EP20K1000CB652C9ES - APEX 20KC FPGA, 1M Gates, 652-BGA | Intel
Référence : EP20K1000CB652C9ES ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $130 | $1 300,00 |
| 100 | $115 | $11 500,00 |
| 250 | $108 | $27 000,00 |
| 500 | $99.5 | $49 750,00 |
EP20K1000CB652C9ES Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device built from a matrix of configurable logic blocks (CLBs), embedded memory, I/O cells, and routing resources that the designer programs after manufacture. FPGAs sit hierarchically as: configurable logic block -> programmable logic device -> programmable logic IC -> digital semiconductor. APEX 20KC is the enhanced-CAM-embedded variant of the APEX 20K family, optimized for high-speed data-path and DSP applications.
Key features of the EP20K1000CB652C9ES include 3,840 logic array blocks (LABs), 488 maximum user I/O pins, 16 embedded system blocks (ESBs) providing the 327,680 RAM bits, and a 0.15-micron CMOS process technology. The device supports in-system programmability via IEEE 1149.1 (JTAG) and IEEE 1532, allowing configuration from serial or parallel PROM. MultiVolt I/O allows interfacing with 1.5V, 1.8V, 2.5V, 3.3V, and 5V systems.
Architecturally, the APEX 20KC combines a fine-grained logic fabric with coarse-grained embedded system blocks that double as dual-port RAM or CAM, delivering high memory bandwidth for look-up tables and FIFOs. The C9 speed grade designates a -40C to +85C industrial temperature operation, while the CB652 package code denotes the 652-ball FineLine BGA. The "ES" suffix indicates an engineering sample / specific customer version per Altera/Intel ordering nomenclature.
Typical applications include telecommunications line cards, high-speed data-path bridges, network processors glue logic, and DSP co-processing. The high gate count and embedded CAM make this device well suited for ATM switching, SONET framer interfaces, and protocol conversion between legacy bus architectures.
When designing with the EP20K1000CB652C9ES, ensure proper decoupling on all VCCINT and VCCIO rails and follow Altera AN 75 (High-Speed Board Design) guidelines for impedance-controlled routing of LVDS clocks and global signals.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not aggregated in the original manufacturer datasheet.
Alternatives de remplacement direct pour EP20K1000CB652C9ES — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K1000CB652C9ES (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Speed Grade, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K1000CB652C8ES
✅ Remplacement direct✓ En stock
$220 / unité
Voir la fiche technique →EP20K1000CB652C7NJ
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP20K600CB652C7
✅ Remplacement direct✓ En stock
$1320 / unité
Voir la fiche technique →EP20K400CB652C7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K200CB652C7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K1000CB652C9ES Valeurs maximales et caractéristiques électriques
| Series | APEX 20KC |
| Number of Logic Elements / Cells | 38,400 |
| Total RAM Bits | 327,680 |
| Number of Gates | 1,772,000 |
| Number of Logic Array Blocks (LABs) | 3,840 |
| Number of I/O | 488 |
| Voltage - Supply | 1.8 V |
| Température de fonctionnement | -40C to +85C |
| Speed Grade | C9 |
| Process Technology | 0.15 um CMOS |
| Boîtier / Format | 652-BGA (FineLine BGA) |
| Type de montage | Surface Mount |
| Niveau de sensibilité à l'humidité (MSL) | 3 (168 hours) |
| Packaging | Tray |
| Programmability | In-system (JTAG IEEE 1149.1 / IEEE 1532) |
Guide de configuration des broches du EP20K1000CB652C9ES 652-bga (fineline bga)
Configuration des broches du EP20K1000CB652C9ES (boîtier 652-bga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K1000CB652C9ES.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K1000CB652C9ES convient pour 7 applications: Telecommunications Line Card Glue Logic, High-Speed Data-Path Bridge, ATM Switch Fabric Controller, Protocol Conversion Engine, Legacy Industrial Controller Backplane, DSP Co-Processor for Medical Imaging, Test and Measurement Instrumentation Front-End.
