EP1S40F1020C5N - Stratix FPGA 41,250 LE | Intel | FBGA-1020
Référence : EP1S40F1020C5N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $365 | $3 650,00 |
| 100 | $332 | $33 200,00 |
| 250 | $305 | $76 250,00 |
| 500 | $280 | $140 000,00 |
EP1S40F1020C5N Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, configurable interconnects, and embedded memory/DSP blocks into a single die. In the system hierarchy, FPGAs sit between general-purpose processors (CPUs/MCUs) and ASICs - offering hardware-level parallelism and I/O flexibility that microcontrollers cannot match, while avoiding the high NRE cost and long lead time of an ASIC. The Stratix family was Altera's (now Intel) flagship high-performance FPGA line, targeting telecom, DSP, and ASIC-prototyping workloads.
Key features of the EP1S40F1020C5N include 4,125 Logic Array Blocks (LABs), embedded DSP blocks for high-speed multiply-accumulate operations, multiple phase-locked loops (PLLs) for clock management, and support for external memory interfaces including DDR SDRAM, QDR SRAM, and FCRAM. The device also includes dedicated high-speed transceiver-ready I/O banks and tri-state buffering on every pin.
Architecturally, the Stratix I family introduced embedded TriMatrix memory (three sizes of memory blocks per LAB region), dedicated multiplier blocks, and the DirectDrive technology that ensures consistent signal integrity across the die. The C5 speed grade denotes the slowest of the commercial speed bins, trading maximum Fmax for lower dynamic power and improved timing margin - often the preferred choice for production ASIC prototyping where timing closure matters more than peak clock rate.
Typical applications include high-speed digital signal processing (DSP), telecom baseband processing, ASIC prototyping and emulation, network packet processing, video and image processing pipelines, and military/aerospace signal intelligence systems. The 1020-ball FBGA package enables the large logic and memory capacity while supporting the high pin count required by wide external memory buses.
When designing with this device, plan the power-decoupling network carefully - the FBGA-1020 package demands a multilayer PCB with dedicated power and ground planes, and the Quartus II tool flow should be used for place-and-route. The C5 speed grade may require additional pipelining stages compared to C6/C7 grades; verify timing closure before committing to this bin in volume.
This page synthesizes distributor pricing, drop-in same-family Stratix alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers select and source the right Stratix variant for legacy and new designs.
Alternatives de remplacement direct pour EP1S40F1020C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S40F1020C5N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, DSP Blocks, Embedded Memory, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S40F1020C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$695 / unité
Voir la fiche technique →EP1S40F1020C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$926.78 / unité
Voir la fiche technique →EP1S40F1020C5
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$165 / unité
Voir la fiche technique →EP1S40F1020C5AA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195.4 / unité
Voir la fiche technique →EP1S60F1020C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2050 / unité
Voir la fiche technique →EP1S40F1020C5N Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements (LE) | 41,250 |
| Logic Array Blocks (LAB) | 4,125 |
| Embedded Memory Bits | 3,423,744 |
| Maximum User I/Os | 773 |
| Process Technology | 130 nm CMOS |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | C5 (commercial, slowest) |
| Temperature Grade | Commercial Extended |
| Boîtier | 1020-ball FBGA (FineLine BGA) |
| Type de montage | Surface Mount |
| PLLs | Yes (multiple, enhanced PLL) |
| DSP Blocks | Yes (embedded multiplier blocks) |
| External Memory Support | DDR SDRAM, QDR SRAM, FCRAM, ZBT |
| Configuration Scheme | Passive serial, active serial, JTAG |
| Statut RoHS | Unknown - verify with manufacturer |
| Lead-Free | Unknown |
Guide de configuration des broches du EP1S40F1020C5N 1020-ball fbga (fineline bga)
Configuration des broches du EP1S40F1020C5N (boîtier 1020-ball fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S40F1020C5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S40F1020C5N convient pour 6 applications: ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Speed Digital Signal Processing, Network Packet Processing, Video and Image Processing Pipelines, Military and Aerospace Signal Intelligence.
