EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
Référence : EP1C12F256C6N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $63.4 | $6 340,00 |
| 500 | $56.8 | $28 400,00 |
| 1 000 | $51.9 | $51 900,00 |
EP1C12F256C6N Présentation
A Field-Programmable Gate Array is a reprogrammable digital logic device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated I/O cells. Within the broader hierarchy, an FPGA sits above CPLDs and below ASICs in terms of integration density and flexibility, and the Cyclone family specifically targets low-cost, high-volume applications where FPGAs were historically considered too expensive. Cyclone was Altera's first family explicitly designed to displace fixed-function ASICs and ASSPs in glue-logic, bus-interface, and DSP pre-processing roles.
Key features of the EP1C12F256C6N include a 2,980-LAB architecture delivering up to 12060 logic elements, two PLLs for clock management, dedicated 18×18 hardware multipliers for DSP, and per-pin LVDS support at up to 640 Mbps. The device supports multiple I/O standards (LVTTL, LVCMOS, PCI, SSTL, LVDS) and is configured via a serial configuration device or JTAG, making it suitable for low-density, low-power designs.
The Cyclone architecture uses 4-input look-up tables (LUTs) and embedded M4K memory blocks, allowing efficient implementation of state machines, FIFOs, and small DSP pipelines. The two embedded PLLs provide clock multiplication, division, and phase shifting, while the multiplier blocks accelerate DSP functions without consuming logic resources. With a 1.5 V core and typical quiescent power well below 1 W at moderate toggle rates, the EP1C12F256C6N balances density with low power consumption.
Typical applications include industrial control boards, consumer video/display glue logic, communication protocol bridging, low-cost DSP preprocessing, and PCI interface bridging. The Cyclone family is also widely used in educational platforms and rapid-prototyping boards due to its mature toolchain (Quartus II) and abundant reference designs.
When designing with this device, ensure that the 256-ball FBGA requires careful PCB layout with via-in-pad or microvia technology, and that configuration requires an EPCS serial flash or JTAG programmer. Power sequencing must respect the 1.5 V VCCINT and 3.3 V VCCIO ramp requirements to avoid high inrush current.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing an at-a-glance view for BOM decisions and FPGA selection.
Alternatives de remplacement direct pour EP1C12F256C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C12F256C6N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Family, Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C12F256C8N
✅ Remplacement direct✓ En stock
$15.1 / unité
Voir la fiche technique →EP1C12F256C7N
✅ Remplacement direct✓ En stock
$27.95 / unité
Voir la fiche technique →EP1C12F256I7N
✅ Remplacement direct✓ En stock
$47.85 / unité
Voir la fiche technique →EP1C12F256I6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP1C12F256C6AA
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP1C12F256C6
✅ Remplacement direct✓ En stock
$48.29 / unité
Voir la fiche technique →EP1C12F256C6N Valeurs maximales et caractéristiques électriques
| Family | Cyclone® |
| Logic Elements (LEs) | 12,060 |
| Logic Array Blocks (LABs) | 1,206 |
| Embedded Memory Bits | 239,616 bits |
| M4K RAM Blocks | 52 |
| Embedded 18x18 Multipliers | Yes |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | 0.13 µm SRAM |
| Boîtier | 256-ball FBGA (F256) |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Speed Grade | 6 |
| Configuration Method | Serial (EPCS) / JTAG |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du EP1C12F256C6N 256-ball fbga (f256)
Configuration des broches du EP1C12F256C6N (boîtier 256-ball fbga (f256)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1C12F256C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1C12F256C6N convient pour 6 applications: Industrial Control and Factory Automation, PCI Bus Bridge and Interface Cards, Low-Cost DSP Preprocessing, Display and Video Glue Logic, Communication Protocol Bridging, Education and Rapid Prototyping.
Industrial Control and Factory Automation
The EP1C12F256C6N fits industrial control boards where its 12,060 logic elements provide enough capacity for state-machine-based PLC logic, while 185 user I/O pins directly drive sensor inputs and actuator outputs. Its two PLLs generate the deterministic clocking required for motor-control PWM and fieldbus timing, and 239,616 bits of embedded RAM accommodate FIFO buffers between fieldbus (e.g., PROFIBUS, Modbus) and backplane interfaces. The 1.5 V core and 0.13 µm process keep typical power dissipation under 1 W at moderate toggle rates, eliminating the need for forced-air cooling in sealed enclosures.
Recommandé
PCI Bus Bridge and Interface Cards
With PCI 33/66 MHz support via dedicated I/O standards, the EP1C12F256C6N is widely deployed in PCI add-in cards for legacy industrial PCs. Its 12,060 LEs comfortably implement a 32-bit PCI target with DMA engine and scatter-gather logic, and the 256-ball FBGA places all PCI signals on a single I/O bank for clean impedance matching. The device's 5 V-tolerant I/O (with external clamping) handles classic PCI signaling, while 52 M4K blocks provide the descriptor memory needed for high-throughput DMA transfers.