Telecommunications Line Card Glue Logic
The EP20K1000CB652C9ES fits telecommunications line card glue logic because its 1,772,000 gates and 488 user I/O pins handle the protocol bridging, bus arbitration, and FIFO buffering between network processors and physical-layer devices per the APEX 20K datasheet. Its 16 embedded system blocks provide dual-port RAM and CAM resources directly suited to ATM cell buffering and SONET framer interfacing. The MultiVolt I/O interface bridges legacy 5V devices to modern 1.8V ASICs without external level shifters. Designers typically pair it with a Tsi568A serial switch or a PowerQUICC processor, where the FPGA implements the local bus controller, interrupt aggregator, and traffic-shaping logic.
Recommandé
High-Speed Data-Path Bridge
The EP20K1000CB652C9ES enables high-speed data-path bridging because of its 327,680 bits of embedded dual-port RAM and 488 I/O pins supporting LVTTL and HSTL standards per the manufacturer datasheet. Designers use it to convert between parallel LVCMOS buses, serial LVDS links, and legacy FIFO interfaces in imaging and DSP aggregation boards. The C9 speed grade delivers the timing margin needed for 133 MHz PCI or 200 MHz Utopia interfaces. A typical application is bridging a TI TMS320C6416 DSP to a host CPU across a custom FIFO bus with hardware-accelerated scatter-gather DMA logic implemented in the FPGA fabric.
Recommandé
ATM Switch Fabric Controller
The EP20K1000CB652C9ES is well matched to ATM switch fabric control because its 16 embedded system blocks support CAM operations per the Altera APEX 20K datasheet. The fabric performs VPI/VCI lookup, connection admission control, and cell routing decisions that previously required external CAM chips. With 488 user I/O pins, the FPGA can connect to multiple OC-3/OC-12 framers simultaneously while preserving plenty of logic headroom for traffic shaping. This CAM capability, combined with 1.8V core power and industrial temperature operation, makes the device a preferred legacy controller in telecom central-office equipment where backward compatibility is critical.
Recommandé
Protocol Conversion Engine
The EP20K1000CB652C9ES handles protocol conversion between legacy bus architectures because its 38,400 logic elements provide sufficient capacity for multi-protocol state machines per the APEX 20K datasheet. Common deployments include I2C-to-SPI bridges, UART-to-USB protocol converters, and parallel-bus-to-I2S audio format adapters. The embedded dual-port RAM simplifies FIFO design between asynchronous clock domains at different baud rates. Designers typically implement 4-8 independent protocol converter channels in a single FPGA while leaving ~40% of logic capacity for application-specific glue.
Recommandé
Legacy Industrial Controller Backplane
The EP20K1000CB652C9ES supports legacy industrial controller backplanes because its MultiVolt I/O and 488 user I/O pins accommodate a mix of 5V ISA, 3.3V PCI, and 1.8V ASIC interfaces per the manufacturer datasheet. Industrial automation systems built in the late 1990s and early 2000s often used this FPGA as a programmable glue layer on VME or CompactPCI backplanes. The 1.8V core and 0.15 um CMOS process deliver lower power than competing 5V-only PLDs while maintaining 5V-tolerant I/O for backward compatibility.
Recommandé
DSP Co-Processor for Medical Imaging
The EP20K1000CB652C9ES serves as a DSP co-processor in medical imaging because its 1,772,000 gates and embedded dual-port RAM accelerate FFT and convolution operations per the Altera APEX 20K datasheet. Ultrasound beamformers and MRI pre-processors offload pixel pipelines and FIR filter banks to the FPGA, freeing the host CPU for user-interface and diagnostics tasks. The industrial -40C to +85C temperature grade and surface-mount BGA package suit the controlled thermal environment of cart-based imaging systems. Designers use Quartus II with the APEX 20KC DSP development kit to implement parallel multiply-accumulate arrays.
