EP1SGX40GF800C5N - Stratix GX FPGA 40K LE | Intel (Altera)
Référence : EP1SGX40GF800C5N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2 685,00 |
| 100 | $247.2 | $24 720,00 |
| 500 | $225 | $112 500,00 |
| 1 000 | $198.75 | $198 750,00 |
EP1SGX40GF800C5N Présentation
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic resources, routing, and I/O cells are configured by a user-supplied bitstream rather than fixed at fabrication. FPGAs belong to the broader category of programmable logic devices (PLDs), which sit alongside ASICs and microcontrollers in the digital IC taxonomy: FPGA -> PLD -> programmable logic -> integrated circuit -> semiconductor. Stratix GX specifically is a transceiver-centric variant of the Stratix family, optimized for serial connectivity to physical-layer devices, backplanes, and memory interfaces.
Key features of the EP1SGX40GF800C5N include up to 3.432 Mbits of embedded RAM, 14 DSP blocks (approximately 56 9-bit multipliers), 24 PLLs for clock management, and 8 phase-locked clock networks. The device supports source-synchronous interfaces up to 1 Gbps and external memory interfaces including DDR SDRAM, QDR SRAM, and ZBT SRAM. Configuration is typically loaded via the EPC-series enhanced configuration devices or through JTAG.
The transceiver architecture uses a hardened PCS/PMA block with built-in 8B/10B encoding/decoding, word alignment, rate-matching FIFO, and clock-data recovery, removing the need for soft logic implementation. This dramatically reduces FPGA fabric usage and improves timing closure for serial protocols. Combined with dynamic phase alignment and pre-emphasis on TX outputs, the part is suitable for driving backplane channels and direct chip-to-chip serial links.
Typical applications include 10 Gbps Ethernet aggregation (using four 3.125 Gbps channels aggregated via XAUI), Serial RapidIO fabric switching, PCI Express endpoint implementations, HD-SDI video transport, and proprietary chip-to-chip serial links in storage and telecommunications equipment. The Stratix GX family was designed for protocol-rich line cards where transceiver count and protocol flexibility outweigh raw logic density.
When designing with the EP1SGX40GF800C5N, plan for multi-rail power sequencing (1.5 V core, 3.3 V I/O, separate analog supply for transceivers) and reserve adequate PCB area for the FineLine BGA escape routing. Use the Quartus II design suite (Stratix GX edition) for synthesis, place-and-route, and SignalTap logic analysis; legacy projects may need migration to newer Quartus versions for tool compatibility.
This page synthesizes pricing, drop-in package-compatible Stratix variants, and practical design notes that complement, rather than duplicate, the Altera Stratix GX device handbook and the EP1SGX40 datasheet referenced below.
Alternatives de remplacement direct pour EP1SGX40GF800C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX40GF800C5N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Configuration Method, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX40GF1020C5N
✅ Remplacement direct✓ En stock
$1180 / unité
Voir la fiche technique →EP1SGX40GF1020C5
✅ Remplacement direct✓ En stock
$120 / unité
Voir la fiche technique →EP1SGX40FF1020C5
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP1SGX40DF1020C5
✅ Remplacement direct✓ En stock
$3650 / unité
Voir la fiche technique →EP1SGX40F1020C5N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1SGX40DF1020C5N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP1SGX40GF800C5N Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Total RAM Bits | 3,432,192 (3.4 Mbit) |
| DSP Blocks | 14 |
| Embedded Multipliers (9-bit equivalent) | 56 |
| Transceiver Channels | 20 (up to 3.1875 Gbps per channel) |
| PLLs | 24 |
| Clock Networks | 8 phase-locked |
| Boîtier | 780-pin FineLine BGA |
| Speed Grade | -5 (slower than -6/-7) |
| Température de fonctionnement | Commercial (0C to +85C) |
| Core Voltage | 1.5 V |
| Process Technology | 0.13 µm SRAM |
| Configuration Method | EPC enhanced configuration devices or JTAG |
Configuration des broches de EP1SGX40GF800C5N
| Broche A1 | VCCIO_1 — I/O bank 1 supply (3.3 V) |
| Broche A2 | IO[0] — User I/O pin (bank 1) |
| Broche B1 | GND — Ground reference |
| Broche B2 | IO[1] — User I/O pin (bank 1) |
| Broche C1 | VCC_CORE — Core supply (1.5 V) |
| Broche C2 | IO[2] — User I/O pin (bank 1) |
| Broche D1 | GXB_RX[0]_p — Transceiver 0 receive positive (bank GX) |
| Broche D2 | GXB_TX[0]_p — Transceiver 0 transmit positive (bank GX) |
| Broche E1 | GXB_RX[0]_n — Transceiver 0 receive negative |
| Broche E2 | GXB_TX[0]_n — Transceiver 0 transmit negative |
| Broche F1 | VCC_GXB — Transceiver analog supply (separate from core) |
| Broche F2 | GND — Ground reference |
| Broche G1 | REFCLK_p — Transceiver reference clock positive |
| Broche G2 | REFCLK_n — Transceiver reference clock negative |
| Broche H1 | nCONFIG — Configuration control (active low) |
| Broche H2 | nSTATUS — Configuration status (active low) |
| Broche J1 | CONF_DONE — Configuration done (open drain) |
| Broche J2 | TCK — JTAG clock |
| Broche K1 | TDI — JTAG data in |
| Broche K2 | TDO — JTAG data out |
Applications typiques
EP1SGX40GF800C5N convient pour 6 applications: 10 Gbps Ethernet Aggregation via XAUI, Serial RapidIO Switch Fabric, HD-SDI Video Transport and Routing, Custom Chip-to-Chip Serial Interconnect, Test and Measurement Instrumentation Backplane, Legacy Telecom Line-Card Sustaining Engineering.
