EP1C3T100C8N - Cyclone FPGA, 2910 LEs, 65 I/O, TQFP-100 | Intel
Référence : EP1C3T100C8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $23.5 | $23,50 |
| 10 | $21.2 | $212,00 |
| 100 | $18.75 | $1 875,00 |
| 500 | $16.4 | $8 200,00 |
| 1 000 | $14.2 | $14 200,00 |
EP1C3T100C8N Présentation
What is a Cyclone FPGA? The Cyclone family is Intel FPGA's low-cost, high-volume programmable logic series, positioned below the Stratix high-performance family in the FPGA hierarchy: FPGA -> SRAM-based programmable logic -> programmable logic device (PLD) -> digital logic IC. Cyclone parts target glue-logic, bus bridging, and DSP pre/post-processing in cost-sensitive designs where the high-end Stratix I/O bandwidth and transceivers are unnecessary. The 'N' suffix indicates lead-free, RoHS-compliant packaging.
Key features include 2,910 logic elements organized into 291 logic array blocks (LABs), 13 embedded 4-Kbit M4K RAM blocks totaling ~60 Kbits, one PLL per device with up to four output taps, support for LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards, and in-system programmability through the passive serial (PS), fast passive parallel (FPP), or JTAG configuration interfaces. The TQFP-100 footprint simplifies PCB layout for low-density designs.
Architecturally, the EP1C3T100C8N uses a 4-input look-up table (LUT) based logic element with embedded carry chains for arithmetic and dedicated M4K memory blocks. The single PLL provides clock multiplication, division, and phase shift for up to three or four output clocks, sufficient for basic DDR memory interfaces and standard video/serializer timing.
Typical applications include low-cost video processing, industrial control logic, consumer electronics glue logic, education and prototyping platforms, and serial protocol bridging (UART, SPI, I2C). The part is widely used in legacy designs that pre-date Cyclone II/III/IV migration; many production designs still rely on the EP1C3 due to its low unit cost and long-term Intel supply commitment.
Design consideration: The EP1C3 uses a 1.5 V core and requires a separate configuration memory or download cable for in-system programming. Plan for the 1.5 V regulator (e.g., a small LDO) and a JTAG header on the PCB. Signal integrity at 100+ MHz requires impedance-controlled traces on the LVDS pairs.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone family, and practical design notes not collected in the manufacturer datasheet.
Alternatives de remplacement direct pour EP1C3T100C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C3T100C8N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Family, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C3T100C8
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP1C3T100C6N
✅ Remplacement direct✓ En stock
$13.5 / unité
Voir la fiche technique →EP1C3T100C7N
✅ Remplacement direct✓ En stock
$10.6 / unité
Voir la fiche technique →EP1C3T10017N
✅ Remplacement direct✓ En stock
$9.6 / unité
Voir la fiche technique →EP1C3T100C6
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EP1C3T100I7N
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EP1C3T100C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone |
| Logic Elements | 2,910 |
| Logic Array Blocks (LABs) | 291 |
| Total RAM Bits | 59,904 |
| Embedded RAM Blocks | 13 x M4K (4 Kbit each) |
| Maximum User I/Os | 65 |
| PLLs | 1 |
| Operating Frequency (max) | 275 MHz |