Recommandé
Test and Measurement Instrumentation Front-End
The EP20K1000CB652C9ES fits test and measurement front-ends because its high I/O count, embedded CAM, and configurable I/O standards support pattern generation and protocol analysis per the manufacturer datasheet. Logic analyzers, BERT testers, and protocol exercisers use this FPGA to implement custom stimulus generators with on-the-fly reconfiguration via JTAG. The 327,680 bits of embedded RAM provide deep capture buffers for protocol traces, while the 488 I/O pins enable direct connection to high-pin-count DUT fixtures. Pairing it with a host processor allows the system to stream captures over USB or Ethernet for offline analysis.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K1000CB652C9ES — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K1000CB652C8ES | EP20K1000CB652C7NJ | EP20K600CB652C7 | EP20K400CB652C7 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 652-BGA | 652-BGA (same) | 652-BGA (same) | 652-BGA (same) | 652-BGA (same) |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Number of Gates | 1,772,000 | 1,772,000 | 1,772,000 | 600,000 | 400,000 |
| Logic Elements / Cells | 38,400 | 38,400 | 38,400 | 24,192 | 16,640 |
| Embedded RAM Bits | 327,680 | 327,680 | 327,680 | 311,296 | 212,992 |
| Max User I/O | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C9 | C8 (slower) | C7 (slower, military temp) | C7 (slower) | C7 (slower) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -55C to +125C (military) | -40C to +85C (industrial) | -40C to +85C (industrial) |
Principaux différenciateurs
- Highest logic capacity in the APEX 20KC family (vs EP20K600CB652C7)
- Industrial temperature grade at full logic capacity (vs EP20K1000CB652C7NJ)
- Embedded CAM capability for routing-table lookups (vs EP20K400CB652C7)
Notes de conception
Decouple each VCCINT and VCCIO bank pin with a 0.1 uF X7R ceramic capacitor placed within 50 mils of the BGA pad, plus a 10 uF tantalum bulk capacitor per voltage rail. The 652-BGA package requires 8+ VCC pins and 8+ GND pins distributed across the package; follow the Altera AN 75 power distribution recommendations to avoid IR drop on the 1.8V core rail. Power-on ramp should be monotonic with a slew rate below 50 V/ms to prevent JTAG configuration latch-up.
Use a 12-layer or 14-layer PCB stack-up with continuous power and ground planes adjacent to the BGA footprint. The 652-ball FineLine BGA uses 1.27 mm pitch; escape routing requires micro-via (laser-drilled) or staggered via-in-pad technology. Maintain 50 ohm single-ended impedance on LVTTL/LVCMOS traces and 100 ohm differential impedance on LVDS pairs. Reference the Altera APEX 20K development board layout as a starting point for stack-up and decoupling.
Estimated: at typical utilization of 60% logic switching at 100 MHz I/O, the EP20K1000CB652C9ES dissipates approximately 3-5 W. The 652-BGA theta-JA is approximately 12 C/W with sufficient thermal vias to inner ground planes. Without thermal vias or airflow, junction temperature rise above ambient is 36-60 C, leaving headroom for industrial 85C operation. For full-utilization designs, recommend 200 LFM airflow or a heatsink attached to the package top.
Do not use EP20K1000CB652 variants with non-CB652 package codes as drop-in replacements; the pinout differs between BGA and other package options. Always verify the configuration mode (Passive Serial, Passive Parallel, or JTAG) before designing the configuration PROM circuit; mixing APEX 20K and APEX 20KC configuration bitstreams is not supported. For unused I/O pins, set them to input tri-stated with weak pull-up to avoid floating-pin supply leakage.
Informations de conformité
RoHS and REACH compliance not explicitly stated in verified web data; consult Intel PSG product compliance documentation. APEX 20KC family predates widespread AEC-Q100 FPGA qualification, so AEC-Q100 is not applicable.
