EP1C3XXB - Intel/Altera Cyclone FPGA | FBGA Package
Référence : EP1C3XXB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
EP1C3XXB Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect fabric, and configurable I/O that can be reprogrammed after manufacturing to implement custom digital circuits. FPGAs sit in the broader semiconductor hierarchy as reconfigurable logic devices, distinct from ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices). The Cyclone family was Altera's (now Intel FPGA's) low-cost, high-volume FPGA line targeting cost-sensitive applications such as digital signal processing, communications, and industrial control.
According to distributor listings, the EP1C3XXB belongs to the Cyclone series of programmable logic ICs. The "EP1C" prefix identifies it as a Cyclone-family device (EP1C3 = Cyclone device density tier 3, the lowest-density member of the family). The trailing "XXB" suffix appears to denote a packaging code. Key features advertised by distributors include a fine-pitch BGA package, surface-mount construction, and industrial-grade operating characteristics. For detailed specifications including logic elements, RAM blocks, I/O count, and maximum operating frequency, consult the manufacturer's official datasheet.
Typical applications for Cyclone-series FPGAs include digital signal processing (DSP), video and image processing, communications protocol bridging, industrial automation, motor control, and embedded computing. The device is suitable for prototype development, low-volume production, and educational platforms. The FBGA package supports high I/O density in a compact footprint suitable for space-constrained designs.
When designing with the EP1C3XXB, verify the exact part variant against the manufacturer's datasheet, as the suffix code determines package pin count, speed grade, and operating temperature range. Use Intel Quartus II or the Intel Quartus Prime design software for HDL synthesis, place-and-route, and bitstream generation. Confirm ball-out assignments from the official Cyclone device pin-out files before PCB layout.
This page synthesizes distributor availability data and cross-reference search results not found in the manufacturer datasheet, providing sourcing intelligence for procurement engineers.
Alternatives de remplacement direct pour EP1C3XXB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3XXB (même facteur de forme et même empreinte) — différant par Core Voltage, Logic Elements, Operating Temperature, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T100C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.2 / unité
Voir la fiche technique →EP1C3T144I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$55.8 / unité
Voir la fiche technique →EP1C3XXB Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel (formerly Altera) |
| Series | Cyclone FPGA family |
| Device Density Tier | Cyclone EP1C3 (lowest density) |
| Product Type | FPGA - Field Programmable Gate Array |
| Package Type | FBGA (Fine-pitch Ball Grid Array) |
| Type de montage | Surface Mount |
| Design Software | Intel Quartus II / Quartus Prime |
Guide de configuration des broches du EP1C3XXB fbga (fine-pitch ball grid array)
Configuration des broches du EP1C3XXB (boîtier fbga (fine-pitch ball grid array)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1C3XXB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1C3XXB convient pour 6 applications: Digital Signal Processing (DSP), Industrial Control and Automation, Communications Protocol Bridging, Video and Image Processing Front-Ends, Embedded Computing and Custom Peripherals, Prototype Development and Education.
Digital Signal Processing (DSP)
The EP1C3XXB, as a member of the Intel Cyclone FPGA family, is suited for low-density digital signal processing tasks where its reprogrammable logic fabric can implement FIR filters, FFT engines, and custom DSP datapaths. Cyclone FPGAs deliver deterministic latency and parallel processing capability that microcontrollers cannot match, while the EP1C3 density tier provides enough logic elements for single-channel audio processing, simple motor control algorithms, or sensor signal conditioning. Engineers typically pair the device with external ADC/DAC converters and use Quartus II MegaWizard Plug-Ins to instantiate DSP IP blocks. The FBGA package requires careful PCB thermal design and signal-integrity-aware layout for high-speed DSP data paths.
Recommandé
Industrial Control and Automation
The EP1C3XXB FPGA serves well in industrial control applications requiring custom logic for PLC interfaces, motor drive control, and sensor fusion. Its reprogrammable nature allows field updates for protocol changes or bug fixes without hardware replacement. The Cyclone family's deterministic timing and parallel I/O handling make it suitable for multi-axis stepper motor control, encoder interfacing, and high-speed digital I/O expansion. Industrial users benefit from long-lifecycle FPGA availability for equipment with 10-20 year service lifetimes. The FBGA package and surface-mount construction suit modern compact industrial controller designs.