| Core Voltage | 1.425 V to 1.575 V |
| Process Technology | 130 nm CMOS |
| Boîtier | TQFP-100 (100-pin Thin Quad Flat Pack), 16 x 16 mm, 0.5 mm pitch |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Configuration Interface | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant (lead-free, 'N' suffix) |
Configuration des broches de EP1C3T100C8N
| Broche 1 | I/O — User I/O (Bank 1) |
| Broche 2 | I/O — User I/O (Bank 1) |
| Broche 3 | I/O — User I/O (Bank 1) |
| Broche 4 | I/O — User I/O (Bank 1) |
| Broche 5 | VCCINT — Core supply voltage 1.5 V |
| Broche 6 | I/O — User I/O (Bank 1) |
| Broche 7 | I/O — User I/O (Bank 1) |
| Broche 8 | I/O — User I/O (Bank 1) |
| Broche 9 | I/O — User I/O (Bank 1) |
| Broche 10 | I/O — User I/O (Bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O (Bank 1) |
| Broche 13 | I/O — User I/O (Bank 1) |
| Broche 14 | I/O — User I/O (Bank 1) |
| Broche 15 | I/O — User I/O (Bank 1) |
| Broche 16 | VCCIO1 — I/O Bank 1 supply voltage |
| Broche 17 | I/O — User I/O (Bank 1) |
| Broche 18 | I/O — User I/O (Bank 1) |
| Broche 19 | I/O — User I/O (Bank 1) |
| Broche 20 | I/O — User I/O (Bank 1) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O (Bank 2) |
| Broche 23 | I/O — User I/O (Bank 2) |
| Broche 24 | I/O — User I/O (Bank 2) |
| Broche 25 | I/O — User I/O (Bank 2) |
| Broche 26 | I/O — User I/O (Bank 2) |
| Broche 27 | TMS — JTAG Test Mode Select |
| Broche 28 | TCK — JTAG Test Clock |
| Broche 29 | TDO — JTAG Test Data Out |
| Broche 30 | TDI — JTAG Test Data In |
| Broche 31 | nSTATUS — Configuration status (active low) |
| Broche 32 | nCONFIG — Configuration start (active low) |
| Broche 33 | CONF_DONE — Configuration complete (open drain) |
| Broche 34 | DCLK — Configuration clock input |
| Broche 35 | DATA0 — Configuration data input |
| Broche 36 | VCCINT — Core supply voltage 1.5 V |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O (Bank 2) |
| Broche 39 | I/O — User I/O (Bank 2) |
| Broche 40 | I/O — User I/O (Bank 2) |
| Broche 41 | I/O — User I/O (Bank 2) |
| Broche 42 | I/O — User I/O (Bank 2) |
| Broche 43 | I/O — User I/O (Bank 2) |
| Broche 44 | I/O — User I/O (Bank 2) |
| Broche 45 | I/O — User I/O (Bank 2) |
| Broche 46 | GND — Ground |
| Broche 47 | I/O — User I/O (Bank 2) |
| Broche 48 | I/O — User I/O (Bank 2) |
| Broche 49 | I/O — User I/O (Bank 2) |
| Broche 50 | VCCIO2 — I/O Bank 2 supply voltage |
| Broche 51 | I/O — User I/O (Bank 3) |
| Broche 52 | I/O — User I/O (Bank 3) |
| Broche 53 | I/O — User I/O (Bank 3) |
| Broche 54 | I/O — User I/O (Bank 3) |
| Broche 55 | I/O — User I/O (Bank 3) |
| Broche 56 | I/O — User I/O (Bank 3) |
| Broche 57 | I/O — User I/O (Bank 3) |
| Broche 58 | GND — Ground |
| Broche 59 | I/O — User I/O (Bank 3) |
| Broche 60 | I/O — User I/O (Bank 3) |
| Broche 61 | I/O — User I/O (Bank 3) |
| Broche 62 | I/O — User I/O (Bank 3) |
| Broche 63 | VCCIO3 — I/O Bank 3 supply voltage |
| Broche 64 | I/O — User I/O (Bank 3) |
| Broche 65 | I/O — User I/O (Bank 3) |
| Broche 66 | I/O — User I/O (Bank 3) |
| Broche 67 | I/O — User I/O (Bank 3) |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O (Bank 4) |
| Broche 70 | I/O — User I/O (Bank 4) |
| Broche 71 | I/O — User I/O (Bank 4) |
| Broche 72 | I/O — User I/O (Bank 4) |
| Broche 73 | I/O — User I/O (Bank 4) |
| Broche 74 | I/O — User I/O (Bank 4) |
| Broche 75 | I/O — User I/O (Bank 4) |
