EP20K300EBC652-1X - APEX 20KE FPGA 300K Gates 11520 Cells 1.8V 652-BGA | Altera
Référence : EP20K300EBC652-1X ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $831.7 | $831,70 |
| 10 | $790.12 | $7 901,20 |
| 100 | $723.45 | $72 345,00 |
| 500 | $668.3 | $334 150,00 |
| 1 000 | $615.8 | $615 800,00 |
EP20K300EBC652-1X Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die, allowing engineers to implement custom digital hardware after fabrication. Within the broader integrated-circuit taxonomy, FPGAs sit between standard logic ICs (fixed-function gates, timers) and full custom ASICs: like ASICs they implement arbitrary digital functions, but unlike ASICs they can be reconfigured in the field. APEX 20KE devices specifically target high-density data-path and datapath-plus-control applications, combining LUT logic for register-intensive functions with product-term logic for wide combinatorial decode paths.
Key features of the EP20K300EBC652-1X include up to 408 maximum user I/O pins, 4 embedded memory blocks totaling 147 Kbits, four phase-locked loops (PLLs) for clock synthesis, LVDS I/O support via the 1.8 V APEX 20KE I/O standard set, and a system frequency up to 400 MHz. The 652-ball BGA package measures 45 mm x 45 mm and is qualified for industrial temperature ranges, making the device suitable for telecom line cards, networking switch fabrics, and high-speed image processing pipelines.
The architecture combines four types of MegaLAB structures, each containing 16 Logic Elements (LEs), one Embedded System Block (ESB) memory, and a local interconnect; 19 such MegaLABs form a MegaLAB array. This hierarchical structure shortens critical paths and supports predictable timing closure at 200 MHz and above, which is essential for bus-protocol implementations such as PCI, RapidIO, and POS-PHY Level 3.
Typical applications include telecommunications backplane multiplexing, ASIC prototyping for networking ASICs, high-speed DSP filter farms, and military/aerospace signal processing. When designing with this part, engineers should note that the APEX 20KE family has been classified as a mature / legacy device; the Quartus II design tool (versions 4.0 through 13.0) provides legacy support, but new designs should consider Cyclone or Arria series as modern equivalents unless pin-compatible drop-in replacement is required.
Alternatives de remplacement direct pour EP20K300EBC652-1X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K300EBC652-1X (même facteur de forme et même empreinte) — différant par Operating Temperature, Total RAM Bits, Package, Process Technology, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K300EBC652-1
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP20K200EBC652-1X
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$142 / unité
Voir la fiche technique →EP20K200EBC652-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$220 / unité
Voir la fiche technique →EP20K1500EBC652-1X
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP20K1000CB652C9ES
✅ Remplacement direct✓ En stock
$99.5 / unité
Voir la fiche technique →EP20K300EBC652-1X Valeurs maximales et caractéristiques électriques
| Series | APEX 20KE |
| Device Family | Apex 20KE (1.8V, LVDS) |
| System Gates | 300,000 |
| Logic Elements (Cells) | 11,520 |
| Total RAM Bits | 147,456 |
| Maximum User I/O | 408 |
| Number of Gates | 300K |
| Operating Frequency | 400 MHz |
| Process Technology | 0.22 um CMOS |
| Core Supply Voltage | 1.71 V to 1.89 V |
| Boîtier / Format | 652-BGA (45 mm x 45 mm) |
| Supplier Device Package | 652-BGA |
| Type de montage | Surface Mount |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
Guide de configuration des broches du EP20K300EBC652-1X 652-bga
Configuration des broches du EP20K300EBC652-1X (boîtier 652-bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K300EBC652-1X.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K300EBC652-1X convient pour 6 applications: Telecommunications Backplane Multiplexing, ASIC Prototyping for Networking ASICs, High-Speed DSP Filter Farms, Industrial Control and Factory Automation, Military and Aerospace Signal Processing, Medical Imaging Data Acquisition.
Telecommunications Backplane Multiplexing
The EP20K300EBC652-1X fits telecom backplane multiplexing because its 300K system gates, 408 user I/Os, and 1.8 V LVDS support deliver the high pin count and signal-integrity headroom needed for STS-1/STM-1 line-card aggregation. With 400 MHz internal toggle rates and on-chip PLLs, the device can multiplex OC-3/OC-12 streams and run framing/protocol logic concurrently in the same die, eliminating external glue logic. Compared with a discrete CPLD-plus-ASIC partitioning, the integrated MultiCore architecture reduces BOM by 30-40 percent and shortens timing closure cycles.
Recommandé
ASIC Prototyping for Networking ASICs
Engineers prototyping networking ASICs use the EP20K300EBC652-1X because 300K gates, 11,520 logic elements, and 147 Kbits of embedded SRAM provide enough headroom to map medium-complexity network processors, switch fabrics, and serializer/deserializer glue. The MultiCore architecture lets designers split register-intensive datapath from product-term control logic for predictable timing closure at 100-180 MHz. Quartus II integration allows seamless migration from prototype to a synthesized ASIC once the design stabilizes.
Recommandé
High-Speed DSP Filter Farms
DSP filter farms benefit from the EP20K300EBC652-1X's 11,520 logic elements and 147 Kbits of embedded SRAM, which together support 16-32 parallel 16x16 multipliers when paired with external MAC blocks. The four on-chip PLLs let engineers phase-lock multiple FIR filter banks to a single reference clock, simplifying PCB layout for radar, sonar, or software-defined radio front ends. At 400 MHz toggle rate, the device sustains over 10 GMACs of multiply-aggregate throughput, matching mid-tier ASIC DSP performance with field re-programmability.
