (without N suffix)
User I/Os 233 233 233 233 233 233
Embedded RAM 294,912 bits (M4K blocks) 294,912 bits 294,912 bits 294,912 bits 294,912 bits 294,912 bits
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete

Principaux différenciateurs

  • Industrial temperature grade variant available in the same FBGA-324 footprint (vs EP1C20F324I7N)
  • Lead-free RoHS-compliant finish (N suffix) (vs EP1C20F324C6 (without N suffix))
  • Faster C6 speed grade available for timing-critical paths (vs EP1C20F324C8N)

Notes de conception

The EP1C20F324C6N requires four separate power rails: VCCINT (1.5 V core), VCCIO[1..4] (per-bank I/O voltages, supporting 1.5/1.8/2.5/3.3 V), VCC_PLL (analog 1.5 V for the two PLL blocks), and a common GND. Place 100 nF X7R ceramic decoupling capacitors on every VCC pin within 3 mm trace length, plus 10 µF X5R bulk capacitors per supply rail. Estimated: at typical 30% toggle rate and 50% utilization on the C6N, core current draw can reach 500–800 mA; the PLL analog supply must be filtered with an LC or ferrite-bead network to minimize jitter. Follow Altera's Cyclone Hardware Design Guidelines (AN-224) for sequencing requirements.

The 324-FBGA has 1.0 mm ball pitch, which demands a 4-6-4 via-in-pad or dog-bone fan-out escape pattern on a 6+ layer PCB. Microvia technology (laser-drilled stacked vias) is strongly recommended for the inner-row ball escape. Use ENIG surface finish for reliable BGA assembly; OSP is acceptable for prototypes but less robust for production. Estimated: full-channel escape requires approximately 4 signal layers between the BGA and the inner layers; allocate at least 2 ground planes adjacent to signal layers for controlled impedance of 50 Ω single-ended traces.

Do not assume the EP1C20F324C6N is hot-swappable; it requires proper VCCINT/VCCIO power-on sequencing per the Cyclone datasheet, otherwise the I/Os may drive into a contention state during ramp. Always deassert nCONFIG (drive high) only after all supplies reach valid levels; CONF_DONE will signal successful configuration. Configuration bitstream storage on an EPCS1/EPCS4/EPCS16 active-serial flash must match the C6 speed grade or design will fail timing closure. Common pitfall: using C8 bitstreams on a C6 device will work but C6 bitstreams on a C8 device will fail timing analysis.

Informations de conformité

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

Lead-free / RoHS compliant per part-number "N" suffix. REACH and halogen-free status not stated in the verified web data and set to "unknown". AEC-Q100 not applicable (FPGA used in industrial/consumer applications, not automotive qualified under AEC-Q100).

Données vérifiées le : 2026-09-06 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EP1C20F324C6N EP1C20F324C6N datasheet Altera Cyclone EP1C20F324C6N Cyclone I FPGA 20060 logic elements 324 BGA EP1C20F324C6N pinout FBGA-324 FPGA glue logic industrial automation EP1C20F324C6N vs EP1C20F324I7N EP1C20F324C6N drop-in replacement EP1C20F324C6N buy price obsolete what is the logic element count of EP1C20F324C6N Altera Cyclone I obsolete replacement Cyclone IV EP1C20F324C6N lead-free RoHS Cyclone I FPGA configuration EPCS flash Cyclone I display controller 324 FBGA EP1C20F324C6N lead time stock 2026

Composants & termes associés

Altera Intel EP1C20F324C6N Cyclone Cyclone I FPGA Field-Programmable Gate Array Programmable Logic Device Logic Element Logic Array Block M4K memory block FBGA-324 FineLine BGA RoHS AEC-Q100 JTAG EPCS configuration flash PLL LCD controller industrial glue logic Quartus 1.5 V core supply LVCMOS LVTTL PCI
RFQ de devis rapide
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Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
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Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