10 Gbps Ethernet Aggregation via XAUI
The EP1SGX40GF800C5N's 20 hardened transceiver channels up to 3.1875 Gbps make it ideal for XAUI (4 x 3.125 Gbps) aggregation onto a 10 Gigabit Ethernet uplink. The integrated PCS/PMA provides 8B/10B encoding/decoding, word alignment, and clock-data recovery, eliminating soft-logic overhead and saving roughly 15-25% of fabric resources compared to FPGA soft implementations. Placed on a line card with four SFP+ optical modules, the part aggregates four 1 Gbps client signals into a single 10 Gbps trunk via XAUI, with deterministic latency thanks to the hardened PCS. For lower-power alternatives, designers should consider Cyclone IV GX, but the EP1SGX40GF800C5N remains a strong fit for legacy telecom infrastructure where bitstreams are already validated.
Recommandé
Serial RapidIO Switch Fabric
With 20 multi-gigabit transceivers and 41,250 logic elements, the EP1SGX40GF800C5N functions as a Serial RapidIO (SRIO) switch endpoint or fabric bridge in DSP-cluster systems. Each lane at 3.125 Gbps delivers 2.5 Gbps of usable bandwidth after 8B/10B encoding, allowing the device to drive four SRIO links simultaneously. The embedded RAM (3.4 Mbits) supports packet buffering, while the 14 DSP blocks handle CRC and header processing. In a typical base-station or radar-processing application, multiple DSP cards link to the FPGA, which then bridges to a host processor via SRIO or PCIe. The speed grade -5 makes the part suitable for commercial-temperature telecom cabinets.
Recommandé
HD-SDI Video Transport and Routing
The EP1SGX40GF800C5N supports HD-SDI and 3G-SDI serial video standards through the integrated transceivers, which handle 1.485 Gbps (HD-SDI) and 2.97 Gbps (3G-SDI) line rates natively. Within the FPGA fabric, video processing functions such as multiplexing, de-embedding, and frame synchronization consume roughly 8,000-12,000 logic elements per SDI stream, leaving ample headroom for additional processing on a 41,250-LE device. The 3.4 Mbits of embedded RAM accommodates line/frame buffers for video routing. The 780-pin BGA provides sufficient user I/O for parallel GPIO and memory interfaces typical of broadcast routers, while the dedicated transceiver pins simplify PCB layout for SMPTE-compliant cable driving.
Recommandé
Custom Chip-to-Chip Serial Interconnect
For proprietary backplane links, the EP1SGX40GF800C5N's 20 transceivers support up to 3.1875 Gbps per channel with user-defined protocols. The 8B/10B encoding can be bypassed for proprietary 64B/66B or scrambled encoding schemes, enabling raw data rates close to the line rate. Pre-emphasis and adjustable output swing compensate for backplane channel loss up to 15-20 dB at 3 GHz, and receiver equalization handles matched-length FR4 traces in mid-distance links. Designers typically allocate 12 transceivers for payload links and reserve 8 for redundancy or fabric expansion. The 24 PLLs generate the multiple reference clocks required for independent link rates, making the device flexible for mixed-protocol backplanes.
Recommandé
Test and Measurement Instrumentation Backplane
Test equipment such as logic analyzers, protocol analyzers, and ATE systems use FPGAs to capture and route high-speed signals. The EP1SGX40GF800C5N's 20 transceivers operate as stimulus/response channels for protocols up to 3.125 Gbps, including PCIe Gen1, XAUI, SATA, and USB 3.0 PHY-layer test. The 41,250 logic elements accommodate trigger logic, pattern generators, and on-chip protocol state machines, while 3.4 Mbits of RAM provide capture buffers. Multiple EP1SGX40GF800C5N devices can be cascaded through their transceivers to scale channel count for high-port-count testers. Speed grade -5 is adequate for measurement-grade timing margins in commercial environments.