ASIC Prototyping and Emulation
The EP1S40F1020C5N's 41,250 logic elements and 3.42 Mbit embedded memory make it a strong fit for ASIC prototyping where designers map RTL from a target ASIC into multiple Stratix FPGAs. The 773 user I/Os at 500 MHz internal clock support wide external memory buses and high-throughput chip-to-chip links. Designers prefer the C5 speed grade because timing closure on a large prototype is easier at the slowest bin; once verified, the same netlist runs unchanged on C6/C7 production parts. The 130 nm process provides predictable timing behavior that matches the synthesized RTL closely. Quartus II synthesis and place-and-route handle multi-FPGA partitioning. Trade-off: large designs require careful thermal management since the FBGA-1020 package dissipates significant power at full utilization.
Recommandé
Telecom Baseband Processing
Telecom baseband designs leverage the EP1S40F1020C5N's embedded DSP multiplier blocks and high I/O count for parallel channel processing. The Stratix I architecture's TriMatrix memory (M512, M4K, M-RAM blocks) is ideal for storing filter coefficients and intermediate sample buffers. The 500 MHz maximum internal frequency supports symbol-rate processing for many wireless standards, and the multiple enhanced PLLs handle the complex clock trees needed for serial transceivers and external memory interfaces. The 1020-ball FBGA exposes enough I/O to drive DDR SDRAM banks for high-bandwidth sample storage. Trade-off vs ASIC: the FPGA's per-unit cost is higher than a production ASIC at high volume, but the time-to-market advantage is decisive for early deployment.
Recommandé
High-Speed Digital Signal Processing
The EP1S40F1020C5N excels at high-throughput DSP workloads including FIR filters, FFT engines, and video codecs. Its dedicated multiplier blocks deliver multiply-accumulate operations per clock cycle, dramatically outperforming LE-based implementations. The 3.42 Mbit of embedded memory provides low-latency storage for sample windows and twiddle-factor tables, while the 773 I/Os enable direct connection to high-speed ADCs and DACs. The C5 speed grade trades peak Fmax for improved timing margin, which is often beneficial in pipelined DSP where every register stage must close timing. Trade-off: for purely serial DSP, a DSP-optimized device may be more power-efficient; the Stratix I is preferred when design flexibility matters.
Recommandé
Network Packet Processing
Network routers and switches benefit from the EP1S40F1020C5N's combination of logic density, embedded memory, and high I/O bandwidth. Packet headers, lookup tables, and queue descriptors fit in the 3.42 Mbit TriMatrix memory, eliminating the latency of off-chip lookups. The 773 user I/Os accommodate multiple 10/100 Gigabit Ethernet MACs and SPI-4.2 interfaces. Hardware parallelism enables line-rate processing at full wire speed without the overhead of a CPU-based design. The C5 speed grade suits most packet-processing clock rates. Trade-off: high-density packet processing at 100G+ may require multiple FPGAs or migration to Stratix IV/V/10 with integrated transceivers, as the Stratix I lacks hardened SerDes.
Recommandé
Video and Image Processing Pipelines
The EP1S40F1020C5N supports real-time video pipelines including HD-SDI ingest, color-space conversion, scaling, and overlay composition. Embedded memory blocks buffer full video frames, while DSP blocks perform per-pixel operations at hundreds of MHz. The 1020-ball FBGA package exposes enough I/Os to drive DDR2 SDRAM frame buffers and BT.656/1120 video interfaces. Designers leverage the C5 speed grade for reliable timing closure on long combinational paths through the pixel pipeline. Quartus II provides IP cores for common video standards. Trade-off: for 4K/UHD pipelines, designers should migrate to newer families (Stratix V/10) with higher logic density and integrated transceivers.
