EP1S80F1020C6 - Stratix FPGA 79,040 Logic Elements | Intel
Référence : EP1S80F1020C6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1450 | $1 450,00 |
| 10 | $1395 | $13 950,00 |
| 100 | $1320 | $132 000,00 |
| 250 | $1245 | $311 250,00 |
| 500 | $1180 | $590 000,00 |
EP1S80F1020C6 Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device whose logic fabric, interconnect, and I/O are configured by the user after manufacture, allowing the same silicon to implement any digital circuit from glue logic to a multi-million-gate SoC. FPGAs belong to the broader programmable logic family, which also includes CPLDs (Complex Programmable Logic Devices). Within Intel's portfolio the Stratix line sits between the lower-density Cyclone family and the high-end Stratix GX/Stratix II families, and is built on a silicon-and-software platform that integrates hard IP blocks such as DSP slices, embedded memory (TriMatrix), and high-speed transceivers to accelerate compute-intensive and signal-processing workloads.
Key features include 79,040 logic elements (LEs), 7,427,520 bits of embedded RAM organized in TriMatrix memory blocks, DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed serializer/deserializer (SERDES) support on select pins, and 773 maximum user I/O pins. The device operates from a 1.5 V core supply (1.425 V to 1.575 V range per GlobalSpec datasheet) and is built on 130 nm process technology. The 'C6' speed grade reflects internal timing closure targets and is suitable for designs whose critical-path Fmax is within the Stratix C6 timing envelope.
The architecture pairs a four-input lookup-table (LUT)-based logic element with adjacent LE carry chains, distributed LAB (Logic Array Block) interconnect, and embedded multiplier/accumulator DSP blocks. TriMatrix memory provides three sizes of RAM block optimized for different width/depth trade-offs, supporting true dual-port, simple dual-port, and single-port modes. Configuration is loaded through a JTAG (IEEE 1149.1) boundary-scan interface or an external configuration device, and design entry is via the Quartus II development suite.
Typical applications for the EP1S80F1020C6 include telecom line cards and baseband processing, ASIC prototyping and emulation, high-performance DSP co-processing, broadcast video and image processing pipelines, and industrial control and test equipment where high logic density and embedded memory are required. The 1020-ball FC-FBGA (flip-chip fine-pitch BGA) package is intended for multilayer PCBs with high-density escape routing.
When designing with this part, allocate a 1.0 mm-pitch BGA escape fanout on at least six PCB layers, and use the Quartus II pin planner with the Stratix device handbook pinout file to verify bank-specific I/O standard support (LVTTL, LVCMOS, LVDS, SSTL, HSTL). Power integrity must be planned for the 1.5 V core rail (typically 3-6 A peak depending on utilization) with decoupling placed inside the package BGA footprint.
This page synthesizes distributor availability, package/parametric specifications, and practical design notes specific to the 1020-ball FC-FBGA package; a separate FC-FBGA pinout diagram accompanies the part on the product detail tab.
Alternatives de remplacement direct pour EP1S80F1020C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S80F1020C6 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, RoHS Status, Speed Grade, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S80F1020C6N
✅ Remplacement direct✓ En stock
$110 / unité
Voir la fiche technique →EP1S80F1020C5
✅ Remplacement direct✓ En stock
$745 / unité
Voir la fiche technique →EP1S80F1020C5N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1S60F1020C6
✅ Remplacement direct✓ En stock
$105 / unité
Voir la fiche technique →EP1S60F1020C6N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1S40F1020C6
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP1S30F1020C6
✅ Remplacement direct✓ En stock
$262 / unité
Voir la fiche technique →EP1S80F1020C6 Valeurs maximales et caractéristiques électriques
| Series | Stratix |
| Logic Elements | 79,040 |
| Total RAM Bits | 7,427,520 |
| Number of Logic Blocks / LABs | 9,191 |
| Number of I/O Pins (max) | 773 user I/O |
| Number of Pins / Balls | 1020 |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA), 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| Speed Grade | C6 |
| Operating Temperature (Commercial) | 0 C to +85 C |
| Type de montage | Surface Mount |
| Maximum Internal Clock Frequency | 450.05 MHz |
| Family Description | FPGA - Field Programmable Gate Array |
| Embedded Memory | TriMatrix (three block sizes, true/simple dual-port) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial/parallel configuration device |
| Design Tool | Quartus II (legacy, Stratix family) |
Guide de configuration des broches du EP1S80F1020C6 fc-fbga (flip-chip fine-pitch bga), 33 x 33 mm, 1.0 mm pitch
Configuration des broches du EP1S80F1020C6 (boîtier fc-fbga (flip-chip fine-pitch bga), 33 x 33 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S80F1020C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S80F1020C6 convient pour 6 applications: Telecom Line Cards and Baseband Processing, ASIC Prototyping and Emulation, High-Performance DSP Co-Processing, Broadcast Video and Image Processing Pipelines, Industrial Control and Test Equipment, Military and Aerospace Signal Processing (Legacy).