Recommandé
Communications Protocol Bridging
The EP1C3XXB can implement custom protocol bridges between industrial communication standards such as UART, SPI, I2C, CAN, RS-485, and proprietary fieldbus variants. Cyclone FPGAs excel at multi-protocol bridging because they can simultaneously run several hardware state machines in parallel, each handling a different protocol stream. The EP1C3 density tier supports bridging applications with 2-3 concurrent protocol channels. Engineers use Cyclone FPGAs to extend the life of legacy equipment by adding modern protocol interfaces without replacing installed microcontroller firmware.
Recommandé
Video and Image Processing Front-Ends
The EP1C3XXB in an FBGA package suits compact video processing front-ends where it can perform real-time pixel-level operations such as color space conversion, scaling, deinterlacing, or simple edge detection. While the EP1C3 density tier is limited for full HD video pipelines, it handles CIF-resolution (352x288) or VGA (640x480) processing comfortably. The BGA package's high pin density supports wide video buses (16-24 bit parallel) required for video ADC/DAC interfacing. Cyclone FPGAs remain popular for low-cost camera modules and machine-vision pre-processing subsystems.
Recommandé
Embedded Computing and Custom Peripherals
The EP1C3XXB functions as a custom peripheral companion to microprocessors in embedded systems, offloading real-time tasks such as PWM generation, quadrature decoding, or high-speed parallel data capture. By offloading these functions to an FPGA, the host CPU is freed for application-level work. The Cyclone family's LVDS and high-speed I/O support enables interfacing to high-bandwidth sensors and ADCs. The FBGA package keeps the footprint small enough to add FPGA-based peripherals to space-constrained embedded boards.
Recommandé
Prototype Development and Education
The EP1C3XXB serves as a low-cost entry point for FPGA learning, digital logic education, and prototype development. The Cyclone family is well-supported by Quartus II tutorials, university course materials, and open-source reference designs. Students and engineers can implement simple processors, state machines, and communication interfaces to learn HDL design and FPGA tool flows. The FBGA package is more challenging for hand-prototyping than TQFP variants, so educational users often select TQFP-packaged Cyclone variants for breadboard-compatible development.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3XXB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T100C8N | EP1C3T144I7N |
|---|---|---|---|
| Package | FBGA (specific ball count unknown) | TQFP-100 (different package) | TQFP-144 (different package) |
| Brand | Intel | Intel | Intel |
| Design Software | Quartus II / Quartus Prime | Quartus II / Quartus Prime | Quartus II / Quartus Prime |
| Series Generation | Cyclone (original) | Cyclone (original) | Cyclone (original) |
Principaux différenciateurs
- Lowest-density Cyclone FPGA tier for cost-sensitive applications (vs EP1C6-series Cyclone FPGAs)
- Compact FBGA package for high-density PCB designs (vs EP1C3T100 / EP1C3T144 TQFP variants)
Notes de conception
The EP1C3XXB uses an FBGA (Fine-pitch Ball Grid Array) package per distributor listings, which requires careful PCB layout: escape routing for inner balls, microvia or via-in-pad technology for high-density designs, and matched-length routing for high-speed differential pairs. Confirm exact ball count and pinout from the manufacturer datasheet before finalizing PCB layout. BGA packages cannot be hand-soldered, requiring reflow assembly with X-ray inspection for solder joint verification.
Verify the exact Cyclone device variant before design finalization. The 'XXB' suffix in EP1C3XXB does not match standard Cyclone part numbering conventions (which typically use codes like T144, Q240, F256 for package and I7/I8 for speed grade). Confirm with the supplier whether EP1C3XXB is a custom part marking, a packaging variant, or a third-party relabel. For new designs, prefer standard EP1C3T144 or EP1C6Q240 part numbers with full datasheet coverage.
BGA packages concentrate heat dissipation through the ball grid into the PCB. For the EP1C3XXB, design the PCB with adequate thermal vias under the package and sufficient copper pour area on inner layers. FPGA power consumption scales with logic utilization, clock frequency, and toggle rate. At typical Cyclone utilization (50-70%), expect 0.5-1.5W core power. Use the Quartus PowerPlay analyzer to estimate junction temperature for your specific design.
Informations de conformité
Compliance information not available in verified web data. As an Intel/Altera legacy Cyclone-family FPGA, RoHS compliance depends on the specific date code and variant - confirm with the manufacturer or distributor for the date code being purchased.