| Broche 76 | VCCINT — Core supply voltage 1.5 V |
| Broche 77 | I/O — User I/O (Bank 4) |
| Broche 78 | I/O — User I/O (Bank 4) |
| Broche 79 | I/O — User I/O (Bank 4) |
| Broche 80 | I/O — User I/O (Bank 4) |
| Broche 81 | GND — Ground |
| Broche 82 | I/O — User I/O (Bank 4) |
| Broche 83 | I/O — User I/O (Bank 4) |
| Broche 84 | I/O — User I/O (Bank 4) |
| Broche 85 | I/O — User I/O (Bank 4) |
| Broche 86 | VCCIO4 — I/O Bank 4 supply voltage |
| Broche 87 | I/O — User I/O (Bank 4) |
| Broche 88 | I/O — User I/O (Bank 4) |
| Broche 89 | I/O — User I/O (Bank 4) |
| Broche 90 | I/O — User I/O (Bank 4) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O (Bank 4) |
| Broche 93 | I/O — User I/O (Bank 4) |
| Broche 94 | I/O — User I/O (Bank 4) |
| Broche 95 | I/O — User I/O (Bank 4) |
| Broche 96 | I/O — User I/O (Bank 4) |
| Broche 97 | I/O — User I/O (Bank 4) |
| Broche 98 | I/O — User I/O (Bank 4) |
| Broche 99 | I/O — User I/O (Bank 4) |
| Broche 100 | I/O — User I/O (Bank 4) |
Applications typiques
EP1C3T100C8N convient pour 6 applications: Industrial Control Logic, Video Processing Front-End, Consumer Electronics Glue Logic, Education and Prototyping Platforms, Serial Protocol Bridging, Legacy System Sustainment.
Industrial Control Logic
The EP1C3T100C8N's 2,910 logic elements and 65 user I/Os make it well-suited for industrial control boards where multiple sensor inputs and actuator outputs must be coordinated with deterministic timing. The single PLL generates stable clocks for motor-control PWM modules, and the 130 nm CMOS architecture tolerates the wide temperature swings common in factory-floor enclosures when paired with the I-temp variant. Engineers value the TQFP-100 footprint for hand-solderable prototypes and field-replaceable designs.
Recommandé
Video Processing Front-End
The 13 embedded M4K RAM blocks (totaling ~60 Kbits) and 1 PLL on the EP1C3T100C8N provide enough on-chip buffering and clock synthesis for cost-sensitive video front-ends such as line buffers, color-space converters, and overlay mixers. LVTTL/LVCMOS I/O standards support parallel digital video interfaces (BT.656, BT.601) at standard definition, while the 275 MHz internal operation comfortably handles pixel-clock domains. The TQFP-100 footprint is preferred over BGA for hand-rework in low-volume broadcast equipment.
Recommandé
Consumer Electronics Glue Logic
Consumer devices that need a small amount of custom logic - protocol bridging, format conversion, LED driving - frequently use the EP1C3T100C8N because of its sub-$15 unit price at volume and Intel's long-term supply commitment. The 100-pin TQFP mounts on standard 4-layer FR-4 with no BGA rework equipment required, keeping manufacturing cost low for high-volume SKUs. The 4-input LUT architecture easily implements UART/SPI/I2C bridges and small state machines.
Recommandé
Education and Prototyping Platforms
Universities and FPGA-training labs use the EP1C3T100C8N as a low-risk teaching platform because the TQFP-100 package is hand-solderable on breakout boards, the Quartus II toolchain is free, and the device has abundant reference designs online. The 2,910 LE capacity is enough to teach RTL coding, finite state machines, basic DSP, and soft-core CPU implementations (e.g. Nios II) without overwhelming students with device complexity. Many Altera/Intel DE-series boards use Cyclone parts for the same reasons.
