EP1S80F1020C6 - Stratix FPGA 79,040 Logic Elements | Intel
부품 번호: EP1S80F1020C6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1395 | $13,950.00 |
| 100 | $1320 | $132,000.00 |
| 250 | $1245 | $311,250.00 |
| 500 | $1180 | $590,000.00 |
EP1S80F1020C6 개요
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device whose logic fabric, interconnect, and I/O are configured by the user after manufacture, allowing the same silicon to implement any digital circuit from glue logic to a multi-million-gate SoC. FPGAs belong to the broader programmable logic family, which also includes CPLDs (Complex Programmable Logic Devices). Within Intel's portfolio the Stratix line sits between the lower-density Cyclone family and the high-end Stratix GX/Stratix II families, and is built on a silicon-and-software platform that integrates hard IP blocks such as DSP slices, embedded memory (TriMatrix), and high-speed transceivers to accelerate compute-intensive and signal-processing workloads.
Key features include 79,040 logic elements (LEs), 7,427,520 bits of embedded RAM organized in TriMatrix memory blocks, DSP blocks for fixed- and floating-point arithmetic, dedicated high-speed serializer/deserializer (SERDES) support on select pins, and 773 maximum user I/O pins. The device operates from a 1.5 V core supply (1.425 V to 1.575 V range per GlobalSpec datasheet) and is built on 130 nm process technology. The 'C6' speed grade reflects internal timing closure targets and is suitable for designs whose critical-path Fmax is within the Stratix C6 timing envelope.
The architecture pairs a four-input lookup-table (LUT)-based logic element with adjacent LE carry chains, distributed LAB (Logic Array Block) interconnect, and embedded multiplier/accumulator DSP blocks. TriMatrix memory provides three sizes of RAM block optimized for different width/depth trade-offs, supporting true dual-port, simple dual-port, and single-port modes. Configuration is loaded through a JTAG (IEEE 1149.1) boundary-scan interface or an external configuration device, and design entry is via the Quartus II development suite.
Typical applications for the EP1S80F1020C6 include telecom line cards and baseband processing, ASIC prototyping and emulation, high-performance DSP co-processing, broadcast video and image processing pipelines, and industrial control and test equipment where high logic density and embedded memory are required. The 1020-ball FC-FBGA (flip-chip fine-pitch BGA) package is intended for multilayer PCBs with high-density escape routing.
When designing with this part, allocate a 1.0 mm-pitch BGA escape fanout on at least six PCB layers, and use the Quartus II pin planner with the Stratix device handbook pinout file to verify bank-specific I/O standard support (LVTTL, LVCMOS, LVDS, SSTL, HSTL). Power integrity must be planned for the 1.5 V core rail (typically 3-6 A peak depending on utilization) with decoupling placed inside the package BGA footprint.
This page synthesizes distributor availability, package/parametric specifications, and practical design notes specific to the 1020-ball FC-FBGA package; a separate FC-FBGA pinout diagram accompanies the part on the product detail tab.
드롭인 대체품: EP1S80F1020C6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1S80F1020C6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, RoHS Status, Speed Grade, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1S80F1020C6N
✅ 드롭인✓ 재고 있음
$110 / 개
데이터시트 보기 →EP1S80F1020C5
✅ 드롭인✓ 재고 있음
$745 / 개
데이터시트 보기 →EP1S80F1020C5N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP1S60F1020C6
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP1S60F1020C6N
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1S40F1020C6
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP1S30F1020C6
✅ 드롭인✓ 재고 있음
$262 / 개
데이터시트 보기 →EP1S80F1020C6 최대 정격 & 전기적 특성
| Series | Stratix |
| Logic Elements | 79,040 |
| Total RAM Bits | 7,427,520 |
| Number of Logic Blocks / LABs | 9,191 |
| Number of I/O Pins (max) | 773 user I/O |
| Number of Pins / Balls | 1020 |
| Package Type | FC-FBGA (flip-chip fine-pitch BGA), 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V nominal (1.425 V to 1.575 V) |
| Speed Grade | C6 |
| Operating Temperature (Commercial) | 0 C to +85 C |
| 실장 유형 | Surface Mount |
| Maximum Internal Clock Frequency | 450.05 MHz |
| Family Description | FPGA - Field Programmable Gate Array |
| Embedded Memory | TriMatrix (three block sizes, true/simple dual-port) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial/parallel configuration device |
| Design Tool | Quartus II (legacy, Stratix family) |
EP1S80F1020C6 fc-fbga (flip-chip fine-pitch bga), 33 x 33 mm, 1.0 mm pitch 핀 구성 가이드
EP1S80F1020C6(fc-fbga (flip-chip fine-pitch bga), 33 x 33 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1S80F1020C6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1S80F1020C6 적합 용도: 6 애플리케이션s: Telecom Line Cards and Baseband Processing, ASIC Prototyping and Emulation, High-Performance DSP Co-Processing, Broadcast Video and Image Processing Pipelines, Industrial Control and Test Equipment, Military and Aerospace Signal Processing (Legacy).