Recommandé
Military and Aerospace Signal Intelligence
The EP1S40F1020C5N's commercial-extended temperature grade and the availability of military-processed variants (e.g., EP1S40F1020C5AA) make it suitable for defense signal-intelligence systems. Its high logic density supports wideband digital receivers, channelizers, and encryption engines, while embedded DSP blocks accelerate FFTs and polyphase filterbanks. The 1020-ball FBGA's high I/O count enables direct connection to high-speed ADC/DAC arrays used in EW and SIGINT systems. The C5 speed grade provides the timing margin required for safety-critical and long-lifecycle defense programs. Trade-off: aerospace programs often require the -AA or -DM screened variants with full MIL-STD-883 processing, which carry longer lead times.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S40F1020C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S40F1020C6N | EP1S40F1020C7N | EP1S40F1020C5 | EP1S40F1020C5AA | EP1S60F1020C5N |
|---|---|---|---|---|---|---|
| Package | 1020-ball FBGA | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same | 1020-ball FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements (LE) | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 57,120 (+38%) |
| Speed Grade | C5 (slowest commercial) | C6 (mid) | C7 (fastest) | C5 | C5 | C5 |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 5,215,104 bits |
| Maximum User I/Os | 773 | 773 | 773 | 773 | 773 | 773 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm | 130 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Pin-compatible upgrade path to higher logic capacity (vs EP1S60F1020C5N)
- Best timing margin among Stratix I speed grades (vs EP1S40F1020C7N)
- Military-processed option available (vs EP1S40F1020C5AA)
Notes de conception
The EP1S40F1020C5N requires multiple supply rails: 1.5 V VCCINT (core), 1.5/1.8/2.5/3.3 V VCCIO (I/O banks), 2.5 V VCC_PLL (PLL analog), and VCCPD for pre-drivers. Each PLL analog supply must be filtered with a ferrite bead and decoupled with 0.1 uF and 10 uF capacitors per the Stratix handbook. Estimated: at 50% logic utilization and 300 MHz operation, total power dissipation typically ranges 4-8 W; use a multilayer PCB with dedicated ground and power planes to minimize supply noise.
The 1020-ball FBGA package has a theta_JA of approximately 8-12 C/W with proper thermal via array under the exposed die pad (per typical Stratix I datasheet). For continuous operation above 5 W, attach a heatsink or use forced-air cooling; without thermal management, junction temperature can exceed 100 C in enclosed enclosures. Estimated: at 6 W dissipation, expect a 50-70 C junction temperature rise above ambient. Use thermal vias under the package BGA balls to conduct heat to inner copper planes.
Route all 773 user I/O signals on inner PCB layers with microstrip or stripline topology to control impedance (typically 50 ohm single-ended, 100 ohm differential). The 1020-ball FBGA at 1.00 mm pitch requires laser-drilled microvias or 4-mil via-in-pad technology for breakout; standard 8-mil through-vias will not escape the inner rows. Maintain continuous ground return paths under all high-speed signals to control crosstalk and EMI.
Common pitfalls with the EP1S40F1020C5N: (1) omitting PLL power filtering causes PLL lock failures; (2) failing to configure all unused I/O banks to a defined VCCIO leads to floating inputs and excess Icc; (3) using the wrong JTAG chain order when programming via passive serial causes configuration failure; (4) selecting C5 when the design requires C7 timing margin leads to Fmax violations; (5) the 'N' suffix denotes lead-free - older designs may require the non-N variant for backwards compatibility. Always run Quartus II timing analysis before tapeout.
Informations de conformité
The 'N' suffix in EP1S40F1020C5N denotes lead-free (Pb-free) per Altera/Intel legacy packaging conventions. RoHS, REACH, and halogen-free status not confirmed in provided web data - verify with manufacturer for current compliance certificates. Not AEC-Q100 qualified - FPGAs are not automotive-grade ICs in the traditional sense, but may be used in automotive designs after qualification.