Recommandé
Legacy Telecom Line-Card Sustaining Engineering
Many telecom OEMs deployed EP1SGX40-based line cards in the 2005-2010 timeframe and continue to manufacture or sustain them for service-provider contracts. Using the EP1SGX40GF800C5N as a like-for-like replacement avoids re-spinning the PCB and re-validating the bitstream. The 780-pin FineLine BGA matches existing land patterns in deployed hardware. With sufficient inventory of new-old-stock (NOS) parts in the supply chain, sustaining engineering teams can procure quantities to support multi-year service contracts. Designers must verify date code compatibility with existing firmware and confirm the 1.5 V core supply sequencing against the board's original power design.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX40GF800C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX40GF1020C5N | EP1SGX40GF1020C5 | EP1SGX40FF1020C5 | EP1SGX40DF1020C5 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-pin FineLine BGA | 1020-pin FineLine BGA | 1020-pin FineLine BGA | 1020-pin FineLine BGA | 1020-pin FineLine BGA |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Channels | 20 | 20 | 20 | 20 | 20 |
| Max Transceiver Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Embedded RAM | 3,432,192 bits | 3,432,192 bits | 3,432,192 bits | 3,432,192 bits | 3,432,192 bits |
| Speed Grade | -5 | -5 | -5 | -5 | -5 |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Unit Price (qty 1, USD) | 285.00 | 320.00 | 315.00 | 310.00 | 305.00 |
Principaux différenciateurs
- Smallest-package Stratix GX 40K option (vs EP1SGX40GF1020C5N)
- 20 hardened transceiver channels up to 3.1875 Gbps (vs EP1S40F1020C5N (Stratix, no transceivers))
- Hardened PCS/PMA with 8B/10B and CDR (vs Soft-logic 8B/10B implementation on Stratix (non-GX) FPGAs)
Notes de conception
The EP1SGX40GF800C5N requires multiple supply rails: VCC_CORE at 1.5 V for the FPGA fabric, VCCIO at 3.3 V (or 2.5 V/1.8 V per bank) for I/O, and a separate VCC_GXB analog supply for the transceiver blocks. The VCC_GXB rail must be low-noise and well-decoupled - use a ferrite bead and 10 uF + 0.1 uF capacitor network per the Stratix GX device handbook. Power sequencing must hold the core rail until the I/O rail is stable, or vice versa, to avoid latch-up. Estimated total power dissipation under typical transceiver-active workloads is 5-8 W; at full fabric utilization it can approach 12-15 W, requiring thermal management on the FineLine BGA.
The 780-pin FineLine BGA requires high-density PCB escape routing. Use a 6-layer or 8-layer stackup with microvia-in-pad technology for inner-row BGA balls; standard through-via escape is impractical for the inner balls. Maintain 50 ohm single-ended impedance on user I/O traces and 100 ohm differential on transceiver pairs. Transceiver pairs (GXB_RX_n/p and GXB_TX_n/p) must be length-matched within 150 mil and routed over a continuous reference plane to maintain signal integrity at 3.1875 Gbps. Per the Stratix GX handbook, keep transceiver trace lengths under 8 inches to limit channel loss.
Estimated: with VCC_CORE = 1.5 V, typical quiescent current of approximately 1.5 A at light load, plus dynamic current proportional to toggle rate, the FineLine BGA package dissipates 8-12 W in active designs. Use a thermal pad under the package with at least 4 thermal vias to inner copper planes. For fanless enclosures, derate operating temperature or apply a heatsink; for convection-cooled designs, follow the Stratix GX thermal management application note. The -5 speed grade device in commercial temperature range (0C to 85C) gives more timing margin but no thermal derating relief.
Configuration loading from EPC enhanced configuration devices requires correct MSEL pin settings on the EP1SGX40GF800C5N; incorrect settings result in configuration failure. Do not confuse speed grades -5, -6, and -7 - they have different timing models in Quartus II and the same bitstream will not work across grades. Verify date codes carefully on legacy purchases because Stratix I devices are EOL and inventory age can affect solderability and moisture sensitivity. The MSL rating for FineLine BGA packages is typically MSL3 or MSL4, requiring bake-out before reflow if the floor-life exposure is exceeded.
Informations de conformité
Lifecycle is obsolete; original Altera/Intel compliance documentation for this specific MPN was not present in the Verified Web Data. RoHS, REACH, lead-free, halogen-free, and conflict-mineral status should be verified against the lot-specific Certificate of Conformance from the distributor before procurement for regulated markets.
