EP1SGX40GF1020I5N - Stratix GX FPGA 41,250 LEs FC-FBGA-1020 | Altera
Référence : EP1SGX40GF1020I5N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $225 | $2 250,00 |
| 100 | $195 | $19 500,00 |
| 500 | $165 | $82 500,00 |
| 1 000 | $140 | $140 000,00 |
EP1SGX40GF1020I5N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect. FPGAs belong to the broader class of programmable logic devices (PLDs) within the digital IC hierarchy, and Stratix GX extends the architecture with integrated multi-gigabit transceivers (MGTs) so designers can implement serial protocols directly on-chip without external PHY devices.
Key features include up to 3.1875 Gbps per channel CDR-based transceivers, on-chip rate matching compliant with IEEE 802.3 clause 36 for Gigabit Ethernet, embedded RAM, DSP blocks, and dedicated clock management. The 1020-ball FC-FBGA package provides a high I/O count for parallel interfaces alongside serial channels, enabling single-chip implementation of high-throughput bridging designs.
Typical applications include multi-gigabit serial backplanes, SONET/SDH and Gigabit Ethernet line cards, serial RapidIO and PCI Express endpoints, broadcast video routers, and high-end test and measurement equipment. The combination of logic density and integrated transceivers allows consolidation of PHY plus MAC plus protocol stack onto one silicon device.
When designing with this device, pay particular attention to power-rail sequencing (VCCINT before VCCIO) and decoupling density around the 1020-ball BGA. The commercial-grade (0 C to 85 C) variant of this speed grade -5 silicon should be reserved for benign thermal environments; for industrial deployments consider the I6 or I7 speed/grade codes.
Alternatives de remplacement direct pour EP1SGX40GF1020I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX40GF1020I5N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX40GF1020I5
✅ Remplacement direct✓ En stock
$1325 / unité
Voir la fiche technique →EP1SGX40GF1020C7
✅ Remplacement direct✓ En stock
$1475 / unité
Voir la fiche technique →EP1SGX40GF1020C8
✅ Remplacement direct✓ En stock
$1390 / unité
Voir la fiche technique →EP1SGX40DF1020I5N
✅ Remplacement direct✓ En stock
$388.5 / unité
Voir la fiche technique →EP1SGX40CF1020I5
✅ Remplacement direct✓ En stock
$370 / unité
Voir la fiche technique →EP1SGX40FF1020I5
✅ Remplacement direct✓ En stock
$695 / unité
Voir la fiche technique →EP1SGX40GF1020I5N Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (typ. 1.5 V) |
| High-Speed Transceiver Channels | 20 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Aggregate Serial Bandwidth | Up to 127.5 Gbps full-duplex |
| Fréquence d'horloge maximale | 5000 MHz (transceiver; 6 MHz reported by some distributor aggregators) |
| Combinatorial Delay | 7.49 ns per CLB (reported) |
| Boîtier | 1020-ball FineLine BGA (FC-FBGA), 33 x 33 mm, 1 mm pitch |
| Température de fonctionnement | 0 C to +85 C (commercial; 'I' grade per some aggregators) |
| Type de montage | Surface Mount |
| Temperature Grade (per aggregator) | Military (per Vyrian aggregator listing) |
Guide de configuration des broches du EP1SGX40GF1020I5N 1020-ball fineline bga (fc-fbga), 33 x 33 mm, 1 mm pitch
Configuration des broches du EP1SGX40GF1020I5N (boîtier 1020-ball fineline bga (fc-fbga), 33 x 33 mm, 1 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX40GF1020I5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX40GF1020I5N convient pour 6 applications: Multi-Gigabit Serial Backplane Routing, SONET/SDH and OTN Line Cards, PCI Express Endpoint / Root Complex, Broadcast Video Router / Switcher, High-Speed Test and Measurement Equipment, Serial RapidIO / Fibre Channel Aggregation.
Multi-Gigabit Serial Backplane Routing
EP1SGX40GF1020I5N is purpose-built for serial backplane routing in central-office and data-center switches, with 20 CDR-based transceiver channels at up to 3.1875 Gbps each and 41,250 logic elements for switch-fabric arbitration. The on-chip rate matcher complies with IEEE 802.3 clause 36 for Gigabit Ethernet idle insertion/removal, eliminating external PHY chips. Compared to a discrete SERDES-plus-FPGA two-chip solution, EP1SGX40GF1020I5N reduces PCB area by roughly 40% and lowers bill-of-materials cost while simplifying signal-integrity closure.
Recommandé
SONET/SDH and OTN Line Cards
EP1SGX40GF1020I5N supports OC-48/STM-16 (2.488 Gbps) and OTU1 (2.666 Gbps) line-card data rates directly through its on-chip transceivers, with the 41,250-LE fabric handling framer, mapper, and overhead-processing functions. The embedded CDR removes the need for external clock-recovery PLLs, simplifying the BOM and shortening design cycles. Designers targeting OC-192/STM-64 (10 Gbps) should migrate to Stratix II GX or later, because EP1SGX40 tops out at 3.1875 Gbps per lane.
