EP1SGX40FF1020I5 - Stratix GX FPGA, 41,250 LEs | Intel
Référence : EP1SGX40FF1020I5 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $950 | $950,00 |
| 10 | $880 | $8 800,00 |
| 50 | $820 | $41 000,00 |
| 100 | $770 | $77 000,00 |
| 500 | $695 | $347 500,00 |
EP1SGX40FF1020I5 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit within the broader hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field via SRAM-based configuration bitstreams, which makes them ideal for prototyping, low-volume production, and applications requiring hardware-level parallelism.
Key features include dedicated full-duplex transceivers supporting CPRI, OBSAI, GigE, SerialLite, and PCI Express, embedded tri-matrix memory for distributed RAM/ROM, a robust PLL and clock network, and support for high-speed external memory interfaces such as DDR SDRAM, QDR SRAM, and RLDRAM. The 1020-ball FineLine BGA package provides a 1.0 mm pitch, optimizing signal integrity while keeping board area manageable for high-I/O designs.
Architecturally, the Stratix GX family integrates hardened transceiver channels with the programmable fabric, dramatically reducing logic utilization for serial I/O and lowering latency compared to soft IP implementations. The 130 nm CMOS process enables a balance of density, performance, and power efficiency suited to telecom, networking, and high-end signal-processing designs.
Typical applications include 10 Gbps telecom backhaul, multi-gigabit serial interface bridging, baseband processing, test and measurement instrumentation, and high-speed data acquisition. The hardened transceivers are particularly valuable where deterministic latency and protocol compliance (such as CPRI/OBSAI in wireless base stations) are required.
When designing with this device, pay careful attention to PCB layout for the 1.0 mm-pitch BGA: matched-length routing, controlled impedance (typically 50 ohm differential for transceivers), and adequate thermal management are essential. Power sequencing must follow the Stratix GX guidelines to avoid latch-up or in-rush damage during configuration.
This page synthesizes distributor pricing, verified drop-in alternatives from the Stratix GX family, and practical design notes not found in the manufacturer datasheet alone, giving engineers a one-stop reference for sourcing and applying this legacy high-performance FPGA.
Alternatives de remplacement direct pour EP1SGX40FF1020I5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX40FF1020I5 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Speed Grade, Family, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX40FF1020I5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP1SGX40FF1020I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP1SGX40FF1020I6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP1SGX40FF1020C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$750 / unité
Voir la fiche technique →EP1SGX40FF1020C6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195 / unité
Voir la fiche technique →EP1SGX40FF1020C5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1245 / unité
Voir la fiche technique →EP1SGX40FF1020I5 Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Elements (LEs) | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Configuration | SRAM-based LUT |
| Nominal Core Supply Voltage | 1.5 V |
| Boîtier | 1020-ball FineLine BGA (FF1020) |
| Terminal Pitch | 1.00 mm |
| Package Shape | Square |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed Grade | I5 |
| Type de montage | Surface Mount (BGA) |
| Logic Family | CMOS |
| Hardened Transceivers | 3.125 Gbps multi-channel (per Stratix GX family) |
Guide de configuration des broches du EP1SGX40FF1020I5 square
Configuration des broches du EP1SGX40FF1020I5 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX40FF1020I5.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX40FF1020I5 convient pour 6 applications: 10 Gbps Telecom Backhaul Equipment, Multi-Gigabit Serial Interface Bridging, Baseband Signal Processing, Test and Measurement Instrumentation, High-Speed Data Acquisition Systems, Legacy Network Switch and Router Line Cards.
10 Gbps Telecom Backhaul Equipment
The EP1SGX40FF1020I5 is well-suited to telecom backhaul applications where its hardened 3.125 Gbps multi-channel transceivers provide native support for CPRI and OBSAI protocols commonly used between base station radio units and baseband units. With 41,250 logic elements and 4,125 CLBs, the device can implement baseband processing, framer/mapper logic, and protocol adaptation alongside the serial I/O, reducing the bill of materials. The industrial -40C to +100C temperature range lets the part operate in outdoor cabinet environments. For new designs, expect to use this part in legacy backhaul upgrades where the existing PCB layout, BOM, and qualification work have already been done.
Recommandé
Multi-Gigabit Serial Interface Bridging
The EP1SGX40FF1020I5's hardened transceiver channels make it ideal for protocol-bridging cards that aggregate multiple lower-speed serial links (GigE, SerialLite, PCI Express) into a higher-speed uplink. The 41,250 LEs provide ample fabric for custom bridging state machines, packet buffering, and clock-domain crossing, while the embedded tri-matrix memory absorbs transient buffering. Design teams can place this part on a line card to bridge legacy interfaces without needing an external PHY per channel. Latency is deterministic because the transceiver IP is hardened rather than implemented in soft logic.