Telecom Line Cards and Baseband Processing
The EP1S80F1020C6 fits telecom line cards because its 79,040 logic elements and 7,427,520 bits of TriMatrix embedded memory support the parallel datapaths required by baseband signal processing, framing, and channel aggregation. The 773 user I/O pins accommodate dense LVDS and SSTL bus connections to DSP coprocessors, network processors, and external memory (DDR/QDR SRAM), while 130 nm CMOS at 1.5 V core keeps per-channel power manageable. Designers typically instantiate soft MAC/PHY cores in the LE fabric and use the embedded RAM for packet buffering and lookup tables. Performance: the C6 speed grade supports the internal Fmax envelope needed for multi-lane serializer/deserializer aggregation.
Recommandé
ASIC Prototyping and Emulation
ASIC prototyping and emulation is a primary use case for the EP1S80F1020C6 because 79,040 LEs and 773 user I/O pins map directly to mid-complexity ASICs with up to ~2 million ASIC gates. The 1020-ball FC-FBGA exposes enough I/O to break out large ASIC pin counts into breadboard-friendly test fixtures. The TriMatrix memory blocks partition cleanly for transaction recording and trace buffers. Performance note: the C6 speed grade allows the FPGA to emulate ASIC clock domains without timing artifacts, while Quartus II provides ASIC-to-FPGA partitioning for design bring-up.
Recommandé
High-Performance DSP Co-Processing
The EP1S80F1020C6 suits high-performance DSP co-processing because Stratix DSP blocks accelerate fixed- and floating-point arithmetic in parallel pipelines, and the 7,427,520 embedded RAM bits hold coefficient tables for FIR, FFT, and DDC operations. Typical designs pair the FPGA with a host DSP or microprocessor over a parallel host-port interface, using the 773 I/O to stream data in and out at hundreds of MHz. The 1.5 V core and C6 speed grade support real-time radar, sonar, and software-defined radio workloads where hardware multiplication must beat software loops.
Recommandé
Broadcast Video and Image Processing Pipelines
Broadcast video and image processing pipelines benefit from the EP1S80F1020C6's high LE count and embedded memory bandwidth. The 7.4 Mbit TriMatrix RAM holds line buffers and frame stores for color-space conversion, scaling, and deinterlacing. The 1020-ball FC-FBGA package exposes enough LVDS pairs to ingest SDI/HDMI/DVI streams and drive DDR2 memory at hundreds of megabytes per second. Performance: C6 timing closes at the pixel clocks typical of 1080p60 (148.5 MHz) and dual-link SDI (297 MHz) pipelines, while the 773 I/O count allows parallel pixel buses at full color depth.
Recommandé
Industrial Control and Test Equipment
Industrial control and test equipment benefit from the EP1S80F1020C6's combination of logic density, I/O count, and commercial temperature range (0 C to +85 C). The 773 user I/O pins accommodate parallel sensor arrays, encoder inputs, and actuator drivers, while the TriMatrix memory captures high-speed transient data for scopes and logic analyzers. The C6 speed grade supports deterministic timing for PID loops and motor-control PWM generation. Industrial designs typically use Quartus II to instantiate soft processor cores (Nios II) for closed-loop control alongside custom datapath logic.