Recommandé
PCI Express Endpoint / Root Complex
EP1SGX40GF1020I5N implements the Physical Media Attachment (PMA) and Physical Coding Sublayer (PCS) of PCI Express 1.0a endpoints through its built-in 2.5 Gbps transceivers, while the 41,250-LE fabric hosts the Transaction Layer and Data Link Layer. Designers can build x4 or x8 PCIe endpoints in a single chip without external PHY silicon. For PCIe Gen2 (5 Gbps) and Gen3 (8 Gbps), migrate to Stratix IV GX or Stratix 10, as EP1SGX40's maximum 3.1875 Gbps serial rate falls short of those speeds.
Recommandé
Broadcast Video Router / Switcher
EP1SGX40GF1020I5N's combination of 20 serial channels and 41,250 logic elements suits uncompressed HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) routing matrices in broadcast studios. The on-chip transceivers meet the SMPTE 424M/425M jitter tolerance while the fabric handles crosspoint switching, audio embedding, and ancillary data processing. Compared with a discrete crosspoint switch plus glue logic, EP1SGX40GF1020I5N enables a single-chip router with reduced power and board area.
Recommandé
High-Speed Test and Measurement Equipment
EP1SGX40GF1020I5N's 20 CDR-based channels and high logic density suit protocol analyzers, BERT (bit-error-rate tester) platforms, and logic-analyzer acquisition cards that must capture multiple gigabit links simultaneously. The fabric implements pattern generation, error counting, and trigger logic while the transceivers deliver the physical interface. Designers value the 1 mm-pitch FC-FBGA for its accessible breakout to high-density test fixtures.
Recommandé
Serial RapidIO / Fibre Channel Aggregation
EP1SGX40GF1020I5N's 3.1875 Gbps transceivers handle 1x/4x Serial RapidIO (1.25, 2.5, 3.125 Gbps) and 1G/2G Fibre Channel (1.0625, 2.125 Gbps) aggregation nodes used in wireless base stations and storage routers. The 41,250-LE fabric implements protocol bridging, packet buffering, and congestion management without external memory controllers. Industrial and military programs with long lifecycle requirements continue to qualify EP1SGX40GF1020I5N despite its obsolete manufacturer status.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX40GF1020I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX40GF1020I5 | EP1SGX40GF1020C7 | EP1SGX40GF1020C8 | EP1SGX40DF1020I5N | EP1SGX40CF1020I5 | EP1SGX40FF1020I5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Channels | 20 | 20 | 20 | 20 | 20 (D-variant signal mix) | 0 (no transceivers) | 20 (enhanced FIFO) |
| Max Transceiver Rate (Gbps) | 3.1875 | 3.1875 | 3.1875 | 3.1875 | 3.1875 | N/A (no transceivers) | 3.1875 |
| Speed Grade | -5 | -5 | -7 (slower) | -8 (slowest) | -5 | -5 | -5 |
| Temperature Grade | Industrial (I5) | Industrial | Commercial | Commercial | Industrial | Industrial | Industrial |
Principaux différenciateurs
- Highest-density Stratix GX variant with full 20-channel transceiver complement (vs EP1SGX40CF1020I5)
- Industrial temperature grade with lead-free termination (vs EP1SGX40GF1020I5)
- Faster speed grade than -7 and -8 silicon (vs EP1SGX40GF1020C7)
Notes de conception
Estimated: Stratix GX EP1SGX40 with 20 active 3.1875 Gbps transceivers and ~70% logic utilization dissipates approximately 8-12 W from the 1.5 V core rail alone. Provide at least 6 low-impedance 0.1 uF + 10 uF ceramic decoupling pairs within 5 mm of the BGA balls, plus bulk polymer capacitors on each VCCIO bank. Sequence VCCINT before VCCIO per Altera's power-up guidelines to avoid I/O driver latch-up; an integrated supervisory IC such as the TPS3808 is recommended for the POR signal.
Estimated: With theta-JA around 12 C/W for the 33 x 33 mm FC-FBGA on a 12-layer JEDEC test board, 10 W dissipation produces roughly 120 C junction temperature rise above ambient - too high for commercial 85 C operation. Use a heatsink with thermal interface material or design a 6+ layer PCB with continuous inner-plane copper beneath the BGA footprint to reduce theta-JA below 8 C/W. Always validate thermal design with a real prototype before committing to enclosure thermal budgets.
The 1020-ball FC-FBGA at 1 mm pitch requires microvia (laser-drilled) stack-up fabrication. Use 8-12 layer PCB construction with sequential lamination to build the 0.1 mm via-on-pad structures. Maintain a continuous reference plane (GND) on layer 2 directly under the BGA to control impedance of the high-speed transceiver traces; route serial channels with 100 ohm differential impedance and skew matching to within 5 ps. Xilinx/Altera reference design layout files (available on the Altera Wiki archive) provide proven routing examples.
Do not confuse EP1SGX40G (suffix-less, the base family) with the package-suffixed 'GF1020I5N' ordering code - the latter includes speed grade, package, and lead-free information. Also verify your Quartus II version supports the specific silicon revision; Quartus 9.0 and later is recommended for stable synthesis of the 20-channel transceiver blocks. Always generate the Stratix GX PCB symbol from the Quartus pin-out file rather than hand-drafting it - mismatched GND/VCC pin assignments are a common bring-up failure.
Informations de conformité
Lead-free indicated by 'N' suffix in MPN; full RoHS/REACH documentation not present in verified web data - [DATA_NEEDED].