Telecom Line Cards and Baseband Processing
The EP1S80F1020C6 fits telecom line cards because its 79,040 logic elements and 7,427,520 bits of TriMatrix embedded memory support the parallel datapaths required by baseband signal processing, framing, and channel aggregation. The 773 user I/O pins accommodate dense LVDS and SSTL bus connections to DSP coprocessors, network processors, and external memory (DDR/QDR SRAM), while 130 nm CMOS at 1.5 V core keeps per-channel power manageable. Designers typically instantiate soft MAC/PHY cores in the LE fabric and use the embedded RAM for packet buffering and lookup tables. Performance: the C6 speed grade supports the internal Fmax envelope needed for multi-lane serializer/deserializer aggregation.
추천
ASIC Prototyping and Emulation
ASIC prototyping and emulation is a primary use case for the EP1S80F1020C6 because 79,040 LEs and 773 user I/O pins map directly to mid-complexity ASICs with up to ~2 million ASIC gates. The 1020-ball FC-FBGA exposes enough I/O to break out large ASIC pin counts into breadboard-friendly test fixtures. The TriMatrix memory blocks partition cleanly for transaction recording and trace buffers. Performance note: the C6 speed grade allows the FPGA to emulate ASIC clock domains without timing artifacts, while Quartus II provides ASIC-to-FPGA partitioning for design bring-up.
추천
High-Performance DSP Co-Processing
The EP1S80F1020C6 suits high-performance DSP co-processing because Stratix DSP blocks accelerate fixed- and floating-point arithmetic in parallel pipelines, and the 7,427,520 embedded RAM bits hold coefficient tables for FIR, FFT, and DDC operations. Typical designs pair the FPGA with a host DSP or microprocessor over a parallel host-port interface, using the 773 I/O to stream data in and out at hundreds of MHz. The 1.5 V core and C6 speed grade support real-time radar, sonar, and software-defined radio workloads where hardware multiplication must beat software loops.
추천
Broadcast Video and Image Processing Pipelines
Broadcast video and image processing pipelines benefit from the EP1S80F1020C6's high LE count and embedded memory bandwidth. The 7.4 Mbit TriMatrix RAM holds line buffers and frame stores for color-space conversion, scaling, and deinterlacing. The 1020-ball FC-FBGA package exposes enough LVDS pairs to ingest SDI/HDMI/DVI streams and drive DDR2 memory at hundreds of megabytes per second. Performance: C6 timing closes at the pixel clocks typical of 1080p60 (148.5 MHz) and dual-link SDI (297 MHz) pipelines, while the 773 I/O count allows parallel pixel buses at full color depth.
추천
Industrial Control and Test Equipment
Industrial control and test equipment benefit from the EP1S80F1020C6's combination of logic density, I/O count, and commercial temperature range (0 C to +85 C). The 773 user I/O pins accommodate parallel sensor arrays, encoder inputs, and actuator drivers, while the TriMatrix memory captures high-speed transient data for scopes and logic analyzers. The C6 speed grade supports deterministic timing for PID loops and motor-control PWM generation. Industrial designs typically use Quartus II to instantiate soft processor cores (Nios II) for closed-loop control alongside custom datapath logic.