Recommandé
Military and Aerospace Signal Processing (Legacy)
Legacy military and aerospace signal processing platforms still operate with the EP1S80F1020C6 because the Stratix family was widely designed into radar, EW, and secure-communication systems in the 2003-2010 era. With 79,040 LEs and 7.4 Mbit embedded RAM, the device fits DSP-heavy signal-processing channels, while the 1020-ball FC-FBGA supports the dense board layouts typical of avionics and shipboard electronics. Designers working in this segment should verify availability through authorized defense distributors and check the lifecycle status of the wider Stratix family for long-term support planning.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S80F1020C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S80F1020C6N | EP1S80F1020C5 | EP1S60F1020C6 | EP1S40F1020C6 | EP1S30F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Speed Grade | C6 | C6 | C5 (slower) | C6 | C6 | C6 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Core Supply Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Lead-free equivalent available in identical FC-FBGA-1020 package (vs EP1S80F1020C6N)
- Higher speed-grade timing margin than C5 variant (vs EP1S80F1020C5)
- Highest logic density in the Stratix FC-FBGA-1020 family (vs EP1S60F1020C6)
- Doubles the logic density of the EP1S40 in the same package (vs EP1S40F1020C6)
Notes de conception
Estimated: at a 1.0 mm ball pitch across a 33 x 33 mm package, escape routing requires a minimum 6-layer PCB with microvia (laser-drilled) stack-up to fan out the inner rows. Use the Quartus II pin planner to place high-speed LVDS/SSTL pairs on bank-aligned pins, and route differential pairs with 100 ohm differential impedance over a continuous reference plane. Decoupling: place 0.1 uF and 0.01 uF MLCCs on every four VCCINT/VCCP balls inside the BGA footprint to suppress the 130 nm core switching transients.
Estimated: the 1.5 V core rail typically draws 3-6 A peak depending on LE utilization and clock rate; with a 1.5 V nominal and 130 nm process, designers should plan a 4-layer power plane and an LDO or buck converter sized for at least 50% margin above the steady-state current. Add bulk tantalum or polymer capacitors (470-1000 uF) on the 1.5 V rail at the BGA perimeter to absorb inrush during configuration bitstream loading.
Although the 1020-ball FC-FBGA package provides excellent thermal performance through its flip-chip attach, the EP1S80F1020C6 at 79,040 LEs can still dissipate 5-10 W in typical designs. Provide thermal vias in the BGA land pattern to a copper flood on the opposite PCB layer, and verify junction temperature against the 0 C to +85 C commercial envelope using the Quartus II PowerPlay early-power estimator before sign-off.
Do not confuse the EP1S80F1020C6 with the EP1S80F1020C5 (lower speed grade) or EP1S80F1020I6 (industrial temperature) - both share the same FC-FBGA-1020 footprint but differ in timing closure and temperature rating. Because the Stratix family is obsolete, configuration devices (EPCS/EPC) for these parts may also be scarce - verify availability of EPCS64 or compatible configuration memories in parallel with FPGA sourcing.
Recommended: place configuration mode jumpers (MSEL pins) and JTAG header within 50 mm of the FPGA to avoid signal-integrity issues on TCK/TMS/TDO/TDI. Stratix requires MSEL pins tied to a known configuration mode (e.g., FPP x16 or Passive Serial); floating MSEL pins cause configuration failures that are difficult to debug post-assembly.
Informations de conformité
Lead-free/RoHS compliance can only be confirmed by checking the 'N' suffix variants (e.g., EP1S80F1020C6N). The base EP1S80F1020C6 was originally released in 2002-2003 era when terminal finishes were often SnPb; RoHS/REACH data is not available in the verified web sources. AEC-Q100 is not applicable - this is a commercial/industrial-grade FPGA.