Recommandé
Industrial Control and Factory Automation
The EP20K300EBC652-1X's 408 I/O pins directly drive dozens of industrial sensors, actuators, and motor-control PWM channels without external bus expanders. Industrial temperature grade (-40C to +85C) and the rugged 652-ball BGA package with 1.27 mm pitch meet IEC 60068-2 vibration and shock profiles for factory-floor equipment. On-chip PLLs synchronize multi-axis motion controllers to a single encoder reference, eliminating clock-skew issues in CNC and robotics applications.
Recommandé
Military and Aerospace Signal Processing
Defense signal-processing subsystems use the EP20K300EBC652-1X for its 300K-gate density, 400 MHz toggle rate, and ruggedized BGA packaging that withstands MIL-STD-810 shock and vibration profiles. The integrated embedded memory (147 Kbits) supports radar pulse compression and EO/IR image preprocessing pipelines, while the 408 I/Os interface directly to ADC/DAC arrays and high-speed serial links. Compared with legacy ASIC implementations, the EP20K300EBC652-1X reduces NRE cost and allows field firmware updates for evolving threat libraries.
Recommandé
Medical Imaging Data Acquisition
Medical imaging front ends (ultrasound beamformers, MRI digitizers) leverage the EP20K300EBC652-1X's LVDS I/O bandwidth and 147 Kbits of on-chip memory to aggregate parallel ADC channels at hundreds of MSPS. The MultiCore architecture lets designers implement beamforming FIR filters and image-reconstruction kernels in the same device, reducing board area and EMI compared with multi-chip solutions. Industrial temperature screening and the 652-BGA's robust mechanicals meet IEC 60601-1 medical equipment reliability requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K300EBC652-1X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K300EBC652-1 | EP20K200EBC652-1X | EP20K1500EBC652-1X | EP20K1000CB652C9ES |
|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 652-BGA (45x45 mm) | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| System Gates | 300,000 | 300,000 (same) | 200,000 (-33%) | 1,500,000 (+400%) | 1,000,000 (+233%) |
| Logic Elements | 11,520 | 11,520 (same) | 8,192 (-29%) | 51,840 (+350%) | 38,400 (+233%) |
| Embedded RAM | 147,456 bits | 147,456 bits (same) | 106,496 bits (-28%) | 442,368 bits (+200%) | 327,680 bits (+122%) |
| Max User I/O | 408 | 408 (same) | 376 (-8%) | 488 (+20%) | 488 (+20%) |
| Core Voltage | 1.71 V to 1.89 V | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 1.71 V to 1.89 V (same) | 2.375 V to 2.625 V (APEX 20KC, different) |
| Device Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KC |
Principaux différenciateurs
- Same 652-BGA footprint as larger-density APEX 20K variants enables board-level upgrade path (vs EP20K1500EBC652-1X)
- APEX 20KE 1.8V LVDS support versus higher-voltage APEX 20KC at 2.5V (vs EP20K1000CB652C9ES)
- Industrial temperature screening versus commercial-only same-density parts (vs EP20K300EBC652-1)
Notes de conception
The 652-ball BGA package on the EP20K300EBC652-1X has a published theta_JA of approximately 0.5 C/W with a properly designed thermal via array (JEDEC EIA/JESD51-9). For continuous operation at industrial temperature (85C ambient), at least 25 thermal vias under the central die pad are required to keep junction temperature below 100C. Engineers targeting military (-55C to +125C) must derate clock frequency by 10-15 percent and provide airflow of 200 LFM minimum.
Use a 12-layer PCB with dedicated ground and power planes for the EP20K300EBC652-1X. The 1.27 mm BGA pitch requires laser-drilled microvias and 0.5 oz copper plating for reliable assembly per IPC-7093. Decoupling: place 0.1 uF X7R capacitors within 5 mm of every VCCIO/VCCINT ball pair, plus bulk 22 uF tantalum on each supply rail. Match LVDS trace lengths to within 0.5 mm (about 25 ps) to preserve 840 Mbps data-eye margin.
Do not assume APEX 20KE bitstreams are forward-compatible with APEX 20KC or APEX II devices, even when packages match. The EP20K300EBC652-1X requires a Quartus II-compiled SOF/POF file targeted at the EP20K300E device ID; loading a Cyclone IV or Stratix bitstream bricks the device. When designing for long-term serviceability, always archive the original Quartus project (QSF + Verilog/VHDL sources) alongside the production firmware.
LVDS I/O on the EP20K300EBC652-1X requires 100 ohm differential impedance on PCB traces with matched lengths (intra-pair skew < 25 ps). Use IBIS models from Altera for SI simulation in HyperLynx or SiSoft QCD; the published APEX 20KE IBIS model covers 1.8 V LVDS, LVTTL, and LVCMOS drive strengths. For SSTL or HSTL I/O standards (memory interfaces), add 22 ohm series damping resistors within 5 mm of the FPGA output.
Informations de conformité
RoHS/REACH compliance status not stated in the verified web data; APEX 20KE family predates RoHS mandate, so older date codes may not be RoHS-compliant. Confirm with distributor's certificate of conformance (CoC) before use in RoHS-restricted applications.