추천
Military and Aerospace Signal Processing (Legacy)
Legacy military and aerospace signal processing platforms still operate with the EP1S80F1020C6 because the Stratix family was widely designed into radar, EW, and secure-communication systems in the 2003-2010 era. With 79,040 LEs and 7.4 Mbit embedded RAM, the device fits DSP-heavy signal-processing channels, while the 1020-ball FC-FBGA supports the dense board layouts typical of avionics and shipboard electronics. Designers working in this segment should verify availability through authorized defense distributors and check the lifecycle status of the wider Stratix family for long-term support planning.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1S80F1020C6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1S80F1020C6N | EP1S80F1020C5 | EP1S60F1020C6 | EP1S40F1020C6 | EP1S30F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | FC-FBGA-1020 (33x33 mm, 1.0 mm pitch) | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same | FC-FBGA-1020 - same |
| Speed Grade | C6 | C6 | C5 (slower) | C6 | C6 | C6 |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Core Supply Voltage | 1.5 V (1.425 V - 1.575 V) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Lead-free equivalent available in identical FC-FBGA-1020 package (vs EP1S80F1020C6N)
- Higher speed-grade timing margin than C5 variant (vs EP1S80F1020C5)
- Highest logic density in the Stratix FC-FBGA-1020 family (vs EP1S60F1020C6)
- Doubles the logic density of the EP1S40 in the same package (vs EP1S40F1020C6)
설계 노트
Estimated: at a 1.0 mm ball pitch across a 33 x 33 mm package, escape routing requires a minimum 6-layer PCB with microvia (laser-drilled) stack-up to fan out the inner rows. Use the Quartus II pin planner to place high-speed LVDS/SSTL pairs on bank-aligned pins, and route differential pairs with 100 ohm differential impedance over a continuous reference plane. Decoupling: place 0.1 uF and 0.01 uF MLCCs on every four VCCINT/VCCP balls inside the BGA footprint to suppress the 130 nm core switching transients.
Estimated: the 1.5 V core rail typically draws 3-6 A peak depending on LE utilization and clock rate; with a 1.5 V nominal and 130 nm process, designers should plan a 4-layer power plane and an LDO or buck converter sized for at least 50% margin above the steady-state current. Add bulk tantalum or polymer capacitors (470-1000 uF) on the 1.5 V rail at the BGA perimeter to absorb inrush during configuration bitstream loading.
Although the 1020-ball FC-FBGA package provides excellent thermal performance through its flip-chip attach, the EP1S80F1020C6 at 79,040 LEs can still dissipate 5-10 W in typical designs. Provide thermal vias in the BGA land pattern to a copper flood on the opposite PCB layer, and verify junction temperature against the 0 C to +85 C commercial envelope using the Quartus II PowerPlay early-power estimator before sign-off.
Do not confuse the EP1S80F1020C6 with the EP1S80F1020C5 (lower speed grade) or EP1S80F1020I6 (industrial temperature) - both share the same FC-FBGA-1020 footprint but differ in timing closure and temperature rating. Because the Stratix family is obsolete, configuration devices (EPCS/EPC) for these parts may also be scarce - verify availability of EPCS64 or compatible configuration memories in parallel with FPGA sourcing.
Recommended: place configuration mode jumpers (MSEL pins) and JTAG header within 50 mm of the FPGA to avoid signal-integrity issues on TCK/TMS/TDO/TDI. Stratix requires MSEL pins tied to a known configuration mode (e.g., FPP x16 or Passive Serial); floating MSEL pins cause configuration failures that are difficult to debug post-assembly.
규정 준수 정보
Lead-free/RoHS compliance can only be confirmed by checking the 'N' suffix variants (e.g., EP1S80F1020C6N). The base EP1S80F1020C6 was originally released in 2002-2003 era when terminal finishes were often SnPb; RoHS/REACH data is not available in the verified web sources. AEC-Q100 is not applicable - this is a commercial/industrial-grade FPGA.