Recommandé
Low-Cost DSP Preprocessing
The EP1C12F256C6N's dedicated 18×18 hardware multipliers and 52 M4K RAM blocks enable efficient FIR filter and FFT pipeline implementations without consuming general-purpose logic. At 100 MHz, a 32-tap FIR filter fits in roughly 500 LEs and 16 multipliers, leaving ample headroom for control logic and communication stacks. Compared to a software DSP, the FPGA delivers deterministic latency critical for motor control and real-time audio preprocessing, with the Quartus II DSP Builder accelerating algorithm-to-bitstream development.
Recommandé
Display and Video Glue Logic
Consumer video applications leverage the EP1C12F256C6N for format conversion, de-interlacing, and timing generation between LCD panels and SoCs. The device's 185 user I/O pins support parallel RGB, LVDS, and DVI TMDS links, while its two PLLs synthesize the pixel clocks required for non-standard display timings. The 239,616 bits of embedded RAM act as a 2-line buffer for video scaling, and the Cyclone architecture's fast carry chain handles chroma interpolation at low cost.
Recommandé
Communication Protocol Bridging
The EP1C12F256C6N serves as a low-latency bridge between legacy and modern serial interfaces, such as UART-to-Ethernet, I2C-to-SPI, or custom proprietary protocols. Its 12,060 LEs comfortably implement multiple UART cores alongside TCP/IP offload logic, while the 256-ball FBGA's 185 user I/Os handle multi-channel bridging without external muxing. The device's industrial temperature variant (EP1C12F256I7N) suits outdoor telecom and substation deployments where ambient temperatures exceed commercial limits.
Recommandé
Education and Rapid Prototyping
Universities and design houses use the EP1C12F256C6N on Altera DE1 / DE2 development boards because its 12,060 LEs accommodate processor cores (NIOS II), peripherals, and student designs simultaneously. The mature Quartus II toolchain with free license and abundant reference designs lowers the learning curve, while the 256-ball FBGA exposes enough I/O for SDRAM, VGA, audio codec, and GPIO expansion. The part's long lifecycle in last-time-buy status means existing university labs can continue to source replacement parts for repair.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C12F256C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C12F256C8N | EP1C12F256C7N | EP1C12F256I7N | EP1C12F256I6N | EP1C12F256C6AA |
|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256) | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Logic Elements | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 | 12,060 |
| Speed Grade | 6 | 8 (slower) | 7 | 7 | 6 | 6 |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) |
| Embedded RAM (bits) | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 | 239,616 |
| User I/O Pins | 185 | 185 | 185 | 185 | 185 | 185 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principaux différenciateurs
- Mid-density Cyclone silicon (12,060 LEs) with mature toolchain (vs EP1C6Q240C8N (6,000 LEs))
- Fastest speed grade (C6) in the F256 commercial-temperature family (vs EP1C12F256C8N)
- Commercial temperature range suitable for indoor industrial use (vs EP1C12F256I7N)
Notes de conception
The 256-ball FBGA package has a 1.0 mm ball pitch, which demands microvia or via-in-pad PCB technology for reliable assembly. Per Cyclone Device Handbook layout guidelines, use a 4 to 6 layer stack-up with continuous ground and power planes beneath the BGA, and route all decoupling capacitors on the top layer with short traces to the balls. Estimate: a 6-layer stack with 0.5 oz copper and 1.0 mm pitch requires ENIG surface finish and an 8-12 mil laser-drilled microvia.
The EP1C12F256C6N requires three power rails: VCCINT (1.5 V core), VCCIO (1.5/1.8/2.5/3.3 V per bank), and VCC_PLL (1.5 V analog PLL supply). Each PLL requires its own filtered analog supply with an RC filter (10 ohm + 1 uF) to minimize jitter. Bulk decoupling should include at least 100 uF tantalum and 10 uF ceramic per rail, with 0.1 uF and 0.01 uF ceramics placed within 100 mils of every VCC pin.
Do not apply VCCIO before VCCINT during power-up - this forward-biases the I/O ESD diodes and may damage the device. The Cyclone handbook mandates VCCINT ramp first, followed by VCCIO within 100 ms. Estimated: a typical inrush current of 1-2 A on VCCINT at 1.5 V requires a soft-start regulator or power sequencer (e.g., LTC2923). Always use an EPCS serial flash or JTAG programmer; modern Active Serial (AS) mode is recommended over passive serial for production.
Although the Cyclone family dissipates relatively little power (typically 0.3 to 1.5 W depending on toggle rate), the FBGA package has a theta-JA of approximately 15 C/W with adequate PCB copper. Estimate: at 1.0 W dissipation in a 25 C ambient, junction temperature rises 15 C to 40 C - well within the 85 C commercial limit. For sealed enclosures, derate toggle rate by 20-30% to maintain thermal margin.
Informations de conformité
Compliance status not explicitly stated in the verified web data. Some Cyclone F256 variants include a Pb-free finish (e.g., EP1C12F256C6AA); check the part marking for specific finish. The part is not AEC-Q100 qualified; choose an automotive-grade Cyclone (e.g., EP1C12F256I7N-A) if required.