Recommandé
Baseband Signal Processing
The EP1SGX40FF1020I5's 41,250 logic elements, combined with Stratix GX-family DSP blocks and embedded memory, enable real-time baseband processing for wireless systems including channel coding, modulation/demodulation, and FFT/iFFT operations. The 1.5 V core supply keeps dynamic power manageable, while the industrial temperature grade allows deployment in outdoor radio units. For designs already qualified on this part, the same Quartus II tool flow can be reused, preserving IP investment.
Recommandé
Test and Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol exercisers, and high-speed digitizers benefit from the EP1SGX40FF1020I5's combination of high logic density, dedicated transceivers for stimulus/response channels, and abundant embedded memory for trace capture. The 1020-ball FF1020 BGA provides the I/O count needed to drive wide parallel buses alongside multi-channel serial links. Because the part is well-characterized in long-standing design tools, instrument vendors can re-use existing firmware and IP libraries to minimize time-to-market for new platforms.
Recommandé
High-Speed Data Acquisition Systems
High-speed data acquisition cards for radar, lidar, medical imaging, and scientific instrumentation require parallel ADC interfaces plus high-speed serial uplinks, both of which the EP1SGX40FF1020I5 supports. The 41,250 LEs and embedded memory blocks can implement front-end DSP, decimation, and packetization, while the hardened transceivers move data off-card at multi-gigabit rates. The industrial temperature range supports outdoor and laboratory environments. Designers should plan for FPGA configuration storage (typically EPCS or compatible serial flash) and JTAG access for production programming.
Recommandé
Legacy Network Switch and Router Line Cards
The EP1SGX40FF1020I5 is well-suited to legacy switch and router line cards where multi-gigabit serial interfaces aggregate network traffic and custom forwarding logic is implemented in FPGA fabric. The 3.125 Gbps transceivers handle uplinks, while the 41,250 LEs implement classification, queuing, and traffic management. Because the part is in the same Stratix GX family as older designs, engineers can leverage existing reference designs and qualification data, accelerating maintenance and upgrade cycles for installed equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX40FF1020I5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX40FF1020I5N | EP1SGX40FF1020I7N | EP1SGX40FF1020I6N | EP1SGX40FF1020C7 | EP1SGX40FF1020C6 | EP1SGX40FF1020C5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-ball FineLine BGA (FF1020) | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same | 1020-ball FineLine BGA (FF1020) - same |
| Logic Elements | 41,250 | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) | 41,250 (same die) |
| Configurable Logic Blocks (CLBs) | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 | 4,125 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 | I5 | I7 (faster) | I6 (faster than I5) | C7 (slower, commercial) | C6 (slower, commercial) | C5 (slower, commercial) |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Hardened Transceivers | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel | 3.125 Gbps multi-channel |
Principaux différenciateurs
- Lead-free terminal finish (RoHS-compliant variant) (vs EP1SGX40FF1020I5 (base part))
- Faster speed grade (I7 vs I5) (vs EP1SGX40FF1020I5)
- Lower-density alternative with same family IP (vs EP1SGX40FF1020I5)
Notes de conception
The 1020-ball FineLine BGA has a 1.00 mm ball pitch and requires a high-density PCB with microvia or via-in-pad construction for reliable breakout routing. Use a multi-layer stackup with dedicated ground and power planes adjacent to the BGA, and follow Altera's Stratix GX package pinout documentation for ball-map assignments. Decoupling capacitors should be placed as close to each power pin as the breakout allows, with a mix of bulk, mid-frequency, and high-frequency values to cover the device's wide switching spectrum. Trace impedance targets: 50 ohm single-ended for general-purpose I/O and 100 ohm differential for transceiver channels.
The Stratix GX family at full utilization can dissipate 5 to 15 W depending on clock rate and toggle activity; the FF1020 package offers a moderate thermal path via the BGA balls. Use thermal vias in the BGA land pattern to conduct heat to internal copper planes, and consider a heatsink or heat-spreader for designs operating at sustained high utilization. Estimate: at 10 W dissipation and 15 C/W theta-JA, junction rise is approximately 150 C above ambient, so a thermal management strategy is critical for industrial-grade (-40C to +100C) deployments.
Configuration bitstream storage and JTAG access must be planned at board level: use an Altera EPCS serial configuration device or compatible flash, and bring out the JTAG TDI/TDO/TMS/TCK pins to a header for factory programming and field updates. Power sequencing must follow the Stratix GX datasheet: bring up VCCINT before VCCIO and VCCHIP, in the order specified, to avoid latch-up. Do not assume the I5 temperature grade is interchangeable with C-grade variants when re-spinning legacy designs, and verify that any speed-grade substitution (e.g., I5 to I7) is supported in your Quartus II fitter settings.
Informations de conformité
RoHS/lead-free status not explicitly stated in the verified web data; the 'N' suffix on variants such as EP1SGX40FF1020I5N indicates lead-free terminal finish per Altera/Intel part-number convention. AEC-Q100 not applicable (FPGA logic device).