Recommandé
Serial Protocol Bridging
The EP1C3T100C8N is widely deployed as a bridge between incompatible serial interfaces - UART-to-SPI, I2C-to-SMBus, RS-232-to-USB, or proprietary sensor protocols. The 65 user I/Os allow multiple bus controllers to be implemented in parallel, and the 1 PLL provides clock synthesis for any baud rate or SPI clock frequency needed. The Cyclone architecture's deterministic timing avoids the latency jitter that microcontroller-based bridges introduce.
Recommandé
Legacy System Sustainment
Long-lifecycle industrial and aerospace systems designed in the early 2000s often depend on the EP1C3T100C8N and must continue production for 10-20 years. Intel's active support for the Cyclone family, combined with the part's stable silicon and TQFP-100 footprint, makes field replacements straightforward without board redesign. Legacy firmware bitstreams remain compatible with newer Quartus programmer versions, simplifying obsolescence management.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C3T100C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C3T100C8 | EP1C3T100C6N | EP1C3T100C7N | EP1C3T10017N | EP1C3T100C6 | EP1C3T100I7N |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C8 (commercial, slowest) | C8 | C6 (faster Fmax) | C7 | C8 industrial | C6 | I7 industrial |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (Industrial) | 0C to +85C | -40C to +100C (Industrial) |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| User I/Os | 65 | 65 | 65 | 65 | 65 | 65 | 65 |
| RoHS Compliance | Yes (lead-free, 'N' suffix) | No (lead-based) | Yes | Yes | Yes | No (lead-based) | Yes |
Principaux différenciateurs
- Lead-free RoHS-compliant finish (vs EP1C3T100C8 (no 'N'))
- Cost-optimized speed grade for non-critical timing paths (vs EP1C3T100C6N (speed grade C6))
- TQFP-100 hand-solderable footprint (vs EP1C3T144C8N (TQFP-144, more I/Os))
Notes de conception
The EP1C3T100C8N requires a 1.5 V VCCINT supply (1.425 V to 1.575 V) capable of sourcing up to ~300 mA during configuration plus dynamic current proportional to switching activity. Use a low-noise LDO such as the TI TPS7A4533 or a switching regulator followed by an LDO for noise-sensitive analog rails. Decouple each VCCINT pin with a 0.1 uF X7R ceramic cap plus a 10 uF bulk cap on the same PCB layer. I/O banks (VCCIO1 through VCCIO4) can run at 1.5 V, 1.8 V, 2.5 V, or 3.3 V independently - tie each unused VCCIO bank to a valid rail, do NOT leave it floating.
Route the TQFP-100 with 0.5 mm pitch using 4 mil traces and 4 mil spaces on a 4-layer FR-4 stackup. Place all configuration components (EPCS serial flash, JTAG header, nCONFIG/nSTATUS pull-ups) within 25 mm of the FPGA. The JTAG chain should include a 10 kohm pull-up on TCK, TMS, and TDI. Avoid routing LVDS signals on the top layer over the FPGA's lead frame; use inner stripline layers with continuous ground reference for the 275 MHz+ signals.
Common pitfalls: (1) leaving VCCIO banks floating will cause I/O behavior to be undefined - always power all four banks even if unused; (2) using the wrong configuration mode - the EP1C3 supports PS (passive serial, most common), FPP (fast passive parallel), and JTAG, but the MSEL pins must be tied to the correct logic levels for the chosen mode; (3) forgetting that the EP1C3 does not have dedicated DDR memory controllers - any DDR interface must be built with user logic and the M4K RAM blocks. Verify pin assignments in the Quartus Pin Planner before PCB fabrication.
Informations de conformité
RoHS compliant per the 'N' suffix in the part number. Halogen-free per Altera/Intel material declaration. AEC-Q100 not applicable for commercial-grade FPGA. For automotive applications, consider Cyclone IV or Cyclone V devices that are AEC-Q100 qualified.
